JP2012107302A - Vapor deposition apparatus and vapor deposition method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a technology whereby vapor deposition of uniform distribution can be carried out at a high speed onto a surface of a deposition target.SOLUTION: A vapor deposition apparatus 10 has a vapor discharger 100 equipped with first to third box-shaped vapor branching parts 1-3 that are communicated with each other via connecting holes which branch in geometric series: 4(wherein n is a natural number) from an inlet toward an outlet of a vapor of an evaporation material. A plurality of vapor discharging outlets 3B are formed on an vapor-outlet end of the third vapor branching part 3 so as to discharge the vapor of the evaporation material in a planar form toward the deposition target.

Description

  The present invention relates to a vapor deposition technique in producing, for example, an organic EL display, an organic EL lighting device, a vapor deposition polymer film, and the like.

Conventionally, as this type of apparatus, for example, those described in Patent Documents 1 and 2 are known.
In the apparatuses described in Patent Documents 1 and 2, the introduced steam is caused to flow out of the plurality of outlets by branching the pipe.

  However, in the case of the prior art according to Patent Document 1, since the outflow openings for allowing the vapor to flow out are arranged in a row, it is difficult to make the in-plane distribution of the vapor flow uniform, especially for large substrates. There is a problem that uniform film formation cannot be performed.

  Moreover, in the prior art which concerns on patent document 2, it cannot perform co-evaporation using a vapor | steam of a different kind, For example, the host material and dopant material which are required when forming the light emitting layer of an organic EL element, etc. were used. Co-evaporation cannot be performed.

Furthermore, the conventional technique according to Patent Document 2 has a problem that the number of branching of the tube is 2 ^n-1 and the number of branches is very large, so that the diffusion speed is slow, the configuration is complicated, and the cost is high.
Furthermore, the apparatuses described in Patent Documents 1 and 2 have a problem that the conductance when flowing the steam through the curved pipe is small and high-speed film formation is difficult.

JP-A-7-90572 JP 2004-79904 A

  The present invention has been made to solve the problems of the conventional technique, and the object of the present invention is to provide a technique capable of performing vapor deposition with uniform distribution on the surface of the vapor deposition object at high speed. There is to do.

Another object of the present invention is to provide a technique capable of performing co-evaporation or vapor deposition polymerization using different evaporation materials.
Furthermore, another object of the present invention is to provide a vapor deposition technique with a simple apparatus configuration and low cost.

In order to achieve the above object, the present invention provides a vacuum chamber in which an object to be deposited is disposed, a vapor generation source provided outside the vacuum chamber, and a vapor of evaporation material supplied from the vapor generation source. In the form of a plane toward the deposition object, and the vapor discharger is 4 ^n-1 (n is a natural number) from the vapor introduction side to the emission side of the evaporation material. A plurality of box-shaped steam branch portions communicated through communication ports that branch stepwise in a geometric series, and the vaporization side end portion of the steam branch portion of the final stage among the steam branch portions, It is a vapor deposition apparatus provided with a plurality of vapor discharge ports for releasing vapor of material toward the vapor deposition object.
In the present invention, the steam discharger is also effective in the case where a box-shaped steam branching device having four steam discharge ports is overlapped with one steam inlet.
In the present invention, the plurality of vapor discharge ports of the vapor discharger are also effective when they are arranged so that the distances between adjacent vapor discharge ports are equal.
In the present invention, a plurality of branch piping sections branching stepwise in a geometric series of 4 ^n-1 (n is a natural number) from the vapor introduction side to the discharge side of the vaporized material in the vapor discharge device. A branch pipe device having a plurality of vapor discharge nozzles for discharging the vapor of the evaporating material is provided in a final branch pipe portion of the branch pipe portions; It is also effective when it is arranged inside the steam discharge port of the steam discharger.
In the present invention, the vapor generation source includes a plurality of evaporation sources that generate vapors of different evaporation materials, and a predetermined evaporation source among the plurality of evaporation sources is connected to the vapor discharger, and the plurality of the evaporation sources This is also effective when a predetermined evaporation source other than the predetermined evaporation source is connected to the branch pipe.
On the other hand, the present invention is a vapor deposition apparatus in which a plurality of the above-described vapor deposition apparatuses are arranged close to each other and configured to supply vapor of the evaporation material independently to the plurality of vapor deposition apparatuses. .
On the other hand, the present invention is a method for forming an organic film on the surface of an object to be vapor-deposited in a vacuum using any one of the above-described vapor deposition apparatuses, and forming an organic thin film layer of an organic EL device as the organic evaporation material. This is a vapor deposition method using a host material and a dopant material.

