JP2012129483A - Circuit board and method of manufacturing the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a circuit board in which transmission speed of thermal energy of an electronic component can be increased.SOLUTION: The circuit board comprises: a circuit layer; a heat conduction plate; and an insulation layer. The heat conduction plate comprises: a plate body having a plate surface; and at lest one bump extending from the plate surface to be connected with a projection plate. The bump has a top face, and a side face surrounding and connecting the circumference of the top face. The side face connects the top face and the plate surface. The insulation layer is arranged on the plate surface, and comes into contact with the side face, thus exposing the top face. The circuit layer is arranged on the insulation layer and insulated from the bump electrically.

Description

  The present invention relates to a circuit board and a manufacturing method thereof, and more particularly, to a circuit board capable of increasing a heat energy transmission speed and a manufacturing method thereof.

  2. Description of the Related Art Current electronic devices such as mobile phones and computers, and household appliances such as televisions and refrigerators include a large number of electronic components such as active components or passive components. Yes. Many of these electronic components are mounted on a circuit board, and electrical signals are transmitted and received by a circuit included in the circuit board. Thus, electrical signals are transmitted between these electronic components.

  However, electronic components generate some heat energy during operation, and certain electronic components such as light emitting diodes (LEDs) and power devices (power devices) generate more heat energy during operation. appear. Therefore, how to increase the heat energy transmission speed of electronic components is a subject worth studying.

  The present invention provides a circuit board that can increase the heat energy transfer speed of an electronic component.

  The present invention provides a circuit board manufacturing method capable of manufacturing the circuit board.

  The present invention provides a circuit board comprising a circuit layer, a heat conducting plate, and an insulating layer. The heat conductive plate includes a plate body having a plate surface and at least one bump that extends from the plate surface and projects to the plate body. The bump has a top surface and side surfaces that surround and surround the periphery of the top surface, and the side surfaces connect the top surface and the plate surface. The insulating layer is disposed on the plate surface and contacts the side surface to expose the top surface. The circuit layer is disposed on the insulating layer and is electrically insulated from the bumps.

  In one embodiment of the present invention, the circuit layer includes at least one connection pad disposed on the insulating layer and not in contact with the bump.

  In one embodiment of the present invention, the insulating layer includes at least a first insulating material and a second insulating material. The first insulating material locally covers the plate surface and is in contact with the side surface. The second insulating material covers a plate surface that is not covered by the first insulating material. The thermal conductivity of the first insulating material is greater than the thermal conductivity of the second insulating material. The connection pad is disposed on the first insulating material.

  In one embodiment of the invention, the circuit board further comprises at least one thermal conductive component disposed on and in contact with the top surface.

  In an embodiment of the present invention, the distance from the top surface to the plate surface is equal to or greater than the thickness of the insulating layer.

  The present invention further provides a method of manufacturing a circuit board. First, a heat conductive substrate having a flat surface is provided. Next, a part of the heat conductive substrate located in a plane is removed to form a plate surface and at least one bump, and the bump has a top surface and a side surface connecting the top surface and the plate surface. Thereafter, an insulating layer exposing the top surface is formed on the plate surface, and the insulating layer is in contact with the plate surface and the side surface. Next, a circuit layer is formed on the insulating layer, and the circuit layer is electrically insulated from the bumps.

  In one embodiment of the present invention, the method of forming the insulating layer includes forming at least a first insulating material and a second insulating material on a plate surface. The first insulating material covers the plate surface locally and is in contact with the side surface, and the second insulating material covers the plate surface not covered by the first insulating material. The thermal conductivity of the first insulating material is greater than the thermal conductivity of the second insulating material.

  In one embodiment of the present invention, the insulating layer is a low-flow prepreg or a non-flow prepreg.

  In an embodiment of the present invention, the distance from the top surface to the plate surface is equal to or greater than the thickness of the insulating layer.

  In one embodiment of the present invention, the circuit layer may be formed by first laminating a metal foil on the insulating layer, and then removing a portion of the metal foil to remove the insulating layer and the top surface. And a method of cleaning the top surface after removing a portion of the metal foil, and a method of cleaning the top surface includes desmear, laser treatment (laser). treatment or plasma treatment.

