JP2012099676A - Template processing method, program, computer storage medium and template processing unit - Google Patents

Abstract

PROBLEM TO BE SOLVED: To supply process liquid to the pattern region of a template while reducing the amount of process liquid supply onto the template.SOLUTION: A process liquid application jig 110 is arranged to face a template T so that the coated surface 111 of the process liquid application jig 110 covers the pattern region Dof the template T, and the distance of a clearance 116 between the coated surface 111 and the pattern region Dbecomes the distance of generating capillary phenomenon of a mold release agent S (Fig. 12(a)). Subsequently, the mold release agent S is supplied from a process liquid supply section 120 to the clearance 116, and the mold release agent S is diffused only onto the pattern region Dby capillary phenomenon (Figs. 12(b)-(d)). Thereafter, the mold release agent S is dried by blowing air thereto from an air nozzle 150 (Fig. 12(e)).

Description

  The present invention relates to a template processing method, a program, a computer storage medium, and a template processing apparatus for applying a processing liquid onto a pattern area where a predetermined pattern is formed on the surface of a template and processing the pattern area.

  For example, in a semiconductor device manufacturing process, for example, a photolithography process is performed on a semiconductor wafer (hereinafter referred to as “wafer”) to form a predetermined resist pattern on the wafer.

  When the resist pattern described above is formed, the resist pattern is required to be miniaturized in order to achieve higher integration of the semiconductor device. In general, the limit of miniaturization in the photolithography process is about the wavelength of light used for the exposure process. For this reason, it has been advancing to shorten the wavelength of exposure light. However, there are technical and cost limitations to shortening the wavelength of the exposure light source, and it is difficult to form a fine resist pattern on the order of several nanometers, for example, only by the method of advancing the wavelength of light. is there.

  Therefore, in recent years, it has been proposed to form a fine resist pattern on a wafer by using a so-called imprint method instead of performing a photolithography process on the wafer. In this method, a template (sometimes called a mold or a mold) having a fine pattern on the surface is pressure-bonded to the resist surface formed on the wafer, then peeled off, and the pattern is directly transferred to the resist surface. (Patent Document 1).

JP 2009-43998 A

  On the surface of the template used in the above-described imprinting method, a release agent having liquid repellency with respect to the resist is usually formed in order to make the template easy to peel from the resist.

  When forming a release agent on the surface of the template, first, after cleaning the surface of the template, the release agent is applied to the surface of the template. Next, the release agent is adhered to the surface of the template so that the release agent to be formed has a predetermined contact angle and can exhibit a liquid repellency function with respect to the resist. Specifically, by chemically reacting the mold release agent and the template surface, among the components contained in the mold release agent, a component having liquid repellency to the resist, such as a fluoride component, is adsorbed on the template surface. Let Thereafter, a rinse liquid is applied to the release agent to remove the unreacted portion of the release agent, and a release agent having a predetermined film thickness is formed on the surface of the template. The unreacted part of the release agent means a part other than the part where the release agent is chemically reacted with the surface of the template.

  When the treatment liquid such as the release agent or the rinse liquid described above is applied on the template, for example, a spin coating method, a nozzle spray coating method, a dip coating method, or the like is used. The spin coating method is a method of supplying a processing liquid onto a rotating template and diffusing the processing liquid on the template by centrifugal force. Nozzle spray application is a method of spraying a mist-like treatment liquid onto a template. Immersion coating is a method in which a template is immersed in a processing solution.

  Here, the range in which the release agent needs to be formed on the template is only the pattern region where the template pattern is formed. That is, since the template surface other than the pattern region is not pressure-bonded to the resist surface on the wafer, it is not necessary to form a release agent. However, even if any of the above-described conventional coating methods is used, the processing liquid is applied to the entire surface of the template and cannot be controlled so that the processing liquid is applied only to the pattern region. In addition, the treatment liquid is also applied to unnecessary portions in the conventional coating method, and a large amount of the treatment liquid is required. Therefore, there has been room for improvement in order to save the processing liquid.

  SUMMARY An advantage of some aspects of the invention is that a processing liquid is appropriately supplied to a pattern region of the template while suppressing a supply amount of the processing liquid on the template.

  In order to achieve the above object, the present invention provides a template processing method for applying a processing liquid onto a pattern area where a predetermined pattern is formed on the surface of a template, and processing the pattern area. The application surface of the treatment liquid application jig for applying the treatment liquid covers at least the pattern region, and the distance between the application surface and the pattern region is a distance at which capillary action of the treatment liquid occurs. As described above, the disposing step of disposing the processing liquid application jig so as to face the template, the supplying step of supplying the processing liquid between the application surface and the pattern region, and then the supply And a diffusion step of diffusing the treated liquid only on the pattern region by capillary action. The application surface is, for example, a flat surface.

  According to the present invention, the treatment liquid supplied between the application surface of the treatment liquid application jig and the pattern region of the template diffuses between the application surface and the pattern region by capillary action. That is, the processing liquid diffuses only on the pattern area. Therefore, the processing liquid is appropriately applied on the pattern area. In addition, since the processing liquid does not diffuse on the template surface other than the pattern region, the supply amount of the processing liquid can be suppressed to a smaller amount than before, and the cost of the processing liquid can be reduced.

  The supply step and the diffusion step may be performed on a plurality of types of processing liquids. For the plural types of treatment liquids, for example, a mold release agent, alcohol for improving the adhesion between the mold release agent and the template surface, a rinse liquid for rinsing the mold release agent, a cleaning liquid for cleaning the template surface, and the like are used.

  In the supplying step, at least a first supply port formed on the application surface or a second supply port provided outside the application surface may be used. In such a case, a plurality of at least the first supply port or the second supply port may be provided.

  In the diffusion step, ultrasonic vibration may be applied to the treatment liquid.

  You may further have the drying process which dries the said process liquid on the said pattern area | region after the said diffusion process. In such a case, in the drying step, air may be blown onto the processing liquid on the pattern region. In the drying step, the treatment liquid on the pattern region may be heated. Furthermore, in the drying step, an atmosphere around the processing liquid on the pattern region may be reduced.

  According to another aspect of the present invention, there is provided a program that operates on a computer of a control unit that controls the template processing apparatus in order to cause the template processing apparatus to execute the template processing method.

  According to another aspect of the present invention, a readable computer storage medium storing the program is provided.

  According to another aspect of the present invention, there is provided a template processing apparatus for applying a processing liquid onto a pattern area where a predetermined pattern is formed on the surface of a template, and processing the pattern area, the application surface being larger than the pattern area. A treatment liquid application jig comprising: a treatment liquid supply unit that supplies the treatment liquid between the application surface and the pattern region; and the application surface covers at least the pattern region; and The treatment liquid application jig is arranged to face the template so that the distance between the pattern area and the treatment liquid becomes a distance that causes capillary action of the treatment liquid, and then the application surface and the pattern area The treatment liquid is applied so that the treatment liquid is supplied in the middle, and then the supplied treatment liquid is diffused only on the pattern region by capillary action. Is characterized by having a control unit for controlling the processing solution supply unit and the tool, the.

  The processing liquid supply unit may supply a plurality of types of processing liquids.

  The treatment liquid supply unit may include at least a first supply port of the treatment liquid formed on the application surface or a second supply port of the treatment liquid provided outside the application surface. . In such a case, a plurality of at least the first supply port or the second supply port may be provided. Further, when the processing liquid supply unit has the first supply port, the processing liquid supply unit has the same diameter as the first supply port and is connected to the first supply port. One supply path and a second supply path having a diameter larger than that of the first supply port and connected to the first supply path may be included.

  You may have the vibration mechanism which provides an ultrasonic vibration to the said process liquid which diffuses between the said coating surface and the said pattern area | regions.

