JP2010013731A - Vapor deposition apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a vapor deposition apparatus which can more uniformly vapor-deposit an evaporation material on a wide surface to be vapor-deposited of a member to be vapor-deposited. <P>SOLUTION: The vapor deposition apparatus for depositing an evaporation material which has been evaporated onto a glass substrate W has: a discharging container 15 provided therein that communicates with an outlet 13a of a passage 13 for the evaporation material, which is arranged so as to face the glass substrate W, and that has a spreading space 16 formed in the inner part; a plurality of discharging holes 17 drilled in a predetermined position on the glass substrate W side of the discharging container 15 except the position which faces the outlet 13a of the passage 13 for the evaporation material; and a reflection face plate 61A provided in the spreading space 16, which faces the outlet 13a of the passage 13 for the evaporation material and reflects particles of the evaporated material. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a vapor deposition apparatus for manufacturing an image display unit such as an organic EL display in a vacuum atmosphere or an inert gas atmosphere.

  In recent years, thinning of displays has progressed, and as this type of display, liquid crystal displays have been put to practical use. This liquid crystal screen requires a backlight and has difficulties in view range, power consumption, etc. Recently, a self-luminous organic EL display has been attracting attention.

  By the way, the basic structure of the organic EL display is an arrangement in which an anode (transparent electrode) is arranged on a glass substrate, a hole transport layer and a light emitting layer are arranged in this order, and a cathode is further arranged. At least for the light emitting layer, an organic material is formed by vapor deposition.

  When a thin film is formed on the substrate by vapor deposition, an organic material evaporation source is placed in a vacuum vessel, the evaporation source is heated in a vacuum state, and the vapor is also emitted from the substrate placed in the vacuum vessel. A thin film was formed by adhering to the surface.

  By the way, an increase in the size of a display is promoted, and even a small display is manufactured by dicing from a large glass substrate. Therefore, it is important to uniformly deposit an organic material on a large glass substrate. When the dilute fluid such as the evaporation material particles is discharged from the discharge hole, it spreads according to the cosine law and is deposited on the glass substrate surface, and the deposition amount tends to be thick at the center of the deposition surface.

In Patent Document 1, the diameter of the discharge hole formed in the discharge part (large diameter pipe) connected to the transfer part (small diameter pipe) on one end side is formed with a small diameter on one end side and a large diameter on the other end side. ing.
In Patent Document 2, two vapor deposition sources are movably disposed under a rotary wafer table in a vapor deposition chamber via a swivel vapor deposition boat, which is displaced from the center of the wafer supported by the wafer table. The vapor deposition source is moved to a different position. Thereby, the evaporation material discharged from the evaporation source can be uniformly evaporated on the surface of the wafer while rotating the wafer.

JP 2002-249868 JP 2002-167664 A (FIG. 2)

  However, in Patent Document 1, there is no problem when the vapor deposition area of the vapor deposition member is small, but the length of the discharge portion becomes longer as the vapor deposition area becomes larger. It may be difficult to release the material evenly.

  Further, in Patent Document 2, the vapor deposition member is held by an adsorber, but when the vapor deposition area of the vapor deposition member becomes large and rotates, the mechanism for holding and rotating the vapor deposition member becomes large and rotates. The accuracy of the member to be deposited at the time is required, and the design burden increases.

  An object of the present invention is to solve the above problems and to provide a vapor deposition apparatus capable of vapor deposition more uniformly on a wide vapor deposition surface of a vapor deposition material.

According to a first aspect of the present invention, in the vapor deposition apparatus for attaching the evaporated evaporation material to the vapor deposition member, the vapor deposition device communicates with the vaporization material passage outlet disposed opposite to the vapor deposition member and has a diffusion space therein. A discharge container is provided, a reflection member is provided in the diffusion space of the discharge container so as to be opposed to the evaporating material passage outlet and to reflect the evaporating material particles, and is opposed to the evaporating material passage outlet on the vapor deposition member side of the discharging container. A plurality of discharge holes are formed at predetermined positions including the part .

According to a second aspect of the present invention, in the configuration according to the first aspect, the reflecting member is arranged so that the opening area per unit area is enlarged from the central portion facing the evaporating material passage outlet toward the outer peripheral side. A plurality of adjustment through holes are formed.

According to a third aspect of the present invention, in the vapor deposition apparatus for adhering the evaporated evaporation material to the vapor deposition member, the vapor deposition device communicates with the vaporization material passage outlet disposed opposite to the vapor deposition member and has a diffusion space therein. A dispersion container is provided, and a dispersion / transmission plate having a plurality of through holes that divides a space part on the evaporative material passage outlet side and a space part on the discharge hole side is disposed in the diffusion space of the discharge container, A reflective portion for reflecting the vaporized material particles is provided at a portion facing the vaporized material passage outlet, and a plurality of discharge holes are formed at predetermined positions including the portion opposed to the vaporized material passage outlet on the vapor deposition member side of the discharge container. It has been drilled.