  In summary, since the bumps are integrally formed on the plate body, after mounting at least one electronic component on the circuit board, the electronic component can be thermally coupled to the heat conducting plate, and therefore The heat conduction plate can increase the transmission speed of the heat energy of the electronic component.

  In order to make the above-described features and advantages of the present invention more understandable, embodiments will be described below and described in detail in conjunction with the drawings.

It is the cross-sectional schematic after mounting an electronic component in the circuit board of one Embodiment of this invention. It is the cross-sectional schematic after mounting an electronic component by the other system on the circuit board in FIG. 1A. It is the cross-sectional schematic after mounting an electronic component by the other system on the circuit board in FIG. 1A. It is a flow section schematic diagram of a manufacturing method of a circuit board in Drawing 1A. It is a flow section schematic diagram of a manufacturing method of a circuit board in Drawing 1A. It is a flow section schematic diagram of a manufacturing method of a circuit board in Drawing 1A. It is a flow section schematic diagram of a manufacturing method of a circuit board in Drawing 1A. It is a flow section schematic diagram of a manufacturing method of a circuit board in Drawing 1A.

  FIG. 1A is a schematic cross-sectional view after an electronic component is mounted on a circuit board according to an embodiment of the present invention. Referring to FIG. 1A, the circuit board 100 includes a circuit layer 110, a heat conductive plate 120, and an insulating layer 130. The heat conductive plate 120 includes a plate body 122 and at least one bump 124, and the bump 124 is connected to the plate body 122. In the embodiment of FIG. 1A, only one bump 124 is shown, but in other embodiments, the circuit board 100 may include a plurality of bumps 124. Accordingly, the number of bumps 124 shown in FIG. 1A is merely an example, and does not limit the present invention.

  Further, when the circuit board 100 is viewed from above, the shape of the bump 124 may be a substantially irregular geometric shape or a regular geometric shape. The irregular geometric shape may be a triangle whose three sides are not parallel, a quadrilateral whose four sides are not parallel, or an asymmetric figure having an arc line (for example, a cloud shape). The regular geometric shape may be a symmetrical figure, and this symmetry includes point symmetry or line symmetry, for example, regular geometric shapes are equilateral triangle, isosceles triangle, isosceles trapezoid, rhombus, square, rectangle May be a regular pentagon, a regular hexagon, a regular heptagon, a circle, an ellipse, a water drop, a fan or a star. The shape of the bump 124 may be a spiral like a mosquito coil. As can be seen, the shape of the bump 124 can be designed in various ways.

  The plate body 122 has a plate surface 122a, and the bump 124 has a top surface 124t and a side surface 124s that surrounds and connects the periphery of the top surface 124t. The bumps 124 extend from the plate surface 122a and project, and the side surfaces 124s connect the top surface 124t and the plate surface 122a. Accordingly, the bumps 124 are integrally formed with the plate body 122. More specifically, since the bumps 124 and the plate body 122 are made of the same material and are manufactured on the same substrate, substantially no interface (between the bump 124 and the plate body 122 ( interface) also does not exist.

  The heat conducting plate 120 has a high heat conductivity, for example, greater than 50 W / MK. It should be explained that all the thermal conductivities described in the specification and claims of the present invention refer to the thermal conductivities at an absolute temperature of 300 K (about 27 ° C.). The material constituting the plate body 122 is, for example, carbon or metal, and thus the plate body 122 may be a metal plate or a carbon-material board, and the carbon material plate is generally composed mainly of carbon. For example, a carbon fiber board or a graphite board. Further, the bumps 124 and the plate body 122 are integrally formed. Therefore, the material constituting the bumps 124 is the same as the material constituting the plate body 122, that is, the material constituting the bumps 124 may be carbon or metal.

