JP2020025075A - module - Google Patents

Abstract

To provide a module having improved shield performance.SOLUTION: A module 101 includes a substrate having a main surface 1u, a first component 41 mounted on the main surface 1u, and two or more wires 5 bonded to the main surface 1u so as to straddle the first component 41. Each of the two or more wires 5 has a first end 51 and a second end 52. When attention is paid to two wires 5 adjacent to each other out of the two or more wires 5, a distance A between the first ends 51 of the two wires 5 is shorter than a distance B between the second ends 52 of the two wires 5.SELECTED DRAWING: Figure 3

Description

  The present invention relates to a module.

  Japanese Patent No. 5276169 (Patent Document 1) describes a structure using a wire bond spring as a shield for shielding electromagnetic waves in an electronic module in which a die (electronic component) is sealed in a mold compound (sealing resin). I have.

Patent No. 5276169

  The configuration described in Patent Document 1 has a problem that the wire bond spring is formed only on the outer peripheral portion of the resin-sealed module, and the shielding performance is not sufficient.

  Therefore, an object of the present invention is to provide a module with improved shielding performance.

  In order to achieve the above object, a module according to the present invention comprises a substrate having a main surface, a first component mounted on the main surface, and two or more bonded to the main surface so as to straddle the first component. And each of the two or more wires has a first end and a second end. When attention is paid to two adjacent wires among the two or more wires, the two The distance between the first ends of the wires is shorter than the distance between the second ends of the two wires.

  According to the present invention, since the two or more wires are bonded to the main surface so as to straddle the first component, the first component can be shielded. In particular, the arrangement of the wires is dense at the places where the first ends are arranged, so that the shielding can be particularly focused. Therefore, a module with improved shield performance can be obtained.

FIG. 2 is a first perspective view of the module according to Embodiment 1 of the present invention. FIG. 3 is a second perspective view of the module according to the first embodiment based on the present invention. FIG. 2 is a perspective plan view of a module according to Embodiment 1 of the present invention. FIG. 4 is a cross-sectional view taken along line IV-IV in FIG. 3. FIG. 2 is a perspective plan view of the module according to the first embodiment of the present invention, in which regions are clearly shown. FIG. 13 is a perspective plan view of a module according to a second embodiment of the present invention. FIG. 14 is a perspective plan view of a first modification of the module according to the second embodiment based on the present invention. FIG. 17 is a perspective plan view of a second modification of the module according to Embodiment 2 based on the present invention. FIG. 14 is a perspective plan view of a module according to a third embodiment of the present invention. FIG. 14 is a perspective plan view of a module according to a third embodiment of the present invention, in which regions are clearly shown. FIG. 21 is a perspective plan view of a modification of the module in the third embodiment according to the present invention. FIG. 15 is a perspective plan view of a module according to a fourth embodiment of the present invention. FIG. 18 is a perspective plan view of a module according to a fourth embodiment of the present invention, in which regions are clearly shown. FIG. 15 is a perspective plan view of a module according to a fifth embodiment of the present invention. FIG. 18 is a perspective plan view of a module according to a fifth embodiment of the present invention, in which regions are clearly shown. FIG. 21 is a perspective plan view of a modification of the module in the fifth embodiment according to the present invention. FIG. 15 is a perspective plan view of a module according to a sixth embodiment of the present invention. FIG. 21 is a perspective plan view of a module according to a sixth embodiment of the present invention, in which regions are clearly shown. FIG. 21 is a perspective plan view of a modification of the module in the sixth embodiment according to the present invention.

  The dimensional ratios shown in the drawings are not necessarily faithful, but may be exaggerated for convenience of explanation. In the following description, reference to the concept of above or below does not necessarily mean absolutely above or below, but may mean relative above or below in the illustrated posture. .

(Embodiment 1)
(Constitution)
A module according to the first embodiment of the present invention will be described with reference to FIGS. The module referred to here may be a component built-in module or a component mounted module.

