JP2012084715A - Deflection correction device of substrate and extraction method of substrate - Google Patents

Abstract

PROBLEM TO BE SOLVED: To prevent collision of a conveyance arm and a substrate without requiring major improvements of an existing facility.SOLUTION: The deflection correction device 3 comprises a support rod 5 (energizing means) which can move in a direction substantially perpendicular to the surface of a wafer (substrate) W housed in a carrier 1. The support rod 5 corrects deflection of the wafer W by abutting against or facing the central portion of the wafer W housed in the carrier 1 and energizing the central portion of the wafer W. When the wafer W is extracted by inserting a conveyance arm 2 to the underside of the wafer W in a state where deflection of the wafer W is prevented, collision of the conveyance arm 2 and the wafer W can be prevented reliably.

Description

  The present invention relates to an apparatus for correcting the deflection of a substrate such as a wafer, and a method for taking out a substrate using the same.

  In a semiconductor device manufacturing process, inspection process, and the like, a carrier that stores a plurality of wafers is used. The carrier is provided with a plurality of upper and lower shelf-shaped wafer receiving portions on which the peripheral edge portion of the wafer is placed on the opposing inner surface of the box-shaped container. When taking out the wafer from the carrier, a U-shaped transfer arm is inserted into the lower side of the wafer from the opening on the front surface of the carrier, and the wafer is lifted about 1 mm from the wafer receiving portion and taken out from the carrier.

  In recent years, thin wafers having a thickness of 200 μm or less have been widely used. Such a thin wafer is known to bend about 1.5 mm by its own weight when the outer diameter is 6 inches, for example. Therefore, when the transfer arm is inserted below the wafer, there is a problem that the transfer arm and the wafer collide with each other and the wafer or the arm is damaged.

  As a technique for preventing the occurrence of cracks or cracks due to wafer warpage, a technique is known in which a carrier is provided with a first support part for supporting the peripheral edge of the wafer and a second support part for supporting the center of the wafer. (For example, refer to Patent Document 1).

  Further, regarding a technique for taking out a large glass substrate that is likely to be warped from a carrier, a U-shaped side support arm that holds both ends of the glass substrate and a center support arm that holds the center of the glass substrate are provided. A technique has been proposed in which a step corresponding to the amount of warp of the glass substrate is provided between the part support arm and the center support arm (see, for example, Patent Document 2).

  In addition, a technique has been proposed in which the gravity load of the substrate is distributed in the vertical direction and the horizontal direction by tilting the carrier containing the substrate such as a wafer or a glass plate as a whole to reduce the amount of bending (for example, (See Patent Document 3).

JP 2000-332097 A (see FIGS. 6 and 8) Japanese Patent Laying-Open No. 2005-285823 (see FIG. 5) JP-A-9-159616 (see FIG. 1)

  However, in the techniques disclosed in Patent Documents 1 to 3 described above, a significant improvement is required for an apparatus for taking out a substrate, such as a transfer arm and a carrier, which causes an increase in manufacturing cost. Further, in the techniques disclosed in Patent Documents 1 to 3, since a substrate having a large deflection amount due to its own weight as compared with the outer diameter, such as a wafer having a thickness of 200 μm or less, is not considered, even if these techniques are applied. It is difficult to sufficiently prevent a collision between the transfer arm and the substrate.

  The present invention has been made to solve the above-described problems, and an object of the present invention is to prevent a collision between a transfer arm and a substrate without significantly improving existing equipment.

  The substrate deflection correcting device according to the present invention includes urging means that is movable in a direction substantially orthogonal to the surface of the substrate accommodated in the carrier, and the urging means is located at the center of the substrate accommodated in the carrier. The bending of the substrate is corrected by urging the central portion of the substrate in contact with or facing the portion.

  In the present invention, the urging means urges the central portion of the substrate to correct the bending, so that in this state, if the transfer arm is inserted under the substrate and the substrate is taken out, the substrate and the transfer arm Can be prevented. Further, since a conventional transfer arm can be used, it is not necessary to significantly improve existing equipment, and the manufacturing cost can be reduced.