  The insulating layer 130 is disposed between the circuit layer 110 and the plate surface 122a, and is disposed on the plate surface 122a. The insulating layer 130 separates the circuit layer 110 and the plate body 122. The insulating layer 130 contacts the plate surface 122 a and the side surface 124 s and exposes the top surface 124 t of the bump 124. The circuit layer 110 is disposed on the insulating layer 130 and is electrically insulated from the bumps 124. Since the bumps 124 and the plate body 122 are integrally formed, the circuit layer 110 is also electrically insulated from the plate body 122. Yes. Further, the distance T1 from the top surface 124t to the plate surface 122a may be equal to or greater than the thickness T2 of the insulating layer 130, so that the bump 124 may protrude more from the insulating layer 130, or the top surface of the bump 124. 124 t is substantially flush with the surface of the insulating layer 130.

  The insulating layer 130 may be composed of a single insulating material or a plurality of insulating materials. When the insulating layer 130 includes a plurality of insulating materials, the insulating layer 130 may include at least a first insulating material 132 and a second insulating material 134, and the first insulating material 132 and the second insulating material 134 The material is different.

  The thermal conductivity of the first insulating material 132 is greater than the thermal conductivity of the second insulating material 134, and thus the heat energy transfer rate of the first insulating material 132 is greater than the heat energy transfer rate of the second insulating material 134. For example, the thermal conductivity of the first insulating material 132 may be higher than 2.0 W / MK, and the thermal conductivity of the second insulating material 134 may be lower than 1 W / MK. 2 The thermal conductivity of the insulating material 134 is 0.3 W / MK to 0.5 W / MK.

  Both the first insulating material 132 and the second insulating material 134 locally cover the plate surface 122a, the first insulating material 132 is in contact with the side surface 124s of the bump 124, and the second insulating material 134 is the first insulating material. The plate surface 122 a that is not covered by 132 is covered. In the present embodiment, the shape of the first insulating material 132 may be a closed loop, and the first insulating material 132 completely blocks the bump 124 so that the second insulating material 134 does not contact the bump 124. Surrounded by.

  However, in other embodiments, the shape of the first insulating material 132 may be a ring shape having a notch or a shape other than the ring shape. For example, the shape of the first insulating material 132 is a C shape. The second insulating material 134 may extend into the notch and may contact the bump 124. Accordingly, it is claimed here that the present invention does not limit the shape of the first insulating material 132.

  The circuit layer 110 may include at least one connection pad 112 disposed on the insulating layer 130, and these connection pads 112 may be disposed on the first insulating material 132. The circuit layer 110 is electrically insulated from the bumps 124, so that the connection pads 112 do not contact the bumps 124. In the embodiment shown in FIG. 1A, the number of the connection pads 112 is plural. However, in other embodiments, the number of the connection pads 112 may be only one, and therefore, as shown in FIG. 1A. The number of connection pads 112 is merely an example, and does not limit the present invention. The circuit layer 110 may further include one or several traces 114, and the traces 114 may be electrically connected to the connection pads 112.

  One or more electronic components 10 may be mounted on the circuit board 100, and the electronic component 10 may be mounted on the circuit board 100 in a flip chip manner, and the electronic component 10 may be an active component or a passive component. For example, the electronic component 10 may be a die package, a die, a light emitting diode (LED), a power supply device, a capacitor, or an inductor.

  The electronic component 10 includes a plurality of connection pads 12 and 14. The connection pad 12 may be a working pad, and the connection pad 14 may be a dummy pad or a ground pad. Good. After the electronic component 10 is mounted on the circuit board 100, each connection pad 112 is electrically connected to one connection pad 12 via one solder block S1, and the connection pad 14 is thermally applied to the bump 124. Can be combined. In this way, the electronic component 10 can be electrically connected to the circuit board 100, and the thermal energy generated when the electronic component 10 operates is transmitted from the bump 124, the connection pad 112, and the first insulating material 132. Can communicate to the external environment.

  There are many methods for thermally connecting the connection pad 14 and the bump 124, and in this embodiment, the bump 124 can be thermally bonded to the connection pad 14 by the heat conducting component 140. Specifically, the circuit board 100 may further include at least one heat conducting component 140 having a thermal conductivity greater than 2 W / MK. In addition to being disposed on the top surface 124t, the heat conducting component 140 is in contact with the top surface 124t, so that the heat conducting component 140 can quickly transfer heat energy from the electronic component 10 to the bumps 124.