According to a fourth aspect of the present invention, in the configuration according to the third aspect , a plurality of the reflecting portions are arranged such that an opening area per unit area is enlarged from the central portion facing the evaporating material passage outlet toward the outer peripheral side. This adjustment hole is perforated.

According to a fifth aspect of the present invention, in the configuration according to the first or third aspect, the evaporating material passage is provided with a buffer member for buffering the flow of the evaporating material.
According to a sixth aspect of the present invention, in the configuration according to the fifth aspect, the buffer member is composed of a plurality of buffer plates that are arranged at predetermined intervals and formed with a plurality of through holes. The through holes are arranged so as to be displaced.

According to the first aspect of the present invention, the evaporated material particles reflected and diffused on the inner surface of the discharge container are discharged from the discharge holes of the rotating discharge container, so that the evaporated material particles are effectively diffused. Thus, even if the deposition surface of the deposition member is wide, the evaporation material can be uniformly deposited (the film thickness distribution according to the cosine law is flattened). In addition, since the evaporation material particles discharged to the diffusion space at a higher density from the outlet of the evaporation material passage to the diffusion space are reflected and diffused by the reflection member, the portion facing the evaporation material passage outlet (the evaporation material passage of the reflection member) The density of the evaporating material reaching the other side of the outlet) can be reduced. Therefore, conventionally, since the density of the evaporating material particles is concentrated, there is a restriction that the discharge hole cannot be formed at a portion facing the evaporating material passage outlet. However, there is no restriction on the formation position of the emitting hole by the reflecting member. . As a result, the discharge holes can be drilled and arranged at arbitrary positions of the discharge container where the evaporation material particles can be uniformly deposited on the deposition surface, and more uniform deposition can be realized.

According to the invention of claim 2, the density of the evaporation material particles on the opposite side of the reflection material passage outlet of the reflection member is reduced by increasing the transmittance of the outer peripheral portion of the reflection member at a low central portion. It can be made more uniform with other diffusion space parts, and the amount of vaporized material released from each discharge hole can be made uniform, so that a vapor deposition film having a uniform thickness can be formed on the vapor deposition surface.

According to the third aspect of the present invention, the evaporation material particles released from the outlet of the evaporation material passage to the diffusion space are diffused while being reflected by the inner surface of the discharge container and the dispersion transmission plate, and further, the transmission of the dispersion transmission plate. It is diffused while passing through the hole to the space on the discharge hole side, and the density of the evaporated material particles is made uniform and can be discharged from the discharge hole. In addition, the reflecting part of the dispersion transmission plate eliminates the restriction on the formation position of the discharge hole, and the discharge hole can be drilled and arranged so that the evaporation material particles are uniformly deposited on the deposition surface. The surface can be deposited with a uniform film thickness.

According to the fourth aspect of the present invention, the adjustment material has a small transmittance at the central portion of the reflection portion and an increase in the transmittance at the outer peripheral portion, thereby evaporating material particles in the space portion on the discharge hole side of the reflection portion. Can be made uniform with other diffusion space portions, and the amount of vaporized material released from each discharge hole can be made uniform to form a vapor deposition film having a uniform thickness.

According to the fifth aspect of the present invention, since the buffer member is provided in the evaporating material passage, even if the evaporating material may flow into the evaporating material passage rapidly, this is buffered and the flow rate of the evaporating material is made uniform. Therefore, film thickness control on the deposition surface can be appropriately performed.

According to invention of Claim 6, the buffer effect of the evaporating material which flows in rapidly is high by arrange | positioning many through-holes in a several buffer plate in position shift.