  The treatment liquid application jig is formed in an annular shape around the application surface, and is in contact with the surface of the template on which the pattern region is not formed, so that a treatment is performed between the treatment liquid application jig and the template. A contact surface that forms a space; an annular seal member provided on the contact surface for maintaining airtightness in the processing space; and an exhaust port for exhausting the atmosphere in the processing space. You may do it.

  You may have the air supply part which blows air on the said process liquid apply | coated on the said pattern area | region. Moreover, you may have the heat processing part which heats the said process liquid apply | coated on the said pattern area | region.

  A mesh plate may be provided on the application surface.

  ADVANTAGE OF THE INVENTION According to this invention, a process liquid can be appropriately supplied to the pattern area | region of the said template, suppressing the supply amount of the process liquid on a template.

It is a top view which shows the outline of a structure of the template processing apparatus concerning this Embodiment. It is a side view which shows the outline of a structure of the template processing apparatus concerning this Embodiment. It is a side view which shows the outline of a structure of the template processing apparatus concerning this Embodiment. It is a top view of a template. It is a side view of a template. It is a longitudinal cross-sectional view which shows the outline of a structure of a coating unit. It is a longitudinal cross-sectional view which shows the outline of a structure of a process liquid application jig | tool. It is a cross-sectional view which shows the outline of a structure of a process liquid application jig | tool. It is a longitudinal cross-sectional view which shows the outline of a structure of a washing | cleaning unit. It is a cross-sectional view which shows the outline of a structure of a washing | cleaning unit. It is the flowchart which showed each process of the template process. It is explanatory drawing which showed typically the state of the template in each process of template processing, (a) shows a mode that the process liquid application jig | tool has been arrange | positioned in the predetermined position, (b) is separated to a process liquid supply part. (C) shows how the mold release agent diffuses in the gap between the application surface and the pattern area, and (d) shows the mold release agent applied on the pattern area. A state is shown, (e) shows a mode that the mold release agent was dried. It is explanatory drawing which showed typically the state of the template in each process of template processing, (a) shows a mode that the process liquid application | coating jig | tool has been arrange | positioned in the predetermined position, (b) shows alcohol in a process liquid supply part. (C) shows how alcohol diffuses in the gap between the coating surface and the mold release agent on the pattern area, and (d) shows alcohol applied on the mold release agent. (E) shows a state where alcohol is removed by drying. It is explanatory drawing which showed typically the state of the template in each process of template processing, (a) shows a mode that the process liquid application | coating jig | tool has been arrange | positioned in the predetermined position, (b) is a process liquid supply part rinsed (C) shows how the rinsing liquid diffuses in the gap between the coating surface and the mold release agent on the pattern area, and (d) shows the rinsing liquid on the mold release agent. The state where the rinsing liquid was dried and removed is shown. It is a longitudinal cross-sectional view which shows the outline of a structure of the coating unit concerning other embodiment. It is explanatory drawing which showed typically the state of the template in each process of template processing, (a) shows a mode that the process liquid application | coating jig | tool has been arrange | positioned in the predetermined position, (b) is a cleaning liquid in a process liquid supply part. (C) shows how the cleaning liquid diffuses in the gap between the application surface and the pattern area, (d) shows how the cleaning liquid is applied on the pattern area, and (e ) Shows how the cleaning liquid is removed by drying. It is a longitudinal cross-sectional view which shows the outline of a structure of the process liquid application jig | tool concerning other embodiment. It is a longitudinal cross-sectional view which shows the outline of a structure of the process liquid application jig | tool concerning other embodiment. It is a cross-sectional view which shows the outline of a structure of the process liquid application jig | tool concerning other embodiment. It is a longitudinal cross-sectional view which shows the outline of a structure of the process liquid application jig | tool concerning other embodiment. It is a longitudinal cross-sectional view which shows the outline of a structure of the process liquid application jig | tool concerning other embodiment. It is a longitudinal cross-sectional view which shows the outline of a structure of the process liquid application jig | tool concerning other embodiment. It is a top view which shows the outline of a structure of the imprint system provided with the template processing apparatus concerning this Embodiment. It is a longitudinal cross-sectional view which shows the outline of a structure of the imprint unit. It is a cross-sectional view which shows the outline of a structure of an imprint unit. It is the flowchart which showed each process of the imprint process. It is explanatory drawing which showed typically the state of the template and wafer in each process of an imprint process, (a) shows a mode that the resist liquid was apply | coated on the wafer, (b) shows the resist film on a wafer. FIG. 3C shows a state in which photopolymerization is performed, FIG. 3C shows a state in which a resist pattern is formed on the wafer, and FIG. 3D shows a state in which a remaining film on the wafer is removed.

  Embodiments of the present invention will be described below. FIG. 1 is a plan view schematically showing the configuration of the template processing apparatus 1 according to the present embodiment. 2 and 3 are side views showing an outline of the configuration of the template processing apparatus 1. In the drawings used in the following description, the dimensions of each component do not necessarily correspond to the actual dimensions in order to prioritize easy understanding of the technology.

In the template processing apparatus 1 of the present embodiment, a template T having a rectangular parallelepiped shape and having a predetermined transfer pattern C formed on the surface is used as shown in FIGS. Hereinafter, the transfer pattern C means the side of the template T which is formed with the surface T _1, the surface T ₁ opposite to the surface of the backside T _2. Further, on the surface T ₁ of the template T, a region where the transfer pattern C is formed is referred to as a pattern region D _1, and a region outside the region where the transfer pattern C is not formed is referred to as an outer region D _2. . Pattern area D ₁ has a protruding from the outer region D ₂ trapezoidal shape. For the template T, a transparent material that can transmit visible light, near ultraviolet light, ultraviolet light, or the like, such as glass, is used.

Template processing unit 1 includes a plurality as shown in FIG. 1, for example, five of the template T or transferring, between the outside and the template processing apparatus 1 with the cassette unit, carrying out a template T the template cassette C _T The template loading / unloading station 2 and the processing station 3 including a plurality of processing units for performing predetermined processing on the template T are integrally connected.

The template loading / unloading station 2 is provided with a cassette mounting table 10. The cassette mounting table 10 can mount a plurality of template cassettes _{CT in a line} in the X direction (vertical direction in FIG. 1). That is, the template carry-in / out station 2 is configured to be capable of holding a plurality of templates T.

The template carry-in / out station 2 is provided with a template carrier 12 that can move on a conveyance path 11 extending in the X direction. The template transport body 12 is also movable in the vertical direction and the vertical direction (θ direction), and can transport the template T between the template cassette _CT and the processing station 3.

  The processing station 3 is provided with a transport unit 20 at the center thereof. Around the transport unit 20, for example, four processing blocks G1 to G4 in which various processing units are arranged in multiple stages are arranged. A first processing block G1 and a second processing block G2 are arranged in this order from the template loading / unloading station 2 side on the front side of the processing station 3 (X direction negative direction side in FIG. 1). A third processing block G3 and a fourth processing block G4 are arranged in this order from the template loading / unloading station 2 side on the back side of the processing station 3 (X direction positive direction side in FIG. 1). A transition unit 21 for delivering the template T is disposed on the template loading / unloading station 2 side of the processing station 3.

  The transport unit 20 has a transport arm that holds and transports the template T and is movable in the horizontal direction, the vertical direction, and the vertical direction. And the conveyance unit 20 can convey the template T with respect to the various processing units mentioned later and the transition unit 21 which are arrange | positioned in the processing blocks G1-G4.

The first processing block G1, a plurality of liquid processing units, as shown in FIG. 2, for example by applying processing solutions to the template T, forming the release agent on the pattern area D ₁ of the said template T applied Units 30 and 31 are stacked in two stages in order from the bottom. Similarly, in the second processing block G2, the coating units 32 and 33 are stacked in two stages in order from the bottom. In addition, chemical chambers 34 and 35 for supplying various processing liquids to the coating units 30 to 33 are provided at the lowermost stages of the first processing block G1 and the second processing block G2, respectively.