  The heat conducting component 140 may be conductive or electrically insulating, and the heat conducting component 140 is, for example, a solder block, a heat radiating adhesive, or a heat radiating film. The heat radiation adhesive generally refers to a colloid having a high thermal conductivity, and may be a liquid, colloidal, or pasty material, and the heat radiation film may be a viscous tape or soft pad. Both the heat dissipation adhesive and the heat dissipation film may include a plurality of granules having a high heat conducting ability, such as metal granules, carbon powder, or silicon carbide (chemical formula: SiC) powder. Further, the number of heat conducting components 140 may be the same as the number of bumps 124. When the heat conductive plate 120 includes a plurality of bumps 124, the number of the heat conductive components 140 may be plural.

  Although the circuit board 100 in FIG. 1A includes a heat conducting component 140, in other embodiments, the connection pads 14 may be in direct contact with the bumps 124 and thermally coupled to the bumps 124. Should be done. Accordingly, since the heat conducting component 140 is only a selective component of the circuit board 100 and is not a necessary component, the heat conducting component 140 shown in FIG. 1A is merely an example and does not limit the present invention.

  As described above, the heat conduction plate 120 has a high heat conductivity, and the bumps 124 and the plate body 122 are integrally formed, and there is substantially no interface between them, so that the heat energy is the thermal conduction. ) Method can be quickly transmitted between the bump 124 and the plate body 122. In this way, when the electronic component 10 in operation generates thermal energy, the heat conduction plate 120 can increase the transmission speed of the thermal energy and reduce the probability that the electronic component 10 is overheated.

  In addition, the shape of the bump 124 can be designed in various ways, for example, an irregular geometric shape or a regular geometric shape. Therefore, the shape of the bump 124 can be designed according to the outer shape of the connection pad 14. In this way, the bumps 124 can be sufficiently thermally coupled to the connection pads 14, thereby enabling the heat conduction plate 120 to effectively increase the transfer rate of heat energy.

  The electronic component 20 shown in FIG. 1A is mounted on the circuit board 100 in a flip-chip manner, but in other embodiments, the electronic component may be placed in a circuit board in another manner, as shown in FIG. 1B. It should be pointed out that it may be implemented on 100.

  Referring to FIG. 1B, the electronic component 20 may be mounted on the circuit board 100 by wire bonding in addition to the flip chip, and the electronic component 20 may be an active component or a passive component. The electronic component 20 may be a die package, a die, a light emitting diode, a power supply device, a capacitor, or an inductor. The electronic component 20 includes a plurality of connection pads 22 and at least one connection pad 24. The connection pad 22 faces the connection pad 24, the connection pad 22 is a work pad, and the connection pad 24 is a dummy pad or A ground pad may be used.

  After mounting the electronic component 20 on the circuit board 100, each connection pad 112 is connected to one connection pad via one bonding wire W1 so that the circuit board 100 can be electrically connected to the electronic component 20. 22 can be electrically connected. The connection pad 24 is thermally coupled to the bump 124, for example, the connection pad 24 is thermally coupled to the bump 124 via the thermally conductive component 140 or is thermally coupled to the bump 124 by directly contacting the bump 124. Are combined. In this way, the heat energy generated when the electronic component 20 operates can be transmitted from the heat conducting plate 120 to the external environment. Since the heat conduction plate 120 can increase the transmission speed of heat energy, the probability that the electronic component 20 will overheat can be reduced.

  Referring to FIG. 1C, the mounting of the electronic component on the circuit board 100 when the electronic component is a die package is illustrated. Specifically, the electronic component 30 is a die package, and taking FIG. 1C as an example, the electronic component 30 is, for example, a light emitting diode, but in other embodiments not shown, the electronic component 30 is a power device or Other parts that can generate a large amount of heat energy may be used.

  The electronic component 30 includes a chip 31, a substrate 32, a mold 33, and a plurality of bonding wires W2. The chip 31 is mounted on the substrate 32 and is electrically connected to the substrate 32. More specifically, the substrate 32 has a plurality of connection pads 321, 322, and 34, the connection pads 321 and 322 are work pads, and the connection pad 34 is a dummy pad or a ground pad. Each bonding wire W2 connects the chip 31 to one of the connection pads 321. In this way, the chip 31 is electrically connected to the substrate 32 via these bonding wires W2 and connection pads 321. The mold 33 covers the chip 31 and encloses these bonding wires W2, thereby protecting the chip 31 and the bonding wires W2.

