JP2005057495A - Electroacoustic transducer and connection element structure used therefor - Google Patents
Electroacoustic transducer and connection element structure used therefor Download PDFInfo
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- JP2005057495A JP2005057495A JP2003286156A JP2003286156A JP2005057495A JP 2005057495 A JP2005057495 A JP 2005057495A JP 2003286156 A JP2003286156 A JP 2003286156A JP 2003286156 A JP2003286156 A JP 2003286156A JP 2005057495 A JP2005057495 A JP 2005057495A
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Abstract
Description
本発明は、小型電子機器に内蔵する電気音響変換器（例えばスピーカ、レシーバ）に関し、特にはその電気音響変換器のボイスコイルのコイル線と小型電子機器の回路基板の電極との接続構造に関する。 The present invention relates to an electroacoustic transducer (for example, a speaker or a receiver) incorporated in a small electronic device, and more particularly to a connection structure between a coil wire of a voice coil of the electroacoustic transducer and an electrode of a circuit board of the small electronic device.
小型電子機器に内蔵する電気音響変換器としては、図６、図７に示すような、スプリング・コネクタ２１を用いるものが知られている（特許文献１参照）。
特許文献１に示されるもののスプリング・コネクタ２１は、図７に示すように、ハウジング部２２内に収納されたスプリング部材２３に押圧されてハウジング部２２から突出する可動ピン２４から構成され、スプリング・コネクタ２１が基板部材２５にハンダ付けされて固着され、このハンダ付けされた基板部材２５がスピーカ２６（図６）に取り付けられる。
そして、スピーカ２６に取り付けられたスプリング・コネクタ２１の可動ピン２４が、図６に示すように、プリント基板２７の導体部（電極）２８に接触して押し当てられて、電気的にスピーカ回路が接続するものである。
As an electroacoustic transducer built in a small electronic device, one using a spring connector 21 as shown in FIGS. 6 and 7 is known (see Patent Document 1).
As shown in FIG. 7, the spring connector 21 shown in Patent Document 1 includes a movable pin 24 that is pressed by a spring member 23 housed in the housing portion 22 and protrudes from the housing portion 22. The connector 21 is soldered and fixed to the board member 25, and the soldered board member 25 is attached to the speaker 26 (FIG. 6).
Then, as shown in FIG. 6, the movable pin 24 of the spring connector 21 attached to the speaker 26 is pressed against the conductor portion (electrode) 28 of the printed circuit board 27 to electrically connect the speaker circuit. To connect.
この従来のスプリング・コネクタ２１は、コネクタとして独立しているものであり、かつ、基板部材２５にハンダ付けされて用いられるものである。
これらによっては、最近特に要望される小型化、薄型化、軽量化に応えることは難しい。
Depending on these, it is difficult to meet the recent demands for size reduction, thickness reduction, and weight reduction.
本発明が解決しようとする課題は、上記のような事情に鑑み、更なる小型化が進む小型電子機器へ省スペースに配置ができ、低荷重で安定した接続が可能な接点素子を筐体に一体化した電気音響変換器（スピーカ、レシーバ）とその接続構造を提供することを課題とする。 In view of the circumstances as described above, the problem to be solved by the present invention is that a contact element that can be placed in a space-saving manner in a small electronic device that is further miniaturized and that can be stably connected with a low load is provided in the housing. It is an object to provide an integrated electroacoustic transducer (speaker, receiver) and a connection structure thereof.
本発明の電気音響変換器は、マグネット、ボイスコイル、ダイヤフラムを収納する樹脂製筐体に段付貫通孔が設けられており、前記段付貫通孔に導電性ヘッドピン、コイルスプリングがこの順に嵌入され、さらに導電性ソルダーレッグが装着され、前記ボイスコイルからの導線が前記導電性ソルダーレッグに接続されていることを特徴とする。前記段付貫通孔は、三段に構成されていることが好ましい。 In the electroacoustic transducer according to the present invention, a stepped through hole is provided in a resin casing that houses a magnet, a voice coil, and a diaphragm, and a conductive head pin and a coil spring are inserted into the stepped through hole in this order. Furthermore, a conductive solder leg is mounted, and a conductive wire from the voice coil is connected to the conductive solder leg. The stepped through hole is preferably configured in three steps.