In the case of the present invention, the vapor discharger is communicated through a communication port that branches stepwise in a geometric series of 4 ^n-1 (n is a natural number) from the vapor introduction side to the discharge side of the vaporized material. A plurality of steams, each having a plurality of box-like steam branching parts, for releasing the vapor of the evaporation material in a plane toward the vapor deposition target at the end of the steam branching side of the steam branching part. Since the discharge port is provided, it is possible to release the vapor of the evaporation material after sufficiently diffusing in the vapor discharge device, so that the distribution is uniform on the surface of various deposition objects, particularly large substrates. A film can be formed.
In the present invention, since the vapor of the evaporation material is diffused through the plurality of box-shaped vapor branch portions, the conductance of the flowing vapor is large and the vapor deposition can be performed at a high speed.
In the present invention, when the steam discharge device is configured by stacking a box-shaped steam branching device having four steam discharge ports on one steam inlet, the configuration is simple and compact. A low-cost vapor deposition apparatus can be provided.
In the present invention, when the plurality of steam discharge ports of the steam discharger are arranged so that the distances between adjacent steam discharge ports are equal, the in-plane distribution of the steam discharged from each of the steam discharge ports is even more uniform. Therefore, the uniformity of the film formation on the surface of the deposition object can be further improved.
In the present invention, a branch having a plurality of branch pipe sections branching stepwise in a geometric series of 4 ^n-1 (n is a natural number) from the vapor introduction side to the discharge side of the vaporizer in the vapor discharger. A plumbing device is provided, and a plurality of vapor discharge nozzles that discharge vapor of the evaporation material are provided in the final branch piping portion of the branch piping portions, and the tip portions of the plurality of vapor discharge nozzles are the vapor discharge devices. If it is arranged inside the vapor discharge port, it is possible to diffuse the vapors of different kinds of evaporation materials without mixing them and release them toward the object to be vapor-deposited. It is possible to prevent cross-contamination of the evaporated material with the vessel.
On the other hand, in the case where any one of the above-described vapor deposition apparatuses is arranged close to each other and configured to supply vapor of the evaporation material independently to the plurality of vapor deposition apparatuses, the large substrate A film having a uniform distribution on the surface can be formed.
Further, according to the present invention, it is possible to perform film formation on deposition objects having various shapes and sizes by operating only a predetermined one of the plurality of deposition apparatuses.
On the other hand, when any one of the above-described vapor deposition apparatuses is used and the host material and the dopant material for forming the organic thin film layer of the organic EL device are used as the organic evaporation material, the organic thin film of the large organic EL device is uniformly formed. Vapor deposition can be performed with a suitable film thickness and quality.

ADVANTAGE OF THE INVENTION According to this invention, the technique which can perform vapor deposition with uniform distribution on the surface of a vapor deposition target object at high speed can be provided.
Further, according to the present invention, co-evaporation or vapor deposition polymerization can be performed using different evaporation materials.
Furthermore, according to the present invention, it is possible to provide a vapor deposition technique that is simple and inexpensive.

The perspective view which shows the inside of the vapor deposition apparatus which concerns on this invention (A) (b): The perspective view which shows the structure of the vapor | steam discharger of the vapor deposition apparatus. (A) (b): The top view which shows the positional relationship of the steam inlet and steam outlet in the embodiment The perspective view which shows the other example of the planar steam discharger used for this invention (A) (b): Schematic diagram showing the internal configuration of a coplanar steam discharger The top view which shows the vapor deposition apparatus using the same surface-like vapor discharger The schematic block diagram which shows the principal part of other embodiment of this invention Schematic configuration diagram showing another embodiment of the present invention The top view which shows other embodiment of this invention

Hereinafter, embodiments for carrying out the present invention will be described with reference to the drawings.
FIG. 1 is a perspective view showing the inside of a vapor deposition apparatus according to the present invention, and FIGS. 2A and 2B are perspective views showing a configuration of a vapor discharger of the vapor deposition apparatus. FIGS. 3A and 3B are plan views showing the positional relationship between the steam inlet and the steam outlet in the same embodiment.