  The electronic component 30 is mounted and electrically connected to the circuit board 100, and the electronic component 30 is electrically connected to the circuit board 100 by a plurality of solder blocks S1. Specifically, these solder blocks S 1 connect between these connection pads 112 of the circuit board 100 and these connection pads 322 of the substrate 32. Thus, the current is input to the chip 31 in the order of the connection pad 112, the solder block S1, the connection pad 322, the connection pad 321, and the bonding wire W2, and the chip 31 can emit light immediately after receiving the current. .

  In addition, the electronic component 30 is thermally coupled to the bump 124 so that the heat energy generated when the electronic component 30 operates can be transmitted from the bump 124, the connection pad 112, and the first insulating material 132 to the external environment. The heat conductive component 140 can connect between the bump 124 and the connection pad 34. In this way, when the electronic component 30 during operation generates thermal energy, the heat conduction plate 120 can increase the transmission speed of the thermal energy and reduce the probability that the electronic component 30 will overheat.

  In the above, only the structure of the circuit board 100 and the mounting of the electronic component 10, 20 or 30 on the circuit board 100 were introduced. Next, in conjunction with FIGS. 2A to 2E, a method for manufacturing the circuit board 100 will be introduced in detail.

  2A to 2E are schematic flow sectional views of the circuit board manufacturing method in FIG. 1A. Referring to FIG. 2A, in the method of manufacturing the circuit board 100, first, a heat conductive substrate 220 having a flat surface 222 is provided, and the heat conductive substrate 220 has a high heat conductivity, for example, greater than 50 W / MK. The material constituting the heat conductive substrate 220 may be carbon or metal. For example, the heat conductive substrate 220 may be a metal plate or a carbon material plate such as a carbon fiber plate or a graphite plate.

  Referring to FIGS. 2A and 2B, a portion of the thermally conductive substrate 220 located on the plane 222 is then removed to form a plate surface 122a and at least one bump 124 having a top surface 124t and side surfaces 124s. Thus, the heat conductive plate 120 is formed. Although there are many methods for removing a part of the heat conductive substrate 220, in this embodiment, the method for removing a part of the heat conductive substrate 220 includes photolithography and etching. When a portion of the thermally conductive substrate 220 is removed by photolithography and etching, a portion of the plane 222 is preserved, thereby forming the top surface 124t of the bump 124.

  Referring to FIG. 2C, next, an insulating layer 130 that exposes the top surface 124t is formed on the plate surface 122a. The insulating layer 130 contacts the plate surface 122a and the side surface 124s of the bump 124, and the distance T1 from the top surface 124t to the plate surface 122a is equal to or greater than the thickness T2 of the insulating layer 130, that is, the bump 124 has the insulating layer 130. Or the top surface 124t of the bump 124 is substantially flush with the surface of the insulating layer 130. Although there are many methods for forming the insulating layer 130, in the present embodiment, the method for forming the insulating layer 130 may include printing or lamination.

  The printing includes various methods, for example, the method of printing the insulating layer 130 may include an application or an ink jet. When the insulating layer 130 is printed by a coating method, the insulating layer 130 may be formed by applying at least one liquid, colloidal, or pasty coating, and the coating may be viscous. For example, a paint containing a resin or a resin component.

  When the insulating layer 130 is printed by an ink jet method, the insulating layer 130 may be formed by spray coating a jet material on the plate surface 122a with an ink jet apparatus (not shown). The jet material is ejected by, for example, a nozzle of an ink jet apparatus, and the nozzle can move. Therefore, in the course of spray coating, the jet material should be spray coated to locally expose the plate surface 122a from the insulating layer 130. The position can be controlled by a nozzle.

