JP2012119699A - プラズマ処理方法、記憶媒体及びプラズマ処理装置 - Google Patents
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- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
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Abstract
【解決手段】ウエハW上の半導体デバイスに形成されたハフニウム酸化膜にエッチング処理を施す際、ウエハWをプラズマ処理装置10のチャンバ11内に搬入し、該チャンバ11内の処理空間SにC4F8ガス、一酸化炭素ガス、アルゴンガス及びキセノンガスを所定の流量比で供給し、処理空間Sに高周波電力を印加して供給された処理ガスからプラズマを発生させ、キセノンによってC4F8からのフッ素の解離をより促進して高いエッチレートで高誘電率絶縁膜をエッチングする。
【選択図】図1
Description
まず、エッチング処理が施されるウエハとして、ハフニウム酸化膜のブランケットウエハ(Blanket wafer)(毛布のように形成されたハフニウム酸化膜を表面上に有するウエハ)を準備した。次いで、該ブランケットウエハをプラズマ処理装置10のチャンバ11内に搬入し、該チャンバ11内の処理空間Sに処理ガスとしてC4F8ガス、一酸化炭素ガス、アルゴンガス及びキセノンガスを流量比27/300/540/60sccmで供給した。すなわち、キセノンの添加量は希ガス全体に対する流量比で10%であった。次いで、処理空間Sに高周波電力を印加して供給された処理ガスからプラズマを発生させ、該ブランケットウエハをエッチングした。そして、このときのエッチレートを計測し、該計測されたエッチレートを図2のグラフに示した。
まず、実施例1と同様に、ハフニウム酸化膜のブランケットウエハを準備した。次いで、実施例1と同様の方法で該ブランケットウエハをエッチングした。このとき、処理空間SにはC4F8ガス、一酸化炭素ガス、アルゴンガス及びキセノンガスを流量比27/300/480/120sccmで供給した。すなわち、キセノンの添加量は希ガス全体に対する流量比で20%であった。そして、計測されたエッチレートを図2のグラフに示した。
まず、実施例1と同様に、ハフニウム酸化膜のブランケットウエハを準備した。次いで、実施例1と同様の方法で該ブランケットウエハをエッチングした。このとき、処理空間SにはC4F8ガス、一酸化炭素ガス、及びアルゴンガスを流量比27/300/600sccmで供給した。そして、計測されたエッチレートを図2のグラフに示した。
まず、エッチング処理が施されるウエハとしてハフニウム酸化膜のブランケットウエハ、窒化珪素膜のブランケットウエハ、及びSiO2膜のブランケットウエハを準備した。次いで、各ウエハをプラズマ処理装置10のチャンバ11内に搬入し、該チャンバ11内の処理空間Sにアルゴンガス、キセノンガス及び水素ガスを流量比180/420/4sccmで供給した。次いで、処理空間Sに高周波電力を印加して供給された処理ガスからプラズマを発生させ、各ウエハをエッチングした。そして、このときのエッチレートを計測し、該計測されたエッチレートを図4のグラフに示した。また、窒化珪素膜に対するハフニウム酸化膜の選択比、及びSiO2膜に対するハフニウム酸化膜の選択比を図5のグラフに示した。
まず、実施例3と同様に、ハフニウム酸化膜のブランケットウエハ、窒化珪素膜のブランケットウエハ、及びSiO2膜のブランケットウエハを準備した。次いで、実施例3と同様の方法で各ウエハをエッチングした。このとき、処理空間Sにはアルゴンガス、キセノンガス及び水素ガスを流量比180/420/8sccmで供給した。そして、計測されたエッチレートを図4のグラフに示し、窒化珪素膜に対するハフニウム酸化膜の選択比、及びSiO2膜に対するハフニウム酸化膜の選択比を図5のグラフに示した。
まず、ハフニウム酸化膜のブランケットウエハ、及び窒化珪素膜のブランケットウエハを準備した。次いで、実施例3と同様の方法で各ウエハをエッチングした。このとき、処理空間Sにはアルゴンガス、キセノンガス及び水素ガスを流量比180/420/16sccmで供給した。そして、計測されたエッチレートを図4のグラフに示し、窒化珪素膜に対するハフニウム酸化膜の選択比を図5のグラフに示した。
