JP5641815B2 - Connection structure between flexible wiring board and electronic components with lead terminals - Google Patents

Connection structure between flexible wiring board and electronic components with lead terminals Download PDF

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JP5641815B2
JP5641815B2 JP2010183183A JP2010183183A JP5641815B2 JP 5641815 B2 JP5641815 B2 JP 5641815B2 JP 2010183183 A JP2010183183 A JP 2010183183A JP 2010183183 A JP2010183183 A JP 2010183183A JP 5641815 B2 JP5641815 B2 JP 5641815B2
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lead terminal
hole
wiring board
flexible wiring
electronic component
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成敏 小川
成敏 小川
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Kyocera Corp
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Description

本発明は、光通信などに使用される半導体装置等の電子部品のリード端子とフレキシブル配線基板との接続構造に関する。   The present invention relates to a connection structure between a lead terminal of an electronic component such as a semiconductor device used for optical communication and a flexible wiring board.

従来から、光通信の分野等で使用される半導体レーザダイオード、フォトダイオード等の光半導体素子が搭載された光半導体装置等の電子部品を外部回路基板に電気的に接続する方法として、電子部品のリード端子をフレキシブル配線基板に形成された貫通孔に挿入してはんだによって固定することが行なわれていた（例えば、特許文献１を参照。）。このようにすると、外部からの応力、振動などの影響がフレキシブル配線基板の可撓性によって緩和され、電子部品のリード端子と外部回路基板との接続を強固に保持することができる。   Conventionally, as a method of electrically connecting an electronic component such as an optical semiconductor device mounted with an optical semiconductor element such as a semiconductor laser diode or a photodiode used in the field of optical communication to an external circuit board, A lead terminal has been inserted into a through-hole formed in a flexible wiring board and fixed with solder (for example, see Patent Document 1). In this way, the influence of external stress, vibration, etc. is alleviated by the flexibility of the flexible wiring board, and the connection between the lead terminal of the electronic component and the external circuit board can be firmly held.

しかしながら、はんだ付けによって固定されるこのような接続方法においては、はんだ付けの際の加熱によって、フレキシブル配線基板の変形やリード端子に接続された半導体素子の破損の可能性があった。また、近年は伝送信号の高速化に対応するためにリード数が増加しており、さらに電子部品の小型化によってリード端子間の距離が小さくなっていることから、はんだによるリード端子間のショートが発生することも懸念されていた。   However, in such a connection method that is fixed by soldering, there is a possibility that the flexible wiring board is deformed or a semiconductor element connected to the lead terminal is damaged by heating during soldering. Also, in recent years, the number of leads has increased in order to cope with higher transmission signal speeds, and the distance between lead terminals has become smaller due to the miniaturization of electronic components. There was also concern about the occurrence.

このような問題に対して、フレキシブル配線基板の貫通孔の内面から貫通孔の周囲のフレキシブル配線基板の主面にかけて、主面の配線層に接続された導体端子を形成して、この貫通孔に端子を嵌合させる方法が提案されている（例えば特許文献２を参照。）。   For such a problem, a conductor terminal connected to the wiring layer of the main surface is formed from the inner surface of the through hole of the flexible wiring substrate to the main surface of the flexible wiring substrate around the through hole, and the through hole is formed in the through hole. A method for fitting the terminals has been proposed (see, for example, Patent Document 2).

特開2006−80418号公報JP 2006-80418 A 特開2004−289016号公報JP 2004-289016 A

しかしながら、貫通孔に端子を嵌合させる方法では、フレキシブル配線基板の弾性によって端子と貫通孔の内壁面の端子導体とを密着させることで接続するものであることから、高い接続強度を実現するには、貫通孔の内径より端子の径あるいは幅を大きくする必要があった。そのため、貫通孔に端子を挿入すると、端子によって貫通孔が押し広げられ、貫通孔の内面から主面にかけて形成された導体端子に亀裂が生じ、破損に至る場合があり、この亀裂が配線と導体部材との接続部付近に発生して端子と配線との導通が損なわれる場合があるという問題点があった。   However, in the method of fitting the terminal into the through hole, since the terminal is connected to the terminal conductor on the inner wall surface of the through hole by the elasticity of the flexible wiring board, high connection strength is realized. However, it is necessary to make the diameter or width of the terminal larger than the inner diameter of the through hole. Therefore, when a terminal is inserted into the through hole, the through hole is pushed out by the terminal, and a crack may occur in the conductor terminal formed from the inner surface to the main surface of the through hole, leading to breakage. There is a problem in that the electrical connection between the terminal and the wiring may be impaired in the vicinity of the connecting portion with the member.

本発明は上記の問題点に鑑みてなされたものであり、その目的は、高い接続強度と導通信頼性とを有するフレキシブル配線基板とリード端子付き電子部品との接続構造を提供することにある。   The present invention has been made in view of the above problems, and an object thereof is to provide a connection structure between a flexible wiring board having high connection strength and conduction reliability and an electronic component with lead terminals.

本発明のフレキシブル配線基板とリード端子付き電子部品との接続構造は、貫通孔を有
するフレキシブル基板と、前記貫通孔の内面から前記貫通孔の周囲の前記フレキシブル基板の主面にかけて形成された接続導体と、前記フレキシブル基板の前記主面に形成されて前記接続導体に接続された配線とを有するフレキシブル配線基板に対して、リード端子付き電子部品のリード端子が前記貫通孔に挿入されることで前記リード端子と前記接続導体とが電気的に接続される、フレキシブル配線基板とリード端子付き電子部品との接続構造であって、前記接続導体は、前記貫通孔の内面および前記貫通孔の周囲の前記フレキシブル基板の主面において、一部に切欠きを有していて前記貫通孔の全周にわたって形成されておらず、前記電子部品は複数の前記リード端子を有し、前記フレキシブル配線基板は前記リード端子の配列に対応する複数の前記貫通孔を有しており、前記接続導体は隣接する２つの前記貫通孔間において前記切欠きと前記切欠き以外の部分とが対向しないように形成されていることを特徴とするものである。
The connection structure between the flexible wiring board of the present invention and the electronic component with lead terminals includes a flexible board having a through hole, and a connection conductor formed from the inner surface of the through hole to the main surface of the flexible board around the through hole. And a flexible wiring board having a wiring formed on the main surface of the flexible board and connected to the connection conductor, the lead terminal of the electronic component with a lead terminal is inserted into the through hole, thereby A connection structure between a flexible wiring board and an electronic component with a lead terminal, in which a lead terminal and the connection conductor are electrically connected, wherein the connection conductor includes the inner surface of the through hole and the periphery of the through hole. in the main surface of the flexible substrate, is formed over the entire periphery of the through hole have a notch in a part Orazu, the electronic component is more The flexible wiring board has a plurality of the through holes corresponding to the arrangement of the lead terminals, and the connection conductor has the notch and the notch between two adjacent through holes. It is characterized in that it is formed so as not to face a portion other than the notch .

また、本発明のフレキシブル配線基板とリード端子付き電子部品との接続構造は、上記構成において、前記リード端子は、先端部側から前記リード端子付き電子部品の本体側に向かって幅が漸次大きくなる突出部を有することを特徴とするものである。   In the connection structure between the flexible wiring board of the present invention and the electronic component with lead terminal, the width of the lead terminal gradually increases from the tip end side toward the main body side of the electronic component with lead terminal in the above configuration. It has a protrusion part, It is characterized by the above-mentioned.

また、本発明のフレキシブル配線基板とリード端子付き電子部品との接続構造は、上記構成において、前記リード端子の前記突出部と前記リード端子付き電子部品の本体の外面との間の距離は、前記フレキシブル配線基板の厚み以下であることを特徴とするものである。   Further, in the connection structure between the flexible wiring board of the present invention and the electronic component with lead terminal, in the above configuration, the distance between the protruding portion of the lead terminal and the outer surface of the main body of the electronic component with lead terminal is The thickness is equal to or less than the thickness of the flexible wiring board.

また、本発明のフレキシブル配線基板とリード端子付き電子部品との接続構造は、上記各構成において、前記電子部品は複数の前記リード端子を有し、前記フレキシブル配線基板は前記リード端子の配列に対応する複数の前記貫通孔を有しており、前記リード端子の前記突出部は隣接する２つの前記リード端子間において対向しないことを特徴とするものである。   In the connection structure between the flexible wiring board and the electronic component with lead terminals according to the present invention, the electronic component has a plurality of the lead terminals in each of the above configurations, and the flexible wiring board corresponds to the arrangement of the lead terminals. The projecting portion of the lead terminal does not oppose between two adjacent lead terminals.

本発明のフレキシブル配線基板とリード端子付き電子部品との接続構造によれば、接続導体は、貫通孔の内面および貫通孔の周囲のフレキシブル基板の主面において、一部に切欠きを有していて貫通孔の全周にわたって形成されていないことから、貫通孔の周囲において、フレキシブル基板の接続導体が形成されていない部分は接続導体が形成されている部分より変形しやすい構造となっている。そのため、リード端子を貫通孔に挿入した際に、接続導体が形成されていない部分が変形して貫通孔が広がり、貫通孔の内面から貫通孔の周囲にかけて形成された接続導体が変形することが抑えられるので、接続導体が破損することなくリード端子と接続導体とを密着させることが可能となり、高い接続強度および導通信頼性を実現することができる。   According to the connection structure between the flexible wiring board of the present invention and the electronic component with lead terminals, the connection conductor has a notch in part on the inner surface of the through hole and the main surface of the flexible substrate around the through hole. Therefore, the portion of the flexible substrate where the connection conductor is not formed is more easily deformed than the portion where the connection conductor is formed around the through hole. For this reason, when the lead terminal is inserted into the through hole, the portion where the connection conductor is not formed is deformed to expand the through hole, and the connection conductor formed from the inner surface of the through hole to the periphery of the through hole may be deformed. Therefore, the lead terminal and the connection conductor can be brought into close contact with each other without damaging the connection conductor, and high connection strength and conduction reliability can be realized.

