JP2002141130A - Pressure welding holding type connector and its connecting structure - Google Patents

Pressure welding holding type connector and its connecting structure

Info

Publication number
JP2002141130A
JP2002141130A JP2000334658A JP2000334658A JP2002141130A JP 2002141130 A JP2002141130 A JP 2002141130A JP 2000334658 A JP2000334658 A JP 2000334658A JP 2000334658 A JP2000334658 A JP 2000334658A JP 2002141130 A JP2002141130 A JP 2002141130A
Authority
JP
Japan
Prior art keywords
holder
probe
conductive
hole
toe pin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2000334658A
Other languages
Japanese (ja)
Inventor
Yuichiro Sasaki
勇一郎 佐々木
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shin Etsu Polymer Co Ltd
Shin Etsu Chemical Co Ltd
Original Assignee
Shin Etsu Polymer Co Ltd
Shin Etsu Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shin Etsu Polymer Co Ltd, Shin Etsu Chemical Co Ltd filed Critical Shin Etsu Polymer Co Ltd
Priority to JP2000334658A priority Critical patent/JP2002141130A/en
Priority to PCT/JP2001/008708 priority patent/WO2002035656A1/en
Priority to KR1020037005747A priority patent/KR100562602B1/en
Priority to AT01974667T priority patent/ATE381124T1/en
Priority to EP01974667A priority patent/EP1329991B1/en
Priority to DE60131876T priority patent/DE60131876T2/en
Priority to US10/381,078 priority patent/US6908347B2/en
Priority to CNB018180221A priority patent/CN100557890C/en
Priority to TW090125947A priority patent/TW526329B/en
Publication of JP2002141130A publication Critical patent/JP2002141130A/en
Pending legal-status Critical Current

Links

Abstract

PROBLEM TO BE SOLVED: To provide an inexpensive pressure welding holding type connector and its connecting structure, capable of simplifying connecting work, ensuring electrical connection at a low load, and shortening a conducting passage by lowering the height. SOLUTION: A holder 20 is interposed between an electronic circuit board 1 and an electroacoustic component 10, the holder 20 is formed in a cylinder with bottom, and a probe 30 is installed on the bottom of the holder 20. The probe 30 is composed of an insulating housing 31 integrally formed on the bottom of the holder 20, conducting toe pins 36 are inserted into a plurality of through holes 32 of the housing 31 from the back face in the bottom of the holder 20, a conduction probe 37 slidably passed from the bottom surface of the holder 20 in each through hole 32 and fit to the conducting toe pin 36, and a coil spring 38 inserted into each through hole 32, supported at the opening end of the conducting toe pin 36, and compression-energizing the conducting probe 37 in the bottom surface direction of the holder 20.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本発明は、携帯電話や携帯情
報端末等の本体ケースに組み込まれる圧接挟持型コネク
タ及びその接続構造に関するものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a press-clamp type connector incorporated in a main body case of a portable telephone, a portable information terminal or the like, and a connection structure thereof.

【0002】[0002]

【従来の技術】従来における携帯電話等は、図示しない
が、本体ケースの取付口に小型の電気音響部品(マイク
ロホン、スピーカ等)が嵌着され、この電気音響部品の
複数の電極と電子回路基板の複数の電極とがワイヤを介
してハンダ付けされている。
2. Description of the Related Art Although not shown, a conventional mobile phone or the like has a small electroacoustic component (microphone, speaker, etc.) fitted in a mounting opening of a main body case, and a plurality of electrodes of the electroacoustic component and an electronic circuit board. Are soldered via wires.

【0003】[0003]

【発明が解決しようとする課題】従来における携帯電話
等は、以上のように別途固定が必要な電気音響部品と電
子回路基板とをワイヤでハンダ付けするだけなので、電
気的な接続に高荷重を要し、しかも、電気音響部品が傾
く等して接続の不安定化を招くおそれがあるという大き
な問題がある。また、単にハンダ付けするので、作業の
工程管理が必要不可欠であり、製造コストの低減を図る
こともできない。さらに、近年における携帯電話等の薄
型化、軽量化、小型化に伴い、接続部分の高さ寸法を小
さくする必要があるが、高さ寸法を支障なく小さくする
のは非常に困難であり、これにより導通経路を短縮する
ことも困難である。
As described above, conventional mobile phones and the like merely solder the electro-acoustic components, which need to be separately fixed, to the electronic circuit board with wires, so that a high load is imposed on the electrical connection. In addition, there is a major problem that the connection of the electroacoustic component may become unstable due to tilting of the electroacoustic component. In addition, since the soldering is simply performed, process control of the work is indispensable, and the manufacturing cost cannot be reduced. Furthermore, in recent years, as mobile phones and the like have become thinner, lighter, and smaller, it is necessary to reduce the height of the connection part. However, it is very difficult to reduce the height without trouble. Therefore, it is also difficult to shorten the conduction path.

【0004】本発明は、上記に鑑みなされたもので、接
続作業を簡素化し、低荷重で確実な電気的接続を得るこ
とができ、しかも、高さ寸法を小さくして導通経路を短
縮することのできる安価な圧接挟持型コネクタ及びその
接続構造を提供することを目的としている。
SUMMARY OF THE INVENTION The present invention has been made in view of the above circumstances, and simplifies a connection operation, can obtain a reliable electric connection with a low load, and reduces a height dimension to shorten a conduction path. It is an object of the present invention to provide an inexpensive press-clamp-type connector and a connection structure thereof.