  FIG. 1 shows the appearance of the module 101 according to the present embodiment. The top and side surfaces of the module 101 are covered with the shield film 6. FIG. 2 shows the module 101 viewed obliquely from below in FIG. The lower surface of the module 101 is not covered with the shield film 6, and the substrate 1 is exposed. One or more external connection electrodes 11 are provided on the lower surface of the substrate 1. The number, size, and arrangement of the external connection electrodes 11 shown in FIG. 2 are merely examples. The substrate 1 may have wiring on the surface or inside. The substrate 1 may be a resin substrate or a ceramic substrate. The substrate 1 may be a multilayer substrate. FIG. 3 shows a perspective plan view of the module 101. FIG. 3 corresponds to a state where the upper surface of the shield film 6 of the module 101 is removed and the sealing resin 3 is removed, as viewed from above. The first component 41 is mounted on the main surface 1u of the substrate 1. The first component 41 may be, for example, an IC (Integrated Circuit). More specifically, the first component 41 may be, for example, an LNA (Low Noise Amplifier). A plurality of pad electrodes 7 are arranged on main surface 1u. FIG. 4 is a sectional view taken along line IV-IV in FIG.

  The module 101 according to the present embodiment includes a substrate 1 having a main surface 1u, a first component 41 mounted on the main surface 1u, and two or more wires bonded to the main surface 1u so as to straddle the first component 41. 5 is provided. Each of the two or more wires 5 has a first end 51 and a second end 52. The first end 51 and the second end 52 are respectively connected to any of the pad electrodes 7. Here, the “first end” is a starting point of bonding, and the “second end” is an ending point of bonding. When attention is paid to two wires adjacent to each other among the two or more wires 5, the distance A between the first ends 51 of the two wires is equal to the distance A between the second ends 52 of the two wires. It is shorter than the distance B between them. As described above, this can be realized by setting the start point side as the first end and the end point side as the second end. That is, since the first end is the starting point of bonding, when the first end is connected to the pad electrode 7, the wire 5 can be pulled up perpendicular to the main surface 1u. Therefore, at this time, there is almost no risk of contact between the wire 5 and the first component 41. Therefore, regarding the first end, the wire 5 and the first component 41 can be arranged close to each other. On the other hand, the second end is the end point of the bonding, and it is difficult to form the wire 5 vertically toward the main surface 1u. . In FIG. 4, the first end 51 is located closer to the first component 41 and the second end 52 is kept away from the first component 41 due to such a situation. In the present embodiment, the portion where the need for the shield is higher is set as the first end of the bonding.

  As shown in FIG. 4, a conductor via 12 is electrically connected to an external connection electrode 11 provided on the lower surface of the substrate 1. Inside the substrate 1, an internal conductor pattern 13 is arranged. The conductor via 12 electrically connects the external connection electrode 11 and the internal conductor pattern 13 so as to penetrate the insulating layer 2. The positions, sizes, and arrangements of the external connection electrodes 11, the conductor vias 12, and the internal conductor patterns 13 shown here are merely examples, and are not limited thereto.

  In the example shown in FIGS. 3 and 4, in addition to the first component 41, a second component 42 and a chip component 49 are mounted on the main surface 1 u. The second component 42 may be, for example, an IC. Here, it is assumed that the chip component 49 is a capacitor, but the type of the chip component is not limited to this. The chip component may be, for example, a filter or a resistor. The positions, sizes, and arrangements of the various components mounted on the main surface 1u are merely examples, and are not limited thereto.

(Action / Effect)
In the present embodiment, since two or more wires 5 bonded to main surface 1u are provided so as to straddle first component 41, first component 41 can be shielded by these wires 5.

  Further, in the present embodiment, when attention is paid to two wires adjacent to each other among the two or more wires 5, the distance A between the first ends 51 of the two wires is equal to the distance between the two wires 5. Is shorter than the distance B between the second ends 52, the arrangement of the wires 5 is dense at the portion where the first ends 51 are arranged, so that the shielding can be particularly focused. Therefore, a module with improved shielding performance can be realized.