また、本発明のフレキシブル配線基板とリード端子付き電子部品との接続構造によれば、上記構成において、リード端子が、先端部側からリード端子付き電子部品の本体側に向かって幅が漸次大きくなる突出部を有するときには、突起部がストッパーとなり、リード端子がフレキシブル配線基板の貫通孔から抜けない構造となる。   Further, according to the connection structure between the flexible wiring board of the present invention and the electronic component with lead terminal, in the above configuration, the lead terminal gradually increases in width from the tip end side toward the main body side of the electronic component with lead terminal. When the protrusion is provided, the protrusion serves as a stopper, and the lead terminal does not come out of the through hole of the flexible wiring board.

また、本発明のフレキシブル配線基板とリード端子付き電子部品との接続構造によれば、上記各構成において、リード端子の突出部とリード端子付き電子部品の距離がフレキシブル配線基板の厚み以下であるときには、突出部と電子部品の外面とでフレキシブル配線基板を強固に挟み込んで固定することができるので、外部からの力によってフレキシブル配線基板が動くことがなく、より高い接続強度および導通信頼性を得ることができる。   Further, according to the connection structure between the flexible wiring board of the present invention and the electronic component with the lead terminal, in each of the above configurations, when the distance between the protruding portion of the lead terminal and the electronic component with the lead terminal is equal to or less than the thickness of the flexible wiring board. Since the flexible wiring board can be firmly sandwiched and fixed between the protrusion and the outer surface of the electronic component, the flexible wiring board does not move due to external force, and higher connection strength and conduction reliability can be obtained. Can do.

また、本発明のフレキシブル配線基板とリード端子付き電子部品との接続構造によれば
、上記各構成において、電子部品が複数のリード端子を有し、フレキシブル配線基板がリード端子の配列に対応する複数の貫通孔を有しており、接続導体は隣接する２つの貫通孔間において切欠きと切欠き以外の部分とが対向しないように形成されているときには、フレキシブル基板の、リード端子を貫通孔に挿入した際に大きく変形する、接続導体の切欠きに近い部分に、隣接する接続導体および接続導体に接続された配線が形成されないので、フレキシブル基板の変形によって、接続導体および配線がフレキシブル基板から剥がれたり、破損して断線したりする可能性が低減された、より接続信頼性の高いものとなる。 Moreover, according to the connection structure between the flexible wiring board and the electronic component with lead terminals of the present invention, in each of the above configurations, the electronic component has a plurality of lead terminals, and the flexible wiring board corresponds to the arrangement of the lead terminals. When the connection conductor is formed so that the notch and the portion other than the notch do not face each other between two adjacent through holes, the lead terminal of the flexible board is used as the through hole. Since the connection conductor and the wiring connected to the connection conductor are not formed in the portion near the notch of the connection conductor that greatly deforms when inserted, the connection conductor and the wiring are peeled off from the flexible substrate due to deformation of the flexible substrate. Or the possibility of breakage due to breakage is reduced, resulting in higher connection reliability.

また、本発明のフレキシブル配線基板とリード端子付き電子部品との接続構造によれば、上記各構成において、リード端子の突出部が隣接する２つのリード端子間において対向しないときには、フレキシブル配線基板にリード端子を挿入する際、２つのリード端子がそれぞれ挿入される２つの貫通孔間におけるフレキシブル基板の変形は、１つのリード端子だけによるものとなるので、フレキシブル基板の変形を最小限にすることができ、フレキシブル基板上に形成された配線や接続導体の破損が抑制される。   Further, according to the connection structure between the flexible wiring board of the present invention and the electronic component with lead terminals, in each of the above configurations, when the protruding portion of the lead terminal is not opposed between two adjacent lead terminals, the lead is connected to the flexible wiring board. When inserting a terminal, the deformation of the flexible substrate between the two through holes into which the two lead terminals are respectively inserted is due to only one lead terminal, so that the deformation of the flexible substrate can be minimized. In addition, damage to the wiring and connection conductor formed on the flexible substrate is suppressed.

本発明のフレキシブル配線基板とリード端子付き電子部品との接続構造の実施の形態の一例を示す斜視図である。It is a perspective view which shows an example of embodiment of the connection structure of the flexible wiring board and electronic component with a lead terminal of this invention. 図１の要部を拡大して示す斜視図である。It is a perspective view which expands and shows the principal part of FIG. 本発明のフレキシブル配線基板とリード端子付き電子部品との接続構造の実施の形態の他の例の要部を拡大して示す断面図である。It is sectional drawing which expands and shows the principal part of the other example of embodiment of the connection structure of the flexible wiring board of this invention and the electronic component with a lead terminal. （ａ）〜（ｅ）は、それぞれ本発明の実施形態であるフレキシブル配線基板とリード端子付き電子部品との接続構造に用いるリード端子の一例を示す斜視図である。(A)-(e) is a perspective view which shows an example of the lead terminal used for the connection structure of the flexible wiring board which is embodiment of this invention, and the electronic component with a lead terminal, respectively. （ａ）〜（ｄ）は、それぞれ本発明の実施形態であるフレキシブル配線基板とリード端子付き電子部品との接続構造に用いるフレキシブル配線基板の要部の一例を示す平面図である。(A)-(d) is a top view which shows an example of the principal part of the flexible wiring board used for the connection structure of the flexible wiring board which is embodiment of this invention, and an electronic component with a lead terminal, respectively. 本発明のフレキシブル配線基板とリード端子付き電子部品との接続構造の実施の形態の他の例の要部を示す断面図である。It is sectional drawing which shows the principal part of the other example of embodiment of embodiment of the connection structure of the flexible wiring board of this invention and the electronic component with a lead terminal. 本発明のフレキシブル配線基板とリード端子付き電子部品との接続構造における電子部品の要部を示す斜視図である。It is a perspective view which shows the principal part of the electronic component in the connection structure of the flexible wiring board of this invention and the electronic component with a lead terminal. 本発明のフレキシブル配線基板とリード端子付き電子部品との接続構造の実施の形態の他の例の要部を示す断面図である。It is sectional drawing which shows the principal part of the other example of embodiment of embodiment of the connection structure of the flexible wiring board of this invention and the electronic component with a lead terminal. 本発明のフレキシブル配線基板とリード端子付き電子部品との接続構造の実施の形態の他の例を示す斜視図である。It is a perspective view which shows the other example of embodiment of the connection structure of the flexible wiring board of this invention, and the electronic component with a lead terminal. （ａ）および（ｂ）は、図９に示すフレキシブル配線基板の要部の一例を示す平面図である。(A) And (b) is a top view which shows an example of the principal part of the flexible wiring board shown in FIG. 本発明のフレキシブル配線基板とリード端子付き電子部品との接続構造の実施の形態の他の例を示す斜視図である。It is a perspective view which shows the other example of embodiment of the connection structure of the flexible wiring board of this invention, and the electronic component with a lead terminal. 本発明のフレキシブル配線基板とリード端子付き電子部品との接続構造の実施の形態の他の例を示す斜視図である。It is a perspective view which shows the other example of embodiment of the connection structure of the flexible wiring board of this invention, and the electronic component with a lead terminal.

以下に、本発明のフレキシブル配線基板とリード端子付き電子部品との接続構造について添付の図面を参照しつつ詳細に説明する。図１〜図12において、１はフレキシブル配線基板、２はフレキシブル配線基板１の絶縁基体であるフレキシブル基板、２ａはフレキシブル基板２に設けられた貫通孔、２ｂは貫通孔２ａの内面から貫通孔２ａの周囲のフレキシブル基板２の主面にかけて形成された接続導体、３はフレキシブル基板２の主面に形成された配線、５はリード端子付き電子部品、６はリード端子、６ａはリード端子６の突出部、６ｂはリード端子６のネイルヘッド部、７はフレキシブル配線基板１の接地導体である。   Below, the connection structure of the flexible wiring board of this invention and the electronic component with a lead terminal is demonstrated in detail, referring an accompanying drawing. 1 to 12, 1 is a flexible wiring board, 2 is a flexible board which is an insulating substrate of the flexible wiring board 1, 2a is a through hole provided in the flexible board 2, and 2b is a through hole 2a from the inner surface of the through hole 2a. The connection conductors formed over the main surface of the flexible substrate 2 around 3, 3 is the wiring formed on the main surface of the flexible substrate 2, 5 is an electronic component with a lead terminal, 6 is a lead terminal, and 6 a is a protrusion of the lead terminal 6. Reference numeral 6 b denotes a nail head part of the lead terminal 6, and 7 denotes a ground conductor of the flexible wiring board 1.

図１〜図12は、本発明を説明するために必要な主要部材のみを簡略化して示すものであり、フレキシブル配線基板１およびリード端子付き電子部品５は、各図に示されていない任意の構成部材を備え得るものである。また、各図中の各部の寸法、形状、数および配置も各図に示すものに限られるものではない。   1 to 12 show only main members necessary for explaining the present invention in a simplified manner. The flexible wiring board 1 and the electronic component 5 with lead terminals are not shown in the drawings. A component can be provided. Further, the size, shape, number, and arrangement of each part in each figure are not limited to those shown in each figure.

図１および図２に示す例のように、フレキシブル配線基板１は、貫通孔２ａを有するフレキシブル基板２と、貫通孔２ａの内面から貫通孔２ａの周囲のフレキシブル基板２の主面にかけて形成された接続導体２ｂと、フレキシブル基板２の主面に形成されて接続導体２ｂに接続された配線３とを有する。   As in the example shown in FIGS. 1 and 2, the flexible wiring board 1 is formed from the flexible board 2 having the through hole 2a and the inner surface of the through hole 2a to the main surface of the flexible board 2 around the through hole 2a. It has a connection conductor 2b and a wiring 3 formed on the main surface of the flexible substrate 2 and connected to the connection conductor 2b.