Hereinafter, the vertical relationship will be described based on the configuration shown in FIGS. 1 and 2, but the present invention is not limited to this.
As shown in FIG. 1 or 2, the vapor deposition apparatus 10 of the present embodiment is a vapor discharger that emits vapor of an evaporation material in a plane toward a substrate (deposition target) 5 in a vacuum chamber (not shown). 100 is provided.

The vapor discharger 100 is provided below the substrate 5 in the vacuum chamber, and is composed of a plurality of (first to third in the present embodiment) vapor branchers 1, 2, and 3 that are vapor branches. ing.
As will be described later, this vapor discharger 100 has a plurality of connections that branch (increase) stepwise in a geometric series of 4 ^n-1 (n is a natural number) from the organic material vapor introduction side to the emission side. Has a mouth.

  As shown in FIG. 2A, the first steam branching device 1 of the present embodiment is a box shape made of a metal material such as stainless steel (in this example, a rectangular parallelepiped shape whose width and depth are larger than the height). It consists of a member, that is, a cell box.

  In the central portion of the bottom surface 1a of the first steam branch 1, a steam inlet 1A for introducing the vapor of the evaporation material is provided. On the other hand, four steam discharge ports 1B for discharging the vapor of the evaporation material are provided at the four corners of the upper surface 1b of the steam branch.

  In the case of the present invention, there is no particular limitation, but from the viewpoint of forming a more uniform film thickness and film quality, on the upper surface 1b of the first steam branching device 1, the adjacent steam release in the same plane. It is preferable that the distance between the outlets 1B be equal. From the same viewpoint, it is preferable to provide the steam inlet 1A at the center of gravity with respect to the four steam outlets 1B.

  In the case of the present invention, although not particularly limited, the sum of the areas of the vapor discharge ports 1B is determined from the viewpoint of not causing the reverse flow of the vapor of the organic material, that is, maintaining the pressure gradient. It is preferable to set so as not to be larger (smaller) than the area of 1A.

And in this Embodiment, as shown in FIG.2 (b), the 4th 2nd steam branch 2 is attached to the upper surface 1b of the 1st steam branch 1 which has the said structure.
The basic structure of the second steam branching device 2 is the same as that of the first steam branching device 1 and is different from the first steam branching device 1 in that its size is smaller than that of the first steam branching device 1.

  That is, the steam inlet 2A for introducing the vapor of the evaporating material is provided in the central portion of the bottom surface of the second steam branch 2, while the four corners of the upper surface 2b of the second steam branch 2 are evaporated. Four steam discharge ports 2B for discharging the material vapor are provided.

  In this case, the second steam branch is connected to the upper surface 1b of the first steam branch 1 so that the steam outlet 1B of the first steam branch 1 and the steam inlet 2A of the second steam branch 2 are connected. Each container 2 is arranged. The steam outlet 1B of the first steam branch 1 and the steam inlet 2A of the second steam branch 2 constitute a communication port.

  In the case of the present invention, although not particularly limited, from the viewpoint of preventing the reverse flow of the vapor of the organic material, that is, maintaining the pressure gradient, the vapor discharge port 2B is also provided in the second vapor branching device 2. It is preferable to set so that the sum of the areas does not become larger (smaller) than the area of the steam inlet 2A.

Furthermore, in the present embodiment, as shown in FIG. 1, four third steam branching devices 3 are fixed to the upper surface 2 b of each second steam branching device 2.
The basic configuration of the third steam branching device 3 is the same as that of the first and second steam branching devices 1 and 2, and the size thereof is smaller than that of the first and second steam branching devices 1 and 2.

In this case, the third steam is connected to the upper surface 2b of each second steam branch 2 so that the steam discharge port 2B of the second steam branch 2 and the steam inlet 3A of the third steam branch 3 are connected. Each branching device 3 is arranged. The steam outlet 2B of the second steam branch 2 and the steam inlet 3A of the third steam branch 3 constitute a communication port.
Further, the upper surface 3b of the third steam branching device 3 is provided with steam discharge ports 3B at the four corner portions, respectively.

  In the present invention, there is no particular limitation, but from the viewpoint of preventing the reverse flow of the vapor of the organic material, that is, maintaining the pressure gradient, the area of the vapor discharge port 3B also in the third vapor branch 3 Is preferably set so as not to be larger (smaller) than the area of the steam inlet 3A.