本発明によれば、樹脂製筐体に設けた段付貫通孔を利用して実質的に従来のスプリングコネクタと同効のものを構成することができたので、従来必須とされてきた基板部材を用いる必要がなくなり、さらにそれへのハンダ付けも必要としなくなったので、部品点数も減少し、組み立て等の工数も格段に少なくすることができ、小型電気機器のさらなる小型化、薄型化、軽量化に応えることが容易になった。 According to the present invention, since the stepped through hole provided in the resin casing can be used to substantially form the same effect as the conventional spring connector, the board member which has been conventionally required Since there is no need to use soldering and soldering is no longer required, the number of parts can be reduced, and the number of man-hours for assembly can be greatly reduced. It has become easier to meet the needs of
図面に基づいて、本発明を詳細に説明する。
図１は、本発明の電気音響変換器の一実施の形態を示す外観斜視説明図である。
図２は、図１に示す本発明の電気音響変換器の一実施の形態の分解斜視説明図である。
図３は、本発明の接点素子を示す断面説明図である。
図４は、本発明の電気音響変換器の他の実施の形態を示す外観斜視説明図である。
図５は、図４に示す本発明の電気音響変換器の他の実施の形態の分解斜視説明図である。
The present invention will be described in detail with reference to the drawings.
FIG. 1 is an external perspective view showing an embodiment of the electroacoustic transducer of the present invention.
FIG. 2 is an exploded perspective view of one embodiment of the electroacoustic transducer of the present invention shown in FIG.
FIG. 3 is a cross-sectional explanatory view showing the contact element of the present invention.
FIG. 4 is an external perspective explanatory view showing another embodiment of the electroacoustic transducer of the present invention.
FIG. 5 is an exploded perspective view of another embodiment of the electroacoustic transducer of the present invention shown in FIG.
本発明の一実施の形態の電気音響変換器１（図１）を分解斜視説明図として示す図２において、２はマグネット、３はボイスコイル、４はダイヤフラム、１４はカバーであり、これらが樹脂製筐体５に組み込まれる。この実施の形態においては、樹脂製筐体５は、突出部６を有している。
突出部６には、段付貫通孔７が形成されており、段付貫通孔７には、導電性ヘッドピン８、コイルスプリング９、導電性ソルダーレッグ１０が装入される。導電性ヘッドピン８は、拡径部１１を有し、拡径部１１の先にスプリングコイル係合突起１２を有する。導電性ヘッドピン８の拡径部１１が段付貫通孔７の段部に係合することにより、抜け止めされる。コイルスプリング９の一端部は、導電性ヘッドピン８の拡径部１１およびスプリングコイル係合突起１２に係合する。導電性ソルダーレッグ１０は、有底筒状体をなす。コイルスプリング９の他端部は、導電性ソルダーレッグ１０の筒状体部に収納され、その有底部に係合する。
In FIG. 2 showing an electroacoustic transducer 1 (FIG. 1) according to an embodiment of the present invention as an exploded perspective view, 2 is a magnet, 3 is a voice coil, 4 is a diaphragm, and 14 is a cover, which are made of resin. It is incorporated in the housing 5. In this embodiment, the resin casing 5 has a protruding portion 6.
A stepped through hole 7 is formed in the protruding portion 6, and the conductive head pin 8, the coil spring 9, and the conductive solder leg 10 are inserted into the stepped through hole 7. The conductive head pin 8 has an enlarged diameter portion 11, and has a spring coil engagement protrusion 12 at the tip of the enlarged diameter portion 11. The expanded diameter portion 11 of the conductive head pin 8 is engaged with the step portion of the stepped through hole 7 and is prevented from coming off. One end of the coil spring 9 engages with the enlarged diameter portion 11 and the spring coil engagement protrusion 12 of the conductive head pin 8. The conductive solder leg 10 forms a bottomed cylindrical body. The other end of the coil spring 9 is housed in the cylindrical body portion of the conductive solder leg 10 and engages with its bottomed portion.