また、リード端子付き電子部品５は、図１に示す例では、基体10ａと枠部10ｂとからなる箱状のパッケージ10と、パッケージ10の基体10ａ上に搭載された半導体素子11と、枠部10ｂを貫通して配置された配線導体12ａを備える配線基板12と、配線導体12ａの枠体10ｂから外に突出した側の端部に接続されたリード端子６と、枠部10ｂの上部に接続された蓋体14とで構成されている。半導体素子11は、配線導体12ａのパッケージ10内に位置する端部にボンディングワイヤ12によって電気的に接続されている。これによって、半導体素子11とリード端子６とが電気的に接続されている。   Further, in the example shown in FIG. 1, the electronic component 5 with lead terminals includes a box-shaped package 10 composed of a base 10a and a frame 10b, a semiconductor element 11 mounted on the base 10a of the package 10, and a frame. Connected to a wiring board 12 having a wiring conductor 12a disposed through 10b, a lead terminal 6 connected to an end of the wiring conductor 12a protruding outward from the frame 10b, and an upper portion of the frame 10b It is comprised with the cover body 14 made. The semiconductor element 11 is electrically connected to the end portion of the wiring conductor 12a located in the package 10 by a bonding wire 12. As a result, the semiconductor element 11 and the lead terminal 6 are electrically connected.

本発明は、このようなフレキシブル配線基板１の貫通孔２ａにリード端子付き電子部品５のリード端子６が挿入されることでリード端子６と接続導体２ｂとが電気的に接続されるフレキシブル配線基板１とリード端子付き電子部品５との接続構造であって、図２に示す例のように、フレキシブル配線基板１の接続導体２ｂは、貫通孔２ａの内面および貫通孔２ａの周囲のフレキシブル基板２の主面において、一部に切欠きを有していて貫通孔２ａの全周にわたって形成されていないものである。   The present invention is a flexible wiring board in which the lead terminal 6 and the connection conductor 2b are electrically connected by inserting the lead terminal 6 of the electronic component 5 with the lead terminal into the through hole 2a of the flexible wiring board 1 as described above. 1 and an electronic component 5 with lead terminals, as in the example shown in FIG. 2, the connection conductor 2b of the flexible wiring board 1 is connected to the inner surface of the through hole 2a and the flexible substrate 2 around the through hole 2a. The main surface has a notch in part and is not formed over the entire circumference of the through-hole 2a.

本発明のフレキシブル配線基板１とリード端子付き電子部品５との接続構造では、貫通孔２ａにリード端子６を挿入するだけで接続するものであり、はんだ等の接合材によって固定する必要はない。そのため、はんだ付けの際の加熱によって、フレキシブル配線基板１が変形したり、リード端子６を通して半導体素子11が加熱されて破損してしまったりすることがないものとなる。また、リード端子６をフレキシブル配線基板１の貫通孔２ａに挿入するだけで接続が完了するため、はんだを用いた接続方法に比べて作業効率が格段に向上するとともに、接続した後の取り外しが容易である。   In the connection structure between the flexible wiring substrate 1 and the electronic component 5 with lead terminals of the present invention, the connection is made by simply inserting the lead terminals 6 into the through holes 2a, and there is no need to fix them with a bonding material such as solder. Therefore, the flexible wiring board 1 is not deformed by heating during soldering, and the semiconductor element 11 is not heated and damaged through the lead terminals 6. Further, since the connection is completed simply by inserting the lead terminal 6 into the through hole 2a of the flexible wiring board 1, the working efficiency is remarkably improved as compared with the connection method using solder, and the removal after the connection is easy. It is.

このような接続構造の場合は、高い接続強度を実現するためには、リード端子６の大きさ（径または幅）を貫通孔２ａの径以上とするものである。このようにすることでリード端子６を貫通孔２ａに挿入してリード端子６が貫通孔２ａを押し広げると、フレキシブル基板２の弾性によって貫通孔２ａの内面がリード端子６に押さえ付けられ、リード端子６と貫通孔２ａの内面に形成された接続導体２ｂとが密着して高い接続強度が得られる。   In the case of such a connection structure, in order to realize high connection strength, the size (diameter or width) of the lead terminal 6 is set to be equal to or larger than the diameter of the through hole 2a. In this way, when the lead terminal 6 is inserted into the through hole 2a and the lead terminal 6 spreads the through hole 2a, the inner surface of the through hole 2a is pressed against the lead terminal 6 by the elasticity of the flexible substrate 2, and the lead The terminal 6 and the connection conductor 2b formed on the inner surface of the through hole 2a are brought into close contact with each other, so that a high connection strength is obtained.

そして、図２に示す例のようにフレキシブル配線基板１の接続導体３が上述したような構成となっていることから、貫通孔２ａの周囲において、フレキシブル基板２の接続導体２ｂが形成されていない部分は接続導体２ｂが形成されている部分より変形しやすい構造となっている。そのため、リード端子６を挿入した際に、接続導体２ｂが形成されていない部分が変形して貫通孔２ａが広がり、貫通孔２ａの内面から貫通孔２ａの周囲にかけて形成された接続導体２ｂが変形することが抑えられるので、接続導体２ｂが破損することなくリード端子６と貫通孔２ａの内面の接続導体２ｂとを密着させることが可能となり、高い接続強度および導通信頼性を実現することができる。   Since the connection conductor 3 of the flexible wiring board 1 has the above-described configuration as in the example shown in FIG. 2, the connection conductor 2b of the flexible board 2 is not formed around the through hole 2a. The portion has a structure that is more easily deformed than the portion where the connection conductor 2b is formed. Therefore, when the lead terminal 6 is inserted, the portion where the connection conductor 2b is not formed is deformed to expand the through hole 2a, and the connection conductor 2b formed from the inner surface of the through hole 2a to the periphery of the through hole 2a is deformed. Therefore, the lead terminal 6 and the connection conductor 2b on the inner surface of the through-hole 2a can be brought into close contact with each other without damaging the connection conductor 2b, and high connection strength and conduction reliability can be realized. .

このような構成において、図３および図４に示す例のように、リード端子６が、先端部
側からリード端子付き電子部品５の本体側に向かって幅が漸次大きくなる突出部６ａを有するのが好ましい。このようにすると、突出部６ａがストッパーとなり、リード端子６がフレキシブル配線基板１の貫通孔２ａから抜けない構造となる。また、より幅の大きい突出部を有していても、その幅は漸次大きくなることから、貫通孔２ａにリード端子６を挿入する際には、貫通孔２ａは徐々に押し広げられることとなるので、貫通孔２ａおよび接続導体２ｂに急激に応力が加わることがなく、接続導体２ｂが損傷してしまうことを抑えることができる。 In such a configuration, as in the example shown in FIGS. 3 and 4, the lead terminal 6 has a protruding portion 6 a whose width gradually increases from the tip end side toward the main body side of the electronic component 5 with a lead terminal. Is preferred. If it does in this way, it will become the structure where the protrusion part 6a becomes a stopper and the lead terminal 6 does not escape from the through-hole 2a of the flexible wiring board 1. FIG. Moreover, even if it has a protrusion part with a larger width | variety, since the width | variety becomes large gradually, when inserting the lead terminal 6 in the through-hole 2a, the through-hole 2a will be gradually expanded. Therefore, no stress is suddenly applied to the through hole 2a and the connection conductor 2b, and the connection conductor 2b can be prevented from being damaged.

また、上記構成において、リード端子６の突出部６ａと電子部品５の本体の外面との間の距離（図３に示す例では、リード端子６の突出部６ａと配線基板12の側面との距離Ｄ）がフレキシブル配線基板１の厚み以下であることが好ましい。このような構成とすることで、突出部６ａと電子部品５の外面とでフレキシブル配線基板１を強固に挟み込んで固定することができるので、外部からの力によってフレキシブル配線基板１が動くことがなく、より高い接続強度および導通信頼性を得ることができる。   In the above configuration, the distance between the protruding portion 6a of the lead terminal 6 and the outer surface of the main body of the electronic component 5 (in the example shown in FIG. 3, the distance between the protruding portion 6a of the lead terminal 6 and the side surface of the wiring board 12). D) is preferably equal to or less than the thickness of the flexible wiring board 1. With such a configuration, the flexible wiring substrate 1 can be firmly sandwiched and fixed between the protruding portion 6a and the outer surface of the electronic component 5, so that the flexible wiring substrate 1 does not move due to an external force. Therefore, higher connection strength and conduction reliability can be obtained.

また、上記各構成において、図１，図５および図９〜図12に示す例のように、電子部品５が複数のリード端子６を有し、フレキシブル配線基板１がリード端子６の配列に対応する複数の貫通孔２ａを有している場合には、接続導体２ｂは隣接する２つの貫通孔２ａ・２ａ間において切欠きと切欠き以外の部分とが対向しないように形成されていることが好ましい。このような構成とすると、フレキシブル基板２の、リード端子６を貫通孔２ａに挿入した際に大きく変形する、接続導体２ｂの切欠きに近い部分に、隣接する貫通孔２ａの周囲に形成された接続導体２ｂおよび接続導体２ｂに接続された配線３がないので、フレキシブル基板２の変形によって、接続導体２ｂおよび配線３がフレキシブル基板２から剥がれたり、破損して断線したりする可能性が低減された、より接続信頼性の高いものとなる。なお、図５は、図１に示す例のフレキシブル配線基板１の要部の一例を示す平面図である。図５（ａ）および図５（ｃ）はそれぞれ配線３が形成された主面側の平面図であり、図５（ｂ）は図５（ａ）の裏面を、図５（ｄ）は図５（ｃ）の裏面をそれぞれ示すものである。また、図10は、図９に示す例のフレキシブル配線基板１の要部の一例を示す平面図である。図10（ａ）は配線３が形成された主面側の平面図であり、図10（ｂ）は図10（ａ）の裏面をそれぞれ示すものである。   In each of the above configurations, the electronic component 5 has a plurality of lead terminals 6 and the flexible wiring board 1 corresponds to the arrangement of the lead terminals 6 as in the examples shown in FIGS. 1, 5 and 9 to 12. In the case of having a plurality of through-holes 2a, the connecting conductor 2b is formed so that the notch and the portion other than the notch do not face each other between the two adjacent through-holes 2a and 2a. preferable. With such a configuration, the flexible substrate 2 is formed around the adjacent through hole 2a in a portion near the notch of the connecting conductor 2b, which is greatly deformed when the lead terminal 6 is inserted into the through hole 2a. Since there is no connection conductor 2b and the wiring 3 connected to the connection conductor 2b, the possibility of the connection conductor 2b and the wiring 3 being peeled off from the flexible substrate 2 due to deformation of the flexible substrate 2 or being broken and disconnected is reduced. In addition, the connection reliability becomes higher. 5 is a plan view showing an example of a main part of the flexible wiring board 1 of the example shown in FIG. 5 (a) and 5 (c) are plan views on the main surface side where the wiring 3 is formed, respectively, FIG. 5 (b) is a back surface of FIG. 5 (a), and FIG. 5 (c) shows the back side. FIG. 10 is a plan view showing an example of a main part of the flexible wiring board 1 of the example shown in FIG. FIG. 10A is a plan view of the main surface side on which the wiring 3 is formed, and FIG. 10B shows the back surface of FIG.