The third processing block G3, the cleaning unit 40, 41 which ultraviolet rays are irradiated to the template T as shown in FIG. 3, the release agent on the template T is to clean the surface T ₁ of the before the deposition Are stacked in two steps from the bottom.

  In the fourth processing block G4, as in the third processing block G3, the cleaning units 42 and 43 are stacked in two stages in order from the bottom.

  Next, the structure of the coating units 30 to 33 described above will be described. As shown in FIG. 6, the coating unit 30 has a processing container 100 in which a loading / unloading port (not shown) for the template T is formed on the side surface.

A mounting table 101 on which the template T is mounted is provided on the bottom surface in the processing container 100. Template T has a surface T ₁ is placed on the top surface of the mounting table 101 to face upward. In the mounting table 101, raising / lowering pins 102 for supporting the template T from below and raising / lowering it are provided. The elevating pin 102 can be moved up and down by the elevating drive unit 103. A through hole 104 penetrating the upper surface in the thickness direction is formed on the upper surface of the mounting table 101, and the elevating pin 102 is inserted through the through hole 104.

Above the mounting table 101, the process liquid coating fixture 110 for applying a treatment liquid onto the pattern area D ₁ of the template T is provided. The treatment liquid application jig 110 is disposed to face the template T on the mounting table 101.

The treatment liquid application jig 110 has a substantially rectangular parallelepiped shape as shown in FIGS. An application surface 111 larger than the pattern region D ₁ is formed on the lower surface of the treatment liquid application jig 110 so as to cover at least the pattern region D ₁ of the template T. In this embodiment, the coated surface 111 and the pattern area D ₁ is approximately the same size. On the outside of the application surface 111, a recess 112 that is recessed upward is formed in an annular shape. Further, a wall 113 is formed in an annular shape outside the recess 112. The lower surface of the wall portion 113 forms a contact surface 114 that contacts the outer region _{D 2.} Then, the contact surface 112 that contacts the outer region D _2, the processing space 115 surrounded by the wall 113 and the template T are formed. That is, the processing space 115 is a space which includes a gap 116 between the coated surface 111 and the pattern area _{D 1,} and a recess 113. In order to maintain airtightness in the processing space 115, the contact surface 114 is provided with an O-ring 117 as a seal material in an annular shape. Further, the treatment liquid application jig 110, when applying the treatment liquid onto the pattern area D ₁ as described later, generates a capillary distance H treatment liquid between the coated surface 111 and the pattern area D ₁ It is comprised so that it may become the distance to be made, for example, 0.01 mm-0.1 mm. When the distance H is increased, the diffusion rate of the processing liquid that diffuses through the gap 116 is increased, and when the distance H is decreased, the diffusion rate of the processing liquid is decreased.

The central portion of the processing liquid coating jig 110, the treatment liquid supplying section 120 for supplying the processing liquid into the gap 116 is provided between the coating surface 111 and the pattern region D _1. The treatment liquid supply unit 120 is provided so as to penetrate the treatment liquid application jig 110 in the thickness direction.

  The processing liquid supply unit 120 includes a first supply port 121 for the processing liquid formed on the coating surface 111, a first supply path 122 connected to the first supply port 121 and extending vertically upward, and further And a second supply path 123 that is connected to one supply path 122 and extends vertically upward. The diameter of the first supply port 121 and the diameter of the first supply path 122 are the same minute diameter, for example, 0.5 mm. The diameter of the second supply path 123 is larger than the diameter of the first supply path 122, for example, 5 mm. Therefore, a tapered portion 124 whose diameter increases upward is formed between the first supply path 122 and the second supply path 122. The taper angle θ of the taper portion 124 is, for example, 120 degrees. Note that the diameters of the first supply path 122 and the second supply path 123 are not limited to the present embodiment, and the diameter of the second supply path 123 may be larger than that of the first supply path 122.

  From the treatment liquid supply unit 120, a plurality of kinds of treatment liquids, for example, a mold release agent, alcohol, and a rinse liquid are supplied. As shown in FIG. 6, a first supply pipe 130, a second supply pipe 131, and a third supply pipe 132 are connected to the second supply path 123 of the processing liquid supply unit 120.

  The first supply pipe 130 communicates with a release agent supply source 133 that stores the release agent therein. Further, the first supply pipe 130 is provided with a supply device group 134 including a valve for controlling the flow of the release agent, a flow rate adjusting unit, and the like. Note that a material having a liquid repellency with respect to a resist film on the wafer, which will be described later, such as a fluorine-carbon compound, is used as the material of the release agent.

  The second supply pipe 131 communicates with an alcohol supply source 135 that stores room temperature alcohol, for example, t-pentyl alcohol. In addition, the second supply pipe 131 is provided with a supply device group 136 including a valve for controlling the flow of alcohol, a flow rate adjusting unit, and the like. In addition, alcohol should just be alcohol and you may use alcohol other than t-pentyl alcohol. For example, ethanol, methanol, propanol, butanol, pentanol, hexanol, heptanol may be used, or a mixture of these alcohols may be used. The concentration of alcohol is not particularly limited, but is preferably 100%. Furthermore, although normal temperature alcohol is used in the present embodiment, alcohol heated to, for example, 70 ° C. or less may be used in order to suppress the condensation of alcohol.

  The third supply pipe 132 communicates with a rinse liquid supply source 137 that stores therein a rinse liquid, for example, a solvent for a release agent. Further, the third supply pipe 132 is provided with a supply device group 138 including a valve for controlling the flow of the rinse liquid, a flow rate adjusting unit, and the like.

  As shown in FIGS. 7 and 8, the wall body 113 is formed with an exhaust port 140 for exhausting the atmosphere in the processing space 115. A vacuum pump 142 that evacuates the atmosphere in the processing space 115 is connected to the exhaust port 140 through an exhaust pipe 141 as shown in FIG.

As shown in FIGS. 7 and 8, an air supply unit that blows air, for example, an inert gas such as nitrogen or dry air, into the gap 116 between the coating surface 111 and the pattern region D ₁ is provided inside the wall body 113. The air nozzle 150 is provided. The air nozzle 150 is disposed at a position facing the exhaust port 140 with the application surface 111 interposed therebetween. The air nozzle 150 is provided so as to extend in the X direction along one side of the pattern region D ₁ (application surface 111). The air nozzle 150 can by blowing air, drying the treatment liquid in the treatment liquid applied onto the pattern area D ₁ as described below. In addition, the shape of the air nozzle 150 is not limited to this Embodiment, A various shape can be used.

  A moving mechanism 160 that moves the processing liquid application jig 110 in the vertical direction and the horizontal direction as shown in FIG. 6 is provided on the ceiling surface of the processing container 100 and above the processing liquid application jig 110. . The moving mechanism 160 includes a support member 161 that supports the treatment liquid application jig 110, and a jig driving unit 162 that supports the support member 161 and moves the treatment liquid application jig 110 in the vertical direction and the horizontal direction. Have.

  In addition, since the structure of the coating units 31-33 is the same as that of the coating unit 30 mentioned above, description is abbreviate | omitted.

  Next, the structure of the washing | cleaning units 40-43 mentioned above is demonstrated. As shown in FIG. 9, the cleaning unit 40 has a processing container 170 in which a loading / unloading port (not shown) for the template T is formed on the side surface.

A chuck 171 for attracting and holding the template T is provided in the processing container 170. Chuck 171, the surface _{T 1} of the template T to face upward, suction-holds the rear surface _{T 2.} A chuck driving unit 172 is provided below the chuck 171. The chuck driving unit 172 is provided on the bottom surface in the processing container 170 and is mounted on a rail 173 extending along the Y direction. The chuck 171 can be moved along the rail 173 by the chuck driving unit 172.