  As described in the present embodiment, the module 101 preferably includes the shield film 6 arranged so as to cover the first component 41 and the two or more wires 5 at a distance from the main surface 1u. FIG. 4 shows a state in which the shield film 6 is arranged apart from the main surface 1u. By employing this configuration, the shielding effect of the shielding film 6 can also be obtained. As shown in FIG. 4, it is preferable that the space inside the shield film 6 is filled with the sealing resin 3. In other words, the module 101 preferably includes the sealing resin 3 disposed so as to cover the first component 41 and the two or more wires 5. As described in the present embodiment, when the module 101 also includes the second component 42, the module 101 is disposed so as to cover the first component 41, the second component 42, and the two or more wires 5. It is preferable to include the sealing resin 3.

  As shown in FIG. 4, it is preferable that at least one of the two or more wires 5 is in contact with the shield film 6. By adopting this configuration, the shield film 6 is connected to the ground of the substrate by the wire 5, so that the space surrounded by the shield film 6 can be efficiently shielded.

  In the module 101 shown in the present embodiment, the arrangement of the ends of the wires 5 can be considered as being divided into a first region 61 and a second region 62 as shown in FIG. The first ends 51 of the plurality of wires 5 are connected to the main surface 1u in the first region 61. The second ends 52 of the plurality of wires 5 are connected to the main surface 1u in the second region 62.

  In the example shown here, the first region 61 is linearly arranged along one side of the first component 41. The second region 62 is arranged in an L shape along two sides of the first component 41. The first region 61 is arranged between the first component 41 and the second component 42.

  For example, it is assumed that mutual electromagnetic interference between the first component 41 and the second component 42 is to be suppressed. As described in the present embodiment, the module 101 includes the second component 42 mounted on the main surface 1u, and the main surface 1u is formed by connecting the first end 51 of the two or more wires 5 and the main surface 1u. It is preferable that the first region 61 be connected, and at least a part of the first region 61 be located between the first component 41 and the second component 42. By adopting this configuration, the first region 61 is arranged between the first component 41 and the second component 42, and the first ends 51 are densely arranged in the first region 61. Shielding between the component 41 and the second component 42 can be intensively performed, and electromagnetic effects that can occur between the first component 41 and the second component 42 can be reduced.

  Note that the first ends 51 of the two or more wires 5 are preferably arranged on the same side. In the example shown in the present embodiment, when focusing on the set of two or more wires 5, the first ends 51 are arranged on one side, and the second ends 52 are arranged on the other side. The arrangement of the first ends 51 is denser than the arrangement of the second ends 52.

  When the first component 41 is an LNA, the reception sensitivity can be improved. When the first component 41 is an LNA, an inductor for input matching of the LNA may be arranged in addition to the LNA as the first component 41, and the inductor for input matching of the LNA is similarly shielded. Is preferred.

(Embodiment 2)
(Constitution)
With reference to FIG. 6, a module according to the second embodiment of the present invention will be described. FIG. 6 shows a plan view of the module 102 according to the present embodiment. The module 102 according to the present embodiment has the same basic configuration as the module 101 described in the first embodiment, but differs in the following points.

  The module 102 includes a pad electrode 7 a in addition to the pad electrode 7. One first end 51 or one second end 52 is connected to the pad electrode 7. The plurality of first ends 51 are connected to the pad electrode 7a.

  In the present embodiment, in the first region 61, an integrated pad electrode 7a to which the two or more first ends 51 are connected collectively is arranged.

(Action / Effect)
In the present embodiment, since there is provided an integral pad electrode 7a to which two or more first ends 51 are collectively connected, one portion using the integral pad electrode 7a is one for the ground electrode of the substrate 1. Vias. That is, when the pad electrodes are separate, a via connected to the ground electrode of the substrate 1 is required for each of the separate pad electrodes. It becomes possible. In the present embodiment, the same potential can be efficiently applied to the plurality of wires 5 at once.