図１，図５（ａ）および図５（ｂ）に示す例では、フレキシブル配線基板１は横１列に並べられた３つの貫通孔２ａを有しており、３つの接続導体２ｂの切欠きはいずれも貫通孔２ａの下側に設けられている。また、図５（ｃ）および図５（ｄ）に示す例では、横１列に並べられた３つの貫通孔２ａのうち中央の貫通孔２ａの内面から周囲にかけて形成された接続導体２ｂは貫通孔２ａの下側に切欠きを有しており、左側の接続導体２ｂは貫通孔２ａの左側に、右側の接続導体２ｂは貫通孔２ａの右側にそれぞれ切欠きを有している。そして、図９〜図12に示す例では、上下に３つずつ２列に並べられた計６つの貫通孔２ａを有しており、上側の３つの接続導体２ｂの切欠きはいずれもそれぞれ貫通孔２ａの下側に設けられ、下側の３つの接続導体２ｂの切欠きはいずれもそれぞれ貫通孔２ａの上側に設けられており、上側の接続導体２ｂの切欠きと下側の接続導体２ｂの切欠きとが対向している。   In the example shown in FIG. 1, FIG. 5A and FIG. 5B, the flexible wiring board 1 has three through holes 2a arranged in a horizontal row, and the three connection conductors 2b are notched. Are provided below the through hole 2a. In the example shown in FIG. 5C and FIG. 5D, the connecting conductor 2b formed from the inner surface of the central through hole 2a to the periphery among the three through holes 2a arranged in a horizontal row passes through. The left connecting conductor 2b has a notch on the left side of the through hole 2a, and the right connecting conductor 2b has a notch on the right side of the through hole 2a. In the example shown in FIG. 9 to FIG. 12, there are a total of six through holes 2a arranged in two rows at the top and bottom, all of the notches of the upper three connection conductors 2b penetrating each other. The notches of the lower three connection conductors 2b are provided on the upper side of the through holes 2a, and the notches of the upper connection conductor 2b and the lower connection conductor 2b are provided below the hole 2a. The notch is facing.

また、上記各構成において、図12に示す例のように、リード端子６の突出部６ａが隣接する２つのリード端子６・６間において対向しないときには、フレキシブル配線基板１にリード端子６を挿入する際、２つのリード端子６がそれぞれ挿入される２つの貫通孔２ａ・２ａ間におけるフレキシブル基板２の変形は、１つのリード端子６だけによるものとなるので、フレキシブル基板１の変形を最小限にすることができ、フレキシブル基板１上に形成された配線３や接続導体２ｂの破損が抑制される。また、このようにすると、リード端子６の間隔を小さくすることができ、電子部品５およびフレキシブル配線基板１を小型
化することができる。 Further, in each of the above configurations, as shown in the example shown in FIG. 12, when the protruding portion 6a of the lead terminal 6 does not oppose between the two adjacent lead terminals 6 and 6, the lead terminal 6 is inserted into the flexible wiring board 1. At this time, since the deformation of the flexible substrate 2 between the two through holes 2a and 2a into which the two lead terminals 6 are respectively inserted is due to only one lead terminal 6, the deformation of the flexible substrate 1 is minimized. It is possible to prevent the wiring 3 and the connecting conductor 2b formed on the flexible substrate 1 from being damaged. Moreover, if it does in this way, the space | interval of the lead terminal 6 can be made small and the electronic component 5 and the flexible wiring board 1 can be reduced in size.

フレキシブル配線基板１は、ポリイミド等の樹脂フィルムからなるフレキシブル基板２の主面上に所定形状に加工された金属箔を転写するなどして配線３が形成されたものである。フレキシブル基板２には、金型による打ち抜き加工やレーザー加工等の孔開け加工によって貫通孔２ａが形成されている。この貫通孔２ａの内面から貫通孔２ａの周囲のフレキシブル基板２の主面にかけて接続導体２ｂが形成されている。   The flexible wiring substrate 1 is formed by transferring a metal foil processed into a predetermined shape onto a main surface of a flexible substrate 2 made of a resin film such as polyimide, and the like. A through hole 2a is formed in the flexible substrate 2 by punching using a mold or drilling such as laser processing. A connection conductor 2b is formed from the inner surface of the through hole 2a to the main surface of the flexible substrate 2 around the through hole 2a.

貫通孔２ａの周囲のフレキシブル基板２の主面上の接続導体２ｂは、配線３と同時に金属箔を転写することによって形成することができる。配線３とフレキシブル基板２の主面上の接続導体２ｂとが接続されたパターン形状に加工された金属箔を転写すればよい。また、フレキシブル基板２の主面上の接続導体２ｂは、配線３が形成された主面だけでなく、この主面と対向する主面、すなわち配線３が形成された面に対する裏面にも形成してよい。金属箔は、通常は導電率の高い銅（Ｃｕ）の箔が用いられる。   The connection conductor 2b on the main surface of the flexible substrate 2 around the through hole 2a can be formed by transferring the metal foil simultaneously with the wiring 3. What is necessary is just to transcribe | transfer the metal foil processed into the pattern shape in which the wiring 3 and the connection conductor 2b on the main surface of the flexible substrate 2 were connected. Further, the connection conductor 2b on the main surface of the flexible substrate 2 is formed not only on the main surface on which the wiring 3 is formed, but also on the main surface opposite to the main surface, that is, on the back surface with respect to the surface on which the wiring 3 is formed. It's okay. As the metal foil, a copper (Cu) foil having a high electrical conductivity is usually used.

貫通孔２ａの内面の接続導体２ｂは、貫通孔２ａの内面の接続導体２ｂは、主面上の接続導体２ｂを形成した後に電解めっき法で形成することができる。主面上の接続導体２ｂを、切欠きを有する形状にしておくことで、貫通孔２ａの内周面の接続導体２ｂも切欠きを有する形状とすることができる。上述したように、フレキシブル基板２の配線３が形成された面とは反対側の面にも接続導体２ｂを形成しておくと、貫通孔２ａの両方の開口からめっき皮膜を形成することができる。ので、貫通孔２ａの内周面の接続導体２ｂを短時間で形成でき、その厚みが厚くなりすぎることがない。   The connecting conductor 2b on the inner surface of the through hole 2a can be formed by electrolytic plating after forming the connecting conductor 2b on the main surface of the connecting conductor 2b on the inner surface of the through hole 2a. By making the connection conductor 2b on the main surface into a shape having a notch, the connection conductor 2b on the inner peripheral surface of the through hole 2a can also be made into a shape having a notch. As described above, when the connection conductor 2b is formed on the surface of the flexible substrate 2 opposite to the surface on which the wiring 3 is formed, a plating film can be formed from both openings of the through hole 2a. . Therefore, the connection conductor 2b on the inner peripheral surface of the through hole 2a can be formed in a short time, and the thickness does not become too thick.

フレキシブル配線基板１の配線３の一端は接続導体２ｂに接続されるが、他端はフレキシブル配線基板１が接続される外部回路基板等に応じたものとなる。他端も同様の貫通孔２ａおよび接続導体２ｂに接続されていてもよいし、例えば、コネクタや端子等を接続してもよい。   One end of the wiring 3 of the flexible wiring board 1 is connected to the connection conductor 2b, and the other end corresponds to an external circuit board to which the flexible wiring board 1 is connected. The other end may be connected to the same through-hole 2a and connecting conductor 2b, for example, a connector or a terminal may be connected.

フレキシブル配線基板１の貫通孔２ａの大きさ（直径）は、フレキシブル基板２の材質や厚みにもよるが、リード端子６の径または幅に対して３％〜10％程度小さくすればよい。３％未満では、リード端子６によって貫通孔２ａがあまり押し広げられず、フレキシブル基板２の弾性による貫通孔２ａの内面がリード端子６を押さえ付ける力が小さいものとなるので、リード端子６と貫通孔２ａの内面に形成された接続導体２ｂとの接続強度が小さいものとなり、接続信頼性が低いものとなりやすく、また、この接続部における電気抵抗値が高くなりやすい。一方、10％を越えると、切欠きがあっても接続導体２ｂが形成された部分まで変形しやすくなって、接続導体２ｂが破損してしまう場合がある。   The size (diameter) of the through-hole 2a of the flexible wiring board 1 may be about 3% to 10% smaller than the diameter or width of the lead terminal 6 although it depends on the material and thickness of the flexible board 2. If it is less than 3%, the lead terminal 6 does not push the through-hole 2a so much, and the inner surface of the through-hole 2a due to the elasticity of the flexible substrate 2 has a small force to press the lead terminal 6; The connection strength with the connection conductor 2b formed on the inner surface of the hole 2a is low, the connection reliability is likely to be low, and the electrical resistance value at this connection portion is likely to be high. On the other hand, if it exceeds 10%, even if there is a notch, the connection conductor 2b is easily deformed to the portion where it is formed, and the connection conductor 2b may be damaged.