It is a front view which shows the basic composition of the bending correction apparatus of the board | substrate in the 1st Embodiment of this invention. It is a perspective view which shows the carrier in the 1st Embodiment of this invention. It is sectional drawing in line segment III-III shown in FIG. It is sectional drawing in line segment IV-IV shown in FIG. It is a figure for demonstrating taking out of the wafer (board | substrate) by the conveyance arm in the 1st Embodiment of this invention. It is a figure which shows the positional relationship of the support bar in the 1st Embodiment of this invention, a wafer, and a transfer arm. It is a figure for demonstrating the taking-out process of the wafer in the 1st Embodiment of this invention. It is the front view (A) and sectional drawing (B) which show the taking-out method of the wafer in a comparative example. It is a front view which shows the basic composition of the deflection correction apparatus of the wafer in the 2nd Embodiment of this invention. It is sectional drawing in the line segment XX shown in FIG. It is a front view which shows the basic composition of the deflection correction apparatus of the wafer in the 3rd Embodiment of this invention. It is sectional drawing in the line segment XII-XII shown in FIG. It is a figure for demonstrating the taking-out process of the wafer W in the 3rd Embodiment of this invention.

First Embodiment FIG. 1 is a front view showing a basic configuration of a substrate deflection correction apparatus according to a first embodiment of the present invention. The substrate deflection correction apparatus (hereinafter referred to as the deflection correction apparatus 3) in the first embodiment is used when a wafer (substrate) is taken out from the carrier 1 in a semiconductor manufacturing process, an inspection process, or the like, for example. It is. Here, a wafer (thin wafer) having an outer diameter D of 6 inches (150 mm) and a thickness of 200 μm or less will be described as an example of the wafer, but the present invention is not limited to this.

  First, the carrier 1 will be described. FIG. 2 is a perspective view showing the carrier 1. 3 is a cross-sectional view taken along line III-III shown in FIG. As shown in FIGS. 2 and 3, the carrier 1 is a box-shaped container having an open front surface, and includes a top plate 13 and a bottom plate 14 opposed to the top and bottom, side plates 11 and 12 opposed to the left and right, and front and rear. Opposite openings 16 and back plate 17 are provided. Here, the vertical direction, that is, the direction in which the top plate 13 and the bottom plate 14 are opposed to each other is defined as the Z direction, and the left and right direction, that is, the direction in which the side plates 11 and 12 are opposed to each other is defined as the X direction. The front-rear direction, that is, the direction in which the opening 16 and the back plate 17 face each other is defined as a Y direction.

  On both side plates 11, 12, shelf-shaped wafer receiving portions 15 that hold the peripheral portion of the wafer W are formed so as to face each other. Each of the wafer receiving portions 15 is formed in a plurality of stages with a predetermined interval (for example, 4.8 mm) in the Z direction. Each of the wafer receiving portions 15 is a rib extending in the Y direction, and holds the peripheral portion of the wafer W (more specifically, both end portions in the X direction of the wafer W) on the upper surface.

  The front surface of the carrier 1 has the opening 16 described above, and the wafer W is accommodated in the carrier 1 through the opening 16, and the wafer W is taken out from the carrier 1. An opening 14 a for allowing a support bar 5 described later to pass therethrough is formed at the center of the bottom plate 14 of the carrier 1 (the part corresponding to the center of the wafer W). In addition, the baseplate 14 should just have the structure which can let the support bar 5 pass not only in the opening part 14a.

  In FIG. 1, a deflection correction device 3 according to the present embodiment includes a support bar 5 as an urging means (contact member) that is movable in the Z direction. Here, the support bar 5 is a columnar (for example, columnar) member whose axial direction is the Z direction, and the material is preferably a fluororesin, more specifically, PFA (perfluoroalkoxyalkane).

  The support bar 5 is driven in the Z direction by a motor 6 as drive means, and is inserted into the carrier 1 from the opening 14 a (FIG. 2) of the bottom plate 14 of the carrier 1. The support bar 5 is movable in the Z direction from at least a position retracted below the bottom plate 14 of the carrier 1 to a position corresponding to the uppermost wafer receiving portion 15 of the carrier 1.

  4 is a cross-sectional view taken along line IV-IV shown in FIG. As shown in FIG. 4, the support bar 5 is arranged so that the position in the XY plane corresponds to the center portion of the wafer W held by the wafer receiving portion 15 of the carrier 1 (that is, near the center of gravity of the wafer W). ing. The shape of the contact portion (contact surface) 5a between the support bar 5 and the wafer W may be any shape, but as an example, a circular shape is preferable. In addition, the outer diameter d of the abutting portion 5 a is preferably 1/5 or less of the outer diameter D of the wafer W.

  In addition, the support bar 5 shall be attached to the mounting base 4 (table) which has a mounting surface parallel to XY surface for mounting the carrier 1, for example. The motor 6 for driving the support bar 5 is controlled by the control unit 7. The support rod 5 and the motor 6 constitute the deflection correction device 3 in the present embodiment.