  Further, the above-described paint and jet material for forming the insulating layer 130 may be the same or different. If the paint and the jet material are different, the viscosity of the paint may be greater than the viscosity of the jet material, for example, the paint may be liquid, colloidal or pasty, and the jet material may be liquid or colloidal It's not pasty. Therefore, the jet material is easier to flow than the paint, so that the nozzle is more likely to eject the jet material.

  However, when attention is paid to the specifications of the ink jet apparatus, for example, the output or the nozzle diameter, the jet material may have a higher viscosity. For example, the jet material may be a pasty material. Accordingly, the present invention does not limit the relative difference in viscosity between the jet material and the paint.

  When the insulating layer 130 is formed of a laminate, the insulating layer 130 may be formed by laminating at least one semi-cured prepreg, and the semi-cured prepreg may be a low-flow prepreg or a no-flow prepreg.

  The insulating layer 130 can be composed of a single insulating material or a plurality of insulating materials. When the insulating layer 130 is composed of a plurality of types of insulating materials, the insulating layer 130 can be formed by the following method. At least a first insulating material 132 and a second insulating material 134 are formed on the plate surface 122a. The first insulating material 132 locally covers the plate surface 122a and contacts the side surface 124s of the bump 124. The second insulating material 134 covers the plate surface 122a that is not covered by the first insulating material 132. Yes. Further, the thermal conductivity of the first insulating material 132 is larger than the thermal conductivity of the second insulating material 134.

  Both the first insulating material 132 and the second insulating material 134 may be formed by printing or laminating. For example, the first insulating material 132 and the second insulating material 134 may be made of a plurality of types of liquid, colloidal, or pasty paints. It may be formed by coating, or may be formed by laminating a plurality of types of semi-cured prepregs, and these semi-cured prepregs may be low-flow prepregs or no-flow prepregs.

  Referring to FIG. 2D, next, a single metal foil 210 is laminated on the insulating layer 130, and the metal foil 210 covers the insulating layer 130 and the top surface 124 t of the bump 124. In FIG. 2D, since the bump 124 protrudes from the insulating layer 130, the metal foil 210 is laminated and deformed by being pressed by the bump 124. The metal foil 210 is, for example, a copper foil, an aluminum foil, a tin foil, a silver foil, a gold foil, or a copper foil with resin (Resin Coated Copper, RCC).

  2D and 2E, the metal foil 210 is partially removed to expose the insulating layer 130 and the top surface 124t of the bump 124, and the circuit layer 110 is formed on the insulating layer 130. 110 is electrically insulated from the bump 124. The method of removing a part of the metal foil 210 may include photolithography and etching. Thus, the manufacturing of the circuit board 100 is almost completed.

  In the process of laminating the metal foil 210, the colloid in the insulating layer 130 flows, so that the colloid penetrates between the metal foil 210 and the top surface 124t (see FIG. 2D), and a part of the metal foil 210 is removed. After that, there is a risk of smear remaining on the top surface 124t. On the other hand, after removing a part of the metal foil 210, the top surface 124t of the bump 124 may be cleaned to remove smear. Methods for cleaning the top surface 124t may include desmear, laser treatment or plasma treatment. In this way, the quality of the thermal coupling between the bump 124 and the electronic component (for example, the electronic component 10, 20, or 30) can be improved.

  However, since the insulating layer 130 may be formed by laminating at least one low-flow prepreg or no-flow prepreg, when the insulating layer 130 is formed by a low-flow prepreg or no-flow prepreg, the metal foil 210 is laminated. In the process, the colloid in the insulating layer 130 does not substantially penetrate between the metal foil 210 and the top surface 124t (see FIG. 2D), and thus the top surface 124t is removed after removing a part of the metal foil 210. There is no need to clean. As can be seen from this, in the present embodiment, it is not always necessary to clean the top surface 124t after the circuit layer 110 is formed.

  It should be pointed out that the circuit layer 110 is formed by laminating the metal foil 210 according to the method for manufacturing the circuit board 100 disclosed in FIGS. 2D and 2E. In this case, the circuit layer 110 may be formed by electroless plating or electroplating, and the circuit layer 110 is not necessarily formed by laminating the metal foil 210.

