JP7036087B2 - module - Google Patents

Description

The present invention relates to modules.

Patent No. 5276169 (Patent Document 1) describes a structure in which a wire bond spring is used as a shield for shielding electromagnetic waves in an electronic module in which a die (electronic component) is enclosed in a mold compound (sealing resin). There is.

Patent No. 5276169

In the configuration described in Patent Document 1, the wire bond spring is only formed on the outer peripheral portion of the resin-sealed module, and there is a problem that the shielding performance is not sufficient.

Therefore, an object of the present invention is to provide a module having improved shielding performance.

In order to achieve the above object, the module based on the present invention includes a substrate having a main surface, a first component mounted on the main surface, and two or more bonded to the main surface so as to straddle the first component. Each of the two or more wires has a first end and a second end, and when attention is paid to two wires adjacent to each other among the two or more wires, the above two wires The distance between the first ends of the wires is shorter than the distance between the second ends of the two wires.

According to the present invention, since two or more wires are bonded to the main surface so as to straddle the first component, the first component can be shielded. In particular, in the place where the first ends are lined up, the arrangement of the wires is dense, and the shield can be particularly focused. Therefore, the module can have improved shielding performance.

It is a 1st perspective view of the module in Embodiment 1 based on this invention. It is a second perspective view of the module in Embodiment 1 based on this invention. It is a perspective plan view of the module in Embodiment 1 based on this invention. FIG. 3 is a cross-sectional view taken along the line IV-IV in FIG. It is a perspective plan view which clearly shows the region of the module in Embodiment 1 based on this invention. It is a perspective plan view of the module in Embodiment 2 based on this invention. It is a perspective plan view of the 1st modification of the module in Embodiment 2 based on this invention. It is a perspective plan view of the 2nd modification of the module in Embodiment 2 based on this invention. It is a perspective plan view of the module in Embodiment 3 based on this invention. It is a perspective plan view which clearly shows the region of the module in Embodiment 3 based on this invention. It is a perspective plan view of the modification of the module in Embodiment 3 based on this invention. It is a perspective plan view of the module in Embodiment 4 based on this invention. It is a perspective plan view which clearly shows the region of the module in Embodiment 4 based on this invention. It is a perspective plan view of the module in Embodiment 5 based on this invention. It is a perspective plan view which clearly shows the region of the module in Embodiment 5 based on this invention. It is a perspective plan view of the modification of the module in Embodiment 5 based on this invention. It is a perspective plan view of the module in Embodiment 6 based on this invention. It is a perspective plan view which clearly shows the region of the module in Embodiment 6 based on this invention. It is a perspective plan view of the modification of the module in Embodiment 6 based on this invention.

The dimensional ratios shown in the drawings do not always faithfully represent the actual situation, and the dimensional ratios may be exaggerated for convenience of explanation. In the following description, when referring to the concept of up or down, it does not necessarily mean absolute up or down, but may mean relative up or down in the illustrated posture. ..

(Embodiment 1)
(Constitution)
The module according to the first embodiment based on the present invention will be described with reference to FIGS. 1 to 4. The module referred to here may be a component built-in module or a component mounting module.

The appearance of the module 101 in this embodiment is shown in FIG. The upper surface and the side surface of the module 101 are covered with the shield film 6. FIG. 2 shows a view of the module 101 from diagonally below in FIG. The lower surface of the module 101 is not covered with the shield film 6, and the substrate 1 is exposed. One or more external connection electrodes 11 are provided on the lower surface of the substrate 1. The number, size, and arrangement of the external connection electrodes 11 shown in FIG. 2 are merely examples. The substrate 1 may be provided with wiring on the surface or inside. The substrate 1 may be a resin substrate or a ceramic substrate. The substrate 1 may be a multilayer substrate. A perspective plan view of the module 101 is shown in FIG. FIG. 3 corresponds to a state in which the upper surface of the shield film 6 of the module 101 is removed and the sealing resin 3 is removed from above. The first component 41 is mounted on the main surface 1u of the substrate 1. The first component 41 may be, for example, an IC (Integrated Circuit). More specifically, the first component 41 may be, for example, an LNA (Low Noise Amplifier). A plurality of pad electrodes 7 are arranged on the main surface 1u. A cross-sectional view taken along the line IV-IV in FIG. 3 is shown in FIG.