An ultraviolet irradiation unit 174 that irradiates the template T held by the chuck 171 with ultraviolet rays is provided on the ceiling surface in the processing container 170 and above the rail 173. The ultraviolet irradiation part 174 extends in the X direction as shown in FIG. Then, while moving the template T along the rail 173, by irradiating ultraviolet from the ultraviolet irradiation unit 174 to the surface T ₁ of the said template T, ultraviolet rays are irradiated onto the surface T ₁ the entire surface of the template T.

  In addition, since the structure of the washing | cleaning units 41-43 is the same as that of the structure of the washing | cleaning unit 40 mentioned above, description is abbreviate | omitted.

  The template processing apparatus 1 is provided with a control unit 200 as shown in FIG. The control unit 200 is a computer, for example, and has a program storage unit (not shown). The program storage unit controls the transfer of the template T between the template loading / unloading station 2 and the processing station 3, the operation of the drive system in the processing station 3, and the like, and executes template processing to be described later in the template processing apparatus 1. The program to be stored is stored. This program is recorded in a computer-readable storage medium such as a computer-readable hard disk (HD), flexible disk (FD), compact disk (CD), magnetic optical desk (MO), memory card, or the like. Or installed in the control unit 200 from the storage medium.

  The template processing apparatus 1 according to the present embodiment is configured as described above. Next, template processing performed in the template processing apparatus 1 will be described. FIG. 11 shows the main processing flow of this template processing, and FIGS. 12 to 14 show the state of the template T in each step.

First, the template carrier 12, the template T is taken from the template cassette C _T on the cassette mounting table 10, it is transported to the transition unit 21 in the processing station 3 (step A1 in FIG. 11). At this time, in the template cassette C _T, the template T, the surface T ₁ of the transfer pattern C is formed is accommodated so as to face upward, the template T in this state is conveyed to the transition unit 21.

Thereafter, the transport unit 20 transports the template T to the cleaning unit 40 and sucks and holds it on the chuck 171. Subsequently, the template T is irradiated with ultraviolet rays from the ultraviolet irradiation unit 174 while moving the template T along the rails 173 by the chuck driving unit 172. Thus, the irradiated ultraviolet rays to the surface T ₁ the entire surface of the template T, the impurities in the organic contaminants and particles of the surface T ₁ of the template T is removed, (step A2 in FIG. 11) that the surface T ₁ is being cleaned.

Thereafter, the template T is transported to the coating unit 30 by the transport unit 20. The template T conveyed to the coating unit 30 is transferred to the lifting pins 102 and placed on the placement table 101. Then, while adjusting the horizontal position of the processing liquid coating jig 110 by the moving mechanism 160, the process liquid coating fixture 110 and the contact surface 114 is the outer region D ₂ a, as shown in FIG. 12 (a) contacting Lower until At this time, the application surface 111 is opposed to cover a pattern region D _1. The distance H between the coated surface 111 and the pattern area D ₁ is the distance to generate a capillary phenomenon of the release agent, for example, it becomes 0.05 mm. Incidentally, in this way the contact surface 114 contacts the outer region D _2, airtightness in the processing space 115 by the O-ring 117 is held.

Thereafter, as shown in FIG. 12B, a predetermined amount of release agent S is supplied from the release agent supply source 133 to the processing liquid supply unit 120. Incidentally, the release agent S as described later is supplied only on the pattern region D _1, it is not supplied onto the outer region D _2. Thus, the predetermined amount described above is the amount the amount, there is slightly more than the amount corresponding to the volume of the gap 116 between the coated surface 111 and the pattern region D _1.

Thereafter, the processing liquid release agent S supplied to the supply unit 120 is supplied to the gap 116 between the coated surface 111 and the pattern area D ₁ as shown in FIG. 12 (c). At this time, the release agent S sequentially passes through the second supply path 123 and the first supply path 122 of the processing liquid supply unit 120 and is supplied to the gap 116 from the first supply port 121. As a result of intensive studies by the inventors, when the diameter of the first supply port 121 and the diameter of the first supply path 122 are set to the same minute diameter, the release agent S flows through the first supply path 122. I found it easier. The inventors speculate that this cause is due to the suppression of the so-called pinning effect and the interaction with the capillary phenomenon. Note that the pinning effect referred to here is, for example, when the second supply path 123 is connected to the first supply port 121 without passing through the first supply path 122, and is separated at the first supply port 121. This is a phenomenon in which the release agent S hardly flows because the surface tension of the mold agent S increases. As described above, the release agent S can be smoothly supplied to the gap 116 by using the processing liquid supply unit 120 of the present embodiment. It should be noted that the processing liquid can be smoothly supplied to the gap 116 as described above when other processing liquids such as alcohol, a rinsing liquid, and a cleaning liquid are supplied from the processing liquid supply unit 120 as described later.

Thereafter, the release agent S supplied to the gap 116 diffuses through the gap 116 by capillary action as shown in FIG. The release agent S as shown in FIG. 12 (d) is filled in the gap 116, is applied over the pattern region _{D 1} (step A3 in FIG. 11). At this time, as described above, the supply amount of the release agent S supplied to the gap 116 is an amount corresponding to the volume of the gap 116, and the capillary phenomenon occurs only in the gap 116. agent S does not flow out to the outer region D _2.

Thereafter, as shown in FIG. 12E, the processing liquid application jig 110 is raised to a predetermined position. This predetermined position is a position that can blow air release agent S on the pattern area D ₁ from the air nozzle 150, the distance H becomes, for example, 1mm position between the coated surface 111 and the pattern area D ₁ It is. Even thus increasing the processing liquid coating jig 110, since the O-ring 117 is in contact with the outer region D _2, airtightness in the processing space 115 is maintained. Then, blowing air into the release agent S on the pattern area D ₁ from the air nozzle 150, thereby drying the release agent S (step A4 in FIG. 11).

When the release agent S on the pattern area D ₁ is dried, lowering the treatment liquid application jig 110 as shown in FIG. 13 (a) to a predetermined position. This predetermined position is a position capable of supplying the alcohol from the processing liquid supply unit 120 to the release agent S on the pattern regions D _1, the distance H is, for example, 0.1mm between the coated surface 111 and the pattern area D ₁ It is a position. Incidentally, O-ring 117 at this time is because in contact with the outer region D _2, airtightness in the processing space 115 is maintained.

  Thereafter, as shown in FIG. 13B, a predetermined amount of alcohol L is supplied from the alcohol supply source 135 to the treatment liquid supply unit 120.

Thereafter, the alcohol L, which is supplied to the processing solution supply unit 120 is supplied to the gap 116 between the release agent S on the coated surface 111 and the pattern area D ₁ as shown in FIG. 13 (c). Subsequently, the alcohol L supplied to the gap 116 diffuses through the gap 116 by capillary action. Then, the alcohol L as shown in FIG. 13 (d) is filled in the gap 116, is applied onto the release agent S pattern region _{D 1} (step A5 in FIG. 11). At this time, since the capillary phenomenon occurs only in the gap 116, there is no possibility that the alcohol L flows out to the outer region D _2. By coating alcoholic L Thus, the release agent S is firmly and closely chemically react with the surface T ₁ of the template T, release agent S is brought into close contact with the surface T ₁ of the said template T. Note that when such release agent S is brought into close contact with the surface T ₁ of the template T, by alcohol L on the release agent S, a part of the unreacted portion of the release agent S, i.e. the release agent S templates some other than a portion in close contact with the surface T ₁ is removed by the surface T ₁ and the chemical reaction of the T.

Thereafter, as shown in FIG. 13E, the processing liquid application jig 110 is raised to a predetermined position. This predetermined position is a position that can blow air from the air nozzle 150 to the alcohol L in the pattern area D _1, is the distance H becomes, for example, 1mm position between the coated surface 111 and the pattern area D ₁ . Even thus increasing the processing liquid coating jig 110, since the O-ring 117 is in contact with the outer region D _2, airtightness in the processing space 115 is maintained. And air is sprayed on alcohol L from the air nozzle 150, and the said alcohol L is dried and removed (process A6 of FIG. 11).

