JP2012091317A5 - - Google Patents

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Publication number
JP2012091317A5
JP2012091317A5 JP2011237797A JP2011237797A JP2012091317A5 JP 2012091317 A5 JP2012091317 A5 JP 2012091317A5 JP 2011237797 A JP2011237797 A JP 2011237797A JP 2011237797 A JP2011237797 A JP 2011237797A JP 2012091317 A5 JP2012091317 A5 JP 2012091317A5
Authority
JP
Japan
Prior art keywords
cavity
wall sections
cap structure
side wall
structure according
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2011237797A
Other languages
English (en)
Japanese (ja)
Other versions
JP2012091317A (ja
Filing date
Publication date
Priority claimed from DE10004964A external-priority patent/DE10004964B4/de
Application filed filed Critical
Publication of JP2012091317A publication Critical patent/JP2012091317A/ja
Publication of JP2012091317A5 publication Critical patent/JP2012091317A5/ja
Pending legal-status Critical Current

Links

JP2011237797A 2000-02-04 2011-10-28 マイクロメカニック式のキャップ構造 Pending JP2012091317A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE10004964A DE10004964B4 (de) 2000-02-04 2000-02-04 Mikromechanische Kappenstruktur
DE10004964.8 2000-02-04

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP2001027356A Division JP2001269900A (ja) 2000-02-04 2001-02-02 マイクロメカニック式のキャップ構造及びその製造方法

Publications (2)

Publication Number Publication Date
JP2012091317A JP2012091317A (ja) 2012-05-17
JP2012091317A5 true JP2012091317A5 (https=) 2012-08-02

Family

ID=7629842

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2001027356A Pending JP2001269900A (ja) 2000-02-04 2001-02-02 マイクロメカニック式のキャップ構造及びその製造方法
JP2011237797A Pending JP2012091317A (ja) 2000-02-04 2011-10-28 マイクロメカニック式のキャップ構造

Family Applications Before (1)

Application Number Title Priority Date Filing Date
JP2001027356A Pending JP2001269900A (ja) 2000-02-04 2001-02-02 マイクロメカニック式のキャップ構造及びその製造方法

Country Status (3)

Country Link
US (1) US6462392B1 (https=)
JP (2) JP2001269900A (https=)
DE (1) DE10004964B4 (https=)

Families Citing this family (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6940636B2 (en) 2001-09-20 2005-09-06 Analog Devices, Inc. Optical switching apparatus and method of assembling same
US6893574B2 (en) * 2001-10-23 2005-05-17 Analog Devices Inc MEMS capping method and apparatus
US6933163B2 (en) 2002-09-27 2005-08-23 Analog Devices, Inc. Fabricating integrated micro-electromechanical systems using an intermediate electrode layer
US6964882B2 (en) 2002-09-27 2005-11-15 Analog Devices, Inc. Fabricating complex micro-electromechanical systems using a flip bonding technique
TWI251712B (en) * 2003-08-15 2006-03-21 Prime View Int Corp Ltd Interference display plate
TW593127B (en) * 2003-08-18 2004-06-21 Prime View Int Co Ltd Interference display plate and manufacturing method thereof
US7424198B2 (en) 2004-09-27 2008-09-09 Idc, Llc Method and device for packaging a substrate
US8124434B2 (en) 2004-09-27 2012-02-28 Qualcomm Mems Technologies, Inc. Method and system for packaging a display
US7573547B2 (en) 2004-09-27 2009-08-11 Idc, Llc System and method for protecting micro-structure of display array using spacers in gap within display device
US7446926B2 (en) * 2004-09-27 2008-11-04 Idc, Llc System and method of providing a regenerating protective coating in a MEMS device
US7405924B2 (en) 2004-09-27 2008-07-29 Idc, Llc System and method for protecting microelectromechanical systems array using structurally reinforced back-plate
US7701631B2 (en) 2004-09-27 2010-04-20 Qualcomm Mems Technologies, Inc. Device having patterned spacers for backplates and method of making the same
US7668415B2 (en) 2004-09-27 2010-02-23 Qualcomm Mems Technologies, Inc. Method and device for providing electronic circuitry on a backplate
US7184202B2 (en) 2004-09-27 2007-02-27 Idc, Llc Method and system for packaging a MEMS device
WO2007120887A2 (en) 2006-04-13 2007-10-25 Qualcomm Mems Technologies, Inc Packaging a mems device using a frame
JP2008135690A (ja) * 2006-10-30 2008-06-12 Denso Corp 半導体力学量センサおよびその製造方法
DE102006061943B4 (de) 2006-12-29 2023-03-30 Pictiva Displays International Limited Lichtemittierende Vorrichtung
US8830695B2 (en) 2007-01-25 2014-09-09 Osram Opto Semiconductors Gmbh Encapsulated electronic device
DE102007044806A1 (de) * 2007-09-20 2009-04-02 Robert Bosch Gmbh Mikromechanisches Bauelement und Verfahren zur Herstellung eines mikromechanischen Bauelements
EP2349914A2 (en) * 2008-10-29 2011-08-03 Nxp B.V. An integrated component and a method of manufacturing an integrated component
US8379392B2 (en) 2009-10-23 2013-02-19 Qualcomm Mems Technologies, Inc. Light-based sealing and device packaging
EP2327658B1 (en) * 2009-11-30 2018-07-04 IMEC vzw Method for manufacturing microelectronic devices and devices according to such method
JP2013519917A (ja) * 2010-02-12 2013-05-30 エーゲンライト・コーポレーション 一列に並んだ光ファイバーデバイス用のリード線付き貫通接続部を有する気密性パッケージおよび作製方法
DE102012222426B4 (de) * 2012-12-06 2015-01-08 Robert Bosch Gmbh Herstellungsverfahren für ein mikromechanisches Bauelement
ITTO20130247A1 (it) * 2013-03-26 2014-09-27 St Microelectronics Srl Metodo di incapsulamento di un dispositivo trasduttore mems e dispositivo trasduttore mems incapsulato
DE102020213772A1 (de) * 2020-11-03 2022-05-05 Robert Bosch Gesellschaft mit beschränkter Haftung Mikromechanisches Bauelement