貫通孔２ａの形状に特に制限はないが、矩形等の角を有する形状であると、リード端子６を挿入して貫通孔２ａを押し広げた際に角部を起点としてフレキシブル基板２に亀裂が入りやすくなるので、通常は角部を有さない、図１，図２，図５および図９〜図11に示すような円形状とする。   Although there is no restriction | limiting in particular in the shape of the through-hole 2a, When it is a shape which has corners, such as a rectangle, when the lead terminal 6 is inserted and the through-hole 2a is expanded, a crack will be cracked in the flexible substrate 2 from the corner | angular part. Since it becomes easy to enter, it is usually circular as shown in FIG. 1, FIG. 2, FIG. 5, and FIG.

接続導体２ｂの切欠きは、貫通孔２ａをはさんで配線３との接続部の反対側に設けるのが望ましい。このようにすると、貫通孔２ａが大きく変形する部分、即ち接続導体２ｂが破断する可能性が最も高い部分が、接続導体２ｂと配線３との接続部より最も遠い位置にあるので、配線３と接続導体２ｂとの導通信頼性をより高くすることができる。   The cutout of the connection conductor 2b is preferably provided on the opposite side of the connection portion with the wiring 3 across the through hole 2a. In this case, the portion where the through-hole 2a is greatly deformed, that is, the portion where the connection conductor 2b is most likely to break is located farthest from the connection portion between the connection conductor 2b and the wiring 3, so that the wiring 3 and The conduction reliability with the connection conductor 2b can be further increased.

接続導体２ｂの切欠きの、貫通孔２ａの周に沿った方向の長さは、平面視した貫通孔２ａ周の２分の１より短い長さ、より好ましくは３分の１以下の長さである。これより切欠きが長いと、接続導体２ｂとリード端子６との接続信頼性が低下し、また、接続部での抵
抗値が高くなりやすいからである。切欠きの長さが短すぎると、貫通孔２ａにリード端子６を挿入した際の貫通孔２ａの変形によって、接続導体２ｂが破損しやすくなる。フレキシブル基板２の材質（弾性率）や厚みにもよるが、切欠きの長さが貫通孔２ａ周の８分の１程度以上であれば、貫通孔２ａにリード端子６を挿入した際に、貫通孔２ａは主に切欠き部分で変形して接続導体２ｂが破損し難くなる。 The length of the notch of the connection conductor 2b in the direction along the circumference of the through hole 2a is shorter than one half of the circumference of the through hole 2a in a plan view, more preferably one third or less. It is. If the notch is longer than this, the connection reliability between the connection conductor 2b and the lead terminal 6 is lowered, and the resistance value at the connection portion tends to be high. If the length of the notch is too short, the connecting conductor 2b is likely to be damaged due to deformation of the through hole 2a when the lead terminal 6 is inserted into the through hole 2a. Although depending on the material (elastic modulus) and thickness of the flexible substrate 2, if the length of the notch is about 1/8 or more of the circumference of the through hole 2a, when the lead terminal 6 is inserted into the through hole 2a, The through hole 2a is mainly deformed at the notch portion, and the connection conductor 2b is hardly damaged.

具体的には、直径が0.3ｍｍのリード端子６を接続するフレキシブル配線基板１として
、フレキシブル基板２が厚さ0.05ｍｍのポリイミド樹脂からなり、貫通孔２ａを直径0.27ｍｍとして、フレキシブル基板２の片側主面上の配線３および接続導体２を厚さ0.04ｍｍの銅箔で形成し、貫通孔２ａの内面の接続導体２を厚さ0.02ｍｍ程度の銅めっき皮膜で形成して、これに接続してフレキシブル基板２の主面上に延びる接続導体２ｂを、外径が0.47ｍｍで内径が0.27ｍｍの貫通孔２ａの開口に沿った円環に切欠きを有する形状とする場合であれば、接続導体２ｂの切欠きは、貫通孔２ａの内面では貫通孔２ｂの周に沿った長さが0.1ｍｍ程度で、フレキシブル基板２の主面上の接続導体２ｂの外周部では、この外
周に沿った長さが0.18ｍｍ（即ち、貫通孔２ａの内面から貫通孔２ａの周囲の主面上にかけて形成された円環状の接続導体２ｂを周方向の長さの８分の１を切り欠いた形状）とすればよい。 Specifically, as the flexible wiring board 1 to which the lead terminal 6 having a diameter of 0.3 mm is connected, the flexible board 2 is made of a polyimide resin having a thickness of 0.05 mm, the through hole 2a has a diameter of 0.27 mm, and one side of the flexible board 2 is provided. The wiring 3 and the connecting conductor 2 on the main surface are made of 0.04 mm thick copper foil, and the connecting conductor 2 on the inner surface of the through-hole 2a is made of a copper plating film having a thickness of about 0.02 mm and connected thereto. If the connection conductor 2b extending on the main surface of the flexible substrate 2 has a notch in the annular shape along the opening of the through hole 2a having an outer diameter of 0.47 mm and an inner diameter of 0.27 mm, the connection The notch of the conductor 2b has a length along the circumference of the through-hole 2b on the inner surface of the through-hole 2a, and is about 0.1 mm along the outer circumference of the connection conductor 2b on the main surface of the flexible substrate 2. The length is 0.18 mm (that is, the through hole 2a The annular connecting conductor 2b formed from the inner surface to the main surface around the through-hole 2a may have a shape in which one-eighth of the circumferential length is cut away.

フレキシブル配線基板１は、配線３で伝送する電気信号が高周波信号である場合には、フレキシブル基板２の配線３が形成された主面やその反対側の主面上に接地導体７を形成することによって、コプレナー線路やマイクロストリップ線路等の高周波信号の伝送に適した構造とするのが好ましい。   When the electrical signal transmitted through the wiring 3 is a high-frequency signal, the flexible wiring board 1 is formed with the ground conductor 7 on the main surface of the flexible substrate 2 on which the wiring 3 is formed or on the opposite main surface. Therefore, a structure suitable for transmission of a high-frequency signal such as a coplanar line or a microstrip line is preferable.

図５（ａ）および図５（ｂ）に示す例は、フレキシブル基板２の一方の主面上に３つの信号用の配線３が形成され、他方の主面上には接地導体７が形成されてマイクロストリップ線路構造となっている。図５（ｃ）および図５（ｄ）に示す例は、フレキシブル基板２の一方の主面上には、１つの信号用の配線３と、配線３と一定の間隔をあけて接地導体７が形成され、他方の主面上には接地導体７が形成されて所謂グランド付きコプレナー線路構造となっている。いずれの例においても、他方主面の接地導体７は、接続導体２ｂとは絶縁されており、また、一方主面の接続導体２ｂの切欠きに対応する位置に、接地導体７の非形成部を設けている。このようにすることで、他方主面に接地導体７を設けても、切欠きを設けた部分が変形しやすい部分となることから、貫通孔２ａにリード端子６を挿入した際に接続導体２ｂが変形することが抑えられ、接続導体２ｂが破損することがないので好ましい。また、同様の理由で、図５（ｃ）および図５（ｄ）に示す例では、配線３の周囲に形成された接地導体７にも非形成部（切欠き）が設けられている。図５（ｃ）および図５（ｄ）に示すフレキシブル配線基板１は、広面積に形成された接地導体７にリード端子６を接続することができるようにした例である。接地導体７は、接地導体７が形成された領域内の貫通孔２ａの内面の接続導体２ｂと接続されており、この接続導体２ｂにも切欠きが設けられ、接地導体７にもこれに対応するように切欠きが設けられている。広面積の接地導体７は、貫通孔２ａにリード端子６を挿入しても、断線するような大きな破損が発生する可能性は低いが、このようにすることで同様に接続信頼性が向上するので好ましい。また、図５（ｃ）に示す例では、接地導体７の非形成部は、貫通孔２ａを挟んで配線３が接続された接続導体２ｂとは反対側に設けられている。このようにすることで、非形成部を設けることによる、配線３による高周波信号の伝送に与える影響を小さくすることができる。   In the example shown in FIGS. 5A and 5B, three signal wirings 3 are formed on one main surface of the flexible substrate 2, and a ground conductor 7 is formed on the other main surface. It has a microstrip line structure. In the example shown in FIG. 5C and FIG. 5D, on one main surface of the flexible substrate 2, one signal wiring 3 and a ground conductor 7 are spaced apart from the wiring 3 by a certain distance. The ground conductor 7 is formed on the other main surface to form a so-called grounded coplanar line structure. In any example, the ground conductor 7 on the other main surface is insulated from the connection conductor 2b, and the non-formation portion of the ground conductor 7 is formed at a position corresponding to the notch of the connection conductor 2b on the one main surface. Is provided. In this way, even if the ground conductor 7 is provided on the other main surface, the portion provided with the notch is easily deformed, so that when the lead terminal 6 is inserted into the through hole 2a, the connection conductor 2b This is preferable because the connecting conductor 2b is not damaged. For the same reason, in the example shown in FIG. 5C and FIG. 5D, the ground conductor 7 formed around the wiring 3 is also provided with a non-formed portion (notch). The flexible wiring board 1 shown in FIG. 5C and FIG. 5D is an example in which the lead terminal 6 can be connected to the ground conductor 7 formed in a large area. The ground conductor 7 is connected to the connection conductor 2b on the inner surface of the through hole 2a in the region where the ground conductor 7 is formed. The connection conductor 2b is also provided with a notch, and the ground conductor 7 also corresponds to this. Notches are provided so that Even if the lead terminal 6 is inserted into the through hole 2a, the ground conductor 7 having a large area is unlikely to be broken so that the connection reliability is improved. Therefore, it is preferable. In the example shown in FIG. 5C, the non-formed portion of the ground conductor 7 is provided on the side opposite to the connection conductor 2b to which the wiring 3 is connected with the through hole 2a interposed therebetween. By doing in this way, the influence which it has on the transmission of the high frequency signal by the wiring 3 by providing a non-formation part can be made small.