When alcohol L on the release agent S is dried, lowering the treatment liquid application jig 110 as shown in FIG. 14 (a) until the contact surface 114 contacts the outer region D _2. When the contact surface 114 comes into contact with the outer region D ₂ in this way, the airtightness in the processing space 115 is maintained by the O-ring 117.

  Thereafter, as shown in FIG. 14B, a predetermined amount of the rinse liquid N is supplied from the rinse liquid supply source 137 to the processing liquid supply unit 120.

Thereafter, the processing liquid rinse liquid supplied to the supply unit 120 N is supplied to the gap 116 between the release agent S on the coated surface 111 and the pattern area D ₁ as shown in FIG. 14 (c). Subsequently, the rinse liquid N supplied to the gap 116 diffuses in the gap 116 by capillary action. The rinsing liquid N, as shown in FIG. 14 (d) is filled in the gap 116, it is applied onto the release agent S pattern region _{D 1} (step A7 in FIG. 11). At this time, since the capillary phenomenon occurs only in the gap 116, there is no possibility that the rinsing liquid N flows out to the outer region D _2. The unreacted part of the release agent S is removed by the rinsing liquid N applied in this way. At this time, since the release agent S is in close contact with the surface T ₁ of the template T, the release agent S having a predetermined distance from the surface T _{1 of the} template T is not peeled off. Further, the contact angle of the mold release agent S on the template T is a predetermined angle, for example, 108 degrees, and the mold release agent S has sufficient liquid repellency with respect to a resist film to be described later. Function can be demonstrated.

Thereafter, as shown in FIG. 13E, the processing liquid application jig 110 is raised to a predetermined position. This predetermined position is a position that can blow air rinsing liquid N in the pattern area D ₁ from the air nozzle 150, the distance H becomes, for example, 1mm position between the coated surface 111 and the pattern area D ₁ is there. Even thus increasing the processing liquid coating jig 110, since the O-ring 117 is in contact with the outer region D _2, airtightness in the processing space 115 is maintained. And air is sprayed on the rinse liquid N from the air nozzle 150, and the said rinse liquid N is dried and removed (process A8 of FIG. 11). Thus, the release agent S along the transfer pattern C is formed on the template T with a predetermined film thickness.

Thereafter, the transport unit 20, the template T is carried to the transition unit 21 and returned to the template cassette _{C T} by the template carrier 12 (step A9 in FIG. 11). Thus a series of template processing is finished in the template processing apparatus 1, only on the pattern region D ₁ of the template T, the release agent S along the shape of the transfer pattern C is formed in a predetermined thickness.

According to the above embodiment, the process liquid coating jig 110 processing liquid supplied to the gap 116 between the pattern area D ₁ of the application surface 111 and the template T of the (release agent S, alcohol L, the rinse liquid N) diffuses the gap 116 by capillary action. That is, the processing solution diffuses only on the pattern region D _1. Accordingly, the processing liquid is suitably coated on the pattern region D _1. Moreover, the processing solution because it does not diffuse into the outer region D ₂ of the template T, the supply amount of the processing liquid can be suppressed small amounts than conventional. For this reason, the cost of the processing liquid can be reduced.

Further, the processing liquid coating jig processing liquid supply unit 120 pattern area D ₁ from the 110, the release agent S, alcohol L, since a plurality of kinds of processing liquid rinse liquid N is supplied, one coating unit Multiple processes can be performed within 30. Therefore, a series of template processes can be performed efficiently. In addition, since it is not necessary to provide a separate unit for each processing solution, the footprint of the template processing apparatus 1 can be reduced, and the apparatus configuration can be simplified to reduce the apparatus cost. In this embodiment, in order to supply a plurality of types of processing liquids, one processing liquid application jig 110 is used in this embodiment, but a plurality of processing liquid application jigs 110 may be provided for each processing liquid. Good.

Further, after spreading the processing liquid onto the pattern area D _1, since the air is blown into the processing liquid from the air nozzle 150, thereby drying the treatment liquid. Accordingly, unnecessary processing liquid does not remain on the template, and subsequent processing can be performed appropriately.

  Moreover, since the atmosphere in the processing space 115 can be kept airtight when applying and drying each processing liquid in the steps A3 to A8, the processing with the processing liquid can be appropriately performed. In addition, the processing liquid can be prevented from splashing outside the processing space 115. In the case where the processing liquid is allowed to be scattered outside the processing space 115, a mechanism (O-ring 117, exhaust port 140, exhaust pipe 141, vacuum pump 142) that keeps the atmosphere in the processing space 115 airtight. Can be omitted.

In the above embodiment, after the step A5 and A6 to improve the adhesion between the surface T ₁ of the release agent S and the template T with an alcohol L, using a rinsing solution N in step A7 and A8 Although the unreacted part of the release agent S has been removed, the application and drying of the rinse liquid N in the steps A7 and A8 may be performed before the application and drying of the alcohol L in the steps A5 and A6. Good. In such a case, after the release agent S on the pattern area D ₁ in step A3 and Step A4 are deposited, the rinsing liquid N is applied to the release agent on S, unreacted portion of the release agent S is removed The Thereafter, the alcohol L is applied to the release agent on S, improves the adhesion between the surface T ₁ of the release agent S and the template T, unreacted portion reliably remove the release agent S by the alcohol L Is done.

Further, when the unreacted portion of the release agent S is sufficiently removed by the alcohol L in the step A5 of the above form, the application and drying of the rinse liquid N in the subsequent steps A7 and A8 may be omitted. . Further, the above embodiment of the process A3 with a release agent S is in the case of sufficiently close contact with the surface T ₁ of the template T is also omitted coating and drying of the alcohol L in the subsequent step A5 and step A6 Good.

In template processing apparatus 1 of the above embodiments are not cleaning the surface T ₁ of the template T in the cleaning unit 40 to 43, in the coating unit 30 to 33, the surface of the template T by using a cleaning solution as the processing solution T ₁ may be washed. Then, the cleaning units 40 to 43 of the template processing apparatus 1 are replaced with application units.

  In such a case, in the coating unit 30, the cleaning liquid is supplied from the processing liquid supply unit 120 of the processing liquid coating jig 110 as shown in FIG. A fourth supply pipe 210 is connected to the processing liquid supply unit 120. The fourth supply pipe 210 communicates with a cleaning liquid supply source 211 that stores the cleaning liquid therein. Further, the fourth supply pipe 210 is provided with a supply device group 222 including a valve for controlling the flow of the cleaning liquid, a flow rate adjusting unit, and the like. As the cleaning liquid, for example, IPA (isopropyl alcohol), acetone, acrylic cleaning liquid, or the like is used.

In step A <b> 2, the template T is transported to the coating unit 30 and placed on the mounting table 101. Then, lowering the treatment liquid application jig 110 as shown in FIG. 16 (a) until the contact surface 114 contacts the outer region D _2. Thereafter, as shown in FIG. 16B, a predetermined amount of the cleaning liquid M is supplied from the cleaning liquid supply source 211 to the processing liquid supply unit 120. Cleaning liquid M, which is supplied to the processing solution supply unit 120 is supplied to the gap 116 between the coated surface 111 and the pattern area D ₁ as shown in FIG. 16 (c). The cleaning liquid M supplied to the gap 116 diffuses in the gap 116 by capillary action. Then, the cleaning liquid M as shown in FIG. 16 (d) is filled in the gap 116, it is applied over the pattern region _{D 1.} Thereafter, as shown in FIG. 16E, the processing liquid application jig 110 is raised to a predetermined position. This predetermined position is a position that can blow air cleaning liquid M on the pattern regions D ₁ from the air nozzle 150, is the distance H becomes, for example, 1mm position between the coated surface 111 and the pattern area D ₁ . Then, blowing air from the air nozzle 150 to the cleaning liquid M on the pattern regions D _1, it is removed by drying the cleaning liquid M. Thus, impurities in the organic contaminants and particles of the surface T ₁ of the template T is removed, the surface T ₁ is being cleaned. Since the other steps A1, A3 to A9 are the same as those in the above embodiment, the description thereof is omitted.