As shown in FIGS. 3 (a) and 3 (b), the vapor discharge ports 3 </ b> B of the present embodiment are preferably arranged in the same horizontal plane and are arranged at the positions of the apexes of a square indicated by reference numeral 16. That is, it is preferable to configure the upper surface 3b of the third steam branch 3 so that the distances between the adjacent steam discharge ports 3B are equal (P ₁ ).

Furthermore, in the case of the present invention, although not particularly limited, from the viewpoint of forming a more uniform film thickness and film quality, the adjacent third steam branching units 3 also relate to the X direction and the Y direction. It is preferable that the distances between the adjacent vapor discharge ports 3B are equal (P ₂ ) and the distances between all the adjacent vapor discharge ports 3B are equal (P ₁ = P _2). ).
From the same viewpoint, it is preferable to provide the steam inlet 3A at the center of gravity with respect to the four steam outlets 3B.

Furthermore, in the case of the present invention, although not particularly limited, from the viewpoint of forming a more uniform film thickness and film quality, the adjacent second steam branch 2 and the second steam branch 2 are adjacent to each other. In the same plane, the distances between the adjacent vapor discharge ports 2B are equal in the X direction and the Y direction, and the distances between all the adjacent vapor discharge ports 2B are equal. It is preferable.
From the same viewpoint, it is preferable to provide the steam inlet 2A at the position of the center of gravity with respect to the four steam outlets 2B.

On the other hand, as shown in FIG. 1, in the case of the present embodiment, the first vapor branching device 1 is a plurality of vapor generation sources (two in this example) for forming an organic layer of an organic EL device, for example. The host material evaporation source 21 and the dopant material evaporation source 31 are connected.
Here, the host material 50h for forming an organic thin film of the organic EL element is accommodated in the evaporation container of the host material evaporation source 21.

Further, in the evaporation container of the dopant material evaporation source 31, a dopant material 50d for forming an organic thin film of the organic EL element is accommodated.
A heating unit 20 is disposed around the host material evaporation source 21 and the dopant material evaporation source 31.

  The host material evaporation source 21 and the dopant material evaporation source 31 are connected to carrier vapor supply devices 17h and 17d, respectively, and the carrier gas supplied from the carrier vapor source 18 is the host material evaporation source 21 and the dopant material evaporation source, respectively. It is comprised so that it may be supplied to 31.

Further, in the case of this example, the host material evaporation source 21 is connected to the supply pipe 6h via the valve 22, and the dopant material evaporation source 31 is connected to the supply pipe 6d via the valve 32.
In the vicinity of the supply pipe 6h and the supply pipe 6d, vapor discharge nozzles 7h and 7d having small conductances are provided, respectively, and the amount of vapor of the organic material discharged from the vapor discharge nozzles 7h and 7d is determined by the film thickness sensor 8h. , 8d, respectively.
Further, although not shown in detail, a heater for heating the vapor discharger 100 during vapor deposition is provided in the vapor discharger 100 described above.

  In the present embodiment having such a configuration, when an organic material film is deposited on the substrate 5, the supply pipe is supplied from the host material evaporation source 21 with the pressure in the vacuum chamber kept at a predetermined pressure. The vapor of the host material 50h is introduced into the first vapor branching device 1 through 6h.

Further, the vapor of the dopant material 50d from the dopant material evaporation source 31 is introduced into the first vapor branching device 1 through the supply pipe 6d.
The vapor of the host material 50h and the vapor of the dopant material 50d introduced into the first steam branch 1 are branched and diffused by the first steam branch 1, the second steam branch 2, and the third steam branch 3 to be steam. It passes through the discharger 100 and is discharged in a planar shape from each vapor discharge port 3B of the third vapor branching device 3 which is the final stage toward the substrate 5, thereby forming a vapor deposition film of an organic material on the entire surface of the substrate 5. Is done.

As described above, according to the present embodiment, the vapor discharger 100 is branched stepwise in a geometric series of 4 ^n-1 (n is a natural number) from the vapor introduction side to the discharge side of the organic material. 1 to 3 steam branching devices 1 to 3 having communication ports to be connected to the end of the steam discharge side of the third steam branching device 3 in the final stage among the first to third steam branching devices 1 to 3. Since the plurality of vapor discharge ports 3B are respectively provided, the vapor of the evaporation material is sufficiently diffused in the vapor discharge device 100, and then the vapor of the organic material is discharged in a plane from the plurality of vapor discharge ports 3B. This makes it possible to perform film formation with a uniform distribution, particularly on the surface of a large substrate.