It is a whole longitudinal cross-sectional view which shows the 1st example of Example 1 of the vapor deposition apparatus which concerns on this invention. (A)-(c) shows the 1st example of Example 1 , (a) is a disassembled perspective view which shows a discharge container, (b) is a top view of a reflecting plate, (c) is an arrangement part of a reflecting plate. It is side surface sectional drawing. (A)-(c) shows the 2nd example of Example 1 , (a) is a disassembled perspective view which shows a discharge container, (b) is a top view of a reflecting plate, (c) is an arrangement part of a reflecting plate. It is side surface sectional drawing. (A)-(c) shows the 3rd example of Example 1 , (a) is a disassembled perspective view which shows a discharge container, (b) is a top view of a reflector, (c) is an arrangement part of a reflector. It is side surface sectional drawing. (A)-(c) shows the 1st example of Example 2 of the vapor deposition apparatus based on this invention, (a) is a disassembled perspective view which shows a discharge container, (b) is a top view of a reflecting plate, (c) These are side surface sectional drawings of the arrangement | positioning part of a reflecting plate. (A)-(c) shows the 2nd example of Example 2 , (a) is a disassembled perspective view which shows a discharge container, (b) is a top view of a reflecting plate, (c) is an arrangement part of a reflecting plate. It is side surface sectional drawing. Shows an embodiment 3 according to the present invention, is an overall longitudinal sectional view in which a buffer plate in Example 1. It is explanatory drawing of the evaporative material channel | path which shows the same buffer plate.

Embodiments of the present invention will be described below with reference to the drawings .
[ Example 1]
As shown in FIG. 1, a vapor deposition chamber 1 for depositing, for example, an organic EL material is provided in a vapor deposition container 2 on the surface (lower surface) of a glass substrate W as a vapor deposition member in a vacuum atmosphere. The container 2 is formed with a vacuum port 4A that is brought into a vacuum atmosphere by a vacuum unit (not shown) and a substrate exchange port 4B with a gate valve (gate valve) through which a glass substrate W as a material to be deposited can be taken in and out. Yes. A work holder 3 for holding the glass substrate W is provided on the upper part of the vapor deposition container 2, and the evaporation material is evaporated from below on the lower surface (deposition surface) of the glass substrate W held by the work holder 3. It is configured as an up-blow type.

An evaporation container 6 for forming an evaporation chamber 5 is provided below the evaporation container 2, and a container mounting table 8 having a heating heating wire (heating means) 8 a for heating and evaporating the material in the evaporation container 6. The material container 7 is accommodated in the container. The evaporation container 6 is provided with a container exchange port 9 with a gate valve (gate valve) for exchanging the material storage container 7 and a vacuum port 10 that is brought into a vacuum atmosphere by a vacuum unit (not shown). The evaporation vessel 6 is connected to a fixed pipe body 11E, which is a connecting member 11 , via an on-off valve 12 capable of discharging / closing or adjusting the flow rate of the evaporation material, thereby forming an evaporation material passage 13.

As shown in FIG. 2 , the discharge container 15 has a rectangular box shape (or may be circular or polygonal) in plan view, a diffusion space 16 is formed inside, and the fixed tube 11E is formed at the center of the bottom. disposed through fixed outlet 13a of the evaporation material passage 13 is opened in. A plurality of discharge holes 17 are formed in a predetermined position including a portion facing the outlet 13a in the upper surface plate 15a facing the glass substrate W in the discharge container 15.

Further, power is supplied to a heating heating wire (heating means) 18 wound outward from the fixed tube 11E over the discharge container 15 to prevent the evaporation material from adhering .
The discharge container 15 is provided with reflecting face plates (reflecting members) 61A to 61C at opposed positions with a predetermined distance from the outlet 13a of the evaporating material passage 13 formed by the fixed tube 11E.

  In the first example shown in FIGS. 1 and 2A to 2C, the reflective surface plate 61 </ b> A is formed in a disk shape slightly larger than the opening surface of the outlet 13 a of the evaporating material passage 13, and is formed by a plurality of leg members 62. It is supported.

The second example shown in FIGS. 3A to 3C is formed on a disk-shaped reflecting surface plate 61B having a diameter several times (2 to 4 times) larger than the opening surface of the outlet 13a, and includes a plurality of leg members. 62 is supported.
Further, the third example shown in FIGS. 4A to 4C is a disk-shaped reflecting surface plate 61C having a diameter several times (2 to 4 times) the opening surface, and a large number of adjustment through holes 63. It has been drilled. The reflective face plate 61C is supported by a plurality of leg members 62, and the adjustment through-hole 63 extends from the central portion facing the outlet 13a of the evaporating material passage 13 toward the outer peripheral side, and the adjustment through-hole 63 per unit area. The openings are formed and arranged so that their opening areas are sequentially enlarged.

  In both the first to third examples, the plurality of discharge holes 17 formed in the upper surface plate 15a of the discharge container 15 have a central portion (a surface opposite to the outlet 13a of the evaporation material passage 13 of the reflection surface plates 61A to 61C). It is drilled at a predetermined position.

