JP2012094756A - Wiring board with female connector and electronic device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a wiring board with a female connector capable of reducing the size of the wiring board.SOLUTION: An electronic device 1 includes: a substrate 2 including a first through hole 2a; an electrode 3 provided to at least one of the opening circumference of the first through hole 2a of the substrate 2 and the inner wall of the first through hole 2a; a resin molding 4 including a second through hole 4a and provided to the substrate 2 so that the second through hole 4a communicates with the first through hole 2a. For example, need to provide a bracket for fixing a metal pin in the female connector 9 is eliminated, thereby providing a wiring board 9 with a female connector capable of reducing the size of the wiring board.

Description

  The present invention relates to a wiring board with a female connector and an electronic device.

  In general, male connector terminals such as metal pins are electrically connected by being inserted into pin holes of a wiring board with a female connector. In addition, the conventional female connector is provided with a metal fitting having a spring property for fixing and electrically connecting a metal pin in a hole of a resin molded body.

JP 11-260457 A

  However, in the conventional female connector, the metal fitting must firmly fix the metal pin, so there is a limit to downsizing. Therefore, since the interval between the metal pins cannot be narrowed, there is a problem that the whole female connector is further increased in size when connecting a plurality of male connector terminals.

  The present invention has been made in view of the above-described problems, and an object thereof is to provide a wiring board with a female connector and an electronic device that can be miniaturized.

  A wiring board with a female connector of the present invention is provided on at least one of a board having a first through hole, a periphery of the opening of the first through hole, and an inner wall of the first through hole. And a resin molded body provided on the substrate so that the second through hole communicates with the first through hole. Is.

  According to the wiring board with a female connector of the present invention, the wiring board is provided on at least one of the board having the first through hole, the periphery of the opening of the first through hole of the board, and the inner wall of the first through hole. Since it has an electrode and a resin molded body provided on the substrate so as to communicate with the first through hole, the second through hole is provided as a male connector terminal. When the metal pin is inserted into the first and second through holes and the end thereof is connected to the electrode, if there is a gap between the tip of the metal pin and the electrode so that the conductive adhesive can enter, the metal pin Can be electrically connected to the substrate side. Therefore, for example, it is not necessary to provide a metal fitting for fixing the metal pin in the female connector. Therefore, it is possible to provide a wiring board with a female connector that can be reduced in size.

It is a longitudinal cross-sectional view which shows an example of embodiment of the wiring board with a female connector of this invention. It is a longitudinal cross-sectional view of the electronic device which has a wiring board with a female connector shown in FIG. (A), (b) is a longitudinal cross-sectional view which shows the other example of embodiment of the electronic device shown in FIG. 2, respectively. It is a front view which shows the metal pin of the electronic device shown in FIG. It is a longitudinal cross-sectional view which shows the other example of embodiment of the electronic device shown in FIG. It is a longitudinal cross-sectional view which shows the other example of embodiment of the electronic device shown in FIG. (A) is a perspective view which shows the other example of embodiment of the electronic device of this invention, (b) is a front view of (a), (c) is a side view of (a). It is. (A) is a perspective view which shows the other example of embodiment of the electronic device of this invention, (b) is a front view of (a). It is a longitudinal cross-sectional view which shows the other example of embodiment of the electronic device of this invention. It is a longitudinal cross-sectional view which shows the other example of embodiment of the electronic device of this invention. It is a longitudinal cross-sectional view which shows the other example of embodiment of the electronic device of this invention. It is a longitudinal cross-sectional view which shows an example of embodiment of the conventional electronic device.

  Hereinafter, an exemplary embodiment of an electronic device according to the present invention will be described in detail with reference to the drawings.

