JP2009087910A - Vapor deposition apparatus and film forming method - Google Patents

Vapor deposition apparatus and film forming method Download PDF

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JP2009087910A
JP2009087910A JP2007280726A JP2007280726A JP2009087910A JP 2009087910 A JP2009087910 A JP 2009087910A JP 2007280726 A JP2007280726 A JP 2007280726A JP 2007280726 A JP2007280726 A JP 2007280726A JP 2009087910 A JP2009087910 A JP 2009087910A
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chamber
vapor
device
steam generator
steam
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JP5008527B2 (en
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Toshio Negishi
敏夫 根岸
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Ulvac Japan Ltd
株式会社アルバック
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Abstract

PROBLEM TO BE SOLVED: To accurately evaporate a necessary amount of organic material by heat to provide an organic thin film with a fine film quality.
SOLUTION: In a vapor deposition apparatus, vapor generating devices 20a to 20c are connected to a discharge device 50 to supply vapor while other vapor generating devices 20a to 20c are cut off from the discharge device 50, so that vapors are not mixed together. After film formation, the vapor generating devices 20a to 20c are connected to an exhaust tank while kept cut off from the discharge device 50. The exhaust tank contains cooling means 85a to 85c, on which vapor discharged into the exhaust tank is deposited to form a deposited material 39, which is recovered and reused.
COPYRIGHT: (C)2009,JPO&INPIT

Description

本発明は蒸着装置と、それを用いた成膜方法に関する。 The present invention provides a vapor deposition apparatus, a film forming method using the same.

有機EL素子は近年最も注目される表示素子の一つであり、高輝度で応答速度が速いという優れた特性を有している。 The organic EL element is one of a display device in recent years the most attention, and has excellent characteristics in that they have a high response speed at high brightness. 有機EL素子は、ガラス基板上に赤、緑、青の三色の異なる色で発色する発光領域が配置されている。 The organic EL element, red on a glass substrate, a green light-emitting region is arranged to be colored in three colors different blue colors. 発光領域は、アノード電極膜、ホール注入層、ホール輸送層、発光層、電子輸送層、電子注入層及びカソード電極膜がこの順序で積層されており、発光層中に添加された発色剤で、赤、緑、又は青に発色するようになっている。 Light emitting region, an anode electrode film, a hole injection layer, a hole transport layer, light emitting layer, electron transporting layer, an electron injection layer and a cathode electrode film are laminated in this order, with the added color former in the light emitting layer, red, is adapted to the color green, or blue.
ホール輸送層、発光層、電子輸送層等は一般に有機材料で構成されており、このような有機材料の膜の成膜には蒸着装置が広く用いられる。 Hole transport layer, light emitting layer, an electron transporting layer or the like is generally is composed of an organic material, the vapor deposition apparatus is widely used for the deposition of films of such organic materials.

図5の符号203は、従来技術の蒸着装置であり、真空槽211の内部に蒸着容器212が配置されている。 Reference numeral 203 in FIG. 5 is a prior art deposition apparatus, deposition vessel 212 is disposed inside the vacuum chamber 211. 蒸着容器212は、容器本体221を有しており、該容器本体221の上部は、一乃至複数個の放出口224が形成された蓋部222で塞がれている。 Vapor deposition case 212 has a container body 221, the upper portion of the container body 221 is closed in one or lid 222 in which a plurality of discharge openings 224 are formed.

蒸着容器212の内部には、粉体の有機蒸着材料200が配置されている。 Inside the vapor deposition vessel 212, the organic vapor deposition material 200 in powder is arranged.
蒸着容器212の側面と底面にはヒータ223が配置されており、真空槽211内を真空排気し、ヒータ223が発熱すると蒸着容器212が昇温し、蒸着容器212内の有機蒸着材料200が加熱される。 The side surface and the bottom surface of the vapor deposition vessel 212 is disposed a heater 223, a vacuum chamber 211 is evacuated, heated and the vapor deposition vessel 212 heater 223 generates heat, the temperature, the organic vapor deposition material 200 in the vapor deposition case 212 is heated It is.
有機蒸着材料200が蒸発温度以上の温度に加熱されると、蒸着容器212内に、有機材料蒸気が充満し、放出口224から真空槽211内に放出される。 When the organic vapor deposition material 200 is heated to a temperature above the evaporation temperature, in the vapor deposition case 212, the organic material vapor is filled, is released into the vacuum chamber 211 from the discharge port 224.

放出口224の上方にはホルダ210が配置されており、ホルダ210に基板205を保持させておけば、放出口224から放出された有機材料蒸気が基板205表面に到達し、ホール注入層やホール輸送層や発光層等の有機薄膜が形成される。 Above the discharge opening 224 is disposed a holder 210, if allowed to hold the substrate 205 to the holder 210, the organic material vapor discharged from the discharge port 224 reaches the substrate 205 surface, the hole injection layer or a hole the organic thin film such as transport layer or light emitting layer is formed.
有機材料蒸気を放出させながら、基板205を一枚ずつ放出口224上を通過させれば、複数枚の基板205に逐次有機薄膜を形成することができる。 While releasing organic material vapor, if passed over discharge openings 224 of the substrate 205 one by one, it is possible to form the successive organic thin film on a plurality of substrates 205.

しかし、複数枚の基板205に成膜するには、蒸着容器212内に多量の有機材料を配置する必要がある。 However, in forming a film on a plurality of substrates 205, it is necessary to arrange a large amount of organic material in the vapor deposition case 212. 実際の生産現場では、有機材料を250℃〜450℃に加熱しながら120時間以上連続して成膜処理を行うため、蒸着容器212内の有機蒸着材料200は長時間高温に曝されることになり、蒸着容器212中の水分と反応して変質したり、加熱による分解が進行する。 In actual production site, for performing a film forming process continuously over 120 hours while heating the organic material to 250 ° C. to 450 ° C., the organic vapor deposition material 200 in the vapor deposition case 212 is to be prolonged exposure to high temperatures becomes, or degenerated by reacting with moisture in the vapor deposition case 212, decomposition by heating proceeds. その結果、初期状態に比べて有機蒸着材料200が劣化し、有機薄膜の膜質が悪くなる。 As a result, the organic vapor deposition material 200 is deteriorated as compared with the initial state, the film quality of the organic thin film is deteriorated.

また、1枚の基板に、複数種類の有機薄膜を成膜する場合は、1種類の有機薄膜の成膜が終了したら、成膜終了後の基板を、異なる有機蒸着材料200が収容された蒸着容器212上へ搬送する必要がある。 Also, on one substrate, when forming the plural kinds of the organic thin film, one After deposition is complete the organic thin film, depositing the substrate after completion of the film formation was different organic vapor deposition material 200 is accommodated it is necessary to transport to the upper container 212.

基板を搬送する時には真空槽内に粉塵が発生し、搬送距離が長くなるほど粉塵の発生量が増える。 When transporting the substrate dust is generated in the vacuum chamber, the amount of dust as the conveyance distance longer increases. その粉塵は有機薄膜に混入して汚染の原因となる。 Its dust causes pollution mixed in the organic thin film.
このように、従来の蒸着装置では、膜質の良い有機薄膜を成膜することは困難であった。 Thus, in the conventional evaporation apparatus, it is difficult to deposit a good organic thin film quality.
特開平10−140334号公報 JP 10-140334 discloses 特開2006−307239号公報 JP 2006-307239 JP 特開2007−70687号公報 JP 2007-70687 JP

本発明は上記課題を解決するためのものであり、その目的は、膜質の良い有機薄膜を成膜することである。 The present invention has been made to solve the above problems, its object is to deposit a good organic thin film quality.

