JP2012099774A - Circuit device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To prevent malfunction of an integrated circuit package.SOLUTION: A substrate 30 comprises: a connection conductor pattern 341 which is formed on a mounting surface 320 mounted with an integrated circuit package 10 and an oscillator 20, and which electrically connects the oscillator 20 to a connection lead 141 of the integrated circuit package 10; a shielding conductor pattern 342 which is formed in a partial annular shape surrounding the oscillator 20 with a length less than the circumference on the mounting surface 320, and which sandwiches the connection conductor pattern 341 between both ends 342a and 342b; and a pair of ground conductor patterns 343 which are formed on both sides to sandwich the connection conductor pattern 341 and the connection lead 141 on the mounting surface 320, and which electrically connect the both ends 342a and 342b of the shielding conductor pattern 342 to respective ground terminals 340 on the substrate 30, while being electrically connected to respective ones of a pair of ground leads 142 of the integrated circuit package 10 overlapping the pair of ground conductor patterns 343 on the mounting surface 320.

Description

  The present invention relates to a circuit device in which an oscillator is electrically connected to an integrated circuit package on a substrate.

  2. Description of the Related Art Conventionally, in an integrated circuit package, there is a circuit device that gives an oscillation frequency output from an oscillator to an integrated circuit package by electrically connecting an oscillator to a predetermined connection lead among a plurality of leads protruding side by side from the package body. ,Are known.

  As one type of such a circuit device, Patent Document 1 discloses a device in which an oscillator is arranged on a plane to which a ground potential is applied. According to such an arrangement, it is possible to suppress malfunction of the integrated circuit package caused by noise superimposed on the oscillator.

JP 2010-10168 A

  However, in the circuit device of Patent Document 1, the connection lead is susceptible to noise such as crosstalk noise generated between adjacent leads. It cannot be suppressed until malfunction.

  Accordingly, a configuration in which a guard ring to which a ground potential is applied is formed on the substrate so as to surround the oscillator and the connection lead from the surroundings is conceivable. However, since the lead adjacent to the connection lead in the integrated circuit package is generally used for signal input / output, it is not possible to form a guard ring that can surround the connection lead through the adjacent leads. It was difficult.

  The present invention has been made in view of the problems described above, and an object thereof is to provide a circuit device in which malfunction of an integrated circuit package is suppressed.

  According to the first aspect of the present invention, the integrated circuit package overlaps the integrated circuit package in which the connection lead and the ground lead are adjacent to each other among the plurality of leads protruding side by side from the package body, and the mounting surface on which the integrated circuit package is mounted. And a substrate having a ground terminal to which a ground potential is applied and an oscillator mounted on the mounting surface and outputting an oscillation frequency. The substrate is formed on the mounting surface, and the oscillator is electrically connected to the connection lead. A connection conductor pattern that provides an integrated circuit package with an oscillation frequency, and a shielding conductor pattern that is formed in a partial annular shape surrounding the oscillator with a length of less than one turn on the mounting surface and sandwiches the connection conductor pattern between both ends. The shielding conductor pattern is formed on both sides of the mounting surface on both sides of the connection conductor pattern and on both sides of the connection lead. A pair of ground conductor patterns that apply a ground potential to the shield conductor pattern by electrically connecting corresponding ends of the both ends to the ground terminal, and at least one of the ground conductor patterns overlaps on the mounting surface. A ground potential is applied to the integrated circuit package by being electrically connected to the ground lead.

  According to the first aspect of the present invention, an integrated circuit package in which a plurality of leads protrudes side by side from the package body on the mounting surface of the substrate is provided with an oscillator via a connection conductor pattern. It becomes a form electrically connected to. Here, with respect to such connection leads, there is a concern about noise superposition such as crosstalk noise generated between adjacent leads.

  However, according to the first aspect of the present invention, the shield conductor pattern formed in a partial ring shape surrounding the oscillator with a length of less than one turn on the mounting surface has a pair of ground conductors at both ends sandwiching the connection conductor pattern. Corresponding patterns are electrically connected. Here, each ground conductor pattern formed on both sides sandwiching the connection conductor pattern on the mounting surface and both sides sandwiching the connection lead of the integrated circuit package is connected to the ground terminal at a location overlapping the integrated circuit package on the mounting surface. The corresponding ends of the pattern are electrically connected.

  According to such an electrical connection form, since the ground potential is applied from the ground terminal to the shielding conductor pattern via each ground conductor pattern, the guard ring that surrounds the oscillator, the connection conductor pattern, and the connection lead from around is provided. It is formed by jointing conductor patterns of ground potential. In addition, at least one of the ground conductor patterns is adjacent to the connection lead and is electrically connected to the ground lead that applies a ground potential to the integrated circuit package on the mounting surface. Thus, even if the external noise propagated to the lead outside the guard ring crosstalks to the ground lead, it can be avoided that the external noise crosstalks to the connection lead inside the guard ring. Therefore, it is possible to suppress a situation in which an integrated circuit package that receives an oscillation frequency output from an oscillator through a connection lead malfunctions due to noise superposition on the connection lead.

