JP2018032524A - Terminal, surface mount connector, connector mounting structure and terminal manufacturing method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a terminal in which robust soldering can be achieved even when manufactured after plating pre-processing, and also to provide a surface mount connector equipped with the same and a terminal manufacturing method.SOLUTION: There is provided a terminal 1 in which plating layers 211 and 221 are formed on an upper surface 21 and a lower surface 22 of a linear conductor 2 and a side surface 23 is formed as a fracture surface. The linear conductor 2 has a terminal part 25 extending in parallel with a substrate. A protrusion 31 soldered to the substrate covered with a plating layer 311 is formed on the lower surface of the terminal part 25.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a terminal placed on an electric circuit of a substrate and conductively connected by soldering, a surface mount connector provided with the terminal, a connector mounting structure, and a method for manufacturing the terminal.

  Conventionally, terminals used in connectors are formed by punching a metal flat base material with a press and bending it, followed by plating (post-plating) after forming a terminal composite in which a plurality of terminals are connected by a carrier. Finally, the carrier is broken off.

  The reason for the post-plating treatment is that if the plating treatment is performed before the punching process (pre-plating treatment) and the punching is performed by a press, the plating layer is not formed and soldering cannot be performed. Is formed. And if such a fracture surface is formed, the area of the part where the plating layer is formed in the solder joint cannot be sufficiently secured, the area of the part where the solder adheres becomes small, and the soldered part becomes There is a bug that it becomes vulnerable.

  On the other hand, when the terminal shape is press-molded after the pre-plating process, the plating process is performed more efficiently than the post-plating process in which the plating process is performed after the terminal-shaped press molding because the plating process is performed in the state of the flat plate base material. There is an advantage that the manufacturing period can be shortened and the manufacturing cost can be reduced.

  By the way, there exists a connector as shown in patent document 1 as a prior art example of the connector used by being mounted on the electric circuit of a board | substrate. Such electrical connection between the connector and the electric circuit is performed by soldering the terminals on the electric circuit.

Japanese Patent Application Laid-Open No. 08-045582

  However, with regard to the connector disclosed in Patent Document 1, when the terminal is pre-plated and manufactured at low cost, the side surface of the terminal becomes a broken surface, and the area of the portion used for soldering is reduced. End up. As a result, soldering to an electric circuit becomes difficult, and there is a problem that the strength of the soldered portion is weakened even when soldering is possible. Therefore, it is desired that the terminals used in the surface mount connector can be realized by a pre-plating process and can realize strong soldering even if the side surface has a broken surface that is difficult to solder.

  The present invention has been made against the background of the prior art as described above. The object of the invention is to provide a terminal that can be firmly soldered even if pre-plating is performed, a surface-mounted connector including the terminal, a connector mounting structure, and a method for manufacturing the terminal.

  In order to achieve the above object, the present invention is configured as follows.

  The present invention relates to a terminal composed of a flat wire conductor, and the linear conductor has a terminal portion soldered to the substrate, and protrudes downward on the lower surface of the terminal portion and is soldered to the substrate. It has the convex part attached.

  By forming the convex portion on the lower surface of the terminal portion, it is possible to solder the electric circuit of the substrate through the three-dimensional convex portion. As a result, the terminals are formed by stamping after the pre-plating treatment, and soldering is performed in a wide area using the outer peripheral surface of the convex portion even if the side surface is a cut surface and not covered with the plating layer. And strong soldering can be performed. Moreover, since the terminal subjected to the pre-plating process forms a three-dimensional shape by punching the terminal after performing the pre-plating process on the flat plate base material, the post-plating process for performing the plating process after punching the flat plate base material to form the three-dimensional shape Compared with the case of performing the process, the number of times of plating treatment and labor can be reduced, and it can be manufactured at low cost.

  The convex portion has a shape that is recessed from the upper surface side of the linear conductor and protrudes to the lower surface side.

  The shape of the convex part that is recessed from the upper surface side of the linear conductor and protrudes to the lower surface side can be formed by pressing. Thereby, it is possible to create a plurality of convex portions more easily as compared with the case of creating by molding or cutting with a mold.

  The said convex part can be formed as a protrusion along the longitudinal direction of the said terminal part.

