JP2012104627A5 - - Google Patents

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Publication number
JP2012104627A5
JP2012104627A5 JP2010251463A JP2010251463A JP2012104627A5 JP 2012104627 A5 JP2012104627 A5 JP 2012104627A5 JP 2010251463 A JP2010251463 A JP 2010251463A JP 2010251463 A JP2010251463 A JP 2010251463A JP 2012104627 A5 JP2012104627 A5 JP 2012104627A5
Authority
JP
Japan
Prior art keywords
substrate
circuit board
printed circuit
board according
interposed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2010251463A
Other languages
English (en)
Japanese (ja)
Other versions
JP2012104627A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2010251463A priority Critical patent/JP2012104627A/ja
Priority claimed from JP2010251463A external-priority patent/JP2012104627A/ja
Publication of JP2012104627A publication Critical patent/JP2012104627A/ja
Publication of JP2012104627A5 publication Critical patent/JP2012104627A5/ja
Pending legal-status Critical Current

Links

JP2010251463A 2010-11-10 2010-11-10 プリント基板 Pending JP2012104627A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2010251463A JP2012104627A (ja) 2010-11-10 2010-11-10 プリント基板

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010251463A JP2012104627A (ja) 2010-11-10 2010-11-10 プリント基板

Publications (2)

Publication Number Publication Date
JP2012104627A JP2012104627A (ja) 2012-05-31
JP2012104627A5 true JP2012104627A5 (cg-RX-API-DMAC7.html) 2013-12-05

Family

ID=46394692

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2010251463A Pending JP2012104627A (ja) 2010-11-10 2010-11-10 プリント基板

Country Status (1)

Country Link
JP (1) JP2012104627A (cg-RX-API-DMAC7.html)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016025220A (ja) * 2014-07-22 2016-02-08 株式会社日立製作所 挿入部品の実装構造体及び回路基板及び電子回路装置の製造方法
JP6092928B2 (ja) 2015-04-28 2017-03-08 ファナック株式会社 ブローホールの発生を抑制するリードを有する電子部品の実装構造

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH098434A (ja) * 1995-06-19 1997-01-10 Nippondenso Co Ltd 電子回路ユニット及びその製造方法
JPH09148705A (ja) * 1995-11-17 1997-06-06 Sony Corp 電子部品を搭載した回路基板
JP2005302929A (ja) * 2004-04-09 2005-10-27 Matsushita Electric Ind Co Ltd ガス抜きプリント基板

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