上記課題を解決するために、本発明は、内部で蒸着材料の蒸気を発生させる蒸気発生源と、前記蒸着材料の蒸気を成膜槽内部に放出する放出装置と、前記蒸気発生源の内部が前記放出装置の内部に接続された状態と、前記蒸気発生源の内部が前記放出装置の内部から遮断された状態とを切替える切替装置とを有する蒸着装置であって、真空槽と、前記真空槽に接続された真空排気系とを有し、前記切替装置は、前記蒸気発生源の内部を前記放出装置の内部から遮断しながら、前記蒸気発生源の内部を前記真空槽に接続できるように構成された蒸着装置である。 In order to solve the above problems, the present invention includes a steam generating source for generating steam inside the vapor deposition material, a discharge device for releasing the vapor of the deposition material inside the deposition chamber, the inside of the steam generating source wherein a state of being connected to the interior of the discharge device, an evaporation device and a switching device for switching between a state of being cut off from the interior of the interior of the steam generating source the emission device, a vacuum chamber, said vacuum chamber and a connected vacuum exhaust system, the switching device, while blocking the inside of the steam generating source from the interior of the discharge device, constituting the inside of the steam source so as to be connected to the vacuum chamber which is the difference between the vapor deposition apparatus.
本発明は蒸着装置であって、前記蒸気発生源は複数の蒸気発生装置を有し、前記蒸気発生源の内部は前記各蒸気発生装置の内部であり、前記切替装置は、前記各蒸気発生装置の内部を、前記放出装置又は前記真空槽に個別に接続できるように構成された蒸着装置である。 The present invention is a vapor deposition apparatus, said vapor source comprises a plurality of steam generator, the interior of the steam generating source is inside the respective steam generator, the switching device, wherein the steam generator interior of a deposition apparatus configured to be individually connected to the discharge device or the vacuum chamber.
本発明は蒸着装置であって、前記各蒸気発生装置は、前記蒸気発生装置の内部空間を構成する蒸発室と、前記蒸着材料が収容されるタンクと、前記蒸着材料を前記タンクから前記蒸発室に供給する供給装置と、前記蒸発室に供給された前記蒸着材料を加熱する加熱装置とを有し、前記蒸着材料は、前記供給装置により、当該供給装置に設定された量供給される蒸着装置である。 The present invention is a vapor deposition apparatus, wherein the steam generator includes an evaporation chamber constituting the internal space of the steam generator, a tank in which the deposition material is accommodated, wherein the evaporation chamber the deposition material from the tank a supply device for supplying to said and a heating device for heating the supplied the deposition material in the evaporation chamber, the deposition material, the by supply device, the amount supplied by the deposition apparatus is set in the feeder it is.
本発明は蒸着装置であって、前記成膜槽は前記真空槽から分離され、前記成膜槽には主真空排気系が接続され、前記放出装置は、前記蒸気を放出する1又は2以上の放出口を有し、前記放出装置の内部空間は、前記放出口を介して前記成膜槽の内部に接続された蒸着装置である。 The present invention is a vapor deposition apparatus, the deposition chamber is separated from the vacuum chamber, which is connected a main vacuum exhaust system for forming a film chamber, the discharge device, the one or more releasing the steam has a discharge port, the internal space of the discharge device is connected to the vapor deposition apparatus within said film forming chamber through the outlet.
本発明は蒸着装置であって、前記成膜槽は前記真空槽と同一であり、前記放出装置は、前記蒸気を放出する1又は2以上の放出口を有し、前記放出装置の内部空間は、前記放出口を介して前記真空槽の内部に接続され、前記切替装置は、前記蒸気発生源の内部空間を、前記真空槽の内部空間のうち、前記放出装置の外部空間に接続する蒸着装置である。 The present invention is a vapor deposition apparatus, the deposition chamber is the same as the vacuum chamber, the discharge device, the has one or more outlet emits steam, the inner space of the discharge device the is through the outlet connected to the interior of the vacuum chamber, wherein the switching device, the interior space of the vapor source, of the internal space of the vacuum chamber, deposition device connected to the external space of the discharge device it is.
本発明は蒸着装置であって、前記真空槽に搬出入可能な冷却手段と、前記真空槽に搬入された前記冷却手段を冷却する冷却装置とを有する蒸着装置である。 The present invention is an evaporation apparatus is an evaporation apparatus having a loading and unloading possible cooling means to said vacuum chamber, and a cooling device for cooling the cooling means are carried into the vacuum chamber.
本発明は、第一〜第三の蒸気発生装置に第一〜第三の色の蒸着材料を配置しておき、前記第一〜第三の蒸気発生装置の内部で、前記第一〜第三の色の蒸着材料の蒸気をそれぞれ発生させ、前記第一〜第三の色の前記蒸着材料の蒸気を、前記第一〜第三の蒸気発生装置から、放出装置に順番に移動させ、当該放出装置の放出口から成膜槽の内部に放出させ、前記成膜槽の内部に配置された基板の、第一〜第三の領域に、前記第一〜第三の色の前記蒸着材料の蒸気をそれぞれ到達させ、前記第一〜第三の色の着色層を形成する成膜方法であって、前記第一〜第三の蒸気発生装置と前記放出装置との間の、前記蒸気が移動する経路に切替装置を設けておき、前記第一の蒸気発生装置を前記放出装置に接続し、前記第一の領域に前記第一の色の着色層 The present invention, in the first to third steam generator advance the first to third color of the vapor deposition material is placed, in the interior of the first to third steam generator, the first to third each generates a color vapor of the vapor deposition material of the vapor of the first to third color said deposition material from the first to third steam generator, is moved in order to release device, the release is emitted into the deposition chamber from the outlet of the device, of the substrate disposed inside the film forming chamber, in the first to third regions, the vapor of the first to third color the deposition material was reached respectively, a film forming method for forming a colored layer of the first to third color, between the first to third steam generator and the discharge device, wherein the vapor moves may be provided a switching device in the path, connecting the first steam generator in the discharge device, the coloring layer of the first color to the first region 形成した後、前記切替装置を切り替え、前記第一の蒸気発生装置を前記放出装置から遮断し、真空排気系に接続した状態で、前記第二の蒸気発生装置を前記放出装置に接続し、前記第二の色の前記蒸着材料の蒸気を、前記放出口から放出させる成膜方法である。 After forming, switches the switching device, the first steam generator is shut off from the release device, while connected to a vacuum exhaust system, connecting the second steam generator to said discharge device, wherein the steam of the second color the deposition material is a film forming method of releasing from the outlet.
本発明は、前記第一〜第三の蒸気発生装置に、前記蒸着材料を配置するタンクと、前記蒸着材料の蒸気を発生させる蒸発室をそれぞれ設けておき、前記タンクに前記蒸着材料を収容しておき、前記タンクから前記蒸発室に蒸着材料を供給し、前記蒸発室内部で前記蒸着材料の蒸気を発生させる成膜方法であって、前記切替装置の切替は、予め設定された量の前記第一の蒸着材料を、第一の蒸発室に供給し、前記蒸発室内の有機材料が蒸発した後行う成膜方法である。 The present invention, in the first to third steam generator, a tank for placing the deposition material, may be provided each evaporation chamber for generating the vapor of the deposition material, accommodating the deposition material to the tank and advance to supply an evaporation material to the evaporation chamber from said tank, said a vaporization chamber portion by a film forming method of generating the vapor of the deposition material, switching of the switching device, the predetermined amount of the the first deposition material is supplied to the first evaporation chamber, an organic material of the evaporation chamber is a deposition method of performing after evaporation.
本発明は成膜方法であって、前記真空排気系と前記切替装置との間に真空槽を設けておき、 前記第一の蒸気発生装置の前記真空排気系への接続は、前記真空槽を介して前記真空排気系に接続し、前記真空槽に引き込まれた蒸気を、前記真空槽内部で冷却し、前記真空槽内部で前記蒸着材料を析出させる成膜方法である。 The present invention provides a film deposition method, the vacuum exhaust system and may be provided in the vacuum chamber between the switching device, connected to the vacuum exhaust system of the first steam generator, the vacuum chamber via connected to the vacuum exhaust system, the steam drawn into the vacuum chamber, the cooling in the vacuum chamber, a film forming method of depositing the deposition material inside the vacuum chamber.
本発明は成膜方法であって、前記真空排気系として、前記成膜槽に接続された主真空排気系を用い、前記第一の蒸気発生装置の前記真空排気系への接続は、前記第一の蒸気発生装置を、前記成膜槽内部空間であって、前記放出装置の外部空間に接続し、前記成膜槽に引き込まれた蒸気を冷却して、前記成膜槽内部に析出させる成膜方法である。 The present invention is a film forming method, as the vacuum evacuation system, with the main evacuation system connected to the deposition chamber, connected to the vacuum exhaust system of the first steam generator, the second one of the steam generator, said a deposition chamber interior space, the connected to the outer space of the discharge device, and cooling the drawn in the film-forming vessel vapor deposition to deposit within the film forming chamber is a film forming method.

本発明は上記のように構成されており、選択した蒸気発生装置を放出装置に接続する時には、該蒸気発生装置は、他の蒸気発生装置と、排気槽と、他の真空排気系から遮断される。 The present invention is constructed as described above, when connecting the steam generator device selected on the discharge apparatus, the vapor generator, and another steam generator, is shut off and the exhaust tank, from other vacuum evacuation system that. 従って、選択した蒸気発生装置で発生した蒸気は、全て放出装置へ供給され、しかも、放出装置へ供給される蒸気に、他の蒸気発生装置で発生した蒸気が混ざらない。 Thus, steam generated by the steam generator device selected is supplied to all emission device, moreover, the steam supplied to the discharge device, not mixed vapor generated in another steam generator.

複数の蒸気発生装置が一つの放出装置に接続され、放出装置には異なる種類の有機材料の蒸気を供給することができる。 A plurality of steam generator is connected to one of the discharge apparatus, it is possible to supply steam for different types of organic materials for emitting device. 従って、基板を放出装置上から移動させなくても、複数種類の有機薄膜を成膜することができる。 Thus, without moving the substrate from the emitting device, it is possible to form a plurality of types of organic thin films. 蒸着材料は必要量だけが蒸気発生装置に供給され、多量の蒸着材料が一度に加熱されることがない。 Deposition material required amount is supplied to the steam generator, is not a large amount of deposition material is heated at a time. 従来に比べて蒸着材料が劣化しにくく、粉塵発生量も少ないから、膜質の良い有機薄膜が得られる。 Hardly deteriorated evaporation material than the conventional, since the dust generation amount is small, the film quality good organic thin film is obtained. 選択した蒸気発生装置で発生した蒸気は、他の蒸気発生装置で発生した蒸気が混入することなく、放出装置から放出されるから、目的の材料だけで有機薄膜を構成することができる。 Vapor generated by the selected steam generator, without steam generated in other steam generator is mixed, because is discharged from the discharge apparatus, it is possible to constitute the organic thin film only material of interest.

図1の符号1は成膜装置(有機EL製造装置)の一例を示している。 Number 1 in Figure 1 shows an example of a deposition apparatus (organic EL manufacturing apparatus).
成膜装置1は複数の蒸着装置10a〜10c、30bを有しており、ここでは、各蒸着装置10a〜10c、30bは搬送室2に接続され、蒸着装置10a〜10c、30bが接続された搬送室2には、搬入室3aと、搬出室3bと、処理室6と、スパッタ室7と、マスク収容室8とが接続されている。 Film-forming apparatus 1 has a plurality of deposition apparatuses 10a to 10c, a 30b, where each vapor deposition apparatus 10a to 10c, 30b are connected to the transfer chamber 2, the vapor deposition apparatus 10a to 10c, 30b are connected the transfer chamber 2, the carry-in chamber 3a, a carry-out chamber 3b, and the processing chamber 6, the sputtering chamber 7, and the mask storage chamber 8 is connected. マスク収容室8内部には複数のマスクが収容されており、蒸着装置10a〜10c、30bやスパッタ室7内部に配置されたマスクと定期的に交換される。 Inside the mask storage chamber 8 has a plurality of mask is accommodated, the deposition apparatus 10a to 10c, is 30b and the sputtering chamber 7 mask and replaced periodically arranged therein.