Moreover, in this Embodiment, since the 1st-3rd vapor | steam branching parts 1-3 are formed in the box shape, the conductance of the vapor | steam which flows is large compared with the case of piping, and it can vapor-deposit at high speed. it can.
Further, in the present embodiment, in the steam discharger 100, the steam discharge ports 1B to 3B in the first to third steam branching units 1 to 3 are arranged in the same plane, and the first to third steam branching are performed. The steam discharge ports 1B to 3B in the devices 1 to 3 are discharged from the steam discharge ports 3B in the third steam branching device 3 by disposing the steam discharge ports 1B to 3B adjacent to each other at an equal distance. Since the in-plane distribution of the vapor of the organic material becomes more uniform, the film thickness and the film quality uniformity with respect to the surface of the substrate 5 can be further improved.

  On the other hand, according to the present embodiment, the branching series of piping can be reduced as compared with the prior art, and furthermore, the steam branching device 100 is configured using a cell box, so the configuration is simple and compact. The vapor deposition apparatus 10 can be provided.

  Thus, according to the present embodiment, by using the host material and the dopant material for forming the organic thin film layer of the organic EL device, the organic thin film of the large organic EL device can be formed with a uniform film thickness and film quality. Vapor deposition can be performed.

  Further, in the present embodiment, a plurality of vapor generation sources that generate different vapors, that is, the host material evaporation source 21 and the dopant material evaporation source 31 are introduced into the vapor branching device 100 through the supply pipe 6h and the supply pipe 6d. Thus, the uniform vapor deposition can be performed on the surface of the substrate 5 by surely mixing different vapors.

  FIG. 4 is a perspective view showing another example of a planar steam discharger used in the present invention, FIGS. 5A and 5B are schematic views showing the internal configuration of the planar steam discharger, and FIG. These are top views which show the vapor deposition apparatus using the same surface-shaped vapor | steam discharger.

In the following, parts corresponding to those in the above embodiment are given the same reference numerals, and detailed description thereof is omitted.
As shown in FIGS. 4, 5 (a), 5 (b), and 6, the steam discharger 100 </ b> A of this example is provided in the vacuum chamber 4, and the first to third steam branching devices 1 to 3 described above are provided. The first to third steam branching units 101 to 103 are formed of cell boxes having the same size as the case where the three are combined.

  Here, the volume of the second steam branch 102 is larger than the volume of the first steam branch 101, and further, the volume of the third steam branch 103 is larger than the volume of the second steam branch 102, A second steam branch 102 is attached on the first steam branch 101, and a third steam branch 103 is attached on the second steam branch 102.

  Below the first steam branch 101, there is provided a steam introduction part 107 for introducing the vapor of the evaporation material from a steam supply source (not shown) through the supply pipe 106. The steam introduction part 107 and the first steam branch are provided. The vessel 101 is communicated through one communication port 108.

In the vapor deposition apparatus 10A of the present embodiment, a plurality of communication branches (increases) stepwise in a geometric series of 4 ^n-1 (n is a natural number) from the vapor introduction side to the emission side of the organic material. Has a mouth. That is, four first communication ports 104 are provided between the first steam branch and the second steam branch, and eight are provided between the second steam branch and the third steam branch. The second communication port 105 is provided. And 64 vapor | steam discharge ports 103B are provided in the upper surface of the 3rd vapor branching device.

In the case of the present invention, although not particularly limited, from the viewpoint of forming a film having a more uniform film thickness and film quality, the first and second communication ports 104 and 105 are formed of the above-described vapor discharge port 1B (vapour. More preferably, the inlet 2A) and the steam outlet 2B (steam inlet 3A) are provided under the same conditions, and the steam outlet 103B is also provided under the same conditions as the above-described steam outlet 3B. It is preferable.
According to this example having such a configuration, since it is easy to manufacture, the cost can be reduced. Further, when the steam branch becomes non-equilibrium (asymmetric), it becomes possible to return to equilibrium again.