導電性ヘッドピン８は、小型電子機器の配線基板の電極（図示せず）にコイルスプリング９の弾発力で押圧接触される。導電性ヘッドピン８の配線基板の電極との接触端部は、平面でも良いし、球面状にラウンド状としても良いし、円錐状等の錐体状でも良いし、また、円錐台状等の切頭錐体状をなしていても良い。
段付貫通孔７は、図３に示すように、三段の段付貫通孔とすることができる。三段の段付貫通孔とした場合には、最大径部分に導電性ソルダーレッグ１０が配置され、その段部で、導電性ソルダーレッグ１０が位置決めされる。そして、中径部分に配置されるコイルスプリング９のコイル径を中径部分の径に対応させることができ、それだけ大径とすることができる。
The conductive head pin 8 is pressed into contact with an electrode (not shown) of a wiring board of a small electronic device by the elastic force of the coil spring 9. The contact end portion of the conductive head pin 8 with the electrode of the wiring board may be a flat surface, a round shape in a spherical shape, a cone shape such as a cone shape, or a truncated cone shape or the like. It may have a head cone shape.
As shown in FIG. 3, the stepped through hole 7 can be a three-step stepped through hole. In the case of a three-stage stepped through hole, the conductive solder leg 10 is arranged at the maximum diameter portion, and the conductive solder leg 10 is positioned at the step portion. And the coil diameter of the coil spring 9 arrange | positioned at a medium diameter part can be made to respond | correspond to the diameter of a medium diameter part, and it can be made large by that much.
導電性ヘッドピン８は、銅あるいは真鍮などの銅合金、アルミニウム合金、ニッケルまたはニッケル合金等、適宜の金属製とすることができる。導電性を高めるために、必要に応じてその表面に金メッキ、銅メッキ等の良導電性のメッキを施すことが望ましい。
導電性ソルダーレッグ１０は、導電性ヘッドピン８と同様の金属材料で作製され得る。必要に応じて、導電性とハンダ性を考慮して、メッキ処理されることができる。
コイルスプリング９は、例えば直径３０〜２００μｍ、好ましくは５０〜１００μｍの金属細線が等ピッチ（例えば、０．４ｍｍ）で巻回されることで略円筒状を呈した弾性のコイル状に形成される。
The conductive head pin 8 can be made of an appropriate metal such as a copper alloy such as copper or brass, an aluminum alloy, nickel or a nickel alloy. In order to increase the conductivity, it is desirable to perform plating with good conductivity such as gold plating or copper plating on the surface as necessary.
The conductive solder leg 10 can be made of the same metal material as that of the conductive head pin 8. If necessary, it can be plated in consideration of conductivity and solderability.
The coil spring 9 is formed in an elastic coil shape having a substantially cylindrical shape by winding a thin metal wire having a diameter of, for example, 30 to 200 μm, preferably 50 to 100 μm at an equal pitch (for example, 0.4 mm). .
このコイルスプリングを形成する金属細線としては、リン青銅、銅、ベリリウム銅、ばね鋼、硬鋼、ステンレス鋼、ピアノ線材等の金属線、あるいはこれらの金属線に金メッキした金属細線があげられる。
導電性ソルダーレッグ１０の有底部外面に、ボイスコイル３からの導線１３がハンダ付け、導電性接着剤による接着、等で接合される。
樹脂製筐体５に、以上に述べたマグネット２、ボイスコイル３、導電性ヘッドピン８、コイルスプリング９、コイルスプリング９からの導線１３を組み付け、カバー１４で覆って、図１に示されるような、突出部を有する本発明の電気音響変換器１ができあがる。図１には、突出部６部分に導電性ヘッドピン８の先端部が樹脂製筐体５より突出していることが示されている。
電気音響変換器の突出部６は、小型電子機器に組み付ける際の位置合わせに有効である。
樹脂製筐体５の材質としては、格別の制限はなく、通常のエンジニアリングプラスチックが用いられる。
Examples of the fine metal wires forming the coil spring include metal wires such as phosphor bronze, copper, beryllium copper, spring steel, hard steel, stainless steel, and piano wire, or fine metal wires plated with gold on these metal wires.