  The electronic device 1 shown in FIGS. 1 and 2 includes a wiring board 9 with a female connector and metal pins 53. The wiring board 9 with a female connector includes a board 2, an electrode 3, and a resin molded body 4. The substrate 2 has a first through hole 2a. The electrode 3 is provided in the periphery of the opening of the first through hole 2a of the substrate 2 and at least one of the inner wall of the first through hole 2a. The resin molded body 4 has a second through hole 4a, and is provided in the substrate 2 so that the second through hole 4a communicates with the first through hole 2a. The metal pin 53 passes through the first through hole 2 a and the second through hole 4 a, and the end 5 a is attached to the electrode via the conductive adhesive 6.

  According to such a configuration, when the metal pin 53 as the male connector terminal is inserted into the first and second through holes 2a, 4a and the end thereof is connected to the electrode 3, the tip of the metal pin 53 and the electrode 3, the metal pin 53 can be electrically connected to the substrate 2 side if there is a gap enough to allow the conductive adhesive 6 to enter. Therefore, it is not necessary to provide, for example, a metal fitting for fixing the metal pin in the female connector 9. Therefore, it is possible to provide the wiring board 9 with the female connector that can be miniaturized. Further, if the metal pin 53 is inserted and connected to the wiring board 9 with the female connector, the electronic device 1 that can be miniaturized can be provided.

As the material of the substrate 2, for example, a resin material such as a phenol resin, a polyimide resin, or an epoxy resin is used. Further, for example, a ceramic material such as alumina, aluminum nitride, or silicon nitride can be used. Use of these ceramic materials is preferable from the viewpoint of excellent rigidity. The diameter of the first through hole 2a of the substrate 2 is, for example, 0.5 to
3 mm.

  The material of the electrode 3 is a metal material such as iron, silver, copper, gold, or an alloy containing at least two of these. Further, as in the example shown in FIG. 2, the electrode 3 extends from the periphery of the first through hole 2 a on the first main surface 2 b of the substrate 2 through the inner wall of the first through hole 2 a to the second main surface of the substrate 2. It is preferable to be provided over the periphery of the opening of the first through hole 2a on the surface 2c. In the case of this configuration, it is possible to ensure a wide bonding area between the electrode 3 and the tip of the metal pin 53 via the conductive adhesive 6. Therefore, the electrode 3 and the metal pin 53 can be firmly joined.

  As in the example illustrated in FIG. 3A, the electrode 3 may be provided around the opening of the first through hole 2 a of the substrate 2. Moreover, the electrode 3 may be provided in the inner wall of the 1st through-hole 2a like the example shown in FIG.3 (b).

As the material of the resin molded body 4, for example, a resin material such as a phenol resin, a polyimide resin, or an epoxy resin is used. The diameter of the 2nd through-hole 4a of the resin molding 4 is 0.5-3 mm, for example.

  As the material of the metal pin 53, iron, silver, copper or the like is used. The diameter of the metal pin 5 is 0.1 to 2.5 mm. In the example shown in FIG. 4, the metal pin 53 is a part of the terminal 5, and the terminal 5 is formed by bending a single metal plate punched into a predetermined shape. The terminal 5 includes a cable crimp portion 51 that is crimped to the outer periphery 82 of the core wire 81 of the cable 8, a core wire crimp portion 52 that is directly crimped to the core wire, and a metal pin that is inserted into the first and second through holes 2a and 2b. 53. In addition, in order to improve the corrosion resistance and to improve the wettability with the solder or the like that is the conductive adhesive 6, the metal pin 53 is plated with Au, Ni or the like at the tip. Is preferred.

  The conductive adhesive 6 is, for example, solder. Moreover, the resin adhesive containing metal microparticles, such as iron, silver, copper, may be sufficient.

  Note that, as in the example shown in FIG. 2, the metal pin 53 and the inner wall of the second through hole 4 a are preferably bonded by the adhesive 7. For the adhesive 7, for example, a resin material such as a phenol resin, a polyimide resin, or an epoxy resin is used. With such a configuration, the metal pin 53 is fixed not only by the portion facing the inner wall of the first through hole 2a but also by the adhesive 7 at the portion facing the inner wall of the second through hole 4a. . Therefore, the metal pin 53 is preferable because it is firmly fixed to the substrate 2 side. In particular, the adhesive 7 is preferably formed of a resin material having a relatively low elasticity, such as a silicone resin. With such a configuration, even if a slight force is applied to the metal pin 53 fixed to the inner walls of the through holes 2a and 4a, the force can be absorbed by the elastic deformation of the adhesive material 7. Therefore, it is possible to further strengthen the bonding between the metal pin 53 and the inner walls of the through holes 2a and 4a.