【0005】[0005]

【課題を解決するための手段】請求項1記載の発明にお
いては、上記課題を達成するため、絶縁性のホルダを略
有底筒形に形成し、このホルダの底部にプローブを設け
たものであって、上記プローブを、上記ホルダの底部厚
さ方向に設けられたハウジングの複数の貫通孔にホルダ
の底部側からそれぞれ嵌められる略キャップ状の導電ト
ーピンと、各貫通孔に該ホルダの開口側からスライド可
能に嵌め通されて該導電トーピンと嵌まり合う導電プロ
ーブと、各貫通孔に嵌められて該導電トーピンの開口端
部に接触し、上記導電プローブに貫通されるとともに、
この導電プローブを上記ホルダの開口側に付勢するスプ
リングとから構成し、上記導電トーピンの閉塞底部を露
出させ、上記導電プローブを上記スプリングの付勢力で
上記ホルダの開口側に突出させるようにしたことを特徴
としている。
According to the first aspect of the present invention, in order to achieve the above object, an insulating holder is formed in a substantially cylindrical shape with a bottom, and a probe is provided at the bottom of the holder. A substantially cap-shaped conductive toe pin fitted into each of a plurality of through holes of a housing provided in a thickness direction of the bottom of the holder from a bottom side of the holder, and an opening side of the holder in each through hole. A conductive probe fitted slidably from and fitted with the conductive toe pin, and fitted into each through hole to contact an open end of the conductive toe pin and penetrated by the conductive probe,
The conductive probe is constituted by a spring biasing the opening side of the holder, the closed bottom of the conductive toe pin is exposed, and the conductive probe is protruded toward the opening side of the holder by the biasing force of the spring. It is characterized by:

【0006】なお、上記ホルダの底部にダミープローブ
を設けることが好ましい。また、上記貫通孔に上記導電
トーピンをスライド可能に嵌め、この導電トーピンを上
記スプリングの付勢力で上記ホルダの底部側に突出させ
ることができる。また、請求項4記載の発明において
は、上記課題を達成するため、相対向する電極の間に、
請求項1又は2記載の圧接挟持型コネクタを介在させて
導通するようにしたことを特徴としている。
It is preferable to provide a dummy probe at the bottom of the holder. Further, the conductive toe pin can be slidably fitted in the through hole, and the conductive toe pin can be protruded toward the bottom of the holder by the biasing force of the spring. In the invention according to claim 4, in order to achieve the above object, between the opposed electrodes,
According to another aspect of the present invention, electrical continuity is achieved with the press-connecting connector according to claim 1 interposed therebetween.

【0007】ここで、特許請求の範囲におけるプローブ
は、2〜5本、好ましくは2〜3本程度がコスト的に良
いが、必要に応じて増減することができる。この点につ
いては、ダミープローブについても同様である。導電プ
ローブの端部は、所定の角度で尖った形、断面半円形、
断面半楕円形、断面半小判形、単数複数のピン、クラウ
ン状、略ジベル鋲状等に適宜形成することができる。特
に、導電プローブの端部を円錐や角錐等の鋭利な形に形
成すれば、電極のハンダの酸化膜を破壊して良好な導通
を得ることが可能となる。また、ホルダは、電気接合物
を収納するが、この電気接合物には、少なくとも通信機
器や情報端末機器の各種マイクロホン(例えば、コンデ
ンサ型マイクロホン)、スピーカ等の電気音響部品が含
まれる。電極を有する電気的接合物には、少なくとも各
種回路基板や検査回路基板が含まれる。
Here, the number of probes in the scope of claims is preferably 2 to 5, preferably 2 to 3, in terms of cost, but can be increased or decreased as necessary. In this regard, the same applies to the dummy probe. The end of the conductive probe is pointed at a predetermined angle, semicircular in cross section,
It can be appropriately formed in a semi-elliptical cross section, a semi-oval cross section, a plurality of pins, a crown, a substantially dowel stud, or the like. In particular, if the end of the conductive probe is formed in a sharp shape such as a cone or a pyramid, it becomes possible to break the oxide film of the solder of the electrode and obtain good conduction. The holder accommodates the electrical joint, and the electrical joint includes at least various microphones (for example, condenser microphones) of communication devices and information terminal devices, and electroacoustic components such as speakers. The electrical joint having electrodes includes at least various circuit boards and test circuit boards.

【0008】[0008]

【発明の実施の形態】以下、図面を参照して本発明の好
ましい実施形態を説明すると、本実施形態における圧接
挟持型コネクタは、図1ないし図4に示すように、電子
回路基板1と小型の電気音響部品10との間に介在する
電気音響部品収納用の絶縁性のホルダ20を備え、この
ホルダ20の底部にプローブ30と複数本のダミープロ
ーブ40とをそれぞれ配設してこれらを略同じ大きさ・
高さとし、これらプローブ30と複数本のダミープロー
ブ40とに電気音響部品10を支持させるようにしてい
る。
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A preferred embodiment of the present invention will be described below with reference to the accompanying drawings. As shown in FIG. 1 to FIG. And an insulating holder 20 for accommodating an electro-acoustic component interposed between the electro-acoustic component 10 and a probe 30 and a plurality of dummy probes 40 are provided at the bottom of the holder 20 and these are substantially arranged. Same size
The height is set such that the probe 30 and the plurality of dummy probes 40 support the electroacoustic component 10.