真空排気系9により、搬送室2内部と、蒸着装置10a〜10c、30bの内部と、処理室6内部と、スパッタ室7内部と、マスク収容室8内部と、搬入室3a内部と、搬出室3b内部に真空雰囲気が形成される。 The vacuum evacuation system 9, and the inner transfer chamber 2, the vapor deposition apparatus 10a to 10c, and internal 30b, and the processing chamber 6, and the internal sputtering chamber 7, and the internal mask accommodating chamber 8, and the internal loading chamber 3a, carry-out chamber vacuum atmosphere is formed inside 3b.

搬送室2の内部には搬送ロボット5が配置されている。 Transport robot 5 is disposed inside of the transfer chamber 2. 表面上に下部電極が形成された基板は搬入室3aに搬入され、該基板は搬送ロボット5によって真空雰囲気中を搬入室3aから搬送室2へ搬入され、処理室6で加熱処理やクリーニング処理等の処理がされ、蒸着装置10a〜10c、30b内部で、電子注入層、電子輸送層、発光層、ホール輸送層、ホール注入層等の有機薄膜が形成され、スパッタ室7内部で上部電極が形成され、製造された有機EL素子は搬出室3bから外部に搬出されるようになっている。 The substrate on which the lower electrode is formed on the surface is carried into loading chamber 3a, the substrate is carried into the vacuum atmosphere from the carry-in chamber 3a by the transport robot 5 to the transfer chamber 2, heat treatment or cleaning process or the like in the processing chamber 6 It is processed in the vapor deposition apparatus 10a to 10c, 30b inside the electron injection layer, an electron transport layer, light emitting layer, a hole transport layer, the organic thin film formation of the hole injection layer, the sputtering chamber 7 inside the upper electrode is formed is, the organic EL device manufactured is adapted to be carried to the outside from the carry-out chamber 3b.

発光層は3色の着色層(例えば赤、緑、青)を複数ずつ有する。 The light-emitting layer having the colored layers of three colors (e.g. red, green, blue) by a plurality. 各色の着色層は異なる領域上にそれぞれ形成されており、有機EL素子はフルカラー表示が可能である。 Colored layers of each color are respectively formed on different regions, the organic EL device may have a full-color display.
着色層が形成される領域には下部電極がそれぞれ位置する。 The region where the colored layer is formed lower electrode respectively located. 上部電極に通電した状態で、選択した下部電極に通電すれば、選択した下部電極と、上部電極の間に位置する着色層が発光する。 While energizing the upper electrode, if energized lower electrode selected, a lower electrode selected, colored layer located between the upper electrode emits light. 所望の場所にある所望の色の着色層を発光させることで、所望の画像又は文字をフルカラー表示することができる。 By emit colored layer of a desired color in the desired location, it can be full color display the desired image or characters.

次に、発光層の成膜に用いられる本発明の蒸着装置10b、30bについて説明する。 Next, the vapor deposition apparatus 10b of the present invention used for the deposition of the light emitting layer, 30b will be described.
図2は本発明第一例の蒸着装置10bの模式的な斜視図であり、図4は本発明第二例の蒸着装置30bの模式的な断面図である。 Figure 2 is a schematic perspective view of the present invention a first example of the vapor deposition apparatus 10b, FIG. 4 is a schematic cross-sectional view of the second example of the present invention of a vapor deposition apparatus 30b. 第一、第二例の蒸着装置10b、30bの同じ部材には同じ符号を付して説明する。 First, the same components of the second example of the vapor deposition apparatus 10b, 30b are designated by the same reference numerals.

第一、第二例の蒸着装置10b、30bは、蒸気発生源12と、放出装置50と、切替装置70と、成膜槽11と、真空排気系89と、第一〜第三の冷却手段85a〜85cをそれぞれ有している。 First and second example of the vapor deposition apparatus 10b, 30b includes a steam source 12, and the discharge device 50, the switching device 70, the film forming chamber 11, a vacuum evacuation system 89, the first to third cooling means each have a 85a~85c.
放出装置50は放出口55が設けられており、少なくとも放出口55が設けられた部分が成膜槽11の内部に位置するよう配置されている。 Discharging unit 50 is discharge openings 55 is provided, and is arranged such that a portion of at least outlet 55 is provided is located inside the deposition chamber 11.

第一例の蒸着装置10bでは成膜槽11とは異なる真空槽82が設けられ、その真空槽82内部に第一〜第三の冷却手段85a〜85cが配置されており、後述するように、真空槽82の内部が残留ガスの排気槽となる。 First example vacuum chamber 82 differ is provided a film forming chamber 11 in the evaporating apparatus 10b of are arranged first to third cooling means 85a~85c is within its vacuum chamber 82, as will be described later, the vacuum chamber 82 is evacuated chamber of residual gases.

第二例の蒸着装置30bでは、成膜槽11の内部であって、放出装置50の外側の空間に第一〜第三の冷却手段85a〜85cが配置されており、放出装置50が配置されたものと同じ成膜槽11が残留ガスの排気槽となる。 In the second example of the deposition apparatus 30b, an internal of the film forming chamber 11, the first to third cooling means 85a~85c the space outside the discharge device 50 is disposed, discharging unit 50 is arranged the same deposition chamber 11 is an exhaust tank of the residual gas as a.

蒸気発生源12は複数の蒸気発生装置20a〜20c(第一〜第三の蒸気発生装置)を有しており、第一〜第三の色の蒸着材料39はそれぞれ別々の蒸気発生装置20a〜20cに収容される。 Steam source 12 has a plurality of steam generator 20 a to 20 c (the first to third steam generator), the first to third color of the vapor deposition material 39 each separate steam generator 20a~ It is housed in 20c. 第一〜第三の色の蒸着材料39を収容する蒸気発生装置20a〜20cをそれぞれ第一〜第三の蒸気発生装置20a〜20cとする。 The steam generator 20 a to 20 c which accommodates the first to third color of the vapor deposition material 39, respectively and first to third steam generator 20 a to 20 c.

図3は第一〜第三の蒸気発生装置20a〜20cを説明するための断面図である。 Figure 3 is a sectional view for explaining the first to third steam generator 20 a to 20 c. 第一〜第三の蒸気発生装置20a〜20cは、異なる蒸着材料39が収容される以外は同じ構成を有しており、同じ部材には同じ符号を付して説明する。 First to third steam generator 20a~20c, except that different evaporation materials 39 is accommodated has the same configuration, the same components are designated by the same reference numerals.
各蒸気発生装置20a〜20cは、タンク(収容部)32と、供給装置31と、蒸発室21と、加熱装置25とをそれぞれ有している。 Each steam generator 20a~20c includes a tank (housing portion) 32, a feeder 31, and the evaporation chamber 21, each have a heating device 25. タンク32は内部に蒸着材料39を収容可能になっている。 Tank 32 is in a can accommodate an evaporation material 39 therein.

供給装置31は一端がタンク32に接続され、他端が蒸発室に接続された導入管42と、導入管42に挿通された回転軸35と、回転軸35に接続された制御装置41を有している。 Feeder 31 has one end connected to the tank 32, organic and inlet pipe 42 whose other end is connected to the evaporation chamber, a rotary shaft 35 inserted through the inlet pipe 42, a control unit 41 connected to the rotary shaft 35 doing. 回転軸35の導入管42に挿通された部分の周囲には突条36が設けられている。 Around the inserted through the inlet pipe 42 of the rotary shaft 35 parts ridge 36 is provided. 制御装置41で回転軸35をその中心軸線を中心として回転させると、タンク32に収容された蒸着材料39は、突条36間の溝を通って、タンク32から蒸発室21へ移動し、蒸発室21に蒸着材料39が供給される。 When the rotary shaft 35 about its central axis by the control unit 41, the vapor deposition material 39 contained in the tank 32, through a groove between ridges 36, moves from the tank 32 to the evaporation chamber 21, evaporation the vapor deposition material 39 is supplied to the chamber 21. 回転軸35の回転量と、蒸着材料39の供給量との関係を求めておけば、その関係から、必要量の蒸着材料39を供給するのに必要な回転軸35の回転量が分かる。 And the amount of rotation of the rotary shaft 35, if obtained relation between the supply amount of the vapor deposition material 39, from the relationship, the amount of rotation of the rotary shaft 35 required to supply seen an evaporation material 39 in the required amount.

制御装置41には記憶装置(不図示)が設けられている。 Storage device (not shown) is provided in the control device 41. 後述するように蒸着材料39の必要量を記憶装置に記憶させ、設定量とすると、制御装置41は設定量の蒸着材料39が供給されるように、回転軸35を回転させる。 Stored in the storage device the required amount of the vapor deposition material 39, as described later, when a set amount, the control apparatus 41 as set amount of the vapor deposition material 39 is supplied to rotate the rotary shaft 35.

加熱装置25は、蒸発室21内部に配置された高温体22と、蒸発室21の周囲にまきまわされたコイル24とを有している。 Heating apparatus 25 includes an evaporation chamber 21 hot body 22 disposed therein and a coil 24 wound around the evaporation chamber 21. 蒸発室21は銅やアモルファス合金等の低透磁率材料で構成され、高温体22はステンレス等の高抵抗導電材料で構成され、電源26からコイル24に交流電圧を印加すると、蒸発室21の内部に電磁場が形成され、高温体22が誘導加熱される。 Evaporation chamber 21 is composed of a low magnetic permeability material such as copper or amorphous alloy, hot body 22 is composed of a high-resistance conductive material such as stainless steel, when an AC voltage is applied from the power source 26 to the coil 24, the interior of the evaporation chamber 21 electromagnetic field is formed, the hot body 22 is induction heated.

蒸発室21には真空排気系83(真空ポンプ)が接続されている。 Vacuum evacuation system 83 is in the evaporation chamber 21 (vacuum pump) is connected. 蒸発室21内部に真空雰囲気を形成しておき、蒸着材料39の蒸発温度以上分解温度未満の加熱温度に高温体22を加熱して、蒸着材料39を蒸発室21に供給すると、加熱した高温体22に蒸着材料39が接触し、蒸発室21の内部に蒸着材料39の蒸気が発生する。 It leaves a vacuum atmosphere inside the evaporation chamber 21, by heating the high-temperature bodies 22 on the heating temperature lower than the evaporation temperature higher than the decomposition temperature of the vapor deposition material 39, when supplying the vapor deposition material 39 in the vaporization chamber 21, heated hot body the vapor deposition material 39 is in contact with 22, the vapor of the vapor deposition material 39 is generated inside the evaporation chamber 21.