  Since the convex portion is a ridge along the longitudinal direction of the terminal portion, it is possible to secure a large contact area with the solder of the portion used for soldering, and to perform stronger soldering.

  The linear conductor has a bent portion that is connected to the terminal portion and serves as a spring adjacent to the convex portion.

  When the surface of the end portion of the linear conductor facing the substrate is a flat surface, the molten solder paste travels along the flat plate surface and adheres to the adjacent bent portion and hardens. If it does so, the hardening body of solder will adhere to a bending part, and it becomes impossible to use the said bending part as a spring. In contrast, in the present invention, the linear conductor has a bent portion adjacent to the convex portion, and the molten solder paste adheres to the outer peripheral surface of the convex portion, but hardly adheres to the bent portion that is one step higher than the convex portion. For this reason, the bent portion can act as a spring. As a result, even when an external force is applied to the terminal due to displacement of the fitting position or vibration due to vibration, the force can be absorbed by bending of the bent portion, effectively preventing the soldered portion from being damaged. can do.

  The present invention provides a surface mount connector comprising any one of the terminals of the present invention.

  The surface-mounted connector of the present invention can be manufactured at a low cost by a pre-plating process or the like, and can be firmly soldered to the electric circuit of the substrate by fixing the solder to the outer peripheral surface of the convex portion described above.

  The present invention relates to a connector mounting structure in which a tail portion of a terminal protruding from a housing is fixed to a substrate by soldering, the tail portion having a terminal portion facing the substrate, and the terminal portion being in contact with the substrate. Provided is a connector mounting structure which has a convex portion projecting downward on an opposing surface, and wherein the solder projects from the substrate and is formed as a projection covering the outer peripheral surface of the convex portion.

  Since the solder protrudes from the substrate and covers the outer peripheral surface of the convex portion, the contact area of the solder can be expanded over the entire outer peripheral surface of the convex portion, so that strong soldering can be performed.

  The present invention relates to a terminal manufacturing method for manufacturing a terminal from a metal flat base material having a plating layer formed on a surface thereof, and forms a linear conductor that is a part of the terminal by punching the flat base material. A step of forming a connecting portion connected to one end of the linear conductor, a step of forming a convex portion projecting from the lower surface by indenting the upper surface of the connecting portion, and the periphery of the convex portion of the connecting portion And a step of removing the portion.

  Since the three-dimensional shape is formed by punching the terminal after pre-plating the flat plate base material, the number of times of the plating treatment is compared with the case of performing the post-plating treatment after forming the solid shape by punching the flat plate base material. Labor can be reduced, and the terminal can be manufactured at low cost. In addition, since the terminal is punched after the pre-plating process, it becomes a terminal having a cut surface that is not covered with the plating layer on the side surface, but since the convex portion is formed and the contact area with the solder used for soldering increases, The terminal is firmly soldered on the substrate through the convex portion. In addition, the upper surface of the joint portion with excellent mechanical strength is depressed by press working and protruded to the lower surface side to form a convex portion, and the thin linear conductor with weak mechanical strength is depressed to form the convex portion. There is nothing to do. As a result, the linear conductor can be prevented from being bent or cut by the pressing force of the press.

  According to the terminal, the surface mount connector, the connector mounting structure, and the terminal manufacturing method of the present invention, a convex portion that protrudes downward is formed on the lower surface of the terminal portion, so that the solder is interposed through the outer peripheral surface of the convex portion. Even if it is a terminal manufactured by press-working after pre-plating treatment in which the side surface has a fractured surface that is difficult to adhere to plating, strong soldering can be realized. As a result, the connection reliability of the surface mount connector using the terminal can be increased, and a high-quality electronic device can be manufactured at low cost.

The perspective view containing the plane of the terminal by one Embodiment of this invention, a right side, and a back surface. FIG. 2 is a perspective view including a bottom surface, a right side surface, and a front surface of the terminal of FIG. 1. The right view of the terminal of FIG. FIG. 4 is a cross-sectional view of the terminal of FIG. 3 taken along the line AA. The right view which shows the mounting state which soldered the terminal of FIG. 1 to the board | substrate. The perspective view which shows the 1st process of the manufacturing method of the terminal of FIG. BB sectional drawing of the terminal of FIG. The perspective view which shows the 2nd process following FIG. The perspective view which shows the 3rd process following FIG. The perspective view which shows the 3rd process of FIG. The perspective view which shows the 4th process following FIG. The perspective view which shows the 4th process of FIG. The perspective view containing the plane of a surface mount connector provided with the terminal of FIG. 1, a back surface, and a right side surface. The right view which shows the mounting structure of the surface mount connector of FIG.