まず、実施例3と同様に、ハフニウム酸化膜のブランケットウエハ、窒化珪素膜のブランケットウエハ、及びSiO2膜のブランケットウエハを準備した。次いで、実施例3と同様の方法で各ウエハをエッチングした。このとき、処理空間Sにはアルゴンガス及びキセノンガスを流量比180/420sccmで供給した。そして、計測されたエッチレートを図4のグラフに示し、窒化珪素膜に対するハフニウム酸化膜の選択比、及びSiO2膜に対するハフニウム酸化膜の選択比を図5のグラフに示した。
S 処理空間
10 プラズマ処理装置
11 チャンバ
12 下部電極
13 シャワーヘッド
14 下部高周波電源
31 上部高周波電源
Claims (13)
- コンデンサの誘電体部分としての高誘電率絶縁膜が形成された基板に処理ガスのプラズマを用いてエッチング処理を施すプラズマ処理方法であって、
前記処理ガスはハロゲンガス、希ガス、及び還元ガスを含むことを特徴とするプラズマ処理方法。 - 前記希ガスはヘリウムガス、ネオンガス、アルゴンガス、クリプトンガス、及びキセノンガスからなる群から選択された少なくとも1つであることを特徴とする請求項1記載のプラズマ処理方法。
- 前記還元ガスは水素ガス、一酸化炭素ガス、及びメタンガスからなる群から選択された少なくとも1つであることを特徴とする請求項1又は2記載のプラズマ処理方法。
- 前記ハロゲンガスはフッ素、塩素、及び臭素からなる群から選択された少なくとも1つを含む化合物のガスであることを特徴とする請求項1乃至3のいずれか1項に記載のプラズマ処理方法。
- 前記処理ガスはフッ素化合物のガス、一酸化炭素ガス、及びキセノンガスを少なくとも含むことを特徴とする請求項1記載のプラズマ処理方法。
- コンデンサの誘電体部分としての高誘電率絶縁膜が形成された基板に処理ガスのプラズマを用いてエッチング処理を施すプラズマ処理方法をコンピュータに実行させるプログラムを格納するコンピュータ読み取り可能な記憶媒体であって、
前記処理ガスはハロゲンガス、希ガス、及び還元ガスを含むことを特徴とする記憶媒体。 - コンデンサの誘電体部分としての高誘電率絶縁膜が形成された基板に処理ガスのプラズマを用いてエッチング処理を施すプラズマ処理装置であって、
前記処理ガスはハロゲンガス、希ガス、及び還元ガスを含むことを特徴とするプラズマ処理装置。 - 処理容器内で高誘電率絶縁膜、並びに窒化珪素膜又はSiO2膜を有する基板において、処理ガスのプラズマを用いて前記高誘電率絶縁膜をエッチングするプラズマ処理方法であって、
前記処理容器内に前記基板を搬入し、
前記処理容器内にハロゲン化合物ガス、還元ガス、希ガス及びキセノンガスを含む前記処理ガスを供給し、
前記処理容器内で前記処理ガスから前記プラズマを生成し、前記プラズマにより前記高誘電率絶縁膜をエッチングし、
前記高誘電率絶縁膜のエッチングでは、前記処理ガスに添加された前記キセノンガスが、前記ハロゲン化合物ガスからのハロゲンの解離を促進させ、前記高誘電率絶縁膜が高いエッチレートでエッチングされることを特徴とするプラズマ処理方法。 - 前記希ガスはヘリウムガス、ネオンガス、アルゴンガス及びクリプトンガスからなる群から選択された少なくとも1つであることを特徴とする請求項8記載のプラズマ処理方法。
- 前記還元ガスは水素ガス、一酸化炭素ガス、及びメタンガスからなる群から選択された少なくとも1つであることを特徴とする請求項8記載のプラズマ処理方法。
- 前記ハロゲン化合物ガスはC4F8ガスであり、前記還元ガスは一酸化炭素ガスであり、前記希ガスはアルゴンガスであることを特徴とする請求項8記載のプラズマ処理方法。
- 前記ハロゲン化合物ガスはC4F8ガスであり、前記還元ガスは水素ガスであり、前記希ガスはアルゴンガスであることを特徴とする請求項8記載のプラズマ処理方法。
- 前記高誘電率絶縁膜は、ハフニウム酸化膜、ジルコニウム酸化膜、及びアルミニウム酸化膜からなる群から選択された少なくとも1つであることを特徴とする請求項8記載のプラズマ処理方法。
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