切替装置70は第一〜第三の蒸気発生装置20a〜20cの蒸発室21のうち、1又は2以上の蒸発室21内部空間をそれぞれ放出装置50に接続し、又は、全部の蒸発室21の内部空間を放出装置50から遮断するように構成されている。 Switching device 70 of the evaporation chamber 21 of the first to third steam generator 20 a to 20 c, 1 or 2 or more evaporation chamber 21 an inner space connected to the respective discharge device 50, or, the whole of the evaporation chamber 21 It is configured to shut off the interior space from the discharge device 50.

第一〜第三の蒸気発生装置20a〜20cの蒸発室は切替装置70を介して排気槽に接続されている。 The evaporation chamber of the first to third steam generator 20a~20c is connected to an exhaust tank through a switching device 70. 上述したように、第一例の蒸着装置10bでは成膜槽11とは異なる真空槽82が排気槽であり、第二例の蒸着装置30bでは成膜槽11の一部が排気槽である。 As described above, the vacuum vessel 82 which is different from the first example of the vapor deposition apparatus 10b in the film forming chamber 11 is evacuated vessel, a part of the second example of the deposition apparatus 30b in the film forming chamber 11 is evacuated vessel.

切替装置70は第一〜第三の蒸気発生装置20a〜20cの蒸発室21のうち、1又は2以上の蒸発室21を排気槽に接続しながら、放出装置50から遮断するか、1又は2以上の蒸発室21を排気槽から遮断しながら、放出装置50に接続するか、全部の蒸発室21を排気槽と放出装置50の両方から遮断するように構成されている。 Switching device 70 of the evaporation chamber 21 of the first to third steam generator 20 a to 20 c, while connecting one or more of the evaporation chamber 21 to the exhaust tank, blocking the discharge device 50 or, 1 or 2 while blocking more evaporation chamber 21 from the exhaust tank, or connected to the discharge device 50 is configured to block all of the evaporation chamber 21 from the exhaust air tank and the discharge device 50.

第一〜第三の蒸気発生装置20a〜20cは第一〜第三の供給配管76a〜76cをそれぞれ介して切替装置70に接続されており、第一〜第三の供給配管76a〜76cには、別の供給配管76a〜76cに接続された蒸気発生装置20a〜20c内の蒸気は通らないようになっている。 First to third steam generator 20a~20c it is connected to the switching device 70 via respectively the first to third supply pipe 76a to 76c, the first to third supply pipe 76a to 76c is , the steam in the connected steam generator 20a~20c that the separate feed pipes 76a~76c so as not pass.

従って、第一〜第三の蒸気発生装置20a〜20cで発生した蒸気は、別々の供給配管76a〜76cを通って放出装置50へ供給される。 Thus, steam generated in the first to third steam generator 20a~20c is supplied to the discharging unit 50 through separate supply pipes 76a to 76c.
排気槽は第一〜第三の排出配管78a〜78cを介して切替装置70に接続されている。 Exhaust tank is connected to the switching device 70 via the first to third exhaust pipes 78a to 78c. 第一〜第三の排出配管78a〜78cの切替装置70と反対側の端部(排出口)は、排気槽の内部に位置する。 Opposite end portions and the switching device 70 of the first to third exhaust pipes 78a to 78c (outlet) is located within the exhaust chamber.

第一例の蒸着装置10bでは排気槽(真空槽82)が成膜槽11で分離されている。 Exhaust tank In the first example of the vapor deposition apparatus 10b (vacuum chamber 82) are separated by a film forming chamber 11. 第二例の蒸着装置30bでは排気槽と成膜槽11で構成されるが、排出口は排気槽の内部であって、放出装置50の外側に位置している。 Is composed of a second example of a deposition apparatus 30b in the exhaust tank and the deposition chamber 11, the outlet is an internal exhaust tank, located outside of the discharge device 50. 従って、第一例、第二例のいずれも、蒸気は放出装置50の外側の空間に排出される。 Thus, the first example, none of the second example, the steam is discharged to the space outside the discharge device 50.

上述した第一〜第三の冷却手段85a〜85cは、第一〜第三の排出配管78a〜78cの排出口とそれぞれ対面するよう配置されている。 First to third cooling means 85a~85c described above, is arranged so as to face the outlet of the first to third exhaust pipes 78a~78c respectively.
第一〜第三の冷却手段85a〜85cにはそれぞれ冷却装置86が取り付けられている。 Each cooling device 86 is attached to the first to third cooling means 85a to 85c. 冷却装置86で第一〜第三の冷却手段85a〜85cを蒸着材料39の蒸発温度未満に冷却しておき、第一〜第三の蒸気発生装置20a〜20cの蒸発室21を排気槽に接続すると、第一〜第三の冷却手段85a〜85cに蒸気が析出する。 In the cooling device 86 was allowed to cool first to third cooling means 85a~85c below the evaporation temperature of the vapor deposition material 39, connecting the first to third evaporation chamber 21 of the steam generator 20a~20c exhaust tank Then, the vapor is deposited on the first to third cooling means 85a to 85c.

第一〜第三の冷却手段85a〜85cは排気槽から搬出入可能になっており、第一〜第三の冷却手段85a〜85cを排気槽から取り出せば、第一〜第三の冷却手段85a〜85cに析出した蒸着材料39を回収することができる。 First to third cooling means 85a~85c is enabled carrying in and carrying out from the exhaust tank, be taken out of the first to third cooling means 85a~85c from the exhaust chamber, the first to third cooling means 85a it can be recovered vapor deposition material 39 deposited on ~85C.

切替装置70は三方弁のようなバルブ71a〜71cを有している。 Switching device 70 has a valve 71a~71c such as three-way valve. 第一〜第三の排出配管78a〜78cはバルブ71a〜71cを介して第一〜第三の供給配管76a〜76cにそれぞれ接続されており、第一〜第三の供給配管76a〜76cに流れる蒸気は、当該供給配管76a〜76cに接続された排出配管78a〜78cを通り、他の供給配管76a〜76cに接続された排出配管78a〜78cを通らない。 First to third discharge pipe 78a~78c are connected respectively to the first to third supply pipe 76a~76c through the valve 71 a to 71 c, flowing through the first to third supply pipe 76a~76c steam passes through the discharge pipe 78a~78c connected to the supply pipe 76a to 76c, not through the discharge pipe 78a~78c connected to the other supply pipe 76a to 76c.

即ち、蒸発室21で発生した蒸気が排気槽に排出されるまでの経路は、第一〜第三の蒸気発生装置20a〜20c毎に異なる。 That is, the path to the vapor generated in the evaporation chamber 21 is discharged into the exhaust chamber is different for each first to third steam generator 20 a to 20 c. 第一〜第三の冷却手段85a〜85cに析出する蒸着材料39には、他の色の蒸着材料39が混ざらないから、回収した蒸着材料39を再びタンク32に戻して再利用することができる。 The vapor deposition material 39 deposited on the first to third cooling means 85a to 85c, do not mix other colors of the vapor deposition material 39 can be recycled back again tank 32 an evaporation material 39 recovered .

次に、本発明の発光層を形成する工程について説明する。 Next, steps for forming the light emitting layer of the present invention.
ここでは着色層は赤、緑、青の3色であり、赤、緑、青のうち、いずれか1色を第一の色、残りの二色のうち、一方の色を第二の色、他方の色を第三の色とする。 Here colored layer is red, green, and three colors of blue, red, green, among the blue, any one color first color, of the remaining two colors, the second color to one color, the other color to the third color.

蒸着材料39として、主成分の有機材料(ホスト)に、着色剤(ドーパント)が添加された、第一〜第三の色の蒸着材料39を用意する。 As the vapor deposition material 39, the organic material of the main component (host), colorant (dopant) is added, providing a first to third color of the vapor deposition material 39. 第一〜第三の色の蒸着材料39を第一〜第三の蒸気発生装置20a〜20cのタンク32にそれぞれ収容し、タンク32の蓋34を閉めて、蒸着材料39が収容された空間を密閉しておく。 The first to third color of the vapor deposition material 39 accommodated respectively in the first to third steam generator 20a~20c tank 32, closes the lid 34 of the tank 32, the vapor deposition material 39 is housed space keep sealed.

第一〜第三の蒸気発生装置20a〜20cの蒸発室21及びタンク32と、成膜槽11(及び真空槽82)とを真空排気し、蒸発室21と、タンク32と、成膜槽11(及び真空槽82)と、放出装置50と、各配管76a〜76c、77、78a〜78cと、切替装置70の内部に所定の成膜圧力(例えば10 -5 Pa)の真空雰囲気を形成する。 The first to third steam generator evaporation chamber 21 and the tank 32 of 20 a to 20 c, the film forming chamber 11 and a (and the vacuum chamber 82) is evacuated, the evaporation chamber 21, a tank 32, the film forming chamber 11 (and the vacuum chamber 82), to form a discharge device 50, the pipes 76a to 76c, and 77,78A~78c, a vacuum atmosphere of a predetermined film deposition pressure in the interior of the switching device 70 (e.g., 10 -5 Pa) .

該真空雰囲気を維持しながら、各高温体22を、蒸着材料39の蒸発温度以上であって、蒸着材料39の分解温度未満の加熱温度(例えば200℃〜300℃)に加熱し、その加熱温度を維持しておく。 While maintaining the vacuum atmosphere, each hot body 22, be more than the evaporation temperature of the vapor deposition material 39 is heated to a heating temperature lower than the decomposition temperature of the vapor deposition material 39 (for example, 200 ° C. to 300 ° C.), the heating temperature keep maintain.