  Hereinafter, a terminal 1 according to an embodiment of the present invention will be described with reference to the drawings.

Terminal [Fig. 1 to Fig. 5]

  The terminal 1 is formed by punching a pre-plated metal flat base material and bending it with a press. The terminals 1 and 221 are formed on the upper surface 21 and the lower surface 22 of the linear conductor 2. (See FIGS. 4 and 7). As the plating layers 211 and 221, known plating used for connector terminals, such as nickel, tin, and gold, can be appropriately employed. Further, the side surface 23 of the linear conductor 2 has a fractured surface and is a surface on which no plating layer is formed.

  The linear conductor 2 is formed with a tail portion 9 for connection to the substrate 7 on one end side (front end side), and on the other end side (rear end side) to a mating connector to which a surface mount connector is to be connected. A contact portion 4 is provided to be connected to each other, and a fixing portion 42 is formed between the tail portion 9 and the contact portion 4 to be fixed to the housing.

  The tail portion 9 is a portion exposed from the housing, and a spring piece portion 26 and a terminal portion 25 are formed. The tail portion 9 is bent as a whole in a crank shape.

  The spring piece portion 26 is formed with a first extended portion 27, a first bent portion 34, a second extended portion 28, and a second bent portion 33 from the contact portion 4 side.

  The first elongated portion 27 is formed in a straight line, and a first bent portion 34 that acts with a spring is formed at an end portion of the first elongated portion 27. The first bent portion 34 is bent at a right angle from the first elongated portion 27.

  A second extended portion 28 is formed in a straight line from the first bent portion 34, and a second bent portion 33 is formed at the end thereof. The second bent portion 33 is shaped to be bent at a right angle from the second elongated portion 28. And the 2nd bending part 33 is following the terminal part 25, and becomes a site | part which a solder does not adhere at the time of soldering to the board | substrate of the terminal 1. FIG. Since the solder does not adhere to the second bent portion 33, the second bent portion 33 can act as a spring after soldering.

  Corner portions of the first bent portion 34 and the second bent portion 33 are rounded and curved. Since the first bent portion 34 and the second bent portion 33 are formed as rounded curved portions, these portions can be elastically deformed and can act as a spring. Even if an external force is applied to the terminal 1 due to a displacement of the fitting position with the connection object, vibration, or the like, the force can be absorbed by the bending of the first bent portion 34 and the second bent portion 33. It is possible to effectively prevent the attached portion from being damaged.

  When the extension direction of the terminal portion 25 is viewed as a horizontal direction, the linear conductor 2 rises vertically by the second bent portion 33 on the rear end side of the terminal portion 25 to become the second extended portion 28, and the first bent portion In 34, it bends in the horizontal direction again and becomes the first extended portion 27, from which the contact portion 4 extends further in the horizontal direction. The terminal portion 25 and the contact portion 4 extend in opposite directions, and the linear conductor 2 has a linear shape in plan view.

  The terminal portion 25 is formed continuously with the spring piece portion 26 and is a portion facing the substrate 7 when in use. A solder joint 3 that protrudes downward is formed on the distal end side of the terminal portion 25, and a straight straight portion having no irregularities is formed between the solder joint 3 and the second bent portion 33. Yes.

  The solder joint portion 3 is a portion that is conductively connected to the substrate 7 by soldering, and a concave portion 32 is formed on the upper surface 21 side and a convex portion 31 that protrudes on the lower surface 22 side is formed.

  The convex portion 31 and the concave portion 32 are formed by pressing and deforming the base material of the terminal portion 25 from the upper surface 21 side by pressing, and the flat plate material on the upper surface 21 side is recessed to form the concave portion 32, and the lower surface On the side of 22, the base material protrudes to form a convex portion 31.