  According to the second aspect of the present invention, the shield conductor pattern is electrically connected to the oscillator to provide the ground potential to the oscillator. As described above, when the ground potential is applied to the oscillator by the electrical connection of the shield conductor pattern to the oscillator, the malfunction of the integrated circuit package is caused not only by the noise superposition on the connection lead but also by the oscillator. Those caused by noise superimposition can be suppressed.

  According to a third aspect of the present invention, the integrated circuit package has a pair of ground leads on both sides of the connection lead, and each ground conductor pattern is electrically connected to the corresponding ground lead so as to overlap on the mounting surface. The In this invention, the ground conductor pattern forming the guard ring is electrically connected to each of the ground leads on both sides sandwiching the connection lead so as to overlap each other on the mounting surface. Noise crosstalk to the lead can be avoided. Therefore, it is possible to suppress a situation in which an integrated circuit package that receives an oscillation frequency output from an oscillator through a connection lead malfunctions due to noise superposition on the connection lead.

  According to the fourth aspect of the present invention, the integrated circuit package has the ground lead that sandwiches the connection lead between the corners of the package body, and one ground conductor pattern overlaps the ground lead on the mounting surface. The other ground conductor pattern is electrically connected and is formed at a location overlapping the corner on the mounting surface. In the present invention, since one ground conductor pattern that forms the guard ring overlaps on the mounting surface and is electrically connected to the ground lead that sandwiches the connection lead between the corners of the package body, the ground lead and Noise crosstalk from adjacent leads to connecting leads can be avoided. In addition, the other ground conductor pattern that forms the guard ring overlaps with the corner of the package body that sandwiches the connection lead between the lead and the ground lead, so that the corner leads to the connection lead. The propagation of external noise can also be avoided. Therefore, it is possible to suppress a situation in which an integrated circuit package that receives an oscillation frequency output from an oscillator through a connection lead malfunctions due to noise superposition on the connection lead.

1 is a perspective view showing a circuit device according to a first embodiment of the present invention. 1 is a plan view showing a circuit device according to a first embodiment of the present invention. It is a schematic diagram for demonstrating the effect of the circuit apparatus by 1st embodiment of this invention. It is a perspective view which shows the circuit apparatus by 2nd embodiment of this invention. It is a top view which shows the circuit apparatus by 2nd embodiment of this invention.

  Hereinafter, a plurality of embodiments of the present invention will be described with reference to the drawings. In addition, the overlapping description may be abbreviate | omitted by attaching | subjecting the same code | symbol to the corresponding component in each embodiment. When only a part of the configuration is described in each embodiment, the configuration of the other embodiment described above can be applied to the other part of the configuration. In addition, not only combinations of configurations explicitly described in the description of each embodiment, but also the configurations of a plurality of embodiments can be partially combined even if they are not explicitly specified unless there is a problem with the combination. .

(First embodiment)
1 and 2 show a circuit device 1 in which an integrated circuit package 10 is electrically connected to an oscillator 20 on a substrate 30 as a first embodiment of the present invention.

  The integrated circuit package 10 includes a rectangular flat package body 12 in which an integrated circuit chip (not shown) is resin-molded, and a plurality of leads 14 that are electrically connected to the integrated circuit chip and protrude from the package body 12 side by side. have. Here, in particular, in the integrated circuit package 10 of the present embodiment, a predetermined number of leads 14 are arranged at equal intervals along each side portion 121 extending between the corner portions 120 in the package body 12, and each lead 14 is a package. A QFD (Quad Flat Package) projecting to the side of the main body 12 is employed.

  The oscillator 20 is an electronic component that generates a predetermined oscillation frequency by, for example, a ceramic vibrator, a crystal vibrator, a silicon vibrator, or the like, and faces a specific one side 121a among the four sides 121 of the package body 12. Arranged. Here, in particular, as the oscillator 20 of the present embodiment, a three-terminal oscillator having a pair of output terminals 22 that output an oscillation frequency and a ground terminal 24 to which a ground potential is applied is employed.

  The substrate 30 is formed by integrally forming a wiring portion 34 on an insulating base material 32. The insulating base material 32 is formed in a flat plate shape by, for example, a resin material, a ceramic material, or the like. One plate surface 320 of the insulating base 32 is a mounting surface 320 on which both the integrated circuit package 10 and the oscillator 20 are mounted. The wiring part 34 has a pair of ground terminals 340 formed in a via shape with a metal conductor, and a plurality of conductor patterns 341 to 345 formed in a foil shape with the metal conductor.