The module 101 in the present embodiment has a substrate 1 having a main surface 1u, a first component 41 mounted on the main surface 1u, and two or more wires bonded to the main surface 1u so as to straddle the first component 41. 5 and. Each of the two or more wires 5 has a first end 51 and a second end 52. The first end 51 and the second end 52 are connected to either pad electrode 7, respectively. Here, the "first end" is the starting point of bonding, and the "second end" is the ending point of bonding. When paying attention to two wires adjacent to each other among the two or more wires 5, the distance A between the first ends 51 of the two wires is the distance A between the second ends 52 of the two wires. It is shorter than the distance B between them. As described above, this can be realized by setting the start point side as the first end and the end point side as the second end. That is, since the first end is the starting point of bonding, the wire 5 can be pulled up perpendicularly to the main surface 1u when the first end is connected to the pad electrode 7. Therefore, at this point, there is almost no risk of contact between the wire 5 and the first component 41. Therefore, with respect to the first end, the wire 5 and the first component 41 can be arranged close to each other. On the other hand, since the second end is the end point of bonding and it is difficult to form the wire 5 vertically toward the main surface 1u, it is necessary to separate the wire 5 from the first component 41 as compared with the first end side. .. In FIG. 4, the first end 51 is located near the first component 41, while the second end 52 is kept away from the first component 41 due to such circumstances. In the present embodiment, the portion where the need for shielding is higher is set as the first end of bonding.

As shown in FIG. 4, the conductor via 12 is electrically connected to the external connection electrode 11 provided on the lower surface of the substrate 1. An internal conductor pattern 13 is arranged inside the substrate 1. The conductor via 12 electrically connects the external connection electrode 11 and the internal conductor pattern 13 so as to penetrate the insulating layer 2. The positions, sizes, and arrangements of the external connection electrode 11, the conductor via 12, and the internal conductor pattern 13 shown here are shown as examples only, and are not limited thereto.

In the example shown in FIGS. 3 and 4, the second component 42 and the chip component 49 are mounted on the main surface 1u in addition to the first component 41. The second component 42 may be, for example, an IC. Here, it is assumed that the chip component 49 is a capacitor, but the type of chip component is not limited to this. The chip component may be, for example, a filter or a resistor. The positions, sizes, and arrangements of various parts mounted on the main surface 1u are shown as examples, and are not limited to these.

(Action / effect)
In the present embodiment, since the two or more wires 5 bonded to the main surface 1u so as to straddle the first component 41 are provided, the first component 41 can be shielded by these wires 5.

Further, in the present embodiment, when paying attention to two wires adjacent to each other among the two or more wires 5, the distance A between the first ends 51 of the two wires is the two wires. Since the distance B between the second ends 52 of the wire 5 is shorter than the distance B between the second ends 52, the arrangement of the wires 5 is dense at the place where the first ends 51 are lined up, and the shield can be shielded with particular emphasis. Therefore, it is possible to realize a module with improved shielding performance.

As shown in this embodiment, the module 101 preferably includes a shield film 6 arranged so as to be separated from the main surface 1u and cover the first component 41 and the two or more wires 5. FIG. 4 shows how the shield film 6 is arranged apart from the main surface 1u. By adopting this configuration, the shielding effect of the shielding film 6 can also be obtained. As shown in FIG. 4, it is preferable that the space inside the shield film 6 is filled with the sealing resin 3. In other words, it is preferable that the module 101 includes the first component 41 and the sealing resin 3 arranged so as to cover the two or more wires 5. As shown in this embodiment, when the module 101 also includes the second component 42, the module 101 is arranged so as to cover the first component 41, the second component 42, and the two or more wires 5. It is preferable to include the sealing resin 3.