  In the example shown in FIG. 6, the first region 61 has a configuration including one pad electrode 7a and a plurality of pad electrodes 7, but the present invention is not limited to this, and other combinations are also conceivable. For example, it may be a module like the module 103 shown in FIG. In the module 103, the first region 61 includes a plurality of pad electrodes 7b, and the plurality of first ends 51 are connected to each pad electrode 7b.

  Further, it may be a module like the module 104 shown in FIG. In the module 104, the first region 61 includes one pad electrode 7c, and all the first ends 51 connected to the main surface 1u in the first region 61 are connected to the one pad electrode 7c. By doing so, one via can be connected to the ground electrode of the substrate 1. Further, the number of parts can be reduced. In addition, if the common pad electrode 7c is arranged as described above, all the first ends 51 can be easily and uniformly set to the ground potential through the pad electrode 7c.

(Embodiment 3)
(Constitution)
The module according to the third embodiment of the present invention will be described with reference to FIGS. FIG. 9 shows a plan view of the module 105 in the present embodiment as seen through. FIG. 10 shows the region clearly. The module 105 according to the present embodiment has the same basic configuration as the module 101 described in the first embodiment, but differs in the following points.

  In the module 105, the first component 41 is surrounded by at least a part of the aggregate of the first end 51 and the second end 52 of the two or more wires 5. That is, the two or more wires 5 are arranged so as to straddle the first component 41 over the entire circumference of the first component 41. As shown in FIG. 10, the first region 61 in which the first ends 51 are arranged may be L-shaped. In the example shown in FIG. 10, the second region 62 in which the second ends 52 are arranged is also L-shaped. Not all wires 5 are the same length. In the example shown here, the two or more wires 5 are densely arranged on the first end side remote from the shield film 6. Thereby, the shielding property can be improved even on the side far from the shield film 6.

(Action / Effect)
In the present embodiment, since the first component 41 is surrounded by the end of the wire, the first component 41 can be sufficiently shielded, and the first region 61 can be shielded with particular emphasis. it can.

(Modification)
With reference to FIG. 11, a modified example of the module in the present embodiment will be described. FIG. 11 shows a plan view of a module 105a as a modification example. In the module 105a, the first component 41 is an LNA, and the second component 42 is an Rx filter. Components 48a, 48b, 48c and 48d are arranged on the main surface 1u of the substrate 1 in addition to the first component 41 and the second component 42. The component 48a is an ANTSW (antenna switch). The component 48b is a Tx filter. The component 48c is a PA (Power Amplifier). The component 48d is a PA controller. The first component 41, which is an LNA, is surrounded by at least a part of the aggregate of the first end 51 and the second end 52 of the two or more wires 5. That is, the two or more wires 5 are arranged so as to straddle the LNA over the entire circumference of the LNA. The first region 61 in which the first ends 51 are arranged has an L-shape along two sides of the first component 41 which is an LNA. The second region 62 in which the second ends 52 are arranged is also L-shaped along the other two sides of the first component 41 that is an LNA. At least a part of the first region 61 is arranged so as to separate the first component 41 that is an LNA and the second component 42 that is an Rx filter. The two or more wires 5 are densely arranged on the first end 51 side. That is, in the plurality of wires 5 straddling the LNA, the first end 51 side which is the side of the second component 42 and the components 48a, 48b, 48c, 48d is densely arranged. In the plurality of wires 5 straddling the LNA, the first end 51 side on which the PA, which is a component related to transmission, that is, the component 48c is arranged, is densely arranged. Therefore, in the module 105a, the effect of improving the receiving sensitivity is high.