According to this embodiment, it is possible to also perform cleaning of the surface T ₁ of the template T in the one coating unit 30 can be performed more efficiently a series of template processing.

In this embodiment, it had been cleaned surface T ₁ of the template T in step A2, after forming a release agent S on the pattern area D ₁ in step A8, the surface of the release agent S Alternatively, the release agent S may be cleaned by supplying the cleaning liquid M.

In the above embodiment, the treatment liquid supply unit 120 of the treatment liquid application jig 110 has the first supply port 121 formed in the application surface 111, but instead of the first supply port 121. The second supply port 220 may be provided as shown in FIG. The second supply port 220 is formed so as to face obliquely downward in the processing liquid nozzle 221. The treatment liquid nozzle 221 is disposed in the recess 112 outside the application surface 111. The processing liquid toward the one end portion of the pattern area D ₁ from the second supply port 221 is adapted to be supplied. Although not shown, for example, the above-described first supply pipe 130, second supply pipe 131, third supply pipe 132, and fourth supply pipe 210 are connected to the processing liquid nozzle 221. A plurality of treatment liquids such as a release agent S, alcohol L, rinse liquid N, and cleaning liquid M are supplied from the second supply port 221.

In such a case, the treatment liquid discharged from the second supply port 220 as shown in FIG. 17 is supplied to one end portion of the pattern region D _1. Supplied process liquid by the capillary phenomenon, the gap 116 between the coated surface 111 and the pattern area D _1, diffuses toward the other end portion of the pattern region D _1. Thus, the processing liquid is applied onto the pattern area D _1. Therefore, also in this embodiment, it is possible to appropriately apply the only treatment liquid on the pattern region D _1.

The processing liquid supply unit 120 may have both the first supply port 121 and the second supply port 220 as shown in FIG. That is, the processing liquid supply unit 120 includes a set of the first supply port 121, the first supply path 122, and the second supply path 123 (hereinafter may be referred to as “first supply mechanism”), and the first. 2 and a set of treatment liquid nozzles 221 (hereinafter sometimes referred to as “first supply mechanism”) may be included. In each case, the processing liquid is supplied from both the first supply port 121 and the second supply port 122, so that a plurality of the first supply mechanism and the second supply mechanism may be provided. The processing liquid can be quickly applied onto the pattern region D _1. Particularly when the processing liquid is supplied from the plurality of first supply ports 121 and the plurality of second supply ports 122, the processing liquid is more efficiently applied. can be applied on the pattern area D ₁ .

  Further, the first supply mechanism in the processing liquid supply unit 120 of the above embodiment has the first supply port 121, the first supply path 122, and the second supply path 123. FIG. The first supply path 122 may be omitted as shown in FIG. In such a case, the second supply path 123 is connected to the first supply port 121. Further, the diameter of the second supply path 123 is larger than the diameter of the first supply port 121. For this reason, a tapered portion 124 whose diameter increases upward is formed between the first supply port 121 and the second supply path 122. The taper angle θ of the taper portion 124 is, for example, 120 degrees as in the above-described embodiment. The first supply mechanism of the present embodiment is effective when the above-described pinning effect does not occur even if the first supply path 122 is omitted, for example, when the flow rate of the processing liquid is large. In such a case, since the first supply path 122 can be omitted, the processing liquid supply unit 120 can be easily processed and manufactured.

  In the steps A2, A4, A6, A8, etc. in the above embodiment, when the treatment liquid such as the mold release agent S, the alcohol L, the rinse liquid N, the cleaning liquid M is dried, air is blown from the air nozzle 150 to the treatment liquid. However, the processing solution may be dried using other methods.

For example, by heating the treatment liquid on the pattern area D _1, it may be dried the treatment liquid. In such a case, for example, as shown in FIG. 21, a heater 230 as a heat treatment unit is provided inside the wall body 113 of the treatment liquid application jig 110. This heater 230 treatment liquid on the pattern area D ₁ is heated.

Further, for example, the atmosphere in the processing space 115 by vacuum, may be dried treatment liquid on the pattern regions D _1. In this case, the vacuum pump 142 connected to the exhaust port 140 of the processing liquid application jig 110 is operated to reduce the atmosphere in the processing space 115 to a predetermined pressure.

In either case, it is possible to suitably dry the treatment liquid on the pattern region D _1.

Gap between the above steps A2, A3, A5, A7, etc. of the embodiment, the release agent S, alcohol L, rinsing liquid N, a process liquid such as washing liquid M, the coated surface 111 and the pattern area _{D 1} When diffusing to 116, ultrasonic vibration may be applied to the treatment liquid. In such a case, for example, as shown in FIG. 22, the ultrasonic vibrator 240 is disposed in the recess 112 of the processing liquid application jig 110. An ultrasonic oscillator 241 for oscillating ultrasonic waves from the ultrasonic transducer 240 is connected to the ultrasonic transducer 240. Then, by applying ultrasonic vibration from the ultrasonic vibrator 240 to the processing liquid that diffuses through the gap 116, the processing liquid can be diffused more smoothly. Such as higher height of the transfer pattern C of the template T, and when the processing solution is less likely to enter the recesses of the transfer pattern C, when cleaning the surface T ₁ of the template T by using the cleaning liquid M is particularly effective is there. The ultrasonic transducer 240 and the ultrasonic oscillator 241 described above constitute the vibration mechanism of the present invention.

In the above embodiment, a mesh plate (not shown) may be provided on the application surface 111 of the treatment liquid application jig 110. The mesh plate is provided with the same size as the application surface 111. In this case, the processing liquid supply unit 120 mold release agent is supplied toward the pattern area D ₁ from S, alcohol L, rinse liquid N, the processing liquid such as cleaning liquid M is a mesh plate and the pattern area D ₁ by the capillary phenomenon Spread between. Then, the processing liquid does not flow out to the outer region D _2. Therefore, also in this embodiment, the processing liquid is suitably coated on the pattern region D _1.

The template processing apparatus 1 of the above embodiment may be arranged in the imprint system 300 as shown in FIG. The imprint system 300 includes an imprint unit 310 that forms a resist pattern on the wafer W using the template T, and a plurality of, for example, 25 wafers W are carried in and out of the imprint system 300 between the outside and the cassette. And a wafer carry-in / out station 311 for carrying the wafer W in and out of the wafer cassette _CW . An interface station 312 for transferring the template T is arranged between the template processing apparatus 1 and the imprint unit 310. The imprint system 300 has a configuration in which the template processing apparatus 1, the interface station 312, the imprint unit 310, and the wafer carry-in / out station 311 are integrally connected.

The wafer loading / unloading station 311 is provided with a cassette mounting table 320. The cassette mounting table 320 can mount a plurality of wafer cassettes _CW in a row in the X direction (vertical direction in FIG. 23). That is, the wafer carry-in / out station 311 is configured to be capable of holding a plurality of wafers W.

The wafer carry-in / out station 311 is provided with a wafer carrier 322 that can move on a conveyance path 321 extending in the X direction. The wafer carrier 322 is also movable in the vertical direction and around the vertical direction (θ direction), and can carry the wafer W between the wafer cassette _CW and the imprint unit 310.

  The wafer carry-in / out station 311 is further provided with an alignment unit 323 for adjusting the orientation of the wafer W. The alignment unit 323 adjusts the orientation of the wafer W based on the position of the notch portion of the wafer W, for example.