また、図10に示す例では、上下２列に配列された貫通孔２ａの内の下側（フレキシブル配線基板１の一端側）の３つの貫通孔２ａに形成された接続導体２ｂには裏面の接地導体７が接続され、上側（フレキシブル配線基板１の他端側）の３つの貫通孔２ａに形成された接続導体２ｂには配線３が接続されている。上側の３つの貫通孔２ａには、電子部品５
のリード端子６の内の信号用のものが挿入され、下側の３つの貫通孔２ａには接地用の信号端子６が挿入される。この例のように、フレキシブル配線基板１の他端側の貫通孔２ａに形成された接続導体２ｂに配線３を接続すると、配線３の長さを短くすることができるとともに、引き回すために配線３を屈曲させなくてもよいので、高周波信号の伝送特性がより優れたものとなる。接地用のリード端子６が１つである場合であっても、上記の理由から信号用のリード端子６を上側に３つ並べ、下側に接地導体７に接続する接続導体２ｂを形成する貫通孔２ａを設けるとよい。そのとき、ダミーのリード端子６ａを２本設けて貫通孔２ａもそれに対応して６つ設けると、フレキシブル配線基板１とリード端子６とを接続した後にフレキシブル配線基板１に外力が加わってもその力は６つの貫通孔２ａに分散されるので、接続信頼性が高まるのでよい。 Further, in the example shown in FIG. 10, the connecting conductor 2b formed in the three through holes 2a on the lower side (one end side of the flexible wiring board 1) of the through holes 2a arranged in two rows in the upper and lower directions is provided on the back surface. The ground conductor 7 is connected, and the wiring 3 is connected to the connection conductor 2b formed in the three through holes 2a on the upper side (the other end side of the flexible wiring board 1). In the upper three through holes 2a, there are electronic components 5
Of the lead terminals 6 is inserted, and the grounding signal terminal 6 is inserted into the lower three through holes 2a. When the wiring 3 is connected to the connection conductor 2b formed in the through hole 2a on the other end side of the flexible wiring board 1 as in this example, the length of the wiring 3 can be shortened and the wiring 3 can be routed for routing. Therefore, the transmission characteristics of the high frequency signal are more excellent. Even if the number of ground lead terminals 6 is one, for the above reasons, three signal lead terminals 6 are arranged on the upper side, and the through conductors forming the connection conductor 2b connected to the ground conductor 7 on the lower side are formed. A hole 2a may be provided. At that time, if two dummy lead terminals 6a are provided and six through holes 2a are provided correspondingly, even if an external force is applied to the flexible wiring board 1 after the flexible wiring board 1 and the lead terminals 6 are connected, Since the force is distributed to the six through holes 2a, the connection reliability may be improved.

図１に示す例では、フレキシブル配線基板１の配線３が形成された主面をリード端子６の先端側に向けてリード端子６とフレキシブル配線基板１とを接続しているが、これとは逆に、フレキシブル配線基板１の配線３が形成された主面を電子部品５側に向けて接続するのが好ましい。このようにすると、フレキシブル配線基板１の厚み分だけ、リード端子６から配線３への信号の伝送経路が短くなる。リード端子６は大きなインダクタンス成分を有するため、配線３までのリード端子６の長さを短くすることで、信号の伝送特性のより良好なものとなり、この効果は伝送する信号が高周波である場合にはより顕著になる。   In the example shown in FIG. 1, the lead terminal 6 and the flexible wiring board 1 are connected with the main surface on which the wiring 3 of the flexible wiring board 1 is formed facing the leading end side of the lead terminal 6. Moreover, it is preferable to connect the main surface on which the wiring 3 of the flexible wiring board 1 is formed toward the electronic component 5 side. In this way, the signal transmission path from the lead terminal 6 to the wiring 3 is shortened by the thickness of the flexible wiring board 1. Since the lead terminal 6 has a large inductance component, shortening the length of the lead terminal 6 to the wiring 3 improves the signal transmission characteristics. This effect is obtained when the signal to be transmitted is at a high frequency. Becomes more prominent.

また、伝送する信号が高周波である場合には、図６に示す例のように、外部回路基板に接続するためにフレキシブル配線基板１が電子部品５とは反対側の方向に折り曲げられるような場合にも、フレキシブル配線基板１の配線３が形成された主面を電子部品５側に向けて接続するのが好ましい。フレキシブル配線基板１の配線３が形成された主面をリード端子６の先端側に向けて接続すると、折り曲げられた内側で、フレキシブル配線基板１の配線３が対向することとなり、対向する配線３・３間において電磁界結合が発生して、配線３において余分な容量、相互インダクタンス等が発生するので、伝送損失が大きくなってしまうからである。フレキシブル配線基板１の配線３が形成された主面を電子部品５側に向けて接続した場合には、対向する配線３・３間には接地導体７が存在することとなるので、このような問題は生じない。   When the signal to be transmitted is a high frequency, the flexible wiring board 1 is bent in the direction opposite to the electronic component 5 in order to connect to the external circuit board as in the example shown in FIG. In addition, it is preferable to connect the main surface on which the wiring 3 of the flexible wiring board 1 is formed toward the electronic component 5 side. When the main surface on which the wiring 3 of the flexible wiring board 1 is formed is connected toward the leading end side of the lead terminal 6, the wiring 3 of the flexible wiring board 1 is opposed to the inside of the bent terminal 6. This is because electromagnetic field coupling occurs between the three lines, and extra capacitance, mutual inductance, and the like are generated in the wiring 3, resulting in an increase in transmission loss. When the main surface on which the wiring 3 of the flexible wiring board 1 is formed is connected to the electronic component 5 side, the ground conductor 7 exists between the opposing wirings 3 and 3, so that There is no problem.

リード端子６は、銅，銅−亜鉛（Ｃｕ−Ｚｎ）合金，タングステン（Ｗ），鉄−ニッケル（Ｆｅ−Ｎｉ）合金，鉄−ニッケル−コバルト（Ｆｅ−Ｎｉ−Ｃｏ）合金等の金属材料が用いられ、必要に応じて表面にニッケル，金（Ａｕ），銅等のめっき皮膜を被着させた、棒状のものである。その断面形状は、特に制限はなく、図１に示す例のような円形状であってもよいし、矩形状であってもよい。上述したように、貫通孔２ａが、通常は円形状であるので、その内面の接続導体２ｂとの接続面積が大きくなるように、リード端子６の断面形状は円形状であるのが好ましい。   The lead terminal 6 is made of a metal material such as copper, copper-zinc (Cu—Zn) alloy, tungsten (W), iron-nickel (Fe—Ni) alloy, or iron-nickel-cobalt (Fe—Ni—Co) alloy. It is used in the form of a rod having a plating film such as nickel, gold (Au) or copper deposited on the surface as required. The cross-sectional shape is not particularly limited, and may be a circular shape as in the example shown in FIG. 1 or a rectangular shape. As described above, since the through hole 2a is usually circular, the cross-sectional shape of the lead terminal 6 is preferably circular so that the connection area of the inner surface with the connection conductor 2b is increased.

また、リード端子６は、上述したように、先端部側からリード端子付き電子部品５の本体側に向かって幅が漸次大きくなる突出部６ａを有するのが好ましい。図４（ａ）に示す例は、円柱状のリード端子６に、その全周に渡って径が大きくなるような、円錐状の突出部６ａが形成されたものである。これに対して、図４（ｂ）に示す例は、同じ円柱状のリード端子６に、一部の径が大きくなるような、平板状の突出部６ａが形成されたものである。また、図４（ｃ）に示す例は、断面が矩形のリード端子６の１つの幅方向だけが大きくなっている例である。図４（ｂ）および図４（ｃ）に示す例のように、リード端子６の１方向のみの幅が大きくなるような突出部６ｂであると、突出部６ｂが貫通孔２ａを押し広げる際に、貫通孔２ａの変形量が小さく、接続導体２ｂの変形も小さくなるので好ましい。また、突出部６ａの大きさは、リード端子６本体に対して0.5ｍｍ程度以上突出して
いれば、上述したように突出部６ａがストッパーとして機能する。リード端子６の幅または径方向の突出部６ａの大きさが大きいほどストッパーとしての機能は高まるが、突出部
６ａが、大きすぎると突出部６ｂが貫通孔２ａを押し広げる際に接続導体２ｂが破損してしまう場合があるので、フレキシブル基板２の材質や厚みに応じて適宜設定すればよい。貫通孔２ａの大きさ（直径）は、リード端子６の径または幅に対して３％〜10％程度小さいのがよいとしたが、突出部６ｂが貫通孔２ａを押し広げる時間は短いので、突出部６ａの径または幅に対して貫通孔２ａの径が10％以上小さくなってもその影響は小さい。 Further, as described above, the lead terminal 6 preferably has the protruding portion 6a whose width gradually increases from the tip end side toward the main body side of the electronic component 5 with lead terminal. In the example shown in FIG. 4 (a), a cylindrical lead terminal 6 is formed with a conical protrusion 6a whose diameter increases over the entire circumference. On the other hand, in the example shown in FIG. 4B, the same columnar lead terminal 6 is formed with a flat plate-like protruding portion 6a having a partly larger diameter. The example shown in FIG. 4C is an example in which only one width direction of the lead terminal 6 having a rectangular cross section is enlarged. 4B and 4C, when the protruding portion 6b has a width that increases in only one direction of the lead terminal 6, the protruding portion 6b spreads the through hole 2a. In addition, it is preferable because the deformation amount of the through hole 2a is small and the deformation of the connection conductor 2b is also small. Further, as long as the protrusion 6a protrudes about 0.5 mm or more from the lead terminal 6 body, the protrusion 6a functions as a stopper as described above. The larger the width of the lead terminal 6 or the size of the protruding portion 6a in the radial direction, the higher the function as a stopper. However, if the protruding portion 6a is too large, the connecting conductor 2b is expanded when the protruding portion 6b expands the through hole 2a. Since it may be damaged, it may be set as appropriate according to the material and thickness of the flexible substrate 2. The size (diameter) of the through hole 2a is preferably about 3% to 10% smaller than the diameter or width of the lead terminal 6, but the time for the protruding portion 6b to push the through hole 2a is short. Even if the diameter of the through hole 2a is smaller by 10% or more than the diameter or width of the protruding portion 6a, the influence is small.