【0009】電子回路基板1は、図1に示すように、例
えば平坦なプリント配線板からなり、表面に複数の電極
2が平坦に配列されている。また、電気音響部品10
は、図1や図3に示すように、例えば携帯電話等の小型
マイクロホンからなり、底面の中心部に円形電極11が
形成され、底面の残部には、円形電極11を囲むドーナ
ツ電極12が形成されている。
As shown in FIG. 1, the electronic circuit board 1 is formed of, for example, a flat printed wiring board, and a plurality of electrodes 2 are arranged on the surface in a flat manner. In addition, the electroacoustic component 10
As shown in FIG. 1 and FIG. 3, a small microphone such as a mobile phone, for example, is formed. A circular electrode 11 is formed in the center of the bottom surface, and a donut electrode 12 surrounding the circular electrode 11 is formed in the remaining bottom surface. Have been.

【0010】ホルダ20は、図1や図2に示すように、
所定の絶縁性エラストマーを使用して断面略U字、略凹
字の有底円筒形に成形され、携帯電話等の本体ケース2
1の取付口22に嵌着されて防振機能、ハウリング防止
機能を発揮する。この弾性を有するホルダ20の具体的
な材料としては、例えば天然ゴム、ポリイソプレン、ポ
リブタジエン、クロロプレンゴム、ポリウレタン系ゴ
ム、シリコーンゴム等があげられる。これらの中でも、
耐候性、圧縮歪み特性、加工性等を考慮すると、シリコ
ーンゴムが材料としては最適である。
The holder 20 is, as shown in FIGS. 1 and 2,
It is formed into a cylindrical shape with a bottom having a substantially U-shaped cross section and a substantially concave shape by using a predetermined insulating elastomer, and a main body case 2 for a mobile phone or the like.
The anti-vibration function and howling prevention function are exhibited by being fitted into the first mounting opening 22. Specific examples of the material of the holder 20 having elasticity include natural rubber, polyisoprene, polybutadiene, chloroprene rubber, polyurethane rubber, and silicone rubber. Among these,
Considering weather resistance, compression strain characteristics, workability, and the like, silicone rubber is the most suitable material.

【0011】ホルダ20の底部については、上記絶縁性
エラストマーで成形しても良いし、そうでなくても良
い。例えば、ホルダ20の底部を所定のプラスチック樹
脂で別に成形することも可能である。この場合の具体的
な材料としては、ABS樹脂、ポリカーボネート、ポリ
プロピレン、塩ビ、ポリエチレン等があげられるが、プ
ローブ30の保持、加工性、コスト等を考慮すると、A
BS樹脂が最適である。また、ホルダ20の開口上面の
内周縁からはフランジ23が半径内方向に突出し、この
フランジ23が電気音響部品10の脱落を有効に防止す
る。
The bottom of the holder 20 may or may not be formed of the insulating elastomer. For example, the bottom of the holder 20 can be separately formed of a predetermined plastic resin. Specific examples of the material in this case include ABS resin, polycarbonate, polypropylene, polyvinyl chloride, polyethylene, and the like.
BS resin is most suitable. Further, a flange 23 protrudes radially inward from the inner peripheral edge of the upper surface of the opening of the holder 20, and the flange 23 effectively prevents the electroacoustic component 10 from falling off.

【0012】プローブ30は、図1、図2、図4に示す
ように、ホルダ20の底部に一体成形される絶縁性のハ
ウジング31と、このハウジング31の上下厚さ方向に
穿孔される複数の貫通孔32と、各貫通孔32にホルダ
20の底部裏面から嵌着固定されるキャップ状の導電ト
ーピン36と、各貫通孔32にホルダ20の底部表面か
らスライド可能に嵌通されて導電トーピン36内に嵌合
する導電プローブ37と、各貫通孔32に嵌入されて導
電トーピン36の開口上端部に接触支持され、導電プロ
ーブ37に貫通され、かつ導電プローブ37の少なくと
も上端部をホルダ20の底部表面方向に弾圧付勢するコ
イルスプリング38とから構成されている。
As shown in FIGS. 1, 2 and 4, the probe 30 has an insulating housing 31 integrally formed on the bottom of the holder 20 and a plurality of holes formed in the housing 31 in the vertical direction. A through hole 32, a cap-shaped conductive toe pin 36 fitted and fixed in each through hole 32 from the bottom rear surface of the holder 20, and a conductive toe pin 36 slidably fitted in each through hole 32 from the bottom surface of the holder 20. And a conductive probe 37 fitted in each of the through-holes 32 and supported in contact with the upper end of the opening of the conductive toe pin 36, penetrated by the conductive probe 37, and at least the upper end of the conductive probe 37 at the bottom of the holder 20. And a coil spring 38 that urges against the surface.

【0013】ハウジング31は、図1、図2、図4に示
すように、所定の材料を使用して薄い単層あるいは複層
の平面長方形・板形に形成され、長手方向に小径の貫通
孔32が所定のピッチ(例えば、0.5mm〜1.27
mm)で一列に並べて穿孔されている。この細長いハウ
ジング31は、耐熱性、寸法安定性、成形性等に優れる
汎用のエンジニアリングプラスチック(例えば、ABS
樹脂、ポリカーボネート、ポリプロピレン、塩ビ、ポリ
エチレン等)を使用して成形される。これらの材料の中
でも、加工性やコスト等を考慮すると、ABS樹脂が材
料としては最適である。
As shown in FIGS. 1, 2 and 4, the housing 31 is formed into a thin single-layer or multi-layer flat rectangular / plate shape using a predetermined material, and has a small diameter through hole in the longitudinal direction. 32 is a predetermined pitch (for example, 0.5 mm to 1.27
mm). The elongated housing 31 is made of a general-purpose engineering plastic (for example, ABS) having excellent heat resistance, dimensional stability, moldability, and the like.
Resin, polycarbonate, polypropylene, PVC, polyethylene, etc.). Among these materials, the ABS resin is most suitable as the material in consideration of workability, cost, and the like.