形成すべき第一〜第三の色の着色層の膜厚は決められている。 The film thickness of the first to third color of the colored layer to be formed is determined. 決められた膜厚の成膜に必要な第一〜第三の色の蒸着材料39の必要量をそれぞれ求めておき、第一〜第三の色の蒸着材料39の必要量を、第一〜第三の蒸気発生装置20a〜20cの制御装置41にそれぞれ設定しておく。 Required amount of the first to necessary-determined thickness of the film a third color of the vapor deposition material 39 to previously obtain each required amount of the first to third color of the vapor deposition material 39, first to It is set to the control device 41 of the third steam generator 20 a to 20 c.

第一の蒸気発生装置20aを排気槽から遮断しながら、放出装置50に接続し、第二、第三の蒸気発生装置20b、20cを放出装置50から遮断した状態で、必要量の第一の色の蒸着材料39を、加熱された高温体22に接触させ、第一の色の蒸着材料39の蒸気を蒸発室21内部に発生させる。 While blocking the first steam generator 20a from the exhaust tank, connected to the discharge device 50, the second, third steam generator 20b, while blocking the 20c from the discharge device 50, the required amount first the color of the vapor deposition material 39 is brought into contact with the heated hot body 22, to generate steam in the first color of the vapor deposition material 39 inside the evaporation chamber 21. 第一の色の蒸着材料39の蒸気は、圧力差により、第一の蒸気発生装置20aの蒸発室21から放出装置50へ移動する。 Vapor of the first color of the vapor deposition material 39, by a pressure difference, to move into the discharge device 50 from the evaporation chamber 21 of the first steam generator 20a.

成膜槽11内部の放出装置50上方位置には基板ホルダ15が配置されている。 Film forming chamber 11 the substrate holder 15 in the interior of the discharge device 50 upper position is arranged.
第一の蒸気発生装置20aを放出装置50に接続した状態で蒸着材料39を高温体22に接触させる前に、基板81を成膜槽11内部に搬入して基板ホルダ15に保持させ、アライメント手段60により、基板81の第一の色の着色層が形成されるべき領域と、マスク16の開口17とが対面するように位置合わせを行っておく。 Prior to contacting the vapor deposition material 39 in a state of connecting the first steam generator 20a to the discharging unit 50 to the hot body 22, it is held by the substrate holder 15 and carries the substrate 81 within the deposition chamber 11, alignment means by 60, it is processed and the area to the colored layer of the first color of the substrate 81 is formed, the alignment so that the opening 17 of the mask 16 are face to face.

放出装置50へ移動し、放出口55から放出された蒸気は、開口17を通って基板81に到達し、基板81の決められた領域に第一の色の着色層が成長する。 Go to the discharging unit 50, the steam that is discharged from the discharge port 55 reaches the substrate 81 through the opening 17, the colored layer of the first color is grown in a region with a predetermined substrate 81. このとき、他の色の着色層を形成すべき領域は、マスク16の遮蔽部18で覆われているから、他の色の着色層を形成すべき領域には、第一の色の着色層は成長しない。 In this case, the region for forming the colored layers of other colors, because they are covered by the blocking portion 18 of the mask 16, the region for forming the colored layer of another color, the colored layer of the first color not grow.

上述したように、蒸発室21に配置された蒸着材料39の量は、決められた膜厚の成膜に必要な量である。 As described above, the amount of the evaporation chamber 21 is arranged in the vapor deposition material 39 is the amount necessary for forming a film thickness that is determined.
その蒸着材料39が全て蒸発するまで、成膜槽11を真空排気しながら、第一の蒸気発生装置20aを排気槽から遮断して放出装置50に接続した状態と、他の蒸気発生装置20b、20cを放出装置50から遮断した状態と、位置合わせされた基板81とマスク16を放出装置50上に位置させる状態を維持する。 Until the deposition material 39 is completely evaporated, while evacuating the film forming chamber 11, a state of connecting the first steam generator 20a to the discharging unit 50 to cut off from the exhaust tank, another steam generator 20b, maintaining a state in which blocked 20c from the discharge device 50, a state to be located in the substrate 81 and the mask 16 is aligned discharging unit 50 on.

第一の蒸気発生装置20aを放出装置50に接続してから所定時間が経過するか、第一の蒸気発生装置20aの蒸発室21の内部圧力が、所定圧力以下になったら、蒸着材料39が全部蒸発し、成膜が終了したと判断する。 Or a predetermined time after connecting the first steam generator 20a to the discharging unit 50 has elapsed, the internal pressure of the evaporation chamber 21 of the first steam generator 20a is, when falls below a predetermined pressure, the vapor deposition material 39 evaporated whole, it is determined that the film formation has been completed.

成膜が終了した時には、基板81表面の決められた領域に、決められた膜厚の第一の色の着色層が形成される。 When deposition is completed, a region with a predetermined substrate 81 surface, the colored layer of the first color-determined thickness is formed.
第一の色の着色層の成膜が終了したら、第一の蒸気発生装置20aを放出装置50から遮断しながら排気槽に接続して後述する排気処理を行い、第二の色の着色層を成膜する。 When the first color of the colored layer deposition is completed, the by connecting the first steam generator 20a in the exhaust chamber while blocking the discharge device 50 performs the exhaust treatment to be described later, the coloring layer of the second color It is deposited.

第二の色の着色層の成膜が終了後は、第二の蒸気発生装置20bを放出装置50から遮断しながら排気槽に接続して排気処理を行い、第三の色の着色層を成膜する。 After deposition of the second color of the colored layer is completed, by connecting the second steam generator 20b to the exhaust chamber while blocking the discharge device 50 performs the exhaust process, forming a colored layer of a third color to film. 第三の色の着色層を成膜後は、第三の蒸気発生装置20cを放出装置50から遮断しながら排気槽に接続して排気処理を行う。 After formation of the colored layer of a third color, for exhausting process by connecting a third steam generator 20c in the exhaust chamber while blocking the discharge device 50.

尚、第二、第三の色の着色層の成膜は、第一の色の着色層を形成した時と同様に、開口17が第二、第三の色の着色層を形成すべき領域と対面するように、基板81とマスク16を位置合わせをしてから、第二、第三の蒸気発生装置20b、20cを放出装置50に接続した状態で、予め求められた量の第二、第三の色の蒸着材料39を蒸発室21内でそれぞれ蒸発させる。 Incidentally, the second, the formation of the third color of the colored layer, as in the case of forming the colored layer of the first color, second opening 17 first, to form the colored layer of the third color regions so as to face the substrate 81 and the mask 16 from the alignment, the second, third steam generator 20b, while connected to 20c to the discharge device 50, a second previously obtained quantity, evaporation respectively in the evaporation chamber 21 a third color of the vapor deposition material 39.

位置合わせされた基板81とマスク16とを放出装置50上に位置させたまま、放出口55から蒸気を放出すれば、予め決められた領域に、決められた膜厚の第二、第三の色の着色層が成膜され、発光層が得られる。 And aligned with the substrate 81 masked 16 while it is positioned on the discharging unit 50, when releasing the vapor from the discharge port 55, a predetermined area, the determined film thickness the second, third colored layers of the color is deposited, the light emitting layer is obtained.
発光層を形成する間、基板81はマスク16に対して相対的に移動するが、放出装置50上から取り外す必要がないので、基板81の移動距離が短く、発塵が少ない。 During formation of the light-emitting layer, but the substrate 81 is moved relative to the mask 16, since it is not necessary to remove from the upper discharge device 50, the moving distance of the substrate 81 is short, less dust.

発光層が形成された状態の基板81を基板ホルダ15から取り外して、成膜槽11から搬出し、発光層が形成される前の未処理の基板81を成膜槽11に搬入して基板ホルダ15に保持させ、上述した工程で第一〜第三の色の着色層の成膜を行う。 Remove the substrate 81 in the state in which the light-emitting layer is formed from the substrate holder 15, it is unloaded from the film forming chamber 11, the substrate holder and carries the substrate 81 before the unprocessed film deposition chamber 11 in which the light-emitting layer is formed 15 is held in, forming a film of the first to third color of the colored layer in the step described above.

各蒸発室21の内部と、各蒸発室21と放出装置50との間の経路には、前の基板81の成膜に用いた蒸気及びその分解物が残留している。 And the inside of the evaporation chamber 21, the path between each evaporation chamber 21 and the discharge device 50, the vapor and its degradation product was used for the film formation before the substrate 81 is left. 経路のうち、切替装置70と蒸発室21の間の部分(供給配管76a〜76c)は、切替装置70と成膜槽11と間の部分に比べて長く、しかも、供給配管76a〜76cと蒸発室21は成膜槽11から遠いから、前に成膜した時の蒸気と、その分解物が残留しやすい。 Of path, the portion between the switching device 70 the evaporation chamber 21 (supply pipe 76a to 76c) is longer than the portion between the switching device 70 deposition chamber 11 and, moreover, evaporation and supply piping 76a to 76c since the chamber 21 is far from the film forming chamber 11, and steam when deposited before, the decomposition product is likely to remain.

蒸気や分解物が残留すると、次の成膜に悪影響を与える虞があるから、蒸発室21に蒸着材料39を供給して着色層の成膜を開始する前に、第一〜第三の蒸気発生装置20a〜20cの排気処理を終了させておく。 When the vapor or decomposition products remain, because there is a concern that an adverse effect on subsequent film formation, before starting the deposition of the colored layer by supplying the vapor deposition material 39 in the evaporation chamber 21, the first to third steam allowed to terminate the exhaust process generator 20 a to 20 c.

排気処理は、排気槽に予め第一〜第三の冷却手段85a〜85cを搬入し、第一〜第三の冷却手段85a〜85cを蒸着材料39の蒸発温度未満の冷却温度に冷却し、その冷却温度を維持しておく。 Exhaust process, carried in advance first to third cooling means 85a~85c the exhaust tank, cooling the first to third cooling means 85a~85c cooling temperature below the evaporation temperature of the vapor deposition material 39, the keep maintain the cooling temperature.