As shown in FIG. 4, it is preferable that at least one of the two or more wires 5 is in contact with the shield film 6. By adopting this configuration, the shield film 6 is connected to the ground of the substrate by the wire 5, so that the space surrounded by the shield film 6 can be efficiently shielded.

In the module 101 shown in the present embodiment, the arrangement of the ends of the wires 5 can be considered separately in the first region 61 and the second region 62 as shown in FIG. The first end 51 of the plurality of wires 5 is connected to the main surface 1u in the first region 61. The second end 52 of the plurality of wires 5 is connected to the main surface 1u in the second region 62.

In the example shown here, the first region 61 is arranged linearly along one side of the first component 41. The second region 62 is arranged in an L shape along the two sides of the first component 41. The first region 61 is arranged between the first component 41 and the second component 42.

For example, it is assumed that it is desired to suppress mutual electromagnetic interference between the first component 41 and the second component 42. As shown in the present embodiment, the module 101 includes a second component 42 mounted on the main surface 1u, and the main surface 1u includes the first end 51 and the main surface 1u of the two or more wires 5. It is preferable to have a first region 61 connected, and at least a part of the first region 61 is located between the first component 41 and the second component 42. By adopting this configuration, the first region 61 is arranged between the first component 41 and the second component 42, and the first end 51 is densely arranged in the first region 61, so that the first region 61 is first. The space between the component 41 and the second component 42 can be shielded intensively, and the electromagnetic influence that may occur between the first component 41 and the second component 42 can be reduced.

It is preferable that the first ends 51 of the two or more wires 5 are arranged on the same side. In the example shown in the present embodiment, when paying attention to the set of the two or more wires 5, the first ends 51 are arranged on one side and the second ends 52 are arranged on the other side. The arrangement of the first ends 51 is denser than the arrangement of the second ends 52.

When the first component 41 is LNA, the reception sensitivity can be improved. When the first component 41 is an LNA, an inductor for input matching of the LNA may be arranged in addition to the LNA as the first component 41, but the inductor for the input matching of the LNA is also shielded in the same manner. Is preferable.

(Embodiment 2)
(Constitution)
The module in the second embodiment based on the present invention will be described with reference to FIG. FIG. 6 shows a perspective view of the module 102 in the present embodiment in a plane. The module 102 in the present embodiment has the same basic configuration as the module 101 described in the first embodiment, but differs in the following points.

The module 102 includes a pad electrode 7a in addition to the pad electrode 7. One first end 51 or one second end 52 is connected to the pad electrode 7. A plurality of first ends 51 are connected to the pad electrode 7a.

In the present embodiment, an integrated pad electrode 7a to which two or more first ends 51 are collectively connected is arranged in the first region 61.

(Action / effect)
In the present embodiment, since the integrated pad electrode 7a to which the two or more first ends 51 are collectively connected is provided, the portion using the integrated pad electrode 7a is one for the ground electrode of the substrate 1. Can be connected with vias. That is, when the pad electrodes are separate, vias connected to the ground electrode of the substrate 1 are required for each of the separate pad electrodes, but the number of vias can be reduced by using an integrated pad electrode. It will be possible. In the present embodiment, the same potential can be efficiently applied to the plurality of wires 5 at once.

In the example shown in FIG. 6, the first region 61 is configured to include one pad electrode 7a and a plurality of pad electrodes 7, but the present invention is not limited to this, and other combinations are also conceivable. For example, the module 103 shown in FIG. 7 may be used. In the module 103, the first region 61 includes a plurality of pad electrodes 7b, and a plurality of first ends 51 are connected to each pad electrode 7b.