In the discharge container 15, when there are no reflection face plates 61 </ b> A to 61 </ b> C, the evaporation material particles discharged from the outlet 13 a of the evaporation material passage 13 to the diffusion space 16 have a density of the evaporation material particles on the central axis O ′ of the outlet 13 a. In order to concentrate, if the discharge hole 17 is formed in this part, a large amount of vaporized material particles are discharged compared to the discharge hole 17 in the other part. Therefore, the restriction that the discharge hole 17 cannot be formed in the part opposite to the outlet 13a is limited. receive. However, in the first embodiment , by providing the reflecting face plates 61A to 61C, the high density evaporating material particles emitted from the outlet 13a of the evaporating material passage 13 are reflected, so that it is formed at a portion facing the outlet 13a. Further, the release of the vaporized material particles from the discharge hole 17 can be restricted. As a result, there is no restriction on the formation position of the discharge hole 17 , and the discharge hole formed in the upper surface plate 15a of the discharge container 15 is formed at an arbitrary position so that the evaporation material particles are uniformly deposited on the deposition surface. Can be made.

  Further, according to the reflective surface plate 61C of the third example, there is almost no transmittance of the evaporating material particles that pass through the central portion, and the transmittance of the evaporating material particles that pass through the adjustment through hole 63 at the outer peripheral portion is increased. Thus, the density of the vaporized material particles on the opposite side of the outlet 13a of the vaporized material passage 13 by the reflective face plate 61C can be made uniform with the other diffusion space 16, so that the vaporized material discharged from each discharge hole 17 The particles can be made uniform to form a deposited film having a uniform thickness on the surface of the glass substrate W.

[ Example 2 ]
The second embodiment is provided with a reflecting member that partitions the dispersion space in the discharge container 15 of the first embodiment , and will be described with reference to FIGS. 5 and 6. Note that the same members as those in the first embodiment are denoted by the same reference numerals and description thereof is omitted.

  In the diffusion space 16 of the discharge container 15, the diffusion space 16 is divided into upper and lower portions, that is, an upper space 16 u on the upper plate 15 a side where the discharge holes 17 are formed, and a lower space 16 d on the outlet 13 a side of the evaporation material passage 13. Dispersive transmission plates (reflection members) 71A and 71B are provided.

As shown in FIG. 5 , the first example of the dispersive transmission plate 71 </ b> A has a reflecting portion 72 </ b> A having a diameter that is several times (2 to 4 times) larger than the opening surface of the outlet 13 a at a portion facing the outlet 13 a. The reflecting portion 72A is formed in a face plate shape that does not have the through hole 17. The dispersion transmission plate 71A other than the reflection portion 72A is formed in a so-called punching metal shape in which a large number of through holes 73 are uniformly formed at a constant pitch.

As shown in FIG. 6 , the second example of the dispersive transmission plate 71 </ b> B is formed with a reflecting portion 72 </ b> B having a diameter several times (2 to 4 times) larger than the opening surface of the outlet 13 a at a portion facing the outlet 13 a. An adjusting through hole 74 is formed in the reflecting portion 72B. These adjustment through holes 74 are formed so that the opening area of the adjustment through holes 74 per unit area is sequentially enlarged from the central axis O ′ facing the outlet 13a of the evaporating material passage 13 toward the outer peripheral side. Has been placed. The dispersion transmission plate 71B other than the reflection portion 72B is formed in a so-called punching metal shape in which a large number of through holes 73 are formed at a constant pitch.

According to the second embodiment, since the dispersion transmission plates 71A and 71B which are divided into the upper space 16u and the lower space 16d are provided in the diffusion space 16 of the discharge container 15, the dispersion material is discharged from the outlet 13a of the evaporation material passage 13. The evaporation material particles are introduced and diffused into the upper space 16u through the through holes 73 while being reflected by the inner surfaces of the dispersion transmission plates 71A and 71B and the discharge container 15 in the lower space 16d. Further, since the permeation of the evaporation material particles is restricted by the reflecting portions 72A and 72B at the portion facing the outlet 13a of the evaporation material passage 13, the density of the evaporation material particles is made more uniform in the upper space 16u. Since the evaporation material particles are evenly discharged from the upper space 16u through the discharge holes 17 toward the glass substrate W, the evaporation material particles are vapor-deposited on the surface of the glass substrate W to form a vapor deposition film having a uniform film thickness. Can be formed.

  Further, according to the second example, in the reflecting portion 72B, the transmittance of the evaporating material particles passing through the central portion is small, and the transmittance of the evaporating material particles passing through the adjustment through hole 74 is increased at the outer peripheral portion. Thus, the density of the evaporation material particles on the upper space 16u side of the reflecting portion 72B can be made the same level as that of the other upper spaces 16u, and the evaporation material particles emitted from the respective emission holes 17 can be made uniform to make the glass substrate. A vapor deposition film having a uniform thickness can be formed on the surface of W.