排気槽を真空排気しながら、第一〜第三の蒸気発生装置20a〜20cを排気槽に接続し、第一〜第三の蒸気発生装置20a〜20cの内部空間(蒸発室21の内部空間)と、該内部空間と切替装置70との間の経路(供給配管76a〜76c)とを真空排気し、残留する蒸気を排気槽に排出して、第一〜第三の冷却手段85a〜85cに析出させる。 While the exhaust chamber is evacuated, the first to third steam generator 20 a to 20 c is connected to the exhaust chamber, the inner space of the first to third steam generator 20 a to 20 c (the internal space of the evaporation chamber 21) When the path between the internal space and the switching device 70 and a (supply pipe 76a to 76c) is evacuated, and discharge the steam remaining in the exhaust chamber, the first to third cooling means 85a~85c It is deposited.

ここでは、蒸発室21にガス供給系84が接続されている。 Here, the gas supply system 84 is connected to the evaporation chamber 21. 第一〜第三の蒸気発生装置20a〜20cを排気槽に接続しながら、ガス供給系84から蒸発室21にN 2ガスのようなパージガスを流せば、残留蒸気はパージガスで押し流されるから、残留蒸気の排出効率が上がる。 While connecting the first to third steam generator 20a~20c the exhaust tank, be allowed to flow purge gas such as N 2 gas to the evaporating chamber 21 from the gas supply system 84, since the residual steam is swept with a purge gas, residual emission efficiency of the steam rises.

第一〜第三の蒸気発生装置20a〜20cを排気槽に接続してから所定時間経過した時、又は蒸発室21が所定の圧力に達したら、残留蒸気が無くなり、排気処理が終了したと判断する。 When the first to third steam generator 20a~20c predetermined time has elapsed after connecting to the exhaust tank, or if the evaporation chamber 21 reaches a predetermined pressure, there is no residual steam, it determines that the exhaust process is completed to.

第一〜第三の蒸気発生装置20a〜20cは、排気処理が終了した後、蒸発室21に蒸着材料39を供給するまでの間、放出装置50から遮断しながら排気槽に接続したままにしてもよいし、排気槽と放出装置50の両方から遮断しておいてもよい。 First to third steam generator 20a~20c, after the exhaust process is completed, until the supply an evaporation material 39 in the evaporation chamber 21, remain connected to the exhaust chamber while blocking the discharge device 50 it may be, may have been cut off from the exhaust air tank and the discharge device 50.

蒸発室21に蒸着材料39を供給する前に、蒸発室21に接続された真空排気系83を動作させ、蒸発室21内部に上述した成膜圧力を形成する。 Before supplying the vapor deposition material 39 in the evaporation chamber 21, by operating the evacuation system 83 connected to the evaporation chamber 21, to form a deposition pressure as described above within the evaporation chamber 21. 排気処理にパージガスを用いた場合、成膜圧力を形成する際に、パージガスが蒸発室21と、第一〜第三の供給配管76a〜76cから除去される。 When using a purge gas exhaust treatment, when forming a deposition pressure, purge gas and the evaporation chamber 21, it is removed from the first to third supply pipe 76a to 76c.

蒸発室21に蒸着材料39を供給する時には、蒸発室21と、蒸発室21と切替装置70との間の経路から、残留蒸気、残留蒸気の分解物及びパージガス等が除去されているから、分解物の混入がなく、かつ、決められた膜厚の着色層が形成される。 When supplying the vapor deposition material 39 in the evaporation chamber 21, the evaporation chamber 21, the path between the evaporation chamber 21 and the switching device 70, the residual vapor, the decomposition of residual steam and purge gas and the like are removed, decomposed no contamination of the object, and the colored layer-determined thickness is formed.

第一〜第三の色の着色層の成膜と、第一〜第三の蒸気発生装置20a〜20cの排気処理と、基板81の交換とを繰り返せば、蒸発室21や配管(特に供給配管76a〜76c)のメンテナンス無しに、多数枚の基板81の成膜処理を連続して行うことができる。 And the deposition of the first to third color of the colored layer, and an exhaust process of the first to third steam generator 20 a to 20 c, repeating the exchange of the substrate 81, the evaporation chamber 21 and pipes (especially supply pipe without maintenance 76a to 76c), it can be continuously performed a film forming process of the large number of substrates 81.

尚、第一〜第三の冷却手段85a〜85cに析出した蒸着材料39は再利用してもよいし、そのまま捨ててもよい。 Incidentally, the vapor deposition material 39 deposited on the first to third cooling means 85a~85c is may be reused, or may be discarded as it is. 析出した蒸着材料39を再利用せずに捨てる場合には、第一〜第三の供給配管76a〜76cを通った蒸気を、同じ排出配管を通して排気槽へ排出させてもよい。 When discarding the vapor deposition material 39 deposited without reuse, the steam having passed through the first to third supply pipe 76a to 76c, it may be discharged to the exhaust chamber through the same discharge pipe.

高温体22を加熱する加熱手段も、誘導加熱手段に限定されない。 Heating means for heating the hot body 22 is not limited to the induction heating means. 高温体22にヒーターを取り付け、該ヒーターに通電し、熱伝導で高温体22を加熱することもできる。 Attaching a heater to a high temperature member 22, is energized to the heater, it is also possible to heat the hot body 22 by heat conduction. 更に、蒸発室21にレーザー光が透過可能な窓部を設け、高温体22又は高温体22に配置された蒸着材料39にレーザー光を照射して、蒸着材料39を蒸発させてもよい。 Further, the evaporation chamber 21 a laser beam is provided capable of transmitting window, the deposition material 39 located hot body 22 or hot body 22 is irradiated with laser light may be evaporated deposition material 39.

高温体22の形状も特に限定されないが、ここでは、高温体22は板状の加熱板22cと、加熱板22c表面に配置されたリング状の外周突部22bと、加熱板22c表面の外周突部22bのリング内側に配置された内側突部22aとを有している。 Without being particularly limited shape of the hot body 22, here, the outer peripheral end collision of the hot body 22 is a plate-like heating plate 22c, and the outer protrusion 22b shaped arranged in the heating plate 22c surface ring, heating plate 22c surface and an inner protrusion 22a arranged in a ring inside parts 22b. 供給装置31から落下した蒸着材料39は、内側突部22aと外周突部22bの間に配置される。 The vapor deposition material 39 dropped from the supply device 31 is disposed between the inner protrusion 22a and the outer peripheral protrusion 22b.

本発明に用いる供給装置31は、決められた量の蒸着材料39を正確に蒸発室21に供給可能なものであれば特に限定されない。 Feeder 31 for use in the present invention, as long as that can be supplied to exactly the evaporation chamber 21 a vapor deposition material 39 in an amount that is determined if no particular limitation.
蒸着材料39はホストとドーパントの混合物に限定されない。 Vapor deposition material 39 is not limited to a mixture of host and dopant. 例えば、第一〜第三の蒸気発生装置20a〜20cに2つ以上のタンク32をそれぞれ設け、タンク32に蒸着材料39の成分(例えば、ホスト、着色剤、他のドーパント)をそれぞれ別々のタンク32に収容させておく。 For example, providing the first to third steam generator 20a~20c into two or more tanks 32, respectively, components of the vapor deposition material 39 in the tank 32 (e.g., a host, colorants, other dopants) each separate tank allowed to accommodate to 32.

決められた組成、決められた膜厚の着色層の成膜に必要な量を各成分毎に求めておき、求めた量の各成分をタンク32から同じ蒸発室21又は異なる蒸発室21にそれぞれ供給し、蒸発室21内で加熱して蒸気を発生させる。 Determined composition, the amount needed to deposit the colored layer-determined thickness to previously obtain each component, respectively the components in the amounts determined from the tank 32 in the same evaporation chamber 21 or different evaporation chamber 21 supplied, the heated evaporation chamber 21 to generate steam.

各蒸発室21を同じ放出装置50に接続して、各成分の蒸気を同じ放出装置50の放出口55から放出させれば、基板81表面には、決められた組成、決められた膜厚の着色層が形成される。 Connect each vaporization chamber 21 to the same release device 50, if the release of vapor of the components from the discharge port 55 of the same discharge device 50, the substrate 81 surface, the composition was determined, the determined film thickness colored layer is formed.

第一〜第三の色は赤、緑、青に限定されず、3原色であれば赤、黄、青であってもよい。 The first to third color is red, green, is not limited to blue, if the three primary colors red, yellow, may be blue. また、着色層の色の数は3色に限定されず、2色以下であってもよいし、4色以上であってもよい。 Further, the number of color of the colored layer is not limited to three colors, it may be more than 2 colors, may be four or more colors. 蒸気発生装置20a〜20cは少なくとも着色層の色の数と同じか、それ以上用意する。 Steam generator 20a~20c Do the same as the number of colors of at least the colored layer, it is prepared more. 要するに本願発明の蒸着装置は、異なる色の着色層を、異なる領域に形成可能なものである。 In short deposition apparatus of the present invention, the colored layers of different colors, and it is capable of forming the different regions.
着色層は、発光材料が含有された発光層を構成する場合に限定されず、発光層とは別に形成してもよい。 Coloring layer is not limited to the case of forming the light emitting layer emitting material is contained, it may be formed separately from the light-emitting layer.

本発明の蒸着装置10bは発光層だけでなく、ホール輸送層、ホール注入層、電子注入層、電子輸送層等、他の有機薄膜の成膜に用いることもできる。 Vapor deposition apparatus 10b of the present invention is not only light-emitting layer, a hole transport layer, hole injection layer, an electron injection layer, an electron transport layer, etc., may be used for forming other organic thin film.
ホール輸送層、ホール注入層、電子注入層、電子輸送層等、発光層以外の有機薄膜を成膜する際には、基板表面の成膜する領域を変える必要が無いから、基板81と放出装置50の間にマスク16を配置しなくてもよく、又はマスク16を配置する場合であっても、各層の成膜毎にマスク16を移動させる必要がない。 Hole transport layer, hole injection layer, an electron injection layer, an electron transport layer or the like, when forming the organic thin film other than the light emitting layer, since there is no need to change the area for forming the substrate surface, the substrate 81 and the release device it is not necessary to place a mask 16 between 50, or even when placing the mask 16, it is not necessary to move the mask 16 for each deposition of the layers.