  The interface station 312 is provided with a template transport body 331 that moves on a transport path 330 extending in the X direction. A reversing unit 332 for inverting the front and back surfaces of the template T is disposed on the positive direction side of the transport path 330 in the X direction, and a plurality of templates T are temporarily stored on the negative direction side of the transport path 330 in the X direction. A buffer cassette 333 is disposed. The template transport body 331 is also movable in the vertical direction and around the vertical direction (θ direction), and can transport the template T between the processing station 3, the reversing unit 332, the buffer cassette 333, and the imprint unit 310.

  In the processing station 3 of the template processing apparatus 1, a transition unit 334 for delivering the template T is disposed on the interface station 312 side of the transport unit 20.

  Next, the configuration of the above-described imprint unit 310 will be described. As shown in FIG. 24, the imprint unit 310 includes a processing container 340 in which a loading / unloading port (not shown) for the template T and a loading / unloading port (not shown) for the wafer W are formed on the side surfaces.

  A wafer holder 341 on which the wafer W is placed and held is provided on the bottom surface in the processing container 340. The wafer W is placed on the upper surface of the wafer holder 341 so that the surface to be processed faces upward. In the wafer holding part 341, elevating pins 342 for supporting the wafer W from below and elevating it are provided. The elevating pin 342 can be moved up and down by the elevating drive unit 343. A through hole 344 that penetrates the upper surface in the thickness direction is formed on the upper surface of the wafer holding portion 341, and the elevating pins 342 are inserted through the through holes 344. The wafer holding unit 341 can be moved in the horizontal direction and can be rotated around the vertical by a moving mechanism 345 provided below the wafer holding unit 341.

  As shown in FIG. 25, a rail 350 extending along the Y direction (left and right direction in FIG. 25) is provided on the negative side in the X direction (downward direction in FIG. 25) of the wafer holder 341. For example, the rail 350 is formed from the outside of the wafer holding portion 341 on the Y direction negative direction (left direction in FIG. 25) to the outside on the Y direction positive direction (right direction in FIG. 25). An arm 351 is attached to the rail 350.

  The arm 351 supports a resist solution nozzle 352 that supplies a resist solution onto the wafer W. The resist solution nozzle 352 has, for example, an elongated shape along the X direction that is the same as or longer than the diameter dimension of the wafer W. For example, an ink jet type nozzle is used as the resist solution nozzle 352, and a plurality of supply ports (not shown) formed in a line along the longitudinal direction are formed below the resist solution nozzle 352. The resist solution nozzle 352 can strictly control the resist solution supply timing, the resist solution supply amount, and the like.

  The arm 351 is movable on the rail 350 by the nozzle driving unit 353. As a result, the resist solution nozzle 352 can move from the standby unit 354 installed on the outer side of the wafer holding unit 341 on the positive side in the Y direction to above the wafer W on the wafer holding unit 341, and further the surface of the wafer W The top can be moved in the radial direction of the wafer W. The arm 351 can be moved up and down by a nozzle driving unit 353, and the height of the resist solution nozzle 352 can be adjusted.

A template holding unit 360 that holds the template T as shown in FIG. 24 is provided on the ceiling surface in the processing container 340 and above the wafer holding unit 341. That is, the wafer holding unit 341 and the template holding unit 360 are arranged so that the wafer W placed on the wafer holding unit 341 and the template T held on the template holding unit 360 face each other. Furthermore, the template holding portion 360 has a chuck 361 for holding adsorb outer peripheral portion of the rear surface T ₂ of the template T. The chuck 361 is movable in the vertical direction and rotatable about the vertical by a moving mechanism 362 provided above the chuck 361. As a result, the template T can rotate up and down in a predetermined direction with respect to the wafer W on the wafer holder 341.

  The template holding unit 360 includes a light source 363 provided above the template T held by the chuck 361. The light source 363 emits light such as visible light, near ultraviolet light, and ultraviolet light, and the light from the light source 363 passes through the template T and is irradiated downward.

  The imprint system 300 according to the present embodiment is configured as described above. Next, an imprint process performed in the imprint system 300 will be described. FIG. 26 shows the main processing flow of this imprint processing, and FIG. 27 shows the state of the template T and the wafer W in each step of this imprint processing.

First, the template T is transported from the template carry-in / out station 2 to the processing station 3 by the template carrier 12 (step B1 in FIG. 26). In the processing station 3, the cleaning of the surface _{T 1} of the template T (step B2 in FIG. 26), the application of the release agent S to the pattern regions _{D 1} (step B3 in FIG. 26), drying of the release agent S (FIG. 26 step B4), the application of the alcohol L in the release agent S on the pattern area _{D 1} (step B5 in FIG. 26), drying and removal of the alcohol L (step B6 in FIG. 26), releasing on the pattern regions _{D 1} agent coating of the rinsing liquid N to S (step B7 in Fig. 26), drying and removal of the rinsing liquid N (step B8 in FIG. 26) are sequentially performed, the release agent S GaNaru on the pattern area D ₁ of the template T Be filmed. In addition, since these processes B2-B8 are the same as the processes A2-A8 in the said embodiment, detailed description is abbreviate | omitted.

The template T on which the release agent S is formed is transported to the transition unit 334. Subsequently, the template T is transported to the reversing unit 332 by the template transport body 331 of the interface station 312 and the front and back surfaces of the template T are reversed. That is, the rear surface T ₂ of the template T is directed upwards. Thereafter, the template T is transported to the imprint unit 310 by the template transport body 331 and is sucked and held by the chuck 361 of the template holding unit 360.

In this way, a predetermined process is performed on the template T in the processing station 3, and the template T is being transferred to the imprint unit 310. At the wafer carry-in / out station 311, the wafer cassette C _W on the cassette mounting table 320 is used by the wafer transfer body 322. The wafer W is taken out from the wafer and transferred to the alignment unit 323. Then, the alignment unit 323 adjusts the orientation of the wafer W based on the position of the notch portion of the wafer W. Thereafter, the wafer W is transferred to the imprint unit 310 by the wafer transfer body 322 (step B9 in FIG. 26). In the wafer carry-in / out station 311, the wafers _W in the wafer cassette _CW are accommodated so that the surface to be processed faces upward. In this state, the wafers W are carried to the imprint unit 310.

  The wafer W carried into the imprint unit 310 is transferred to the lift pins 342 and is placed and held on the wafer holding unit 341. Subsequently, after aligning the wafer W held by the wafer holding unit 341 by moving it to a predetermined position in the horizontal direction, the resist solution nozzle 352 is moved in the radial direction of the wafer W, as shown in FIG. As shown, a resist solution is applied onto the wafer W to form a resist film R as a coating film (step B10 in FIG. 26). At this time, the control unit 200 controls the supply timing and supply amount of the resist solution supplied from the resist solution nozzle 352. That is, in the resist pattern formed on the wafer W, the amount of the resist solution applied to the portion corresponding to the convex portion (the portion corresponding to the concave portion in the transfer pattern C of the template T) is large, and the portion corresponding to the concave portion ( The resist solution is applied so that the amount of the resist solution applied to a portion corresponding to the convex portion in the transfer pattern C is small. Thus, the resist solution is applied on the wafer W in accordance with the aperture ratio of the transfer pattern C.

When the resist film R is formed on the wafer W, the wafer W held by the wafer holder 341 is moved to a predetermined position in the horizontal direction for alignment, and the template T held by the template holder 360 is used. Is rotated in a predetermined direction. Then, the template T is lowered to the wafer W side as shown by the arrow in FIG. Template T is lowered to a predetermined position, the surface T ₁ of the template T is pressed against the resist film R on the wafer W. The predetermined position is set based on the height of the resist pattern formed on the wafer W. Subsequently, light is emitted from the light source 363. The light from the light source 363 passes through the template T and is irradiated onto the resist film R on the wafer W as shown in FIG. 27B, whereby the resist film R is photopolymerized. In this way, the transfer pattern C of the template T is transferred to the resist film R on the wafer W to form the resist pattern P (step B11 in FIG. 26).