【0014】各貫通孔32は、図4に示すように、電子
回路基板1側に位置して導電トーピン36に密嵌される
縦長の嵌合孔33と、この嵌合孔33の上端部に形成さ
れて導電トーピン36の開口上端部との間に空間を形成
する区画孔34と、この区画孔34の上端部に段差を介
し形成されて電気音響部品10側に位置する縮径孔35
とから一体連続的に形成されている。
As shown in FIG. 4, each through hole 32 has a vertically long fitting hole 33 which is located on the electronic circuit board 1 side and is closely fitted to the conductive toe pin 36, and has an upper end portion of the fitting hole 33. A partition hole 34 formed to form a space between the upper end of the opening of the conductive toe pin 36 and a reduced diameter hole 35 formed at the upper end of the partition hole 34 via a step and located on the electroacoustic component 10 side.
And are formed integrally and continuously.

【0015】各導電トーピン36は、同図に示すよう
に、例えば金メッキされた導電性の材料、例えば銅、真
鍮、アルミニウムを用いて断面略U字の有底円筒形に形
成されている。この導電トーピン36は、その平坦な閉
塞下面がハウジング31の下面から僅かに突出(突出量
は、0.1〜0.3mm、好ましくは0.1〜0.2m
m程度)し、この閉塞下面が電子回路基板1の電極2に
接触したり、電子回路基板1の電極2にクリームハンダ
からなるハンダ層やACF(anisotropic
conductive film:異方性導電膜)等を
介し適宜固定され、導通を確実化する。
As shown in the drawing, each conductive toe pin 36 is formed in a bottomed cylindrical shape having a substantially U-shaped cross section using, for example, a gold-plated conductive material, for example, copper, brass, or aluminum. The conductive toe pin 36 has a flat closed lower surface slightly protruding from the lower surface of the housing 31 (a protruding amount is 0.1 to 0.3 mm, preferably 0.1 to 0.2 m).
m), and the closed lower surface contacts the electrode 2 of the electronic circuit board 1 or a solder layer made of cream solder or an ACF (anisotropic)
It is appropriately fixed via a conductive film (anisotropic conductive film) or the like to ensure conduction.

【0016】各導電プローブ37は、図4に示すよう
に、例えば金メッキされた導電性の銅、真鍮、アルミニ
ウム、導電性エラストマー等を用いたピンからなる。こ
の導電プローブ37は、上部が径の小さい縮径に形成さ
れ、上端部が径の大きい拡径の円錐状に形成されてお
り、この上端部が電気音響部品10の円形電極11又は
ドーナツ電極12に接触する。
As shown in FIG. 4, each of the conductive probes 37 is made of a pin made of, for example, gold-plated conductive copper, brass, aluminum, conductive elastomer, or the like. The conductive probe 37 has an upper portion formed in a small diameter with a small diameter, and an upper end portion formed in a conical shape with a large diameter in a large diameter, and the upper end portion is formed in a circular electrode 11 or a donut electrode 12 of the electroacoustic component 10. Contact

【0017】各コイルスプリング38は、例えば直径3
0〜100μm、好ましくは30〜80μmの直径を有
する所定の金属細線が例えば50μmの等ピッチで巻回
されることにより形成され、0.5mmの圧縮時に30
g〜60gの荷重を発生させる。金属細線の径を30〜
80μmとするのは、この値の範囲を選択すれば、低コ
ストや低荷重接続の実現が容易となるからである。各コ
イルスプリング38を形成する金属細線としては、リン
青銅、銅、ステンレス、ベリリウム銅、ピアノ線等の金
属線、あるいはこれらの金属線に金メッキした金属細線
が使用される。
Each coil spring 38 has, for example, a diameter of 3
A predetermined thin metal wire having a diameter of 0 to 100 μm, preferably 30 to 80 μm is formed by being wound at an equal pitch of, for example, 50 μm.
g to generate a load of 60 g. The diameter of the thin metal wire is 30 ~
The reason why the thickness is set to 80 μm is that if this value range is selected, low cost and low load connection can be easily realized. As the thin metal wire forming each coil spring 38, a metal wire such as phosphor bronze, copper, stainless steel, beryllium copper, piano wire, or a thin metal wire obtained by plating these metal wires with gold is used.

【0018】各コイルスプリング38の長さとしては、
例えば0.5〜3.0mm、好ましくは1.0〜1.5
mmが良く、半分程度の長さがハウジング31の表面か
ら露出するのが良い。係る範囲とすれば、外部からのノ
イズによる悪影響を回避し、弾性特性を維持することが
可能になるからである。各コイルスプリング38の一端
部である下端部は、図4に示すように、導電トーピン3
6の開口上端部に接触する拡径に形成され、貫通孔32
の区画孔34に密嵌して脱落やずれをきわめて有効に規
制する。
The length of each coil spring 38 is as follows:
For example, 0.5 to 3.0 mm, preferably 1.0 to 1.5
mm is good, and about half the length is preferably exposed from the surface of the housing 31. With such a range, adverse effects due to external noise can be avoided and elastic characteristics can be maintained. The lower end, which is one end of each coil spring 38, is, as shown in FIG.
6 is formed to have an enlarged diameter in contact with the upper end of the opening, and the through hole 32 is formed.
And tightly fits into the partitioning hole 34 to effectively control the dropout or displacement.