1つの成膜槽11内部には、1又は複数の放出装置50を配置することができる。 Inside one of the film forming chamber 11 can be arranged one or more discharge devices 50. 1つの成膜槽11内部に複数の放出装置50を配置する場合、各放出装置50から放出される蒸気が混合されないよう、放出装置50同士の距離を十分に離すか、成膜槽11内部に蒸気の流れを遮蔽する遮蔽板を設けることが望ましい。 When a plurality of discharge device 50 within a single deposition chamber 11, such that vapor released from the discharge device 50 is not mixed, or adequate separation distance between the discharging unit 50, the film forming chamber 11 to the interior it is desirable to provide a shielding plate for shielding the flow of steam.

放出装置50と、基板ホルダ15のいずれか一方又は両方を揺動手段58に接続してもよい。 A discharging unit 50, may be connected to either or both of the substrate holder 15 in the rocking means 58. 蒸気を放出している間、基板81とマスク16を相対的に静止させた状態で、該基板81を放出装置50に対して、水平面内で往復移動又は円運動させれば、基板81表面に成長する有機薄膜の膜厚が均一になる。 While releasing steam, in a state where the substrate 81 and the mask 16 are relatively stationary, the substrate 81 on the release device 50, if reciprocating or circular movement in a horizontal plane, the substrate 81 surface the film thickness of the organic thin film to be grown is uniform.

基板ホルダ15と放出装置50との相対的な往復移動の方向は特に限定されない。 Direction of relative reciprocal movement between the substrate holder 15 and the discharge device 50 is not particularly limited.
例えば、放出装置50が、放出口55が設けられた放出容器51と、該放出容器51内部に配置された供給管52とを有し、該供給管52が所定間隔を空けて略平行に配置された複数本の分岐管を有する場合、基板81と放出装置50を、該分岐管と交差する方向に水平面内で相対的に移動させる。 For example, the release device 50, the discharge vessel 51 to the discharge port 55 is provided, and a supply pipe 52 disposed inside said discharging container 51, substantially parallel to the feed pipe 52 at a predetermined distance If having a plurality of branch pipes that are the substrate 81 and the discharge device 50, it is relatively moved in a horizontal plane in a direction intersecting with the branch pipe.

供給管52の噴出口53を、放出容器51の放出口55と対面しない位置に設ければ、噴出口53から噴出される蒸気は、放出容器51に充満してから放出口55から放出されるため、放出速度が安定する。 The spout 53 of the supply pipe 52, be provided at a position not facing the outlet 55 of the discharge vessel 51, steam ejected from the ejection port 53 is discharged from the discharge port 55 after filling the discharge vessel 51 Therefore, the release rate is stabilized. 具体的には、放出口55が放出容器51の天井に設けられている場合は、噴出口53は供給管52の放出容器51の底面又は側面と対向する部分に設ける。 Specifically, if the discharge port 55 is provided in the ceiling of the discharge vessel 51, spout 53 is provided on the bottom or side portion facing the release chamber 51 of the supply pipe 52.

放出装置50(ここでは放出容器51)の放出口55が形成された面(前面)を、基板81よりも大面積にし、放出口55を前面に所定間隔を空けて分散配置しておけば、基板81を放出装置50上に位置させたまま、基板81表面全部に亘って薄膜を形成することができる。 A surface discharge openings 55 are formed in the discharge device 50 (here desorption chamber 51) (front), and the larger area than the substrate 81, if and distributed at predetermined intervals the outlet 55 to the front, the substrate 81 while keeping the position on the release device 50, it is possible to form a thin film over the entire substrate 81 surface. この方法によれば、基板81を搬送しながら成膜する必要がなく、成膜槽11内での基板81の移動距離が短くなるので、基板81の搬送によるダストの発生量が少ない。 According to this method, it is not necessary to form while conveying the substrate 81, the moving distance of the substrate 81 in the film forming chamber within 11 becomes shorter, less generation of dust due to the transport of the substrate 81.
蒸発室21を放出装置50に接続して蒸気を供給する際、蒸発室21にパージガス(例えばN 2 )を導入すれば、蒸気の供給効率が高くなる。 When supplying steam connected to the evaporation chamber 21 to the discharging unit 50, when introducing the purge gas (e.g., N 2) in the evaporation chamber 21, the supply efficiency of the steam is increased.

尚、決められた膜厚を成膜するのに要する有機材料39の供給量は予備試験で求めておく。 The supply amount of the organic material 39 required to deposit a determined film thickness values ​​are obtained in preliminary tests. 予備試験は、実際の成膜に用いるものと同じ有機材料39をタンク32に収容し、真空雰囲気の圧力、高温体22の加熱温度等の成膜条件を、実際の製造の時と成膜条件と同じにし、放出装置50上に基板81(マスク16使用するならばマスク16と基板81)とを配置したまま、有機材料39を蒸発室21に供給して蒸気を発生させ、該蒸気を放出口55から放出させて薄膜を形成する。 Preliminary tests accommodates the same organic material 39 and that used for the actual film formation tank 32, the pressure of the vacuum atmosphere, the deposition conditions such as heating temperature of the hot body 22, the actual time of manufacture and deposition conditions the same west, while placing the substrate 81 on the release device 50 (the mask 16 and the substrate 81 if used mask 16), by supplying the organic material 39 in the evaporation chamber 21 to generate steam, release the gas the evaporated and released from the outlet 55 to form a thin film. 有機材料39の落下量と、薄膜の膜厚との関係を求めれば、その関係から必要供給量が分かる。 By obtaining the drop amount of the organic material 39, the relationship between the thickness of the thin film, the supply amount is found necessary from the relationship.

蒸気発生装置20a〜20cの設置場所は特に限定されず、蒸気発生装置20a〜20cの一部又は全部を、放出装置50と同じ成膜槽11内部に設置してもよい。 Location of the steam generator 20 a to 20 c is not particularly limited, a part or all of the steam generator 20 a to 20 c, may be installed inside the same deposition chamber 11 and the discharge device 50.
尚、蒸発室21を放出装置50に接続して蒸気を供給する時には、少なくとも蒸気が通る経路(供給配管76a〜76c、切替装置70、放出配管77、放出装置50)をヒーターで、蒸着材料39の蒸発温度以上分解温度未満に加熱すれば、該経路で蒸気が析出しない。 Incidentally, when supply steam by connecting the evaporation chamber 21 to the discharge device 50, at least the steam passes path (supply pipe 76a to 76c, switching device 70, discharge pipe 77, discharge device 50) with the heater, the vapor deposition material 39 if heated to below the evaporation temperature higher than the decomposition temperature, the vapor does not precipitate in the route.

放出装置50からの輻射熱でマスク16が加熱されると、熱膨張が起こり、成膜精度が下がるので、放出装置50とマスク16との間に断熱材(冷却板)67を配置し、ヒーター68を冷却板67で覆うことが望ましい。 When the mask 16 in the radiant heat from the discharge device 50 is heated, occurs thermal expansion, since the film formation accuracy is lowered, the heat insulating material (cooling plate) 67 is disposed between the discharging unit 50 and the mask 16, the heater 68 it is desirable to the covering by the cooling plate 67.

冷却板67の放出口55上の位置に、放出口55が露出する開口(蒸気放出口)を設けておき、該開口の大きさを、放出口55から放出される蒸気が接触しない程度に大きくすれば、蒸気が冷却板67に析出しない。 The position on the outlet 55 of the cooling plate 67, may be provided an opening (steam outlet) of outlet 55 is exposed, increasing the size of the opening, to the extent that vapor released does not contact the outlet 55 if steam is not deposited on the cooling plate 67.

蒸発室21を排気槽に接続して蒸気を排出する際には、少なくとも蒸気が排出される経路(供給配管76a〜76c、切替装置70、排出配管78a〜78c)を、蒸着材料39の蒸発温度以上分解温度未満に加熱すれば、該経路で蒸気が発生しない。 When discharging steam by connecting the evaporation chamber 21 to the exhaust tank, at least the path steam is discharged (supply pipe 76a to 76c, switching device 70, discharge pipe 78a to 78c) to the evaporation temperature of the vapor deposition material 39 if heated to less than the decomposition temperature, the steam is not generated in the pathway. その経路に加え、排気槽も蒸発温度以上分解温度未満に加熱しておけば、蒸着材料39は排気槽の壁面に析出せず、第一〜第三の冷却手段85a〜85cに析出するから、蒸着材料39の回収効率が上がる。 In addition to the path, if also the exhaust chamber is heated to less than the evaporation temperature decomposition temperature, the vapor deposition material 39 is not deposited on the wall surface of the exhaust chamber, because deposited in the first to third cooling means 85a to 85c, the recovery efficiency of the vapor deposition material 39 is increased.

第一〜第三の冷却手段85a〜85cの形状は特に限定されず、板状であってもよいし、容器状であってもよい。 The shape of the first to third cooling means 85a~85c is not particularly limited, may be a plate shape, or may be a container shape. また、第一〜第三の冷却手段85a〜85cは一体であってもよいし、分離されていてもよい。 Further, the first to third cooling means 85a~85c may be the integral may be separated.