  FIG. 5 is a view showing the transfer arm 2 for taking out the wafer W from the carrier 1. The transfer arm 2 has a U-shaped tip 21 for holding the wafer W. The transfer arm 2 is inserted into the carrier 1 from the opening 16 in the Y direction by an actuator (not shown), holds the wafer W held by the wafer receiving portion 15 at the tip portion 21, and carries it out of the carrier 1.

  FIG. 6 is a diagram showing a positional relationship among the transfer arm 2 inserted into the carrier 1, the wafer W, and the support bar 5. The distance between the pair of Y-direction extending portions 21 a and 21 b (the distance in the X direction) at the distal end portion 21 of the transfer arm 2 is wider than the outer diameter d of the support bar 5. That is, when the tip 21 of the transfer arm 2 is inserted into the carrier 1 and the wafer W is taken out, the tip 21 of the transfer arm 2 and the support bar 5 do not interfere with each other.

  The transport arm 2 is controlled by a control unit 7 that controls the motor 6 of the deflection correction device 3.

  Next, a method for taking out the wafer W from the carrier 1 in the present embodiment will be described with reference to FIG. First, the carrier 1 storing a plurality of wafers W is placed on the placement table 4. A guide member (not shown) for regulating the position of the carrier 1 in the XY plane is disposed on the mounting table 4, and the position in the XY plane of the central portion of the wafer W stored in the carrier 1 is The position of the support bar 5 in the XY plane matches.

  At the stage where the carrier 1 is placed on the placing table 4, the support bar 5 is retracted below the bottom plate 14 of the carrier 1 so as not to interfere with the placing operation of the carrier 1.

  Subsequently, the control unit 7 drives the motor 6 to raise the support bar 5. As shown in FIG. 7, the support bar 5 enters the carrier 1 through the opening 14 a of the bottom plate 14 of the carrier 1 and comes into contact with the center portion of the wafer W held by the lowermost wafer receiving portion 15. . The wafer W having a thickness of 200 μm or less is bent downward by its own weight, and its central portion is lower than the peripheral portion by about 1.5 mm. The support bar 5 pushes up (biases) the central portion of the wafer W to the same height as the peripheral edge held by the wafer receiving portion 15, thereby correcting the deflection of the wafer W.

  In a state where the support bar 5 pushes up the wafer W (by the push-up amount necessary for the deflection correction), the control unit 7 stops the raising of the support bar 5. In this state, the control unit 7 causes the transfer arm 2 to enter the carrier 1 from the opening 16 of the carrier 1 in the Y direction, and inserts it under the lowermost wafer W (region A shown in FIG. 7). At this time, since the deflection of the wafer W is corrected by the support bar 5, the collision between the transfer arm 2 and the wafer W is prevented.

  Subsequently, the control unit 7 raises the transfer arm 2 by about 1 mm and lifts the wafer W from the wafer receiving unit 15. At this time, the U-shaped tip 21 (FIG. 6) of the transport arm 2 is located on both sides of the support bar 5 in the X direction, and thus does not interfere with the support bar 5. Further, the control unit 7 moves the transfer arm 2 to the outside from the opening 16 of the carrier 1 and unloads the wafer W to the outside of the carrier 1. After that, the transfer arm 2 transfers the wafer W unloaded from the carrier 1 to another apparatus in the semiconductor manufacturing process or the inspection process.

  After the wafer W is carried out of the carrier 1, the control unit 7 drives the motor 6 to raise the support bar 5 again, and the center of the wafer W held on the wafer receiving unit 15 in the second stage from the bottom. The part is pressed to correct the deflection. In this state, the control unit 7 again causes the transfer arm 2 to enter the carrier 1 from the opening 16 of the carrier 1 in the Y direction, and inserts it below the second wafer W from the bottom. Further, the control unit 7 raises the transfer arm 2 by about 1 mm, lifts the wafer W from the wafer receiving unit 15, moves the transfer arm 2 from the carrier 1 to the outside, and carries the wafer W out of the carrier 1.

  Similarly, all the wafers W held on the third wafer receiving unit 15 from the bottom to the wafer W held on the uppermost wafer receiving unit 15 are carried out of the carrier 1. After all the wafers W are unloaded from the carrier 1, the control unit 7 lowers the support bar 5 and retracts it below the bottom plate 14 of the carrier 1. After that, the carrier 1 is removed from the mounting table 4, and the carrier 1 storing the wafer W is newly mounted on the mounting table 4.

  As described above, according to the present embodiment, the wafer W is taken out by the transfer arm 2 in a state where the center of the wafer W is pushed up by the support bar 5 and the deflection is corrected. Even when the wafer W is 200 μm or less, collision with the wafer W is prevented when the transfer arm 2 is inserted. Therefore, damage to the wafer W and the transfer arm 2 can be prevented.