【0019】各コイルスプリング38の上端部は、同図
に示すように、導電プローブ37に嵌合する小さな縮径
に形成され、導電プローブ37の溝状を呈した縮径上部
に嵌合して脱落や抜けをきわめて有効に防止する。各コ
イルスプリング38の上端部の径は、下端部、下部、中
央部、上部の径よりも縮径に形成される。具体的には、
最近の電極の低ピッチ化を考慮し、中央部の径よりも
0.05〜0.2mm程度縮径に形成される。これは、
各コイルスプリング38の上端部の径が導電プローブ3
7の上部と同径の場合には、円滑に導電プローブ37が
導電トーピン36に嵌入しないおそれがあるからであ
る。また、クリアランスが大きい場合、貫通孔32全体
が大きくなり、コイルスプリング38の抜け防止機能が
低下するからである。
As shown in the figure, the upper end of each coil spring 38 is formed to have a small diameter that fits with the conductive probe 37, and fits into the groove-shaped reduced upper part of the conductive probe 37. Drops and dropouts are very effectively prevented. The diameter of the upper end of each coil spring 38 is smaller than the diameters of the lower end, the lower part, the center, and the upper part. In particular,
In consideration of the recent pitch reduction of the electrode, the diameter is reduced by about 0.05 to 0.2 mm from the diameter of the central part. this is,
The diameter of the upper end portion of each coil spring 38 is the conductive probe 3
If the diameter is the same as that of the upper part 7, the conductive probe 37 may not smoothly fit into the conductive toe pin 36. Also, if the clearance is large, the entire through hole 32 becomes large, and the function of preventing the coil spring 38 from coming off is reduced.

【0020】さらに、複数本のダミープローブ40は、
図2に示すように、ホルダ20と同様の材料を使用して
ピン状に成形される。各ダミープローブ40は、ホルダ
20の底部に一体化され、上端部がドーナツ電極12に
接触する。
Further, the plurality of dummy probes 40
As shown in FIG. 2, it is formed into a pin shape using the same material as the holder 20. Each dummy probe 40 is integrated with the bottom of the holder 20, and the upper end contacts the donut electrode 12.

【0021】上記構成において、ホルダ20に電気音響
部品10を開口側から嵌合収納してその円形電極11と
ドーナツ電極12とに導電プローブ37、ダミープロー
ブ40の上端面をそれぞれ接触させ、本体ケースの取付
口22にホルダ20を嵌着し、複数本の導電トーピン3
6の下端部を電子回路基板1の電極2に直接圧接、ある
いはACF等で固定接続すれば、携帯電話等の本体ケー
スに電気音響部品10を適切、かつ容易に組み込み、電
子回路基板1と電気音響部品10とを確実に導通するこ
とができる(図1参照)。
In the above configuration, the electroacoustic component 10 is fitted and stored in the holder 20 from the opening side, and the upper ends of the conductive probe 37 and the dummy probe 40 are brought into contact with the circular electrode 11 and the donut electrode 12, respectively. The holder 20 is fitted into the mounting opening 22 of the plurality of conductive toe pins 3.
When the lower end of the electronic component 6 is directly press-contacted to the electrode 2 of the electronic circuit board 1 or fixedly connected by an ACF or the like, the electroacoustic component 10 is appropriately and easily incorporated into a main body case of a mobile phone or the like, and the electric circuit board 1 is electrically connected to the electronic circuit board 1. Conduction with the acoustic component 10 can be ensured (see FIG. 1).

【0022】上記構成によれば、電子回路基板1と電気
音響部品10との間にプローブ30をホルダ20及びハ
ウジング31を介して介在するので、プローブ30を簡
単に組み込んだり、実装することができ、位置決め精度
やアセンブリ性を著しく向上させることが可能となる。
また、導電プローブ37とコイルスプリング38とを一
体化し、導電トーピン36の凹部に導電プローブ37を
往復動可能に嵌入するので、高さ寸法を問題なく小さく
する(1.50mm〜2.00mm程度)ことができ、低
抵抗、低荷重接続(例えば、30g〜60g/ピン)も大
いに期待できる。
According to the above configuration, the probe 30 is interposed between the electronic circuit board 1 and the electroacoustic component 10 via the holder 20 and the housing 31, so that the probe 30 can be easily incorporated or mounted. In addition, the positioning accuracy and the assemblability can be significantly improved.
In addition, since the conductive probe 37 and the coil spring 38 are integrated and the conductive probe 37 is reciprocally fitted into the recess of the conductive toe pin 36, the height dimension can be reduced without any problem (about 1.50 mm to 2.00 mm). And low resistance, low load connections (e.g., 30-60 g / pin) are also highly promising.

【0023】この点に関し、導電トーピン36と導電プ
ローブ37とが周面で常時直接接触し、最短の導通経路
を形成するので、螺旋状に巻かれた長いコイルスプリン
グ38のみを導通経路とする場合と異なり、導通経路を
短縮してインダクタンスの著しい低下、すなわち高周波
特性を実現することができ、加えて導電プローブ37の
全長を短くすることもできる。また、各貫通孔32に安
定性と実装性に優れる導電トーピン36を嵌着して塞
ぎ、導電プローブ37を電気音響部品10の円形電極1
1又はドーナツ電極12に接触させるので、安定した導
通が大いに期待できる。また、導電プローブ37の上端
部を略半球状、半楕球状とすれば、例えコイルスプリン
グ38が前後左右に少々傾斜しても、導通の安定性を確
保することが可能となる。
In this regard, since the conductive toe pin 36 and the conductive probe 37 are always in direct contact with each other on the peripheral surface to form the shortest conductive path, only the long coil spring 38 wound spirally is used as the conductive path. Unlike this, it is possible to realize a remarkable reduction in inductance, that is, high-frequency characteristics by shortening the conduction path, and also to shorten the entire length of the conductive probe 37. Further, a conductive toe pin 36 having excellent stability and mountability is fitted and closed in each through hole 32, and the conductive probe 37 is closed by the circular electrode 1 of the electroacoustic component 10.
Since it is in contact with the first or donut electrode 12, stable conduction can be greatly expected. Further, if the upper end of the conductive probe 37 is substantially hemispherical or semi-elliptical, the stability of conduction can be ensured even if the coil spring 38 is slightly inclined forward, backward, left and right.