  Each ground terminal 340 is disposed on the mounting surface 320 at a location overlapping the back surface of the package body 12. Each ground terminal 340 is provided with a ground potential (zero potential) by electrical connection with the outside.

  The pair of connection conductor patterns 341 extend linearly parallel to each other between the side portion 121 a of the package body 12 and the oscillator 20 on the mounting surface 320. One end portion of each connection conductor pattern 341 is electrically connected to a corresponding one of the pair of connection leads 141 adjacent to each other as the lead 14 protruding from the side portion 121a of the package body 12. The other end of each connection conductor pattern 341 is electrically connected to a corresponding one of the pair of output terminals 22 of the oscillator 20. Thus, according to the oscillator 20 in which each output terminal 22 is electrically connected to each connection lead 141 via each connection conductor pattern 341, the output oscillation frequency is output from the output terminal 22 to the integrated circuit chip in the package body 12. Will be given.

  The shielding conductor pattern 342 extends on the mounting surface 320 in a partial annular shape with a gap 321 between the shielding conductor pattern 342 and surrounds the oscillator 20 with a length of less than one round. With this extended form, a pair of connection conductor patterns 341 are sandwiched between the both end portions 342a and 342b of the shielding conductor pattern 342 with a gap 322 therebetween.

  The pair of ground conductor patterns 343 extend linearly parallel to each other across the overlapping portion of the package main body 12 from the oscillator 20 side to the side surface 121a on the mounting surface 320. One end portion of each ground conductor pattern 343 is electrically connected to the corresponding one of both end portions 342a and 342b of the shielding conductor pattern 342, and the other end portion of each ground conductor pattern 343 is each of the pair of ground terminals 340. It is electrically connected to the corresponding one. Thus, the ground potential is applied to the shield conductor pattern 342 in which both end portions 342a and 342b are electrically connected to the ground terminals 340 via the ground conductor patterns 343.

  Each ground conductor pattern 343 is provided on both sides of the pair of connection conductor patterns 341 and the pair of connection leads 141 with a gap 323 therebetween. Here, the arrangement pitch of the ground conductor pattern 343 and the connection conductor pattern 341 adjacent to each other with a gap 323 is set to be substantially the same size as the pitch of the adjacent leads 14 in the side portion 121 of the package body 12. Has been. With this pitch setting, the leads 14 on both sides sandwiching the pair of connection leads 141 on the mounting surface 320 are electrically connected so as to overlap with the corresponding ground conductor patterns 343, and the ground potential is set to the integrated circuit chip in the package body 12. It functions as a ground lead 142 to be applied to.

  The ground conductor pattern 344 protrudes inward from the shield conductor pattern 342 on the mounting surface 320 on the opposite side of the package body 12 from the side 121a of the package body 12 with the oscillator 20 interposed therebetween, and is electrically connected to the ground terminal 24 of the oscillator 20. Has been. With this electrical connection configuration, the oscillator 20 is given a ground potential through each ground conductor pattern 343 and shield conductor pattern 342.

  A plurality of signal conductor patterns 345 are arranged on the mounting surface 320 so as to electrically connect the leads 14 other than the connection leads 141 and the ground leads 142 to the outside. Each signal conductor pattern 345 transmits a signal between the electrically connected outside and the lead 14.

  In the first embodiment described above, the guard ring 346 surrounding the oscillator 20, the pair of connection conductor patterns 341, and the pair of connection leads 141 from the periphery is formed by the joint of the conductor patterns 342 and 343 having the ground potential. In addition, the ground conductor pattern 343 forming the guard ring 346 is overlapped with the ground lead 142 adjacent to the connection lead 141 among the leads 14 of the integrated circuit package 10 so as to be electrically connected to the lead 142 and give a ground potential. It will be. Accordingly, for example, as shown in FIG. 3, even if the external noise N propagated to the lead 14 outside the guard ring 346 crosstalks to the ground lead 142 adjacent to the lead 14, the external noise N is applied to the connection lead 141 inside the guard ring 346. Crosstalk can be avoided. Therefore, according to the first embodiment, the integrated circuit chip that receives the oscillation frequency through the connection leads 141 in the package body 12 of the integrated circuit package 10 malfunctions due to noise superposition on the connection leads 141. The situation can be suppressed. In addition, in the first embodiment in which the ground potential is applied to the oscillator 20 by the electrical connection of the shield conductor pattern 342 to the ground terminal 24 via the ground conductor pattern 344, the integration due to the noise superposition in the oscillator 20 is performed. The malfunction of the circuit chip can also be suppressed.