[ Example 3 ]
As shown in FIGS. 7 and 8, the third embodiment communicates with the outlet 13a of the evaporating material passage 13 disposed facing the glass substrate W in the vapor deposition apparatus shown in the first or second embodiment . A discharge container 15 having a diffusion space 16 is provided, a plurality of discharge holes 17 are formed at predetermined positions on the vapor deposition member side of the discharge container 15, and one or a plurality of buffer plates ( Buffer member) 81A and 81B are arranged.

That is, a single buffer plate or a plurality of (two in the figure) buffer plates 81A, in the evaporating material passage 13 formed by the fixed tube 11E communicating with the discharge container 16 from the evaporation container 6 through the on-off valve 12; 81B are arranged at a predetermined interval. The buffer plates 81A and 81B are formed in a punching metal shape in which a large number of through holes 82A and 82B are formed. If possible, the buffer holes 81A and 82B are formed so as to be displaced from each other as shown in the figure. In FIG. 8 , the through holes 82A of the upper buffer plate 81A are distributed in the outer peripheral portion, and the through holes 82B of the lower buffer plate 81B are distributed in the central portion to improve the buffer effect.

  If the heating is continued without releasing the evaporating material, for example, when the glass substrate W is replaced, the atmospheric pressure in the evaporating container 6 increases. If the on-off valve 12 is opened in this high pressure state, the evaporation material is released to the vapor deposition container 2 through the evaporation material passage 13 and the discharge container 15 at once, and it becomes difficult to control the film thickness on the glass substrate W. There is. For this reason, by arranging the buffer plates 81A and 81B in the evaporating material passage 13, the high-speed flow of the evaporating material can be effectively buffered and the film thickness deposited on the glass substrate W can be controlled well.

  The through holes 82A and 82B of the buffer plates 81A and 81B may have the same shape, for example, evenly distributed, and the same can be obtained by rotating the buffer plates 81A and 81B to shift the positions of the through holes 82A and 82B. The effect of this can be achieved.

O 'central axis W glass substrate 1 deposition chamber 2 deposition container 5 vaporization chamber 7 material storage container
11 Connecting members
11E fixed tube 13 evaporative material passage 13a outlet 15 discharge container 16 diffusion space 16u upper space 16d lower space 17 discharge hole
61A, 61B, 61C reflecting face plate 63 adjustment through hole
71A Dispersive transmission plate
71B Dispersive transmission plate
72A Reflector
72B Reflecting portion 73 Through hole 74 Adjustment through hole 81A, 81B Buffer plate
82A, 82B Through hole

Claims (6)

In the vapor deposition apparatus for attaching the evaporated evaporation material to the vapor deposition member,
In communication with the evaporative material passage outlet disposed facing the vapor deposition member, a discharge container having a diffusion space inside is provided,
In the diffusion space of the discharge container, a reflecting member that reflects the evaporated material particles is provided facing the evaporated material passage outlet,
A vapor deposition apparatus, wherein a plurality of discharge holes are formed at predetermined positions including a portion facing the vapor material passage outlet on the vapor deposition member side of the discharge container. The reflective member is provided with a plurality of adjustment through holes arranged so that an opening area per unit area is enlarged from a central portion facing the evaporative material passage outlet toward an outer peripheral side. Item 2. The vapor deposition apparatus according to Item 1. In the vapor deposition apparatus for attaching the evaporated evaporation material to the vapor deposition member,
In communication with the evaporative material passage outlet disposed facing the vapor deposition member, a discharge container having a diffusion space inside is provided,
In the diffusion space of the discharge container, a dispersion transmission plate having a large number of through holes that divides the space part on the evaporative material passage outlet side and the space part on the discharge hole side is arranged,
A reflection part for reflecting the evaporation material particles is provided at a portion facing the evaporation material passage outlet of the dispersion transmission plate,
A vapor deposition apparatus, wherein a plurality of discharge holes are formed at predetermined positions including a portion facing the vapor material passage outlet on the vapor deposition member side of the discharge container. Claim that the reflecting portion, toward the outer peripheral side from the center, facing the evaporation material passage outlet, characterized in that the opening area per unit area was bored arranged plurality of adjusting holes are enlarged 3. The vapor deposition apparatus according to 3 . The vapor deposition apparatus according to claim 1, wherein a buffer member for buffering a flow of the evaporation material is provided in the evaporation material passage. The buffer member is composed of a plurality of buffer plates arranged at predetermined intervals and formed with a plurality of through holes, and these buffer plates are arranged so that the respective through holes are displaced.
  The vapor deposition apparatus according to claim 5.

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