  Specifically, the circuit layer 110 may be formed by a semi-additive method or an additive method. When the circuit layer 110 is formed by a semi-additive method or an additive method, a thin metal layer may be formed on the insulating layer 130 first, and this metal may be a metal foil 210 having a reduced thickness or sputtering ( The method for reducing the thickness of the metal foil 210 includes etching or grinding.

  Next, a mask pattern for locally covering the metal layer is formed, and the mask pattern is, for example, a dry film or a photoresist layer after photolithography. Thereafter, electroless plating or electroplating is performed. After electroless plating or electroplating, micro-etching is performed. In this way, the circuit layer 110 is formed. As can be seen from this, the method of forming the circuit layer 110 by laminating the metal foil 210 shown in FIGS. 2D and 2E is merely an example, and does not limit the present invention.

  Although the present invention discloses the above-described embodiments as described above, it is not intended to limit the present invention, and equivalent arrangements such as changes and modifications made by those skilled in the art without departing from the spirit of the present invention. Replacement is also included in the scope of rights protection of the present invention.

10, 20, 30 Electronic component 12, 14, 22, 24, 34, 112, 321, 322 Connection pad 31 Chip 32 Substrate 33 Mold 100 Circuit board 110 Circuit layer 114 Trace 120 Thermal conductive plate 122 Plate body 122a Plate surface 124 Bump 124s Side surface 124t Top surface 130 Insulating layer 132 First insulating material 134 Second insulating material 140 Thermal conductive component 210 Metal foil 220 Thermal conductive substrate 222 Planar S1 Solder block T1 Distance T2 Thickness W1, W2 Bonding wire

Claims (10)

A heat conductive plate comprising a plate having a plate surface and at least one bump extending from the plate surface and connected to the plate body, the bump surrounding the top surface and the periphery of the top surface A heat conduction plate that connects between the top surface and the plate surface;
An insulating layer disposed on the plate surface and contacting the side surface to expose the top surface;
A circuit board, comprising: a circuit layer disposed on the insulating layer and electrically insulated from the bumps.   The circuit board according to claim 1, wherein the circuit layer includes at least one connection pad disposed on the insulating layer, and the connection pad does not contact the bump. The insulating layer is
At least one first insulating material that locally covers the plate surface and is in contact with the side surface;
A second insulating material that covers the plate surface not covered by the first insulating material;
The circuit board according to claim 2, further comprising: a thermal conductivity of the first insulating material greater than a thermal conductivity of the second insulating material, wherein the connection pad is disposed on the first insulating material.   The circuit board of claim 1, further comprising at least one heat conducting component disposed on the top surface, wherein the heat conducting component is in contact with the top surface.   The circuit board according to claim 1, wherein a distance from the top surface to the plate surface is equal to or greater than a thickness of the insulating layer. Providing a thermally conductive substrate having a plane;
Removing a portion of the thermally conductive substrate located in the plane to form a plate surface and a top surface and at least one bump having a side surface connecting the top surface and the plate surface;
Forming an insulating layer on the plate surface, exposing the top surface and contacting the plate surface and the side surface; and a circuit layer electrically insulated from the bumps on the insulating layer. A method of manufacturing a circuit board, comprising forming. Forming the insulating layer comprises:
Forming at least a first insulating material and a second insulating material on the plate surface, wherein the first insulating material locally covers the plate surface, contacts the side surface, and the second insulating material. 7. The circuit board of claim 6, wherein a material covers the plate surface not covered by the first insulating material, and the thermal conductivity of the first insulating material is greater than the thermal conductivity of the second insulating material. Production method.   The method for manufacturing a circuit board according to claim 6, wherein the insulating layer is a low-flow prepreg or a no-flow prepreg.   The method for manufacturing a circuit board according to claim 6, wherein a distance from the top surface to the plate surface is equal to or greater than a thickness of the insulating layer. Forming the circuit layer comprises:
Laminating a metal foil on the insulating layer;
Removing a part of the metal foil to expose the insulating layer and the top surface;
Cleaning the top surface after removing a portion of the metal foil;
The method for manufacturing a circuit board according to claim 6, wherein the method for cleaning the top surface includes desmear, laser treatment, or plasma treatment.

Images