【0024】また、区画孔34と導電トーピン36とに
コイルスプリング38の下端部を挟持させるので、簡易
な構成でコイルスプリング38の抜け防止を図ることが
できる。さらに、コイルスプリング38が部分的に径の
異なる三段形状なので、例え導電プローブ37がハウジ
ング31から突出しても、横方向からの外力でなんら悪
影響を蒙ることがない。さらにまた、小型のプローブ3
0とダミープローブ40に電気音響部品10の姿勢を適
正に保持させるので、電気音響部品10の傾きを簡易な
構成できわめて有効に抑制防止することが可能になる。
Since the lower end of the coil spring 38 is sandwiched between the partitioning hole 34 and the conductive toe pin 36, the coil spring 38 can be prevented from coming off with a simple configuration. Furthermore, since the coil spring 38 has a three-stage shape with a partially different diameter, even if the conductive probe 37 protrudes from the housing 31, there is no adverse effect due to external force from the lateral direction. Furthermore, a small probe 3
Since the position of the electroacoustic component 10 is properly held by the dummy probe 40 and 0, the inclination of the electroacoustic component 10 can be extremely effectively suppressed and prevented with a simple configuration.

【0025】次に、図5は本発明の第2の実施形態を示
すもので、この場合には、プローブ30の導電プローブ
37とダミープローブ40の数や配列を、図のように変
更するようにしている。その他の部分については、上記
実施形態と同様であるので説明を省略する。
Next, FIG. 5 shows a second embodiment of the present invention. In this case, the numbers and arrangements of the conductive probes 37 and the dummy probes 40 of the probe 30 are changed as shown in FIG. I have to. The other parts are the same as those in the above-described embodiment, and a description thereof will be omitted.

【0026】次に、図6は本発明の第3の実施形態を示
すもので、この場合には、ハウジング31を複層構造と
し、各貫通孔32を形成する嵌合孔33の下端部を縮径
に形成し、各導電トーピン36を貫通孔32に下方から
スライド可能に嵌入するとともに、各導電プローブ37
の上端部を拡径の半円弧状に湾曲形成し、各コイルスプ
リング38の下端部を拡径に形成して貫通孔32の区画
孔34に遊嵌するようにしている。
FIG. 6 shows a third embodiment of the present invention. In this case, the housing 31 has a multi-layer structure, and the lower end of a fitting hole 33 forming each through hole 32 is formed. Each conductive toe pin 36 is slidably fitted into the through-hole 32 from below.
The upper end of the coil spring 38 is formed in a curved shape in a semicircular shape with an enlarged diameter, and the lower end of each coil spring 38 is formed with an enlarged diameter so as to be loosely fitted in the partition hole 34 of the through hole 32.

【0027】各導電トーピン36の下端面は、断面略半
円弧状に湾曲形成されている。導電トーピン36の上部
外周面は、拡径に形成され、嵌合孔33とその縮径部分
の段差部に係止して脱落しないよう機能する。このよう
な導電トーピン36は、固定されるのではなく、コイル
スプリング38の弾圧付勢力でホルダ20のハウジング
31から下方向に上下動可能に突出する。その他の部分
については、上記実施形態と同様であるので説明を省略
する。
The lower end face of each conductive toe pin 36 is formed in a curved shape having a substantially semicircular cross section. The upper outer peripheral surface of the conductive toe pin 36 is formed to have an enlarged diameter, and functions so as to be engaged with the fitting hole 33 and the step portion of the reduced diameter portion so as not to fall off. Such a conductive toe pin 36 is not fixed but protrudes downward and upward from the housing 31 of the holder 20 by the elastic force of the coil spring 38. The other parts are the same as those in the above-described embodiment, and a description thereof will be omitted.

【0028】次に、図7は本発明の第4の実施形態を示
すもので、この場合には、各導電プローブ37の上部周
面から係止フランジ41を半径外方向に突出させ、各導
電プローブ37の上端部を拡径に形成することなく断面
半円弧状に湾曲形成し、各コイルスプリング38の下端
部・中央部を伸長した区画孔34に遊嵌するとともに、
各コイルスプリング38の上端部を縮径に形成すること
なく略円柱状に形成し、導電プローブ37の係止フラン
ジ41及び導電トーピン36の上部外周面に嵌合当接す
るようにしている。導電プローブ37の係止フランジ4
1は、区画孔34と縮径孔35の段差部に係止して外れ
たり、抜けないよう機能する。その他の部分について
は、上記実施形態と同様であるので説明を省略する。
Next, FIG. 7 shows a fourth embodiment of the present invention. In this case, the locking flange 41 is projected radially outward from the upper peripheral surface of each conductive probe 37, and each conductive probe 37 The upper end of the probe 37 is formed in a semicircular cross-section without forming an enlarged diameter, and the lower end and the center of each coil spring 38 are loosely fitted into the elongated partition hole 34.
The upper end of each coil spring 38 is formed in a substantially cylindrical shape without being formed in a reduced diameter, and is fitted and abutted on the locking flange 41 of the conductive probe 37 and the upper outer peripheral surface of the conductive toe pin 36. Locking flange 4 of conductive probe 37
1 functions so as to be locked in the step portion between the partitioning hole 34 and the reduced diameter hole 35 so as not to come off or come off. The other parts are the same as those in the above-described embodiment, and a description thereof will be omitted.