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6013314B2 (ja) * 1978-08-09 1985-04-06 株式会社日立製作所 圧力−電気信号変換装置
US4699006A (en) * 1984-03-19 1987-10-13 The Charles Stark Draper Laboratory, Inc. Vibratory digital integrating accelerometer
DD272704A1 (de) * 1988-05-18 1989-10-18 Teltov Geraete Regler Quadratische oder rechteckfoermige (100)-orientierte membran aus monokristallinem silizium und verfahren zur herstellung
JP2728807B2 (ja) * 1991-07-24 1998-03-18 株式会社日立製作所 静電容量式加速度センサ
JP2776142B2 (ja) * 1992-05-15 1998-07-16 株式会社日立製作所 加速度センサ
DE4218789A1 (de) * 1992-06-06 1993-12-09 Philips Patentverwaltung Mikroelektronikkompatibler pyroelektrischer Detektor und Verfahren zu seiner Herstellung
JPH07159432A (ja) * 1993-12-03 1995-06-23 Matsushita Electric Works Ltd 半導体加速度センサ
JPH0832088A (ja) * 1994-07-12 1996-02-02 Seiko Instr Inc 半導体加速度センサのストッパーの形成方法
SE9500729L (sv) * 1995-02-27 1996-08-28 Gert Andersson Anordning för mätning av vinkelhastighet i enkristallint material samt förfarande för framställning av sådan
JPH08274208A (ja) * 1995-03-29 1996-10-18 Toyo Commun Equip Co Ltd セラミックパッケージの封止蓋の構造
JP3613838B2 (ja) * 1995-05-18 2005-01-26 株式会社デンソー 半導体装置の製造方法
DE19620940A1 (de) * 1995-11-17 1997-05-22 Werner Prof Dr Buff Elektronisches Bauelement und Verfahren zu seiner Herstellung
JP3767836B2 (ja) * 1997-06-13 2006-04-19 シャープ株式会社 変形可能ミラー及びその製造方法
DE19757197A1 (de) * 1997-12-22 1999-06-24 Bosch Gmbh Robert Herstellungsverfahren für mikromechanische Vorrichtung
DE19819456B4 (de) * 1998-04-30 2011-06-09 Robert Bosch Gmbh Verfahren zur Herstellung eines mikromechanischen Bauelements
US6201283B1 (en) * 1999-09-08 2001-03-13 Trw Inc. Field effect transistor with double sided airbridge

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