Further, it may be something like the module 104 shown in FIG. In the module 104, the first region 61 includes one pad electrode 7c, and all the first ends 51 connected to the main surface 1u in the first region 61 are connected to this one pad electrode 7c. By doing so, it is possible to connect to the ground electrode of the substrate 1 with one via. Furthermore, the number of parts can be reduced. Further, if the common pad electrode 7c is arranged in this way, the ground potential can be easily and evenly set for all the first ends 51 through the pad electrode 7c.

(Embodiment 3)
(Constitution)
The module according to the third embodiment based on the present invention will be described with reference to FIGS. 9 to 10. FIG. 9 shows a perspective view of the module 105 in the present embodiment in a plane. The area is clearly shown in FIG. The module 105 in the present embodiment has the same basic configuration as the module 101 described in the first embodiment, but differs in the following points.

In the module 105, the first component 41 is surrounded by at least a portion of the aggregate of the first end 51 and the second end 52 of the two or more wires 5. That is, the two or more wires 5 are arranged so as to straddle the first component 41 over the entire circumference of the first component 41. As shown in FIG. 10, the first region 61 in which the first end 51 is arranged may be L-shaped. In the example shown in FIG. 10, the second region 62 in which the second end 52 is arranged is also L-shaped. Not all wires 5 have the same length. In the example shown here, the two or more wires 5 are densely arranged on the first end side far from the shield film 6. Thereby, the shielding property can be improved even on the side far from the shielding film 6.

(Action / effect)
In the present embodiment, since the first component 41 is surrounded by the end of the wire, the first component 41 can be sufficiently shielded, and the first region 61 can be shielded with particular emphasis. can.

(Modification example)
A modification of the module according to the present embodiment will be described with reference to FIG. FIG. 11 shows a perspective view of the module 105a as a modified example in a plane. In the module 105a, the first component 41 is an LNA and the second component 42 is an Rx filter. In addition to the first component 41 and the second component 42, the components 48a, 48b, 48c, and 48d are arranged on the main surface 1u of the substrate 1. The component 48a is an ANTSW (antenna switch). The component 48b is a Tx filter. The component 48c is a PA (Power Amplifier). Part 48d is a PA controller. The first component 41, which is an LNA, is surrounded by at least a part of an aggregate of the first end 51 and the second end 52 of the two or more wires 5. That is, the two or more wires 5 are arranged so as to straddle the LNA over the entire circumference of the LNA. The first region 61 in which the first ends 51 are arranged is L-shaped so as to be along the two sides of the first component 41 which is an LNA. The second region 62 in which the second end 52 is arranged is also L-shaped so as to be along the other two sides of the first component 41 which is an LNA. At least a part of the first region 61 is arranged so as to separate the first component 41 which is an LNA and the second component 42 which is an Rx filter. The two or more wires 5 are closely arranged on the first end 51 side. That is, in the plurality of wires 5 straddling the LNA, the second component 42 and the first end 51 side, which is the side of the components 48a, 48b, 48c, and 48d, are densely arranged. Among the plurality of wires 5 straddling the LNA, in particular, the first end 51 side, which is the side on which the PA, that is, the component 48c, which is a component related to transmission, is arranged, is densely arranged. Therefore, in the module 105a, the effect of improving the reception sensitivity is high.

(Embodiment 4)
(Constitution)
The module according to the fourth embodiment based on the present invention will be described with reference to FIGS. 12 to 13. FIG. 12 shows a perspective view of the module 106 in the present embodiment in a plane. The area is clearly shown in FIG.