リード端子６が突出部６ａを有する場合は、突出部６ｂと電子部品５の本体の外面との間の部分が貫通孔２ａの内面の接続導体２ｂと密着する部分なので、この部分の径または幅が貫通孔２ａの径に対して３％〜10％程度大きいものであればよい。そのため、図４（ｄ）に示す例のように、リード端子６の突出部６ａよりも先端側の部分の径または幅を、貫通孔２ａの径よりも小さくしてもよい。また、図４（ｅ）に示す例のように、リード端子６の突出部６ａよりも先端側の部分の径または幅を、先端に行くほど小さくなるようにしてもよい。このようにすると、貫通孔２ａがリード端子６によって押し広げられて接続導体２ｂや配線３が変形したり、リード端子６と貫通孔２ａの内面の接続導体２ｂとが擦れ合ったりする時間がより短くなり、接続導体２ｂや配線３が破損してしまう可能性をより低減することができる。また、貫通孔２ａにリード端子６を挿入しやくなり、リード端子６とフレキシブル配線基板１との接続作業を容易にすることができる。   When the lead terminal 6 has the protruding portion 6a, the portion between the protruding portion 6b and the outer surface of the main body of the electronic component 5 is a portion that is in close contact with the connection conductor 2b on the inner surface of the through hole 2a. May be about 3% to 10% larger than the diameter of the through hole 2a. Therefore, as in the example shown in FIG. 4D, the diameter or width of the tip side portion of the lead terminal 6 relative to the protruding portion 6a may be smaller than the diameter of the through hole 2a. Further, as in the example shown in FIG. 4E, the diameter or width of the tip side of the lead terminal 6 relative to the protruding portion 6a may be made smaller toward the tip. In this way, the through-hole 2a is expanded by the lead terminal 6 and the connection conductor 2b and the wiring 3 are deformed, or the lead terminal 6 and the connection conductor 2b on the inner surface of the through-hole 2a are rubbed together. The possibility that the connection conductor 2b and the wiring 3 are damaged can be further reduced. Moreover, it becomes easy to insert the lead terminal 6 into the through hole 2a, and the connection work between the lead terminal 6 and the flexible wiring board 1 can be facilitated.

上述したように、リード端子６の突出部６ａと電子部品５の本体の外面との間の距離がフレキシブル配線基板１の厚み以下であることが好ましい。具体的には、リード端子６の突出部６ａと電子部品５の本体の外面との間の距離が、フレキシブル配線基板１の厚みより10％程度小さければよい。これより小さくなると、フレキシブル配線基板１が変形してしまう。この突出部６ａと電子部品５との距離のコントロールを容易にするには、図７に示す例のように、電子部品５に溝部12ｂを設けるとよい。溝部12ｂの電子部品５の外面からの長さを所定の長さにして、リード端子６の端部を溝部12ｂの壁面に突き当てるようにすることで、突出部６ａと電子部品５との距離が所定の長さに定まる。図７に示す例のように、溝部12ｂの幅をリード端子６の幅に合わせて、リード端子６が嵌合するような形状とすれば、リード端子６の位置も定まるのでより好ましい。また、溝部12ｂにリード端子６を嵌合させることで、リード端子６の電子部品５本体への接続強度を高めることもできる。なお、図７に示す例のように、溝部12ｂの内面にも配線導体12ａを形成しておくことで、リード端子６と配線導体12ａとの電気的接続も容易になる。   As described above, the distance between the protruding portion 6 a of the lead terminal 6 and the outer surface of the main body of the electronic component 5 is preferably equal to or less than the thickness of the flexible wiring board 1. Specifically, the distance between the protrusion 6 a of the lead terminal 6 and the outer surface of the main body of the electronic component 5 only needs to be about 10% smaller than the thickness of the flexible wiring board 1. If it becomes smaller than this, the flexible wiring board 1 will deform | transform. In order to easily control the distance between the protruding portion 6a and the electronic component 5, it is preferable to provide a groove 12b in the electronic component 5 as in the example shown in FIG. The length of the groove portion 12b from the outer surface of the electronic component 5 is set to a predetermined length so that the end of the lead terminal 6 abuts against the wall surface of the groove portion 12b, whereby the distance between the protruding portion 6a and the electronic component 5 is reached. Is determined to a predetermined length. As in the example shown in FIG. 7, it is more preferable that the width of the groove 12 b is matched with the width of the lead terminal 6 so that the lead terminal 6 is fitted, because the position of the lead terminal 6 is also determined. Further, by fitting the lead terminal 6 into the groove portion 12b, the connection strength of the lead terminal 6 to the electronic component 5 body can be increased. In addition, as in the example shown in FIG. 7, by forming the wiring conductor 12a on the inner surface of the groove 12b, the electrical connection between the lead terminal 6 and the wiring conductor 12a is facilitated.

また、上述したように、リード端子６の突出部６ａが隣接する２つのリード端子６・６間において対向しないことが好ましい。図12に示す例では、フレキシブル配線基板１の貫通孔２ａは上下にそれぞれ３つずつ２列の計６つが縦横に配列されて設けられており、電子部品５のリード端子６もこれに対応する位置に、リード端子６は上下（縦）方向に突出する突出部６ａを有するものと、左右（横）方向に突出する突出部６ａを有するものとが交互に配置されている。突出部６ａが隣接する２つのリード端子６・６間において対向しなければよいので、突出部６ａの突出する方向は、必ずしも縦横交互にする必要はなく、また斜めでもよい。図12に示す例のようにリード端子６および貫通孔２ａが縦横に配列されている場合は、突出部６ａが縦方向に突出する突出部６ａを有するものと、横方向に突出する突出部６ａを有するものとが交互に配置されていると、それぞれの貫通孔２ａの周囲に発生するフレキシブル基板２の突出部６ａによって変形する部分同士を最も離すことができ、フレキシブル基板２の変形をより小さいものとすることができるので好ましい。さらには、全てのリード端子６が突出部６ａを有していなくてもよく、例えば、突出部６ａを有するリード端子６と突出部６ａを有さないリード端子６とを交互に配置しても、突出部６ａが隣接する２つのリード端子６・６間において対向しないのでよい。図４（ａ）に示す例のように全周に渡って径が大きくなるような突出部６ａを有するリード端子６の場合などはこのようにすればよい。   Further, as described above, it is preferable that the protruding portion 6a of the lead terminal 6 is not opposed between the two adjacent lead terminals 6 and 6. In the example shown in FIG. 12, the through-hole 2a of the flexible printed circuit board 1 is provided with a total of six rows arranged in two rows, three in the vertical direction, and the lead terminal 6 of the electronic component 5 also corresponds to this. In the position, the lead terminals 6 are alternately arranged with protrusions 6a protruding in the vertical (vertical) direction and those having protrusions 6a protruding in the horizontal (lateral) direction. Since the protrusions 6a do not have to face each other between the two adjacent lead terminals 6 and 6, the protrusion directions of the protrusions 6a do not necessarily have to be alternated vertically and horizontally, and may be oblique. When the lead terminals 6 and the through holes 2a are arranged vertically and horizontally as in the example shown in FIG. 12, the protrusion 6a has a protrusion 6a that protrudes in the vertical direction, and the protrusion 6a that protrudes in the horizontal direction. Are alternately arranged, the portions deformed by the protruding portions 6a of the flexible substrate 2 generated around the respective through-holes 2a can be most separated from each other, and the deformation of the flexible substrate 2 can be made smaller. Since it can be used, it is preferable. Furthermore, all the lead terminals 6 may not have the protruding portions 6a. For example, the lead terminals 6 having the protruding portions 6a and the lead terminals 6 having no protruding portions 6a may be alternately arranged. The protruding portion 6a may not be opposed between the two lead terminals 6 and 6 adjacent to each other. In the case of the lead terminal 6 having the protruding portion 6a whose diameter is increased over the entire circumference as in the example shown in FIG.

図９〜図12に示す例では、電子部品５の６つのリード端子６は、上下にそれぞれ３つずつ２列に並べられている。このように、複数のリード端子６を複数列に配列すると、横１列に配列する場合に比較して電子部品５を外部回路基板への実装面積の小さいものとすることができるので好ましい。   In the example shown in FIGS. 9 to 12, the six lead terminals 6 of the electronic component 5 are arranged in two rows, three each in the vertical direction. As described above, it is preferable to arrange the plurality of lead terminals 6 in a plurality of rows because the mounting area of the electronic component 5 on the external circuit board can be reduced as compared with the case where the lead terminals 6 are arranged in a horizontal row.