  The convex portion 31 is formed as a ridge that protrudes in a downward curved shape on the lower surface 22 and extends along the longitudinal direction of the terminal portion 25. A plating layer 311 is formed on the surface of the convex portion 31 so as to be continuous with the plating layer 221 on the lower surface 22. Since the convex portion 31 is formed as a downwardly curved protrusion, the entire outer peripheral surface of the convex portion 31 can be a three-dimensional soldering surface as described later, and the lower surface is simply flat. The area of soldering is increased as compared with the conventional tail portion, and a stronger soldering can be performed.

  The concave portion 32 is formed in a long groove shape, and is formed as a groove whose inner surface corresponds to the convex portion 31, that is, a groove that is recessed downward with respect to the upper surface 21 of the terminal portion 25. A plating layer 321 is formed on the inner side surface of the recess 32 continuously with the plating layer 211 on the upper surface 21.

  The contact portion 4 located inside the housing 101 of the connector 100 is a portion that comes into contact with the terminal of the mating connector to be connected, and the tip portion 41 is tapered so that the terminal 1 can be easily inserted into the housing of the mating connector. It has become.

  The fixing portion 42 is formed with an uneven portion 421 having an uneven shape that is press-fitted into the terminal holding portion of the housing 101, and a protrusion 35 that prevents the contact portion 4 from entering deeper than a predetermined insertion position.

Action and effect of terminal

  According to the terminal 1 described above, the side surface 23 protrudes from the lower surface 22 side of the terminal portion 25 of the terminal 1 even if the side surface 23 is a fracture surface where the plating layer is not formed because it is formed using the pre-plating process. Strong soldering can be performed via the outer peripheral surface of the convex portion 31.

  Further, since the shape of the convex portion 31 is a curved shape that protrudes downward, the solder paste that is melted is bent so as to be sucked up by the surface tension along the outer peripheral surface of the convex portion 31 during soldering. It adheres so as to cover the outer peripheral surface from the lower end to the upper end, and then cools and hardens. Accordingly, the solder 8 forms an outer peripheral surface shape that spreads from the adhesion surface to the outer peripheral surface of the convex portion 31 toward the substrate 7. Therefore, the terminal portion 25 can be firmly soldered to the substrate 7 by the convex portion 31.

  Further, since the spring piece portion 26 is formed, the first bent portion 34 and the second bent portion 33 are applied to the terminal 1 even if an external force is applied to the terminal 1 due to a displacement of the fitting position with the connection object or vibration. The force can be absorbed by the bending of, and the soldering portion can be effectively prevented from being damaged.

Terminal manufacturing method [FIGS. 6 to 12]

  Next, a method for manufacturing the terminal 1 described above will be described. In the first step of the method for manufacturing the terminal 1, first, as shown in FIG. 6, a flat base material having a plating layer formed on the surface is punched to form a terminal composite 10.

  As shown in FIG. 7, the plating layers 211 and 221 remain on the upper surface 21 and the lower surface 22 of the terminal composite 10, while the plating layer is removed from the side surface 23 having a broken surface. Yes.

  In the terminal composite 10, the terminal portion 20 which is the original shape of the plurality of terminals 1 made of the linear conductor 2 having the plating layers 211 and 221 formed on the upper surface 21 and the lower surface 22, respectively, is a part of the terminal portion 20. The unit 5 and the terminal unit 20 are connected by a carrier 6 that is not included.

  In the first step, the linear conductor 2, the contact portion 4, and the fixing portion 42 are formed on the terminal portion 20, but the spring piece portion 26 is not formed. Also, the terminal portion 25 is not formed, and the portion that will later become the terminal portion 25 is a flat plate that is wider than the linear conductor 2 of the terminal portion 20 and is a connecting portion that connects the linear conductors 2 to each other. 5 is formed. The carrier 6 and the connecting portion 5 are formed continuously.

  Between the carrier 6 and the connecting portion 5, a plurality of through-holes 62 and notches 63 having a trapezoidal shape in plan view with the connecting portion 5 side being the bottom are formed. As a result, the connecting portion 61 between the carrier 6 and the connecting portion 5 has a narrowed shape, and the carrier 6 can be easily folded off from the connecting portion 61 later.

  Next, in the second step, as shown in FIG. 8, the upper surface 21 side of the joint portion 5 is depressed into a long groove shape along the extending direction of the terminal portion 20 by pressing so as to protrude toward the lower surface 22 side. A convex portion 31 having a curved shape protruding downward along the extending direction of the portion 20 is formed. At this time, a portion recessed in the shape of a long groove on the upper surface 21 side becomes a recess 32.