The module 106 includes a substrate 1 having a main surface 1u and a plurality of components mounted on the main surface 1u. Here, the first component 41 and the second component 42 are shown as examples of the plurality of components. For each of the plurality of parts, two or more wires 5 bonded to the main surface 1u are arranged so as to straddle the parts. That is, two or more wires 5 of the first group are arranged so as to straddle the first component 41, and two or more wires 5 of the second group are arranged so as to straddle the second component 42. As shown in FIG. 12, each of the two or more wires 5 has a first end 51 and a second end 52. As shown in FIG. 13, the main surface 1u has a common first region 61 in which the first ends 51 of the two or more wires 5 related to the plurality of parts are concentrated and connected to the main surface 1u. The distance between the two first ends 51 adjacent to each other in the first region 61 is shorter than the distance between the second ends 52 adjacent to each other in areas other than the first region 61. In the example shown here, the second end 52 is connected to the main surface 1u in any of the two second regions 62a and 62b. The second region 62a is arranged in an L shape along the two sides of the first component 41. The second region 62b is arranged in an L shape along the two sides of the second component 42. Pad electrodes 7 are linearly arranged in a row in the first region 61. In the first region 61, the first end 51 of the wire 5 straddling the first component 41 and the first end 51 of the wire 5 straddling the second component 42 are alternately arranged.

(Action / effect)
In the present embodiment, since the structure is such that the plurality of parts are each straddled by two or more wires 5, it is possible to individually form a shield for the plurality of parts. Since the common first region 61 is provided, a large number of first end 51s are concentrated in the first region 61, and the shield can be more reliably performed.

In the example shown here, the structure in which the wire 5 straddles a total of two parts, that is, the first part 41 and the second part 42 is illustrated, but the same configuration can be considered for three or more parts. Be done. Further, in addition to these plurality of components, components that do not straddle the wires 5 may be mounted on the main surface 1u of the substrate 1. Also in FIG. 12, for example, a component that cannot be straddled by any of the wires 5 is mounted on the left side of the figure. Further, in FIG. 12, the chip component 49 is also mounted. The chip component 49 is shown as an example and is not essential.

(Embodiment 5)
(Constitution)
The module according to the fifth embodiment based on the present invention will be described with reference to FIGS. 14 to 15. FIG. 14 shows a perspective view of the module 107 in the present embodiment in a plane. The area is clearly shown in FIG.

In the module 107, four components are mounted on the main surface 1u of the substrate 1. That is, the first component 41, the second component 42, the third component 43, and the fourth component 44 are mounted on the main surface 1u. A common first region 61 is provided in which the first ends 51 of the wires 5 related to these parts are concentrated and connected to the main surface 1u, and the four parts each contact a corner portion with respect to the first region 61. It is arranged like this. The first region 61 is located at a position surrounded by the corners of the four parts and at the same time extends into the gap between the two parts. The first region 61 extends between, for example, the first component 41 and the second component 42. The first region 61 extends between, for example, the first component 41 and the fourth component 44. The second regions 62a, 62b, 62c, and 62d are arranged along the sides of each component. The second regions 62a, 62b, 62c, and 62d correspond to the first component 41, the second component 42, the third component 43, and the fourth component 44, respectively.

(Action / effect)
In the present embodiment, the wires 5 are properly arranged so that the plurality of parts can be shielded from each other. In particular, in a portion where the corners of a plurality of parts are concentrated, the first region 61 is provided and the wires 5 are densely arranged, so that the influence of electromagnetic waves that may occur in such a portion should be reduced intensively. Can be done.

A configuration such as the module 108 shown in FIG. 16 may be adopted. In the module 108, an integrated pad electrode 7d is arranged in the first region 61 instead of arranging individual pad electrodes. The first end 51 of the plurality of wires 5 is connected to the pad electrode 7d.

(Embodiment 6)
(Constitution)
The module in the sixth embodiment based on the present invention will be described with reference to FIGS. 17 to 18. FIG. 17 shows a perspective view of the module 109 in the present embodiment in a plane. The area is clearly shown in FIG.