また、図11に示す例のように、リード端子６を複数列に並べた場合は、リード端子６の長さを列毎に異なる長さにしてもよい。このようにすると、リード端子６をフレキシブル配線基板１の貫通孔２ａに挿入する際、全てのリード端子６と貫通孔２ａとを同時に位置合わせする必要がないので作業性が飛躍的に向上する。また、全てのリード端子６を１度に貫通孔２ａに挿入しないので、挿入に必要な力が小さくてすむ。多数のリード端子６を１度に貫通孔２ａに挿入する場合には、大きな力を加える必要があり、この大きな力を加える方向がずれてリード端子６が変形してしまう場合があるが、このような可能性を低減することができる。図11に示す例では、上下の２列間でリード端子６の長さを異ならせているが、横方向の３列間で長さを異ならせてもよいし、複数のリード端子６それぞれの間で長さを異ならせても構わない。図11に示す例のように、リード端子６が突出部６ａを有する場合は、突出部６ａより先端側の長さを異ならせるものである。また、上述したような、リード端子６の突出部６ａよりも先端側の部分の径または幅を貫通孔２ａの径よりも小さくする構造と組み合わせると、リード端子６とフレキシブル配線基板１との接続作業の更なる効率向上を実現することができる。   In addition, when the lead terminals 6 are arranged in a plurality of rows as in the example shown in FIG. 11, the length of the lead terminals 6 may be different for each row. If it does in this way, when inserting the lead terminal 6 in the through-hole 2a of the flexible wiring board 1, since it is not necessary to align all the lead terminals 6 and the through-holes 2a simultaneously, workability | operativity improves drastically. Further, since all the lead terminals 6 are not inserted into the through hole 2a at a time, a force required for insertion can be reduced. When inserting a large number of lead terminals 6 into the through-hole 2a at a time, it is necessary to apply a large force, and the direction in which the large force is applied may be shifted and the lead terminal 6 may be deformed. Such a possibility can be reduced. In the example shown in FIG. 11, the lengths of the lead terminals 6 are made different between the upper and lower two rows, but the lengths may be made different among the three rows in the horizontal direction. It does not matter if the length is different. When the lead terminal 6 has the protruding portion 6a as in the example shown in FIG. 11, the length on the tip side is different from the protruding portion 6a. When combined with the structure in which the diameter or width of the tip side of the lead terminal 6 is smaller than the diameter of the through hole 2a as described above, the connection between the lead terminal 6 and the flexible wiring board 1 is combined. Further improvement in work efficiency can be realized.

また、図８に示す例のように、リード端子６は電子部品５の外面に立設されていてもよい。この場合のリード端子６は、電子部品５本体との接合強度を高めるために、電子部品５との接合部に、所謂ネイルヘッド６ｂを有する形状とすればよい。この場合の突出部６ａとネイルヘッド６ｂとの距離（図８に示すＤ）を、フレキシブル配線基板１の厚み以下になるように形成すると、突起部６ａとネイルヘッド６ｂとでフレキシブル配線基板１を強固に挟み込むことができ、フレキシブル配線基板１を強固に固定することができる。   Further, as in the example shown in FIG. 8, the lead terminal 6 may be erected on the outer surface of the electronic component 5. In this case, the lead terminal 6 may have a shape having a so-called nail head 6b at the joint portion with the electronic component 5 in order to increase the joint strength with the electronic component 5 body. If the distance (D shown in FIG. 8) between the protruding portion 6a and the nail head 6b in this case is formed to be equal to or less than the thickness of the flexible wiring substrate 1, the flexible wiring substrate 1 is formed by the protrusion 6a and the nail head 6b. Thus, the flexible wiring board 1 can be firmly fixed.

リード端子６およびフレキシブル配線基板１の配線３を伝送する信号が10ＧＨｚ程度以上の高周波信号である場合は、フレキシブル配線基板１の貫通孔２ａに電子部品５のリード端子６を挿入して固定した状態で、配線３からリード端子６の先端までの長さ（図３および図６に示すＬ）は、信号の波長の４分の１未満であるのが好ましい。このようにすると、リード端子６の、配線３からリード端子６の先端までの部分において信号の共振が発生することが抑えられるので、共振による伝送損失が大きくなってしまうことが抑えられ、高周波信号の伝送特性に優れた接続構造となる。具体的には、リード端子６およびフレキシブル配線基板１の配線３を伝送する信号の周波数が30ＧＨｚである場合には、配線３からリード端子６の先端までの長さを2.5ｍｍ未満とすればよい。   When the signal transmitted through the lead terminal 6 and the wiring 3 of the flexible wiring board 1 is a high frequency signal of about 10 GHz or more, the lead terminal 6 of the electronic component 5 is inserted and fixed in the through hole 2a of the flexible wiring board 1 Thus, the length from the wiring 3 to the tip of the lead terminal 6 (L shown in FIGS. 3 and 6) is preferably less than a quarter of the signal wavelength. In this way, the occurrence of signal resonance at the portion of the lead terminal 6 from the wiring 3 to the tip of the lead terminal 6 can be suppressed, so that transmission loss due to resonance can be prevented from increasing, and high frequency signals can be suppressed. The connection structure has excellent transmission characteristics. Specifically, when the frequency of the signal transmitted through the lead terminal 6 and the wiring 3 of the flexible wiring board 1 is 30 GHz, the length from the wiring 3 to the tip of the lead terminal 6 may be less than 2.5 mm. .

電子部品５は、その外面から突出するリード端子６を備えるものであれば、図１に示す例のような半導体装置に限らず、コンデンサや光通信装置などに用いられるレーザダイオードやフォトダイオード等であってもよい。また、半導体装置である場合も、図１に示す例のような形態に限られるものではない。例えば、図１に示す例では、リード端子６は、パッケージ10の枠部10ｂを貫通して配置された配線基板12に接続されているが、枠部10ｂに設けた貫通孔内に、ガラス等の封止材によって固定されたものであってもよい。   The electronic component 5 is not limited to the semiconductor device as shown in the example of FIG. 1 as long as it has the lead terminal 6 protruding from the outer surface thereof, but is a laser diode or a photodiode used for a capacitor or an optical communication device. There may be. Further, the semiconductor device is not limited to the form shown in FIG. For example, in the example shown in FIG. 1, the lead terminal 6 is connected to the wiring substrate 12 disposed through the frame portion 10 b of the package 10, but glass or the like is placed in the through hole provided in the frame portion 10 b. It may be fixed by a sealing material.

１：フレキシブル配線基板
２：フレキシブル基板
２ａ：貫通孔
３：接続導体
４：配線
５：リード端子付き電子部品
６：リード端子
６ａ：突出部
６ｂ：ネイルヘッド部
７：接地導体 1: Flexible wiring board 2: Flexible board 2a: Through hole 3: Connection conductor 4: Wiring 5: Electronic component with lead terminal 6: Lead terminal 6a: Protruding part 6b: Nail head part 7: Ground conductor

Claims (4)

貫通孔を有するフレキシブル基板と、前記貫通孔の内面から前記貫通孔の周囲の前記フレキシブル基板の主面にかけて形成された接続導体と、前記フレキシブル基板の前記主面に形成されて前記接続導体に接続された配線とを有するフレキシブル配線基板に対して、リード端子付き電子部品のリード端子が前記貫通孔に挿入されることで前記リード端子と前記接続導体とが電気的に接続される、フレキシブル配線基板とリード端子付き電子部品との接続構造であって、前記接続導体は、前記貫通孔の内面および前記貫通孔の周囲の前記フレキシブル基板の主面において、一部に切欠きを有していて前記貫通孔の全周にわたって形成されておらず、
前記電子部品は複数の前記リード端子を有し、前記フレキシブル配線基板は前記リード端子の配列に対応する複数の前記貫通孔を有しており、前記接続導体は隣接する２つの前記貫通孔間において前記切欠きと前記切欠き以外の部分とが対向しないように形成されていることを特徴とするフレキシブル配線基板とリード端子付き電子部品との接続構造。 A flexible substrate having a through hole; a connection conductor formed from an inner surface of the through hole to a main surface of the flexible substrate around the through hole; and a connection conductor formed on the main surface of the flexible substrate and connected to the connection conductor A flexible wiring board having a wired wiring, wherein the lead terminal and the connection conductor are electrically connected by inserting a lead terminal of an electronic component with a lead terminal into the through hole. And an electronic component with a lead terminal, wherein the connection conductor has a notch in part on an inner surface of the through hole and a main surface of the flexible substrate around the through hole. It is not formed over the entire circumference of the through hole ,
The electronic component has a plurality of lead terminals, the flexible wiring board has a plurality of through holes corresponding to the arrangement of the lead terminals, and the connection conductor is between two adjacent through holes. A connection structure between a flexible wiring board and an electronic component with lead terminals , wherein the cutout and a portion other than the cutout are not opposed to each other . 前記リード端子は、先端部側から前記リード端子付き電子部品の本体側に向かって幅が漸次大きくなる突出部を有することを特徴とする請求項１記載のフレキシブル配線基板とリード端子付き電子部品との接続構造。 2. The flexible wiring board and the electronic component with lead terminal according to claim 1, wherein the lead terminal has a protruding portion whose width gradually increases from the tip side toward the main body side of the electronic component with the lead terminal. Connection structure. 前記リード端子の前記突出部と前記リード端子付き電子部品の本体の外面との間の距離は、前記フレキシブル配線基板の厚み以下であることを特徴とする請求項２記載のフレキシブル配線基板とリード端子付き電子部品との接続構造。 3. The flexible wiring board and the lead terminal according to claim 2, wherein a distance between the protruding portion of the lead terminal and an outer surface of the main body of the electronic component with the lead terminal is equal to or less than a thickness of the flexible wiring board. Connection structure with attached electronic components. 前記電子部品は複数の前記リード端子を有し、前記フレキシブル配線基板は前記リード端子の配列に対応する複数の前記貫通孔を有しており、前記リード端子の前記突出部は隣接する２つの前記リード端子間において対向しないことを特徴とする請求項２又は請求項３に記載のフレキシブル配線基板とリード端子付き電子部品との接続構造。 The electronic component has a plurality of the lead terminals, the flexible wiring board has a plurality of the through holes corresponding to the arrangement of the lead terminals, and the protruding portions of the lead terminals are adjacent to the two 4. The connection structure between a flexible wiring board and an electronic component with lead terminals according to claim 2, wherein the lead terminals are not opposed to each other.
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