  Note that, as in the example shown in FIG. 5, the second through hole 4 a is a first space 41 and a second space 42 that is closer to the substrate 2 than the first space 41 and wider than the first space 41. And a step 43 provided between the first space 41 and the second space 42, and the metal pin 53 has a catch portion 5 a for catching the step 43 in the middle. Is preferred. In the case of such a configuration, even if a slight force is applied to the metal pin 53, the catching portion 5a of the metal pin 53 is caught by the step 43, so that the metal pin 53 is difficult to be removed from the through holes 2a, 4a. preferable.

  Further, as in the example shown in FIG. 6, the metal pin 53 preferably has a catch portion 5 a for catching on the second main surface 2 c of the substrate 2 at the tip portion. In such a case, it is possible to obtain a strong bonding force due to the hook portion 5a being hooked on the substrate 2 without increasing the inner diameters of the resin molded body 4 and the through hole 2a of the substrate 2.

Next, the dimensions of the electronic device 1 shown in FIG. 2 and the conventional electronic device 100 shown in FIG. 12 are compared.

First, in the electronic device 1 of the example shown in FIG. 2, the diameter of the metal pin 53 is 0.6 mm,
There is a gap of 0.05 mm between the outer periphery of the metal pin 53 and the inner periphery of the first and second through holes 2a, 4a. That is, the inner diameters of the first and second through holes 2a and 4a are 0.7 mm. In addition,
In order for the adhesive 7 described above to enter between the metal pin 53 and the first and second through holes 2a, 4a, a gap of 0.05 mm is sufficient.

Next, the conventional electronic device 100 of the example shown in FIG. 12 includes a metal pin 105 and a female connector 101 having a pin hole 101a into which the metal pin 105 is inserted. This female connector 101 is fixedly provided on the inner wall of the resin molded body 104 and the through hole 102a of the substrate 102. The metal pin 105 is joined to the pin hole 101a by a metal fitting 103. One end of the metal fitting 103 is attached to one of the inner walls of the pin hole 101a, and the other end is configured to press the metal pin 105 against the other of the inner wall of the pin hole 101a. Here, the diameter of the metal pin 105 is 0.6 mm. The female connector 101 has a thickness of 0.3 mm, and the pin hole 101a has a diameter of 1.2 mm.

  From the above, in the electronic device 1 of the example shown in FIG. 2, the inner diameters of the resin molded body 4 and the through hole 2a of the substrate 2 are 0.7 mm, whereas the conventional example of the electronic device shown in FIG. In the apparatus 100, the inner diameter of the resin molded body 104 and the through hole 102a of the substrate 102 was 1.8 mm. Therefore, the electronic device 1 of the example shown in FIG. 2 can be reduced by 1.1 mm compared to the electronic device 100 of the conventional example.

  From this result, it can be seen that the metal fitting 103 that functions to fix the metal pin 105 is no longer necessary in the electronic device 1 of the example shown in FIG. That is, it is apparent that the electronic device 1 and the wiring board 9 with the female connector of the example shown in FIG. 2 can be reduced in size by simplifying the structure.

  Next, the electronic device 1 having a plurality of metal pins 53 will be described with reference to FIG. In the example shown in FIG. 7, the resin molded body 4 includes a plurality of second through holes 4 a for inserting a plurality of metal pins 53, a storage portion 4 b for storing a plurality of cables, and various electronic components. And a recess 4c for storage. In FIG. 7, the substrate 2 is not shown, but the actual substrate 2 has a plurality of first through holes 2a that communicate with the second through holes 4a. The substrate 2 is placed on the resin molded body 4 so that the plurality of metal pins 53 are passed through the plurality of first through holes 2a. Even if the electronic component mounted on the concave portion 4c side of the substrate 2 is large, it is housed in the concave portion 4c. Therefore, even an electronic component having a large size can be covered with the resin molded body 4, which is preferable because impact resistance can be improved.