FIG. 7 is a schematic configuration diagram showing a main part of another embodiment of the present invention. Hereinafter, parts corresponding to those of the above embodiment are given the same reference numerals, and detailed description thereof is omitted.
As shown in FIG. 7, the vapor deposition apparatus 10 </ b> B of the present embodiment is provided with a vapor discharger 100 </ b> B corresponding to the vapor discharger 100 shown in FIGS. 1 to 3 (a) and 3 (b) in the vacuum chamber 4. ing.

This steam discharger 100B includes a box branching unit 11 having the same basic configuration as the first to third steam branching units 1-3, and an inner branching unit 12 is provided in the box branching unit 11. ing.
The box branching device 11 is provided with a steam introducing portion 13 at the lower part of the first steam branching device 1 so as to communicate with the first steam branching device 1, and for example an organic EL via a supply pipe 6 h to the steam introducing portion 13. It is connected to a host material evaporation source (not shown) for forming the organic layer of the device.

On the other hand, the inner branching device 12 is formed by integrally connecting pipes made of, for example, a metal material by a joint or the like, and 4 ^n-1 (n is a natural number) from the vapor introduction side to the emission side of the organic material. ), A plurality of (first to third in this embodiment) branch piping sections 121 to 123 branch in stages.

  Here, the inner branching device 12 introduces vapor connected to a dopant material evaporation source (not shown) for forming an organic layer of an organic EL device, for example, via a supply pipe 6d different from the supply pipe 6h. Part 14.

  And in the 1st steam branching device 1 of the box branching device 11, the 1st branch joint 51 attached to the upper part of the steam introduction part 14 is arrange | positioned. The first branch joint 51 is provided with, for example, four first horizontal piping parts 51H that extend in the horizontal direction and are connected so that the angle of adjacent ones is 90 degrees, and further, the first horizontal piping part 51H. For example, first vertical piping parts 51V extending vertically upward are attached to the respective front end parts.

  Here, each of the four first vertical pipe portions 51 </ b> V has a first end portion via a communication port 11 a provided between the first steam branching device 1 and the second steam branching device 2 of the box branching device 11. The second branch joint 52 is attached to the distal end portion (upper end portion) of the first vertical piping portion 51V.

  For example, four second horizontal piping parts 52H configured to extend in the horizontal direction and have an angle of 90 degrees adjacent to each other are attached to each second branch joint 52. Furthermore, the 2nd vertical piping part 52V which extends each vertically upward is attached to the front-end | tip part of the 2nd horizontal piping part 52H, for example.

  Here, each 2nd vertical piping part 52V has a box branching device at each front-end | tip part via the communicating port 12a provided between the 2nd steam branching device 2 and the 3rd steam branching device 3 of the box branching device 11. 11 and the third branch joint 53 is attached to the tip (upper end) of the second vertical pipe portion 52V.

  Each of the third branch joints 53 is attached with, for example, four third horizontal pipe parts 53H configured to extend in the horizontal direction and have an angle of 90 degrees adjacent to each other. For example, a vapor discharge nozzle 53N extending vertically upward is attached to the tip of 53H.

Here, the front end portion (upper end portion) of each steam discharge nozzle 53N is disposed in a steam discharge port 13a provided on the upper surface of the third steam branching device 3.
In the case of the present invention, there is no particular limitation, but from the viewpoint of forming a film with a more uniform film thickness and film quality, the length of the horizontal pipe section and the vertical pipe section of the same stage are equal. It is preferable to do.

  Further, the box branching device 11 is not particularly limited. However, from the viewpoint of forming a film with a more uniform film thickness and film quality, the first to third steam branching units 1 to 3 and the first ones adjacent to each other. In the same plane, the distances between the adjacent communication ports 11a, 12a and the vapor discharge port 13a are equal and all adjacent to each other in the same plane with respect to the third steam branching units 1-3. It is preferable that the distance between the steam discharge ports 13a be equal.

Although not shown in detail, a heater for heating the vapor discharger 100A at the time of vapor deposition is provided in the vapor discharger 100A.
In the present embodiment having such a configuration, when a film of an organic material is deposited on the substrate 5, the supply pipe 6h and the vapor introduction part are kept in a state where the pressure in the vacuum chamber 4 is set to a predetermined pressure. For example, the vapor of the host material is introduced into the box branching device 11 through 13.