成膜装置の一例を説明するための平面図 Plan view for explaining an example of a film forming apparatus 本発明第一例の蒸着装置の模式的な斜視図 Schematic perspective view of a deposition apparatus of the present invention first example 本発明第一〜第三の蒸気発生装置を説明するための断面図 Sectional view for illustrating the first to third steam generator present invention 本発明第二例の蒸着装置の模式的な断面図 Schematic cross-sectional view of a vapor deposition apparatus of the second example of the present invention 従来技術の蒸着装置を説明するための断面図 Sectional view for explaining a prior art deposition apparatus

符号の説明 DESCRIPTION OF SYMBOLS

9、89……真空排気系 10b……蒸着装置 11……成膜槽 12……蒸気発生源 20a〜20c……第一〜第三の蒸気発生装置 21……蒸発室 25……加熱装置 31……供給装置 42……導入管 32……タンク 39……蒸着材料 50……放出装置 70……切替装置 81……基板 82……真空槽 85a〜85c……第一〜第三の冷却手段 86……冷却装置 9,89 ...... evacuation system 10b ...... deposition apparatus 11 ...... film forming chamber 12 ...... steam source 20 a to 20 c ...... first to third steam generator 21 ...... vaporization chamber 25 ...... heating device 31 ...... supply device 42 ...... inlet tube 32 ...... tank 39 ...... deposition material 50 ...... emitting device 70 ...... switching device 81 ...... substrate 82 ...... vacuum chamber 85a to 85c ...... first to third cooling means 86 ...... cooling device

Claims (10)

  1. 内部で蒸着材料の蒸気を発生させる蒸気発生源と、 A steam generating source for generating the vapor of the vapor deposition material therein,
    前記蒸着材料の蒸気を成膜槽内部に放出する放出装置と、 A release device for releasing the vapor of the deposition material inside the deposition chamber,
    前記蒸気発生源の内部が前記放出装置の内部に接続された状態と、前記蒸気発生源の内部が前記放出装置の内部から遮断された状態とを切替える切替装置とを有する蒸着装置であって、 A vapor deposition apparatus having a state in which the interior of the steam generating source is connected to the inside of the discharge device and a switching device for switching between a state in which the interior of the vapor source is cut off from the interior of the discharge device,
    真空槽と、前記真空槽に接続された真空排気系とを有し、 Includes a vacuum chamber, and a vacuum exhaust system connected to said vacuum chamber,
    前記切替装置は、前記蒸気発生源の内部を前記放出装置の内部から遮断しながら、前記蒸気発生源の内部を前記真空槽に接続できるように構成された蒸着装置。 Wherein the switching device, while blocking the inside of the steam generating source from the interior of the discharge device, configured evaporation apparatus so that it can connect the inside of the steam generating source into the vacuum chamber.
  2. 前記蒸気発生源は複数の蒸気発生装置を有し、 The steam source includes a plurality of steam generator,
    前記蒸気発生源の内部は前記各蒸気発生装置の内部であり、 Inside of the steam generating source is inside the respective steam generator,
    前記切替装置は、前記各蒸気発生装置の内部を、前記放出装置又は前記真空槽に個別に接続できるように構成された請求項1記載の蒸着装置。 Wherein the switching device, the interior, the discharge device or vapor deposition device according to claim 1, wherein configured to be individually connected to the vacuum chamber of the steam generator.
  3. 前記各蒸気発生装置は、前記蒸気発生装置の内部空間を構成する蒸発室と、 Each steam generator includes an evaporation chamber constituting the internal space of the steam generator,
    前記蒸着材料が収容されるタンクと、 A tank in which the deposition material is accommodated,
    前記蒸着材料を前記タンクから前記蒸発室に供給する供給装置と、 A supply device for supplying the deposition material in the evaporation chamber from the tank,
    前記蒸発室に供給された前記蒸着材料を加熱する加熱装置とを有し、 And a heating device for heating the vapor deposition material supplied to the evaporation chamber,
    前記蒸着材料は、前記供給装置により、当該供給装置に設定された量供給される請求項2記載の蒸着装置。 The deposition material, the by supply device, the vapor deposition apparatus of claim 2, wherein the amount supplied is set to the supply device.
  4. 前記成膜槽は前記真空槽から分離され、 The film bath is separated from the vacuum chamber,
    前記成膜槽には主真空排気系が接続され、 The main vacuum pumping system is connected to the film forming chamber,
    前記放出装置は、前記蒸気を放出する1又は2以上の放出口を有し、 The release device has one or more discharge port for discharging the steam,
    前記放出装置の内部空間は、前記放出口を介して前記成膜槽の内部に接続された請求項1乃至請求項3のいずれか1項記載の蒸着装置。 The inner space of the discharge apparatus, the deposition apparatus according to any one of the outlet is connected to the inside of the deposition chamber via the claims 1 to claim 3.
  5. 前記成膜槽は前記真空槽と同一であり、 The film forming chamber is the same as the vacuum chamber,
    前記放出装置は、前記蒸気を放出する1又は2以上の放出口を有し、 The release device has one or more discharge port for discharging the steam,
    前記放出装置の内部空間は、前記放出口を介して前記真空槽の内部に接続され、 The inner space of the discharge device, through the outlet connected to the interior of the vacuum chamber,
    前記切替装置は、前記蒸気発生源の内部空間を、前記真空槽の内部空間のうち、前記放出装置の外部空間に接続する請求項1乃至請求項3のいずれか1項記載の蒸着装置。 Wherein the switching device, the interior space of the vapor source, of the internal space of the vacuum chamber, the deposition apparatus according to any one of claims 1 to 3 connected to the outer space of the discharge device.
  6. 前記真空槽に搬出入可能な冷却手段と、前記真空槽に搬入された前記冷却手段を冷却する冷却装置とを有する請求項1乃至請求項5のいずれか1項記載の蒸着装置。 Deposition apparatus according to any one of claims 1 to 5 has a loading and unloading possible cooling means to said vacuum chamber, and a cooling device for cooling the cooling means are carried into the vacuum chamber.
  7. 第一〜第三の蒸気発生装置に第一〜第三の色の蒸着材料を配置しておき、 First to third steam generator advance the first to third color of the vapor deposition material is arranged,
    前記第一〜第三の蒸気発生装置の内部で、前記第一〜第三の色の蒸着材料の蒸気をそれぞれ発生させ、 Within the first to third steam generator, respectively to generate vapor of the first to third color of the vapor deposition material,
    前記第一〜第三の色の前記蒸着材料の蒸気を、前記第一〜第三の蒸気発生装置から、放出装置に順番に移動させ、当該放出装置の放出口から成膜槽の内部に放出させ、 Releasing the vapor of the first to third color said deposition material from the first to third steam generator, is moved in order to release apparatus, the inside of the deposition chamber from the outlet of the discharge device then,
    前記成膜槽の内部に配置された基板の、第一〜第三の領域に、前記第一〜第三の色の前記蒸着材料の蒸気をそれぞれ到達させ、前記第一〜第三の色の着色層を形成する成膜方法であって、 The substrate disposed inside the film forming chamber, in the first to third regions, respectively to reach the vapor of the first to third color the deposition material, the first to third color a film forming method for forming a colored layer,
    前記第一〜第三の蒸気発生装置と前記放出装置との間の、前記蒸気が移動する経路に切替装置を設けておき、 Between the discharge device and the first to third steam generator, it may be provided a switching device to route the steam is moved,
    前記第一の蒸気発生装置を前記放出装置に接続し、前記第一の領域に前記第一の色の着色層を形成した後、 After the first steam generator connected to the discharge device, thereby forming a colored layer of the first color to said first region,
    前記切替装置を切り替え、前記第一の蒸気発生装置を前記放出装置から遮断し、真空排気系に接続した状態で、 In a state where the switching of the switching device to cut off the first steam generator from said emission device, connected to a vacuum exhaust system,
    前記第二の蒸気発生装置を前記放出装置に接続し、前記第二の色の前記蒸着材料の蒸気を、前記放出口から放出させる成膜方法。 Said second steam generator connected to the release device, the vapor of the second color the deposition material, the deposition method of releasing from the outlet.
  8. 前記第一〜第三の蒸気発生装置に、前記蒸着材料を配置するタンクと、前記蒸着材料の蒸気を発生させる蒸発室をそれぞれ設けておき、 The first to third steam generator, a tank for placing the deposition material, may be provided each evaporation chamber for generating the vapor of the deposition material,
    前記タンクに前記蒸着材料を収容しておき、前記タンクから前記蒸発室に蒸着材料を供給し、前記蒸発室内部で前記蒸着材料の蒸気を発生させる請求項7記載の成膜方法であって、 Leave accommodating the deposition material in the tank, it said supplying an evaporation material to the evaporation chamber, a 7. The film deposition method according to generate a vapor of the deposition material in the evaporation chamber portion from said tank,
    前記切替装置の切替は、予め設定された量の前記第一の蒸着材料を、第一の蒸発室に供給し、前記蒸発室内の有機材料が蒸発した後行う請求項7記載の成膜方法。 The switching of the switching device, the first deposition material a preset amount, and supplied to the first evaporation chamber, a film forming method according to claim 7, wherein the organic material of the evaporation chamber performed after evaporation.
  9. 前記真空排気系と前記切替装置との間に真空槽を設けておき、 The may be provided in the vacuum chamber between the vacuum exhaust system and the switching device,
    前記第一の蒸気発生装置の前記真空排気系への接続は、前記真空槽を介して前記真空排気系に接続し、前記真空槽に引き込まれた蒸気を、前記真空槽内部で冷却し、前記真空槽内部で前記蒸着材料を析出させる請求項7又は請求項8のいずれか1項記載の成膜方法。 Connection to the vacuum exhaust system of the first steam generator, the connected to the vacuum chamber the vacuum exhaust system through the steam drawn into the vacuum chamber, and cooled within the vacuum chamber, wherein any one film forming method according to claim 7 or claim 8 to precipitate the deposition material in the vacuum chamber.
  10. 前記真空排気系として、前記成膜槽に接続された主真空排気系を用い、 As the vacuum exhaust system using a main evacuation system connected to said film forming vessel,
    前記第一の蒸気発生装置の前記真空排気系への接続は、前記第一の蒸気発生装置を、前記成膜槽内部空間であって、前記放出装置の外部空間に接続し、 The connection to the vacuum exhaust system of the first steam generator, the first steam generator, the A film vessel interior space is connected to the outer space of the discharge device,
    前記成膜槽に引き込まれた蒸気を冷却して、前記成膜槽内部に析出させる請求項7又は請求項8のいずれか1項記載の成膜方法。 The cooled steam drawn into film chamber, the film forming method according to any one of the film forming chamber according to claim 7 or claim 8 inside precipitate.
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