  In the example shown in FIG. 7, the metal pin 53 having a large diameter and the metal pin 53 having a small diameter are inserted into the resin molded body 4 separately in rows, but as shown in FIG. The metal pins 53 may be inserted into the resin molded body 4 in a line without dividing the rows according to the size of the diameter. In the example shown in FIG. 8, the substrate 2 having a plurality of first through holes 2 a is placed on the resin molded body 4.

  Note that the electronic device 1 of the present invention is generally used as having a plurality of metal pins 53 as in the examples shown in FIGS. 7 and 8. FIG. 2 is an enlarged view of the embodiment of FIGS.

  The present invention is not limited to the embodiments described above, and various changes and improvements can be made without departing from the scope of the present invention.

  In the example shown in FIG. 9, the metal pin 53 has a first inclined portion whose diameter decreases toward the tip, and the inner diameter of the second through hole 4 a of the resin molded body 4 is the metal pin 53. And the metal pin 53 has the first and second through-holes 2a, so that the first inclined portion is aligned with the second inclined portion. 4a is inserted. With such a configuration, a strong frictional force is generated between the outer periphery of the metal pin 53 and the inner periphery of the second through-hole 4a of the resin molded body 4, so that the metal pin 53 extends from the second through-hole 4a. This is preferable because it is difficult to come off.

In the example shown in FIG. 10, a cut is provided on the outer periphery of the metal pin 53 so as to open on the side opposite to the tip, and the adhesive 7 enters the cut opening. With such a configuration, when the metal pin 53 is to be removed from the second through hole 4a, the metal pin 53 is pulled out of the second through hole 4a by the cutting of the outer periphery of the metal pin 53 being caught by the adhesive material 7. Since it becomes difficult, it is preferable.

  In the example shown in FIG. 11, the hook portion 5 a is provided on the outer periphery of the metal pin 53, and the adhesive 7 is filled in the second through hole 4 a. With such a configuration, when the metal pin 53 is pulled out of the second through hole 4a, the hook portion 5a on the outer periphery of the metal pin 53 is hooked on the adhesive material 7, so that the metal pin 53 is pulled into the second through hole 4a. It is preferable because it is difficult to come off.

1: Electronic device 2: Substrate 2a: First through hole 2b: First main surface 2c: Second main surface 3: Electrode 4: Resin molded body
4a: second through-hole 41: first space 42: second space 43: step 53: metal pin 5a: hook 6: conductive adhesive 7: adhesive 9: wiring board with female connector

Claims (7)

A substrate having a first through hole;
An electrode provided on the periphery of the opening of the first through hole of the substrate and on at least one of the inner wall of the first through hole;
With a female connector having a second through hole, and a resin molded body provided on the substrate so that the second through hole communicates with the first through hole Wiring board. A wiring board with a female connector according to claim 1;
A metal pin penetrating the first through hole and the second through hole and having an end portion attached to the electrode via a conductive adhesive;
An electronic device comprising the electronic device.   The electrode is provided from the periphery of the opening of the through hole on the first main surface of the substrate through the inner wall of the through hole to the periphery of the opening of the through hole of the second main surface of the substrate. The electronic device according to claim 2. The second through hole is
A first space;
A second space that is closer to the substrate than the first space and wider than the first space;
While having a step provided between the first space and the second space,
4. The electronic device according to claim 2, wherein the metal pin has a catching portion for catching on the step.   4. The electronic device according to claim 2, wherein the metal pin has a catch portion for catching on the second main surface of the substrate at the tip portion. 5.   The electronic device according to claim 2, wherein the metal pin and the inner wall of the second through hole are bonded by an adhesive.   The electronic device according to claim 2, wherein the adhesive is made of an elastic resin.

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