For example, the vapor | steam of the said dopant material is introduce | transduced in the inner branching device 12 through the supply pipe | tube 6d and the vapor | steam introducing | transducing part 14. FIG.
The steam of the host material introduced into the box branching device 11 is branched and diffused by the first steam branching device 1, the second steam branching device 2, and the third steam branching device 3, and the third steam branching device 3 as the final stage. Are discharged in a plane from the respective vapor discharge ports 13 a toward the substrate 5.

On the other hand, the vapor of the dopant material introduced into the inner branching device 12 is the first branch joint 51, the first horizontal pipe part 51H, the vertical pipe part 51V, the second branch joint 52, the second horizontal pipe part 52H, the second It is branched and diffused by the vertical pipe portion 52V, the third branch joint 53, and the third horizontal pipe portion 53H, and is discharged in a planar shape from the vapor discharge nozzle 53N toward the substrate 5.
Thereby, for example, a film of the host material and the dopant material is co-evaporated on the entire surface of the substrate 5.

As described above, according to the present embodiment, in addition to the effects of the above embodiment, the vapors of different types of evaporation materials can be diffused and released toward the substrate 5 without mixing, Cross contamination of the evaporation material between the box branching device 11 and the inner branching device 12 can be prevented.
Since other configurations and operational effects are the same as those of the above-described embodiment, detailed description thereof is omitted.

FIG. 8 is a schematic configuration diagram showing another embodiment of the present invention. Hereinafter, the same reference numerals are given to portions corresponding to the above-described embodiment, and detailed description thereof will be omitted.
As shown in FIG. 8, a vapor deposition apparatus 10C for organic EL production according to the present embodiment includes a box branching device 11 having the same configuration as the vapor discharger 100A shown in FIGS. 4 to 6, and an inner branching device shown in FIG. And a steam discharger 100 </ b> C combined with 12.

Here, the steam discharger 100 </ b> C has a steam introduction part 11 a that introduces steam into the box branching device 11 and a steam introduction part 12 a that introduces steam into the inner branching device 12.
On the other hand, outside the vacuum chamber 4 are provided first to third evaporation sources 7 to 9 for forming an organic layer by vapor deposition.

  The first evaporation source 7 includes, for example, a hole injection layer material evaporation source 71, a hole transport layer material evaporation source 72, a first host material evaporation source 73, a second host material evaporation source 74, and a third host material evaporation source 75. The fourth host material evaporation source 76 is connected to the supply pipe 6h connected to the steam introducing portion 11a of the box branching device 11 via a valve 70 that can be switched independently.

  For example, the first assistant dopant material evaporation source 81 and the second assistant dopant material evaporation source 82 are independently switched to the supply pipe 6 d connected to the vapor introducing portion 11 a of the box branching device 11. Each is connected via a possible valve 80.

  The third evaporation source 9 is, for example, the first dopant material evaporation source 91, the second dopant material evaporation source 92, the third dopant material evaporation source 93, and the fourth dopant material evaporation source 94 are the vapor introduction part of the box branching device 11. The supply pipe 6a connected to 12a is connected to each other via an independently switchable valve 90.

In the present embodiment having such a configuration, in addition to the same effects as in the above-described embodiment, the first to third steam supply sources 7 to 9 supply the vapor of the organic material supplied to the steam discharger 100C. Since the valves 70 to 90 that independently control the amount are respectively provided, a full color or white organic layer is laminated by using the vapors of the organic materials of the three primary colors of light by switching the valves 70 to 90. It becomes possible.
Since other configurations and operational effects are the same as those of the above-described embodiment, detailed description thereof is omitted.

FIG. 9 is a plan view showing another embodiment of the present invention. Hereinafter, the same reference numerals are given to the portions corresponding to the above-described embodiment, and the detailed description thereof will be omitted.
As shown in FIG. 9, a vapor deposition apparatus 10D of the present embodiment has a plurality of the vapor deposition apparatuses 10, 10A, 10B, and 10C described above, that is, 3 × 4 arranged side by side.

Although not shown in detail, each of the vapor deposition apparatuses 10, 10A, 10B, and 10C has an independently controllable vapor supply source, and each vapor supply source is connected to the vapor discharge device via the supply pipe described above. Has been.
The positions of the vapor discharge ports 110 are set so that the distances between adjacent ones are equal.