  By forming the connecting portion 5, mechanical strength can be ensured, and when the convex portion 31 is formed by causing the upper surface 21 of the connecting portion 5 to be depressed and protruded toward the lower surface 22 side by pressing in the second step. It is possible to prevent the linear conductor 2 of the terminal portion 20 from being bent or cut by the pressing force of the device.

  Next, in the third step, as shown in FIGS. 9 and 10, the terminal composite body 10 is bent by pressing. By this bending process, the linear conductor 2 of the terminal portion 20 is bent, the first bent portion 34 and the second bent portion 33 are formed, and the spring piece portion 26 is formed.

  Next, in a 4th process, as shown in FIG.11 and FIG.12, the peripheral part of the convex part 31 and the recessed part 32 currently formed in the connection part 5 is deleted by the punching by a press, and the terminal part 25 is set to the terminal part 20. FIG. Is formed. Further, the carrier 6 is cut off from the portion between the connecting portion 61 and the convex portion 31, whereby the terminal 1 shown in FIGS.

Effects and effects of the terminal manufacturing method

  In order to perform the pre-plating process on the flat plate base material before the three-dimensional shape is formed, it is possible to put a large number of flat plate base materials at once into the plating apparatus as compared with the case of performing the post-plating process performed after the three-dimensional shape formation. The number of plating processes can be greatly reduced. Therefore, the number and labor of the plating treatment can be reduced as compared with the case where the post-plating treatment is performed, and the terminal 1 can be manufactured at a low cost.

  Further, the convex portion 31 is formed by depression of the upper surface of the wide flat joint portion 5 having excellent mechanical strength by pressing and projecting to the lower surface side, and the linear conductor is thin and weak in mechanical strength. 2 is not depressed and the convex portion 31 is not formed. Therefore, it is possible to prevent the linear conductor 2 from being bent or cut by the pressing force of the press machine.

Surface mount connector [Fig. 13]

  The surface mount connector 100 including the terminal 1 described above is placed on the surface of the substrate and fixed in a state of being electrically connected to the substrate by soldering, and mediates transmission / reception of electric signals between the external electronic device and the substrate. It is a connector.

  The surface mount connector 100 is formed such that the terminal 1 is fixed to the housing 101 by the contact portion 4 of the terminal 1 being inserted into the insertion hole 102 formed in the housing 101 and the fixing portion 42 being locked in the housing 101. ing.

  The housing 101 is formed in a box shape into which the mating connector is inserted, and a plurality of insertion holes for inserting the contact portion 4 of the terminal 1 into the rear surface portion opposite to the fitting port into which the mating connector is inserted. 102 are formed side by side in two rows.

  In addition to the terminal 1, the surface mount connector 100 of FIG. 13 has the structure of the contact portion 4 and the solder except that the linear conductor 2 is longer than the terminal 1 and the protruding direction of the protrusion 35 is reversed. Although the structure of the junction part 3 is provided with the terminal 1 'which is the same, the aspect which has only any one among the terminals 1 and 1' in this invention may be sufficient.

Action and effect of surface mount connector

  The surface mount connector 100 described above can be manufactured at low cost because the number of plating processes required for manufacturing the terminal 1 can be greatly reduced.

  Further, the entire outer peripheral surface of the convex portion 31 of the terminal 1 can be firmly soldered to the substrate by using the solder attachment surface, and the first bent portion 34 and the second bent portion 33 act as springs and serve as terminals. The impact transmitted to 1 can be absorbed, and breakage of the soldered portion can be effectively prevented.

  Thereby, the durability of various devices on which the surface mount connector 100 is mounted can be enhanced, and the manufacturing cost can be reduced.

Connector mounting structure [Figure 14]

  Next, the mounting structure 200 (hereinafter referred to as “connector mounting structure”) of the surface mount connector 100 described above will be described. In FIG. 14, the surface mount connector 100 is schematically shown in a simplified manner.