The conducting wire 13 from the voice coil 3 is joined to the bottomed outer surface of the conductive solder leg 10 by soldering, bonding with a conductive adhesive, or the like.
The magnet 2, the voice coil 3, the conductive head pin 8, the coil spring 9, and the conductive wire 13 from the coil spring 9 described above are assembled in the resin casing 5, covered with a cover 14, and as shown in FIG. Thus, the electroacoustic transducer 1 of the present invention having the protruding portion is completed. FIG. 1 shows that the tip of the conductive head pin 8 protrudes from the resin casing 5 at the protruding portion 6.
The protruding portion 6 of the electroacoustic transducer is effective for alignment when assembled to a small electronic device.
The material of the resin casing 5 is not particularly limited, and ordinary engineering plastic is used.
本発明の他の実施の形態である電気音響変換器１５を、図４、図５に示す。本発明の他の実施の形態である電気音響変換器１５においては、樹脂製筐体１６はほぼ円形をなし、突出部を有しない。そして、段付貫通孔７は、円形をなす樹脂製筐体１６のほぼ中心位置と、適宜の距離離れた位置とに設けられる。
この実施の形態においては、電気音響変換器１５が全体として円形をなしているので、小型電子機器の配線基板の電極が蛇の目状の電極であれば、向きに関係無しに組み付けることができる。
この、本発明の他の実施の形態である電気音響変換器１５における他の部材は、第一の実施の形態でのものと基本的に相違するところがないので、同一の符号を付して図示することとし、説明は省略する。
The electroacoustic transducer 15 which is other embodiment of this invention is shown in FIG. 4, FIG. In the electroacoustic transducer 15 according to another embodiment of the present invention, the resin casing 16 is substantially circular and does not have a protrusion. And the stepped through-hole 7 is provided in the approximate center position of the resin-made housing | casing 16 which makes | forms a circle | round | yen, and the position away from the appropriate distance.
In this embodiment, since the electroacoustic transducer 15 has a circular shape as a whole, if the electrode of the wiring board of the small electronic device is a snake-like electrode, it can be assembled regardless of the direction.
Since the other members in the electroacoustic transducer 15 according to another embodiment of the present invention are basically not different from those in the first embodiment, the same reference numerals are used for illustration. The explanation will be omitted.
本発明によれば、少ない部品点数で構成され、組み付け工数等も大幅に減少し、小型電子機器のさらなる小型化、薄型化、軽量化が図れるようになったので、小型電子機器用の電気音響変換器として、きわめて有用である。 According to the present invention, it is configured with a small number of parts, and the number of assembling steps and the like are greatly reduced, so that further downsizing, thinning, and weight reduction of small electronic devices can be achieved. It is extremely useful as a converter.