(Second embodiment)
As shown in FIGS. 4 and 5, the second embodiment of the present invention is a modification of the first embodiment. In the integrated circuit package 1010 of the second embodiment, the pair of connection leads 141 in the side portion 121a of the package body 12 includes a corner portion 120a that forms one end portion of the side portion 121a of the four corner portions 120, and one ground. It is sandwiched between the lead 142. Accordingly, one of the pair of ground conductor patterns 343 is electrically connected to the ground lead 142 on the mounting surface 320, while the other 343b is an end opposite to the shield conductor pattern 342. The portion is bent and overlaps the corner portion 120a.

  In such a second embodiment, the guard ring 1346 surrounding the oscillator 20, the pair of connection conductor patterns 341, and the pair of connection leads 141 from the periphery is formed by the joint of the conductor patterns 342, 343a, and 343b of the ground potential. It will be. In addition, one ground conductor pattern 343a forming the guard ring 1346 overlaps with the ground lead 142 adjacent to the connection lead 141 on the side far from the corner 120a, thereby being electrically connected to the lead 142 and giving a ground potential. become. As a result, external noise propagated outside the guard ring 1346 to the lead 14 adjacent to the ground lead 142 crosstalks to the connection lead 141, or external noise is generated from the corner 120 a side outside the guard ring 1346 to the connection lead 141. Propagation can also be avoided. Therefore, even in the second embodiment, the integrated circuit chip that receives the oscillation frequency through the connection leads 141 in the package body 12 of the integrated circuit package 1010 malfunctions due to noise superposition on the connection leads 141. Can be suppressed. Also in the second embodiment, since the ground potential is applied to the oscillator 20 in the same manner as in the first embodiment, malfunction of the integrated circuit chip due to noise superposition in the oscillator 20 can be suppressed. is there.

(Other embodiments)
Although a plurality of embodiments of the present invention have been described above, the present invention is not construed as being limited to these embodiments, and various embodiments and combinations can be made without departing from the scope of the present invention. Can be applied.

  Specifically, as the integrated circuit package 10, as long as the effects of the present invention can be obtained, for example, a DIP (Dual InLine Package) in which the leads 14 protrude in parallel from the two opposite side portions 121 of the package body 12 or the like. May be adopted. In addition, a two-terminal oscillator 20 may be employed, and in that case, a configuration in which the ground conductor pattern 344 is not provided may be employed.

DESCRIPTION OF SYMBOLS 1 Circuit device 10, 1010 Integrated circuit package, 12 Package body, 14 Lead, 20 Oscillator, 22 Output terminal, 24 Ground terminal, 30 Substrate, 32 Insulating base material, 34 Wiring part, 120, 120a Corner part, 121, 121a Side, 141 Connection lead, 142 Ground lead, 320 Mounting surface, 321, 322, 323 Clearance, 340 Ground terminal, 341 Connection conductor pattern, 342 Shielding conductor pattern, 342a, 342b End, 343, 343a, 343b Ground conductor pattern 344 Ground conductor pattern, 345 Signal conductor pattern, 346, 1346 Guard ring

Claims (4)

An integrated circuit package in which a connection lead and a ground lead are adjacent among a plurality of leads protruding side by side from the package body;
A substrate having a ground terminal to which a ground potential is applied at a location where the integrated circuit package overlaps on a mounting surface on which the integrated circuit package is mounted;
An oscillator mounted on the mounting surface and outputting an oscillation frequency;
With
The substrate is
A connection conductor pattern formed on the mounting surface and providing the oscillation frequency to the integrated circuit package by electrically connecting the oscillator to the connection lead;
A shielding conductor pattern that is formed in a partial annular shape surrounding the oscillator with a length of less than one turn on the mounting surface, and sandwiches the connection conductor pattern between both ends,
Formed on both sides of the connection conductor pattern and the connection lead on the mounting surface, and shields the ground potential by electrically connecting corresponding ends of the shield conductor pattern to the ground terminal. A pair of ground conductor patterns applied to the conductor pattern;
Have
The circuit device according to claim 1, wherein at least one of the ground conductor patterns is electrically connected to the ground lead that overlaps on the mounting surface, thereby applying the ground potential to the integrated circuit package.   The circuit device according to claim 1, wherein the shield conductor pattern is electrically connected to the oscillator to apply the ground potential to the oscillator. The integrated circuit package has a pair of ground leads on both sides of the connection lead,
The circuit device according to claim 1, wherein each of the ground conductor patterns is electrically connected to the corresponding ground lead so as to overlap the mounting surface. The integrated circuit package has the ground lead that sandwiches the connection lead between corner portions of the package body,
One of the ground conductor patterns is electrically connected to the ground lead so as to overlap the mounting surface,
The circuit device according to claim 1, wherein the other ground conductor pattern is formed at a location overlapping the corner portion on the mounting surface.

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