  In the connector mounting structure 200, the tail portion 9 of the terminal 1 protruding from the housing 101 of the surface mount connector 100 is fixed to the substrate 7 with the hardened solder 8. The tail portion 9 has a terminal portion 25 extending in parallel with the substrate 7, and the terminal portion 25 has a convex portion 31 on the surface facing the substrate 7. Then, the solder 8 is formed in a flared shape in which the outer peripheral surface adheres to the outer peripheral surface of the convex portion 31. Thereby, the whole outer peripheral surface of the convex part 31 is soldered, and firm soldering can be performed.

Modification of the embodiment

  The present invention is not limited to the above-described embodiment, and various modifications can be made. Examples thereof will be described.

  In the above embodiment, the example in which the terminal 1 has the two bent portions 33 and 34 has been described. However, the number of the bent portions may be one or three or more, and the bent portion may not be provided. Good. Even if the number of bent portions is one or three or more, the spring piece portion of the terminal 1 can be easily elastically deformed compared to a linear terminal in which these are not formed, and the terminal is connected to the terminal. Even if an external force is applied due to a displacement of the fitting position with an object, vibration, or the like, the force can be absorbed by bending of the bent portion, so that the soldered portion can be effectively prevented from being damaged.

  In the said embodiment, although the example which provides the one convex part 31 in the solder junction part 3 was shown, it is good also as two or more. Since the surface area of the plating layer to be used for soldering can be increased by increasing the number of the convex portions 31, it is possible to perform stronger soldering.

  In the said embodiment, although the convex part 31 showed the example made into the protrusion along the longitudinal direction of the terminal part 25, it is good also as a dot shape. In this case, since it is difficult to secure a sufficient area of the plating layer when the number of the convex portions 31 is one, it is preferable to form a plurality of dot-like convex portions in a discrete manner.

  In the embodiment, the example in which the convex portion 31 is formed in the downward curved shape on the lower surface 22 is shown, but it may be a downward triangular shape. Also by this, the melted solder paste is bent so as to be sucked up by the surface tension along the outer peripheral surface of the triangular convex portion, and the hardened solder can be adhered so as to cover the entire outer peripheral surface.

DESCRIPTION OF SYMBOLS 1 Terminal 2 Linear conductor 3 Solder junction part 4 Contact part 5 Connecting part 6 Carrier 7 Board | substrate 8 Solder 9 Tail part 10 Terminal composite 20 Terminal part 21 Upper surface 22 Lower surface 23 Side surface 25 Terminal part 26 Spring piece part 27 1st expansion | extension Part 28 Second elongating part 31 Convex part 32 Concave part 33 Second bent part 34 First bent part 35 Protrusion 41 Tip part 42 Fixing part 61 Connection part 62 Through hole 63 Notch part 100 Surface mount connector 101 Housing 102 Insertion hole 211, 221, 311, 321 Plating layer

Claims (7)

In a terminal made of a flat wire conductor,
The linear conductor has a terminal portion to be soldered to the substrate,
A terminal characterized in that it has a projecting portion protruding downward on the lower surface of the terminal portion and soldered to the substrate.
The terminal according to claim 1, wherein the convex portion has a shape that is recessed from the upper surface side of the linear conductor and protrudes toward the lower surface side.
The terminal according to claim 1, wherein the convex portion is formed as a protrusion along the longitudinal direction of the terminal portion.
The terminal according to claim 1, wherein the linear conductor has a bent portion that is connected to the terminal portion and serves as a spring adjacent to the convex portion.
In surface mount connectors with terminals,
The surface mount connector, wherein the terminal is the terminal according to any one of claims 1 to 4.
In the mounting structure of the connector that fixes the tail part of the terminal protruding from the housing to the board with solder,
The tail portion has a terminal portion facing the substrate;
The terminal portion has a convex portion protruding downward on the surface facing the substrate,
The connector mounting structure, wherein the solder protrudes from the substrate and is formed as a protrusion covering the outer peripheral surface of the protrusion.
In the manufacturing method of a terminal for manufacturing a terminal from a metal flat base material having a plating layer formed on the surface,
Forming a linear conductor to be a part of the terminal by punching the flat plate base material, and forming a connecting portion connected to one end of the linear conductor;
Forming a convex portion protruding from the lower surface by indenting the upper surface of the joint portion;
Removing the peripheral portion of the convex portion of the connecting portion;
The manufacturing method of the terminal characterized by comprising.

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