【0029】次に、図8は本発明の第5の実施形態を示
すもので、この場合には、ハウジング31を複層構造と
し、各貫通孔32を形成する嵌合孔33の下端部を縮径
に形成し、各導電トーピン36を貫通孔32にスライド
可能に嵌入するとともに、各導電プローブ37の上端部
を尖った拡径の略歯形滑節ジベル状に形成して円形電極
11又はドーナツ電極12の例えばハンダメッキによる
酸化膜を破壊可能とし、各コイルスプリング38の下端
部を拡径に形成して貫通孔32の区画孔34に遊嵌する
ようにしている。その他の部分については、上記実施形
態と同様であるので説明を省略する。
Next, FIG. 8 shows a fifth embodiment of the present invention. In this case, the housing 31 has a multi-layer structure, and the lower end of a fitting hole 33 forming each through hole 32 is provided. Each of the conductive toe pins 36 is slidably fitted into the through-hole 32, and the upper end of each of the conductive probes 37 is formed in a sharply enlarged, substantially tooth-shaped smooth dovetail shape to form the circular electrode 11 or the donut. An oxide film formed by, for example, solder plating of the electrode 12 can be destroyed, and the lower end of each coil spring 38 is formed to have an enlarged diameter so that it can fit loosely into the partition hole 34 of the through hole 32. The other parts are the same as those in the above-described embodiment, and a description thereof will be omitted.

【0030】なお、上記実施形態では貫通孔32を備え
たハウジング31をホルダ20の底部に一体化したが、
なんらこれに限定されるものではなく、例えば図5に示
すように、ホルダ20の底部に、例えばプラスチック樹
脂により成形されたハウジング31を底部全体に設け、
該底部に複数の貫通孔32を直接設けても良い。ハウジ
ング31は、長方形でも良いが、正方形、円形、楕円
形、小判形等でも良い。さらに、上記第1、2、3、
4、5の実施形態は適宜変更したり、組み合わせること
が可能である。
In the above embodiment, the housing 31 having the through hole 32 is integrated with the bottom of the holder 20.
However, the present invention is not limited to this. For example, as shown in FIG.
A plurality of through holes 32 may be provided directly on the bottom. The housing 31 may be rectangular, but may be square, circular, oval, oval, or the like. Further, the first, second, third,
The fourth and fifth embodiments can be appropriately changed or combined.

【0031】[0031]

【発明の効果】以上のように本発明によれば、接続作業
を簡素化し、低荷重で確実な電気的接続を得ることがで
きるという効果がある。また、高さ寸法を小さくして導
通経路を短縮することが可能となる。
As described above, according to the present invention, there is an effect that the connection operation can be simplified and a reliable electric connection can be obtained with a low load. In addition, it is possible to shorten the conduction path by reducing the height dimension.

【図面の簡単な説明】[Brief description of the drawings]

【図1】本発明に係る圧接挟持型コネクタの接続構造の
実施形態を示す断面全体図である。
FIG. 1 is an overall sectional view showing an embodiment of a connection structure of a press-clamping connector according to the present invention.

【図2】本発明に係る圧接挟持型コネクタの実施形態を
示す底面図である。
FIG. 2 is a bottom view showing the embodiment of the press-contact and pinch type connector according to the present invention.

【図3】本発明に係る圧接挟持型コネクタの実施形態に
おける電気音響部品を示す斜視図である。
FIG. 3 is a perspective view showing an electroacoustic component in the embodiment of the press-connecting connector according to the present invention.

【図4】本発明に係る圧接挟持型コネクタの実施形態を
示す要部断面説明図である。
FIG. 4 is an explanatory cross-sectional view of a main part showing an embodiment of the press-contact pinching connector according to the present invention.

【図5】本発明に係る圧接挟持型コネクタの第2の実施
形態を示す底面図である。
FIG. 5 is a bottom view showing a second embodiment of the press-contact pinching connector according to the present invention.

【図6】本発明に係る圧接挟持型コネクタの第3の実施
形態を示す断面説明図である。
FIG. 6 is an explanatory sectional view showing a third embodiment of the press-contact and pinch type connector according to the present invention.

【図7】本発明に係る圧接挟持型コネクタの第4の実施
形態を示す断面説明図である。
FIG. 7 is an explanatory sectional view showing a fourth embodiment of the press-contact and pinch type connector according to the present invention.

【図8】本発明に係る圧接挟持型コネクタの第5の実施
形態を示す断面説明図である。
FIG. 8 is an explanatory sectional view showing a fifth embodiment of the press-contact and pinch type connector according to the present invention.

【符号の説明】[Explanation of symbols]

1 電子回路基板 2 電極 10 電気音響部品 11 円形電極(電極) 12 ドーナツ電極(電極) 20 ホルダ 30 プローブ 31 ハウジング 32 貫通孔 36 導電トーピン 37 導電プローブ 38 コイルスプリング(スプリング) 40 ダミープローブ DESCRIPTION OF SYMBOLS 1 Electronic circuit board 2 Electrode 10 Electroacoustic component 11 Circular electrode (electrode) 12 Donut electrode (electrode) 20 Holder 30 Probe 31 Housing 32 Through-hole 36 Conductive topin 37 Conductive probe 38 Coil spring (spring) 40 Dummy probe

Claims (4)