(Embodiment 4)
(Constitution)
The module according to the fourth embodiment of the present invention will be described with reference to FIGS. FIG. 12 shows a plan view of the module 106 in this embodiment. FIG. 13 clearly shows the area.

  Module 106 includes substrate 1 having main surface 1u, and a plurality of components mounted on main surface 1u. Here, a first component 41 and a second component 42 are shown as an example of the plurality of components. For each of the plurality of components, two or more wires 5 bonded to the main surface 1u are arranged so as to straddle the components. That is, two or more wires 5 of the first group are arranged so as to straddle the first component 41, and two or more wires 5 of the second group are arranged so as to straddle the second component 42. As shown in FIG. 12, each of the two or more wires 5 has a first end 51 and a second end 52. As shown in FIG. 13, the main surface 1u has a common first region 61 in which the first ends 51 of the two or more wires 5 relating to the plurality of components are concentrated and connected to the main surface 1u. The distance between two adjacent first ends 51 in the first area 61 is shorter than the distance between adjacent second ends 52 in areas other than the first area 61. In the example shown here, the second end 52 is connected to the main surface 1u in one of the two second regions 62a and 62b. The second region 62a is arranged in an L shape along two sides of the first component 41. The second region 62b is arranged in an L shape along two sides of the second component 42. In the first region 6, pad electrodes 7 are linearly arranged in one row. In the first region 61, the first ends 51 of the wires 5 straddling the first component 41 and the first ends 51 of the wires 5 straddling the second component 42 are alternately arranged.

(Action / Effect)
In the present embodiment, since a structure is provided in which a plurality of components are straddled by two or more wires 5, a shield can be individually formed for a plurality of components. Since the common first region 61 is provided, a large number of the first ends 51 are concentrated in the first region 61, so that the shield can be more reliably shielded.

  In the example shown here, the structure in which the wire 5 straddles a total of two parts, the first part 41 and the second part 42, is exemplified. However, a similar configuration is conceivable for three or more parts. Can be In addition to the plurality of components, components that do not straddle the wires 5 may be mounted on the main surface 1u of the substrate 1. In FIG. 12, for example, a component that is not straddled by any wire 5 is mounted on the left side in the figure. Further, in FIG. 12, a chip component 49 is also mounted. The chip component 49 is shown as an example and is not essential.

(Embodiment 5)
(Constitution)
A module according to the fifth embodiment of the present invention will be described with reference to FIGS. FIG. 14 shows a plan view of the module 107 in the present embodiment. FIG. 15 shows the area clearly specified.

  In the module 107, four components are mounted on the main surface 1u of the substrate 1. That is, the first component 41, the second component 42, the third component 43, and the fourth component 44 are mounted on the main surface 1u. A common first region 61 is provided in which the first ends 51 of the wires 5 relating to these components are concentrated and connected to the main surface 1u, and the four components are in contact with the first regions 61 at their corners. Are arranged as follows. The first region 61 is located at a location surrounded by the corners of the four components, and also extends to a gap between the two components. The first region 61 extends, for example, between the first component 41 and the second component 42. The first region 61 extends, for example, between the first component 41 and the fourth component 44. The second regions 62a, 62b, 62c, 62d are arranged along the sides of each component. The second regions 62a, 62b, 62c, 62d correspond to the first component 41, the second component 42, the third component 43, and the fourth component 44, respectively.

(Action / Effect)
In the present embodiment, by appropriately arranging the wires 5, it is possible to shield each of a plurality of components. In particular, in a region where the corners of a plurality of components are concentrated, the first region 61 is provided and the wires 5 are densely arranged. Can be.

  Note that a configuration like the module 108 shown in FIG. 16 may be adopted. In the module 108, an integrated pad electrode 7d is arranged in the first region 61 instead of arranging individual pad electrodes. The first ends 51 of the plurality of wires 5 are connected to the pad electrodes 7d.