Thereafter, as shown in FIG. 27C, the template T is raised, and a resist pattern P is formed on the wafer W. At this time, since the surface T ₁ of the template T release agent S is coated, never resist on the wafer W adheres to the surface T ₁ of the template T. Thereafter, the wafer W is transferred to the wafer carrier 322 by the lift pins 342, transferred from the imprint unit 310 to the wafer carry-in / out station 311 and returned to the wafer cassette _CW (step B12 in FIG. 26). Note that a thin resist residual film L may remain in the recesses of the resist pattern P formed on the wafer W. For example, as shown in FIG. The film L may be removed.

The above steps B9 to B12 (portions surrounded by dotted lines in FIG. 26) are repeatedly performed to form resist patterns P on the plurality of wafers W using one template T, respectively. During this period, it repeats the step B1~B8 described above, forming the release agent S on the surface T ₁ of the plurality of templates T. The template T on which the release agent S is formed is stored in the buffer cassette 333 of the interface station 312.

  Then, when Steps B9 to B12 are performed on the predetermined number of wafers W, the used template T is unloaded from the imprint unit 310 by the wafer transfer body 331 and transferred to the reversing unit 332 (Step of FIG. 26). B13). Subsequently, the template T in the buffer cassette 333 is transported to the imprint unit 310 by the wafer transport body 331. Thus, the template T in the imprint unit 310 is exchanged. Note that the timing for exchanging the template T is set in consideration of deterioration of the template T and the like. The template T is also replaced when a different pattern P is formed on the wafer W. For example, the template T may be exchanged every time the template T is used once. Further, for example, the template T may be exchanged for each wafer W, or the template T may be exchanged for each lot, for example.

The used template T conveyed to the reversing unit 332 has its front and back surfaces reversed. Thereafter, the wafer transfer body 331, the transport unit 20, by the wafer transfer body 12, the template T is returned to the template cassette _{C T.} Thus, in the imprint system 300, the predetermined resist pattern P is continuously formed on the plurality of wafers W while the template T is continuously replaced.

  Since the imprint system 300 of the above embodiment includes the template processing apparatus 1, the template T is deposited on the imprint unit 310 while the release agent S is formed on the template T in the imprint system 300. Can be supplied continuously. Accordingly, for example, even when the resist pattern P is formed on the plurality of wafers W before the template T deteriorates, the template T in the imprint unit 310 can be exchanged continuously and efficiently. Therefore, the predetermined resist pattern P can be continuously formed on the plurality of wafers W. This also enables mass production of semiconductor devices.

  The preferred embodiments of the present invention have been described above with reference to the accompanying drawings, but the present invention is not limited to such examples. It is obvious for those skilled in the art that various modifications or modifications can be conceived within the scope of the idea described in the claims, and these naturally belong to the technical scope of the present invention. It is understood. The present invention is not limited to this example and can take various forms. The present invention can also be applied to a case where the substrate is another substrate such as an FPD (flat panel display) other than a wafer or a mask reticle for a photomask.

DESCRIPTION OF SYMBOLS 1 Template processing apparatus 30-33 Application | coating unit 40-43 Cleaning unit 110 Processing liquid application | coating jig | tool 111 Application | coating surface 114 Contact surface 115 Processing space 117 O-ring 120 Processing liquid supply part 121 1st supply port 122 1st supply path 123 Second supply path 140 Exhaust port 142 Vacuum pump 150 Air nozzle 200 Control unit 220 Second supply port 230 Heater 240 Ultrasonic vibrator 241 Ultrasonic oscillator C Transfer pattern D ₁ pattern area D ₂ outer area L Alcohol M Cleaning liquid N Rinse solution S Mold release agent T Template T ₁ surface T ₂ back surface

Claims (21)

A template processing method for applying a processing liquid on a pattern area where a predetermined pattern is formed on the surface of a template, and processing the pattern area,
An application surface of a treatment liquid application jig for applying the treatment liquid onto the pattern area covers at least the pattern area, and the distance between the application surface and the pattern area is a capillary phenomenon of the treatment liquid. An arrangement step of arranging the treatment liquid application jig so as to face the template so as to be a generated distance;
Thereafter, a supply step of supplying the treatment liquid between the application surface and the pattern region;
And a diffusion step of diffusing the supplied processing solution only on the pattern region by capillary action. The template processing method according to claim 1, wherein the supplying step and the diffusing step are performed on a plurality of types of processing liquids. 3. The supply step according to claim 1, wherein the supply step is performed from at least a first supply port formed on the application surface or a second supply port provided outside the application surface. Template processing method. The template processing method according to claim 3, wherein a plurality of at least the first supply port or the second supply port are provided. The template processing method according to claim 1, wherein ultrasonic vibration is applied to the processing liquid in the diffusion step. The template processing method according to claim 1, further comprising a drying step of drying the processing liquid on the pattern region after the diffusion step. The template processing method according to claim 6, wherein in the drying step, air is blown onto the processing liquid on the pattern region. The template processing method according to claim 6, wherein in the drying step, the processing liquid on the pattern region is heated. The template processing method according to claim 6, wherein in the drying step, an atmosphere around the processing liquid on the pattern region is reduced. A program that operates on a computer of a control unit that controls the template processing apparatus in order to cause the template processing apparatus to execute the template processing method according to claim 1. A readable computer storage medium storing the program according to claim 10. A template processing apparatus that applies a processing liquid onto a pattern area where a predetermined pattern is formed on the surface of a template, and processes the pattern area,
A treatment liquid coating jig having a coating surface larger than the pattern region;
A treatment liquid supply unit for supplying the treatment liquid between the application surface and the pattern region;
The treatment liquid application jig is used as the template so that the application surface covers at least the pattern region, and the distance between the application surface and the pattern region is a distance that causes capillary action of the treatment liquid. Arranged so as to face each other, and then supplying the processing liquid between the application surface and the pattern area, and then diffusing the supplied processing liquid only on the pattern area by capillary action, A template processing apparatus comprising: a processing liquid application jig; and a control unit that controls the processing liquid supply unit. The template processing apparatus according to claim 12, wherein the processing liquid supply unit supplies a plurality of types of processing liquid. The treatment liquid supply unit has at least a first supply port of the treatment liquid formed on the application surface or a second supply port of the treatment liquid provided outside the application surface. The template processing apparatus according to claim 12 or 13. 15. The template processing apparatus according to claim 14, wherein a plurality of at least the first supply port or the second supply port are provided. In the case where the processing liquid supply unit has the first supply port,
The treatment liquid supply unit has the same diameter as the first supply port and a first supply path connected to the first supply port, and a larger diameter than the first supply port. The template processing apparatus according to claim 14, further comprising: a second supply path connected to the first supply path. The template processing apparatus according to claim 12, further comprising a vibration mechanism that applies ultrasonic vibration to the processing liquid that diffuses between the coating surface and the pattern region. The treatment liquid application jig is
A contact surface that is annularly formed around the coating surface and that contacts the surface of the template on which the pattern region is not formed, and forms a processing space between the processing liquid coating jig and the template;
A seal material provided annularly on the contact surface, for maintaining airtightness in the processing space;
The template processing apparatus according to claim 12, further comprising an exhaust port for exhausting an atmosphere in the processing space. The template processing apparatus according to claim 12, further comprising an air supply unit that blows air to the processing liquid applied on the pattern region. The template processing apparatus according to claim 12, further comprising a heat processing unit that heats the processing liquid applied onto the pattern region. The template processing apparatus according to claim 12, wherein a mesh plate is provided on the application surface.

Images