１：（本発明の一実施の形態の）電気音響変換器
２：マグネット
３：ボイスコイル
４：ダイヤフラム
５：樹脂製筐体
６：突出部
７：段付貫通孔
８：導電性ヘッドピン
９：コイルスプリング
１０：導電性ソルダーレッグ
１１：（導電性ヘッドピンの）拡径部
１２：スプリングコイル係合突起
１３：（ボイスコイルからの）導線
１４：カバー
１５：（本発明の他の実施の形態である）電気音響変換器
１６：樹脂製筐体
２１：スプリング・コネクタ
２２：ハウジング部
２３：スプリング部材
２４：可動ピン
２５：基板部材
２６：スピーカ
２７：プリント基板
２８：導体部（電極）
1: Electroacoustic transducer 2 (of one embodiment of the present invention) 2: Magnet 3: Voice coil 4: Diaphragm 5: Resin casing 6: Projection 7: Stepped through hole 8: Conductive head pin 9: Coil Spring 10: Conductive solder leg 11: Expanded portion 12 (of conductive head pin) 12: Spring coil engagement protrusion 13: Conductor 14 (from voice coil): Cover 15: (Another embodiment of the present invention) ) Electroacoustic transducer 16: resin casing 21: spring connector 22: housing portion 23: spring member 24: movable pin 25: substrate member 26: speaker 27: printed circuit board 28: conductor portion (electrode)
Claims (3)
A connection element structure for an electroacoustic transducer, in which a conductive head pin, a coil spring, and a conductive solder leg are fitted into a through hole provided in a housing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2003286156A JP2005057495A (en) | 2003-08-04 | 2003-08-04 | Electroacoustic transducer and connection element structure used therefor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2003286156A JP2005057495A (en) | 2003-08-04 | 2003-08-04 | Electroacoustic transducer and connection element structure used therefor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2005057495A true JP2005057495A (en) | 2005-03-03 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2003286156A Pending JP2005057495A (en) | 2003-08-04 | 2003-08-04 | Electroacoustic transducer and connection element structure used therefor |
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| Country | Link |
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| JP (1) | JP2005057495A (en) |
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101399485B1 (en) | 2012-11-13 | 2014-05-27 | 코트론 코포레이션 | Vibrating element |
| JP2014103652A (en) * | 2012-11-20 | 2014-06-05 | Qinghua Univ | Acoustic chip and acoustic device |
| US9088851B2 (en) | 2012-11-20 | 2015-07-21 | Tsinghua University | Thermoacoustic device array |
| US9161135B2 (en) | 2012-11-20 | 2015-10-13 | Tsinghua University | Thermoacoustic chip |
| US9241221B2 (en) | 2012-11-20 | 2016-01-19 | Tsinghua University | Thermoacoustic chip |
| US9264819B2 (en) | 2012-11-20 | 2016-02-16 | Tsinghua University | Thermoacoustic device |
| US9402127B2 (en) | 2012-11-20 | 2016-07-26 | Tsinghua University | Earphone |
| US9491535B2 (en) | 2012-11-20 | 2016-11-08 | Tsinghua University | Earphone |
| TWI578801B (en) * | 2014-04-30 | 2017-04-11 | 鴻海精密工業股份有限公司 | Earphone |
| US9756442B2 (en) | 2012-11-20 | 2017-09-05 | Tsinghua University | Method for making thermoacoustic device array |
| US9774971B2 (en) | 2012-11-20 | 2017-09-26 | Tsinghua University | Method for making thermoacoustic device |
-
2003
- 2003-08-04 JP JP2003286156A patent/JP2005057495A/en active Pending
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101399485B1 (en) | 2012-11-13 | 2014-05-27 | 코트론 코포레이션 | Vibrating element |
| JP2014103652A (en) * | 2012-11-20 | 2014-06-05 | Qinghua Univ | Acoustic chip and acoustic device |
| US9088851B2 (en) | 2012-11-20 | 2015-07-21 | Tsinghua University | Thermoacoustic device array |
| US9161135B2 (en) | 2012-11-20 | 2015-10-13 | Tsinghua University | Thermoacoustic chip |
| US9241221B2 (en) | 2012-11-20 | 2016-01-19 | Tsinghua University | Thermoacoustic chip |
| US9264819B2 (en) | 2012-11-20 | 2016-02-16 | Tsinghua University | Thermoacoustic device |
| US9402127B2 (en) | 2012-11-20 | 2016-07-26 | Tsinghua University | Earphone |
| US9491535B2 (en) | 2012-11-20 | 2016-11-08 | Tsinghua University | Earphone |
| US9756442B2 (en) | 2012-11-20 | 2017-09-05 | Tsinghua University | Method for making thermoacoustic device array |
| US9774971B2 (en) | 2012-11-20 | 2017-09-26 | Tsinghua University | Method for making thermoacoustic device |
| TWI578801B (en) * | 2014-04-30 | 2017-04-11 | 鴻海精密工業股份有限公司 | Earphone |
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