(Embodiment 6)
(Constitution)
A module according to the sixth embodiment of the present invention will be described with reference to FIGS. FIG. 17 shows a plan view of the module 109 in this embodiment. FIG. 18 shows the area clearly specified.

  In the module 109, four components are mounted on the main surface 1u of the substrate 1. That is, the first component 41, the second component 42, the third component 43, and the fourth component 44 are mounted on the main surface 1u. A common first region 61 is provided in which the first ends 51 of the wires 5 relating to these components are concentrated and connected to the main surface 1u, and the four components are in contact with the first regions 61 at their corners. Are arranged as follows. The second regions 62a, 62b, 62c, 62d are arranged along the sides of each component. The second regions 62a, 62b, 62c, 62d correspond to the first component 41, the second component 42, the third component 43, and the fourth component 44, respectively.

(Action / Effect)
Also in the present embodiment, the same effect as in the fifth embodiment can be obtained.

  Note that a configuration like the module 110 shown in FIG. 19 may be adopted. In the module 110, an integrated pad electrode 7e is arranged in the first region 61 instead of arranging individual pad electrodes. The first ends 51 of the plurality of wires 5 are connected to the pad electrodes 7e.

  Note that, in each of the above embodiments, an example in which the component is rectangular has been described, but the shape of the component is not limited to a rectangle and may be another shape.

Note that a plurality of the above embodiments may be appropriately combined and adopted.
It should be noted that the above-described embodiment disclosed herein is illustrative in all aspects and is not restrictive. The scope of the present invention is defined by the appended claims, and includes equivalents of the claims and all modifications within the scope.

  Reference Signs List 1 substrate, 1u main surface, 2 insulating layers, 3 sealing resin, 5 wires, 6 shield film, 7, 7a, 7b, 7c, 7d pad electrode, 11 external connection electrode, 12 conductor via, 13 internal conductor pattern, 41 First component, 42 second component, 43 third component, 44 fourth component, 48a, 48b, 48c, 48d component, 49 chip component, 51 first end, 52 second end, 61 first area, 62, 62a , 62b, 62c, 62d Second area, 101, 102, 103, 104, 105, 105a, 106, 107, 108, 109, 110 modules.

Claims (11)

A substrate having a main surface;
A first component mounted on the main surface;
And two or more wires bonded to the main surface so as to straddle the first component.
Each of the two or more wires has a first end and a second end;
When focusing on two wires adjacent to each other among the two or more wires, a distance between the first ends of the two wires is a distance between the second ends of the two wires. Module shorter than the distance.   The module of claim 1, wherein the first ends of the two or more wires are on the same side. A second component mounted on the main surface;
The main surface has a first region where the first end of the two or more wires and the main surface are connected,
The module according to claim 1, wherein at least a part of the first region is located between the first component and the second component.   The module according to claim 3, wherein an integrated pad electrode to which two or more of the first ends are collectively connected is arranged in the first region.   The module according to claim 1, further comprising a sealing resin disposed so as to cover the first component and the two or more wires.   The module according to any one of claims 1 to 5, further comprising a shield film spaced from the main surface and arranged to cover the first component and the two or more wires.   The module according to claim 6, wherein at least one of the two or more wires is in contact with the shield film.   The module according to any one of claims 1 to 7, wherein the first component is surrounded by at least a part of an assembly of the first end and the second end of the two or more wires. .   The module according to claim 3, further comprising a sealing resin disposed so as to cover the first component, the second component, and the two or more wires.   The module according to claim 1, wherein the first component is an LNA. A substrate having a main surface;
Comprising a plurality of components mounted on the main surface,
For each of the plurality of components, two or more wires bonded to the main surface are disposed so as to straddle the components,
Each of the two or more wires has a first end and a second end;
The main surface has a common first region in which the first ends of the two or more wires related to the plurality of components are concentrated and connected to the main surface,
A module wherein a center distance between two first ends adjacent to each other in the first region is shorter than a center distance between the second ends adjacent to each other in the region other than the first region.

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