【特許請求の範囲】[Claims] 【請求項1】 絶縁性のホルダを略有底筒形に形成し、
このホルダの底部にプローブを設けた圧接挟持型コネク
タであって、 上記プローブを、上記ホルダの底部厚さ方向に設けられ
たハウジングの複数の貫通孔にホルダの底部側からそれ
ぞれ嵌められる略キャップ状の導電トーピンと、各貫通
孔に該ホルダの開口側からスライド可能に嵌め通されて
該導電トーピンと嵌まり合う導電プローブと、各貫通孔
に嵌められて該導電トーピンの開口端部に接触し、上記
導電プローブに貫通されるとともに、この導電プローブ
を上記ホルダの開口側に付勢するスプリングとから構成
し、 上記導電トーピンの閉塞底部を露出させ、上記導電プロ
ーブを上記スプリングの付勢力で上記ホルダの開口側に
突出させるようにしたことを特徴とする圧接挟持型コネ
クタ。
1. An insulating holder is formed in a substantially cylindrical shape with a bottom.
A pressure-contacting / clamping type connector in which a probe is provided at the bottom of the holder, wherein the probe has a substantially cap shape which is fitted from a bottom side of the holder to a plurality of through holes of a housing provided in a thickness direction of the bottom of the holder. A conductive probe that is slidably fitted into each through-hole from the opening side of the holder and fits with the conductive toe pin; and a conductive probe that is fitted into each through-hole and contacts the open end of the conductive toe pin. A spring penetrating the conductive probe and biasing the conductive probe toward the opening of the holder, exposing a closed bottom portion of the conductive toe pin, and pressing the conductive probe with the biasing force of the spring. A press-clamp type connector characterized in that it protrudes toward the opening side of the holder.
【請求項2】 上記ホルダの底部にダミープローブを設
けた請求項1記載の圧接挟持型コネクタ。
2. The press-clamping connector according to claim 1, wherein a dummy probe is provided at the bottom of the holder.
【請求項3】 上記貫通孔に上記導電トーピンをスライ
ド可能に嵌め、この導電トーピンを上記スプリングの付
勢力で上記ホルダの底部側に突出させるようにした請求
項1又は2記載の圧接挟持型コネクタ。
3. The press-clamping connector according to claim 1, wherein the conductive toe pin is slidably fitted in the through hole, and the conductive toe pin is projected to the bottom side of the holder by the urging force of the spring. .
【請求項4】 相対向する電極の間に、請求項1又は2
記載の圧接挟持型コネクタを介在させて導通するように
したことを特徴とする圧接挟持型コネクタの接続構造。
4. The method according to claim 1, wherein the electrodes are opposed to each other.
A connection structure for a press-clamp type connector, wherein the connection is made by interposing the press-clamp type connector described above.
JP2000334658A 2000-10-26 2000-11-01 Pressure welding holding type connector and its connecting structure Pending JP2002141130A (en)

Priority Applications (9)

Application Number Priority Date Filing Date Title
JP2000334658A JP2002141130A (en) 2000-11-01 2000-11-01 Pressure welding holding type connector and its connecting structure
PCT/JP2001/008708 WO2002035656A1 (en) 2000-10-26 2001-10-03 Press contact clamping connector and its connection structure
KR1020037005747A KR100562602B1 (en) 2000-10-26 2001-10-03 Press contact clamping connector and its connection structure
AT01974667T ATE381124T1 (en) 2000-10-26 2001-10-03 PRESS CONNECTOR AND CORRESPONDING CONNECTION STRUCTURE
EP01974667A EP1329991B1 (en) 2000-10-26 2001-10-03 Compression type connector and the connecting structure thereof
DE60131876T DE60131876T2 (en) 2000-10-26 2001-10-03 PRESS CONNECTORS AND CORRESPONDING CONNECTION STRUCTURE
US10/381,078 US6908347B2 (en) 2000-10-26 2001-10-03 Compression type connector and the connecting structure thereof
CNB018180221A CN100557890C (en) 2000-10-26 2001-10-03 Press contact clamping connector and syndeton thereof
TW090125947A TW526329B (en) 2000-10-26 2001-10-19 Pressure contact pinching type connector and its connecting structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000334658A JP2002141130A (en) 2000-11-01 2000-11-01 Pressure welding holding type connector and its connecting structure

Publications (1)

Publication Number Publication Date
JP2002141130A true JP2002141130A (en) 2002-05-17

Family

ID=18810534

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000334658A Pending JP2002141130A (en) 2000-10-26 2000-11-01 Pressure welding holding type connector and its connecting structure

Country Status (1)

Country Link
JP (1) JP2002141130A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005317227A (en) * 2004-04-27 2005-11-10 Shin Etsu Polymer Co Ltd Pressure contact holding connector
WO2006061991A1 (en) * 2004-12-08 2006-06-15 Matsushita Electric Industrial Co., Ltd. Microphone and its manufacturing method

Citations (3)

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JPH06168756A (en) * 1992-11-30 1994-06-14 Nec Kansai Ltd Contact pin
JPH10189111A (en) * 1996-12-25 1998-07-21 Sony Corp Spring contact device
JPH10214649A (en) * 1997-01-30 1998-08-11 Yokowo Co Ltd Spring connector and device using spring connector

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Publication number Priority date Publication date Assignee Title
JPH06168756A (en) * 1992-11-30 1994-06-14 Nec Kansai Ltd Contact pin
JPH10189111A (en) * 1996-12-25 1998-07-21 Sony Corp Spring contact device
JPH10214649A (en) * 1997-01-30 1998-08-11 Yokowo Co Ltd Spring connector and device using spring connector

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005317227A (en) * 2004-04-27 2005-11-10 Shin Etsu Polymer Co Ltd Pressure contact holding connector
WO2006061991A1 (en) * 2004-12-08 2006-06-15 Matsushita Electric Industrial Co., Ltd. Microphone and its manufacturing method

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