In the module 109, four components are mounted on the main surface 1u of the substrate 1. That is, the first component 41, the second component 42, the third component 43, and the fourth component 44 are mounted on the main surface 1u. A common first region 61 is provided in which the first ends 51 of the wires 5 related to these parts are concentrated and connected to the main surface 1u, and the four parts each contact a corner portion with respect to the first region 61. It is arranged like this. The second regions 62a, 62b, 62c, and 62d are arranged along the sides of each component. The second regions 62a, 62b, 62c, and 62d correspond to the first component 41, the second component 42, the third component 43, and the fourth component 44, respectively.

(Action / effect)
Also in the present embodiment, the same effect as that of the fifth embodiment can be obtained.

A configuration such as the module 110 shown in FIG. 19 may be adopted. In the module 110, the integrated pad electrodes 7e are arranged in the first region 61 instead of arranging the individual pad electrodes. The first end 51 of the plurality of wires 5 is connected to the pad electrode 7e.

In each of the above embodiments, an example in which the component is rectangular is shown, but the shape of the component is not limited to a rectangle and may be another shape.

It should be noted that a plurality of the above embodiments may be appropriately combined and adopted.
It should be noted that the above-described embodiment disclosed this time is an example in all respects and is not limiting. The scope of the present invention is indicated by the scope of claims and includes all modifications within the meaning and scope equivalent to the scope of claims.

1 Substrate, 1u Main surface, 2 Insulation layer, 3 Encapsulating resin, 5 Wire, 6 Shield film, 7,7a, 7b, 7c, 7d Pad electrode, 11 External connection electrode, 12 Conductor via, 13 Internal conductor pattern, 41 1st part, 42 2nd part, 43 3rd part, 44 4th part, 48a, 48b, 48c, 48d part, 49 chip part, 51 1st end, 52 2nd end, 61 1st area, 62, 62a , 62b, 62c, 62d second region, 101, 102, 103, 104, 105, 105a, 106, 107, 108, 109, 110 modules.

Claims (11)

A board with a main surface and
The first component mounted on the main surface and
It comprises three or more wires bonded to the main surface so as to straddle the first component.
Each of the three or more wires has a first end and a second end.
The first ends of the three or more wires are evenly spaced.
The three or more wires straddle the first component without straddling the signal line connected to the first component by wire bonding.
When focusing on two wires adjacent to each other among the three or more wires, the distance between the first ends of the two wires is between the second ends of the two wires. A module that is shorter than the distance. The module of claim 1, wherein the first ends of the three or more wires are aligned on the same side. It is equipped with a second component mounted on the main surface.
The main surface has a first region in which the first end of the three or more wires and the main surface are connected.
The module according to claim 1 or 2, wherein at least a part of the first region is located between the first component and the second component. The module according to claim 3, wherein an integral pad electrode to which three or more first ends thereof are collectively connected is arranged in the first region. The module according to any one of claims 1 to 4, comprising the first component and a sealing resin arranged so as to cover the three or more wires. The module according to any one of claims 1 to 5, comprising a shield film arranged so as to cover the first component and the three or more wires at a distance from the main surface. The module according to claim 6, wherein at least one of the three or more wires is in contact with the shield film. The module according to any one of claims 1 to 7, wherein the first component is surrounded by at least a part of an assembly of the first end and the second end of the three or more wires. .. The module according to claim 3, further comprising a sealing resin arranged to cover the first component, the second component, and the three or more wires. The module according to any one of claims 1 to 9, wherein the first component is LNA. A board with a main surface and
With multiple components mounted on the main surface
For each of the plurality of parts, three or more wires bonded to the main surface are arranged so as to straddle the parts.
Each of the three or more wires has a first end and a second end.
The first ends of the three or more wires are evenly spaced.
The three or more wires straddle the component without straddling the signal line connected to the component by wire bonding.
The main surface has a common first region in which the first ends of the three or more wires relating to the plurality of parts are concentrated and connected to the main surface.
A module in which the distance between the centers of two adjacent first ends adjacent to each other in the first region is shorter than the distance between the centers of the second ends adjacent to each other in areas other than the first region.

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