According to this embodiment having such a configuration, it is possible to form a film with a uniform distribution on the surface of a very large substrate.
In addition, according to the present embodiment, only predetermined ones of the twelve vapor deposition apparatuses 10, 10A, 10B, and 10C are operated to form a film on vapor deposition objects having various shapes and sizes. It can be carried out.
Since other configurations and operational effects are the same as those of the above-described embodiment, detailed description thereof is omitted.

The present invention is not limited to the above-described embodiment, and various changes can be made.
For example, in the above-described embodiment, the adjacent steam discharge ports are arranged at the positions of the apexes of the square so that the distances between the steam discharge ports are equal. However, the present invention is not limited to this, and the steam discharge ports are not limited to this. It is also possible to place the exit at the position of a rectangular vertex.
However, from the viewpoint of performing more uniform film formation, the vapor discharge ports are arranged at the positions of the apexes of the square as in the above embodiment, so that the distances between adjacent vapor discharge ports are equal. It is preferable.

  Further, in the above embodiment, the steam is released upward with the steam outlet facing upward, but the present invention is not limited to this, and the steam is directed diagonally up and down, horizontally or vertically downward. It can also be released.

On the other hand, the number of steam branching portions of the steam discharger is not limited to the above embodiment, and two or four or more may be provided.
However, from the viewpoint of dealing with a large substrate, it is preferable to provide three or more steam branching portions as in the above embodiment, thereby providing 64 or more steam discharge ports.

Furthermore, the present invention can be applied not only when the organic layer of the organic EL device is formed, but also when the electrode layer of the organic EL device is formed.
In addition, the present invention can also be applied to an apparatus for performing vapor deposition polymerization using a plurality of raw material monomers.

1 ... 1st steam branch (steam branch)
2 ... Second steam branch (steam branch)
3 ... Third steam branch (steam branch)
3B ... Vapor discharge port 4 ... Vacuum chamber 5 ... Substrate (deposition target)
10 ... Vapor deposition apparatus 21 ... Host material evaporation source (steam generation source)
31 ... Dopant material evaporation source (steam generation source)
100: Steam discharger

Claims (7)

A vacuum chamber in which a deposition object is arranged;
A steam generation source provided outside the vacuum chamber;
A vapor discharger for discharging the vapor of the evaporation material supplied from the vapor generation source in a plane toward the deposition object;
The steam discharger is a plurality of boxes communicated via a communication port that branches stepwise in a geometric series of 4 ^n-1 (n is a natural number) from the vapor introduction side to the discharge side of the evaporating material. And a plurality of vapor discharge ports for releasing the vapor of the evaporation material toward the deposition target are provided at the vapor discharge side end of the final vapor branch portion of the vapor branch portions. Vapor deposition equipment.   The vapor deposition apparatus according to claim 1, wherein the vapor discharge device is configured by stacking a box-shaped vapor branching device having four vapor discharge ports with respect to one vapor introduction port.   The vapor deposition apparatus according to any one of claims 1 and 2, wherein the plurality of vapor discharge ports of the vapor discharger are arranged so that distances between adjacent vapor discharge ports are equal. A branch pipe having a plurality of branch pipe sections branched in stages in a geometric series of 4 ^n-1 (n is a natural number) from the vapor introduction side to the discharge side of the vapor material in the vapor discharge unit. And a plurality of vapor discharge nozzles for releasing the vapor of the evaporation material are provided in the final branch pipe portion of the branch pipe portions, and the tip portions of the plurality of vapor discharge nozzles are provided in the steam discharge device. The vapor deposition apparatus of any one of Claims 1 thru | or 3 arrange | positioned inside a vapor | steam discharge port.   The vapor generation source includes a plurality of evaporation sources that generate vapors of different evaporation materials, and a predetermined evaporation source among the plurality of evaporation sources is connected to the vapor discharge device, and the plurality of evaporation sources The vapor deposition apparatus according to claim 4, wherein a predetermined evaporation source other than the predetermined evaporation source is connected to the branch pipe.   A vapor deposition apparatus in which a plurality of vapor deposition apparatuses according to any one of claims 1 to 5 are arranged close to each other and configured to supply vapor of an evaporation material independently to the plurality of vapor deposition apparatuses. A method for forming an organic film on a surface of a vapor deposition object in a vacuum using the vapor deposition apparatus according to claim 1,
A vapor deposition method using a host material and a dopant material for forming an organic thin film layer of an organic EL device as the organic evaporation material.

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