  In addition, since a conventional transfer arm can be used as the transfer arm 2, the existing facilities can be improved and the manufacturing cost can be reduced. Moreover, since the conventional carrier can be used only by providing the opening part 14a in the baseplate 14 as the carrier 1, manufacturing cost can further be reduced.

  Further, since the support bar 5 is configured to contact the central portion of the wafer W, the deflection of the wafer W can be effectively corrected, and the U-shaped tip of the transfer arm 2 when the wafer W is taken out. There is no interference with the part 21.

  Further, since the outer diameter d of the contact surface between the support bar 5 and the wafer W is 1/5 or less of the outer diameter D of the wafer W, it is possible to prevent interference with the front end portion 21 of the transfer arm 2 and the wafer W. The damage | wound by contact with the lower surface of this and the support bar 5 can be suppressed to the minimum.

  In the present embodiment, since the wafers W are taken out in order from the lower stage of the carrier 1 (the stage on the side where the support bar 5 is disposed), the deflection of all the wafers from the lowermost stage to the uppermost stage is corrected. You can take it out.

Comparative example.
Here, a comparative example with respect to the present embodiment will be described.
FIGS. 8A and 8B are a front view (A) and a cross-sectional view (B) showing a method of taking out a wafer when the deflection correction apparatus 3 in the present embodiment is not used.
As described above, when a wafer W having a thickness of 200 μm or less is used, the wafer W is held by the carrier 1 and a downward deflection of 1.5 mm or more occurs. That is, the central portion of the wafer W is in a state of being lower than the peripheral portion by 1.5 mm or less.

  When the transfer arm 2 is to be inserted below the wafer W in a state where the central portion of the wafer W is lowered downward by 1.5 mm or more with respect to the peripheral portion in this way, the wafer W is bent, and therefore FIG. In the region B shown in FIG. 2, the U-shaped tip 21 of the transfer arm 2 may collide with the wafer W, and the wafer W or the transfer arm 2 may be damaged.

  On the other hand, according to the above-described embodiment (FIGS. 1 to 7), the wafer W is taken out by the transfer arm 2 in a state where the center portion of the wafer W is pushed up by the support bar 5 and the deflection is corrected. Therefore, for example, even if the wafer W has a thickness of 200 μm or less, the collision between the transfer arm 2 and the wafer W is prevented. Therefore, damage to the wafer W and the transfer arm 2 can be prevented.

Second embodiment.
Next, a second embodiment of the present invention will be described.
FIGS. 9 and 10 are a front view and an XY cross-sectional view showing a basic configuration of a deflection correction device 3 (substrate deflection correction device) according to the second embodiment. The deflection correction device 3 in the second embodiment is provided with an ejection pipe 8 as an urging means (gas ejection member) instead of the support bar 5 in the first embodiment.

  The ejection pipe 8 in the second embodiment is, for example, a tubular member whose axial direction is the Z direction, and is driven in the Z direction by the motor 6 as in the first embodiment, and the bottom plate 14 of the carrier 1. It is configured to be movable from a position retracted below to a position reaching the uppermost wafer receiving portion 15.

The ejection tube 8 has one or more ejection ports (ejection ports) 80 on the upper end surface facing the central portion of the wafer W held by the carrier 1. Although the number of the jet nozzles 80 is four here, it is not limited to this. The opening area of each jet outlet 80 is, for example, 5 mm ² .

  The jet outlet 80 is connected to a vent hole (not shown) formed inside the jet pipe 8, and air is supplied from a gas supply device 82 such as a pump. The flow rate of the air ejected from the ejection port 80 may be a flow rate that can correct the deflection of the wafer W, and is 3 m / second here. For example, the gas supply device 82 is controlled by the control unit 7. The gas ejected from the ejection port 80 is not limited to air, but may be other gas.

  Note that the shape of the upper end surface 8a of the ejection pipe 8 may be any shape, but as an example, a circular shape is preferred, and its outer diameter d is 1/5 of the outer diameter D of the wafer W. The following is preferable. These jet pipe 8, gas supply device 82, and motor 6 constitute the deflection correction device 3 in the present embodiment. Other components are as described in the first embodiment.

  Next, a method for taking out the wafer W from the carrier 1 in the present embodiment will be described. First, similarly to the first embodiment, after placing the carrier 1 containing a plurality of wafers W on the mounting table 4, the control unit 7 drives the motor 6 to raise the ejection pipe 8, It penetrates into the carrier 1 through the opening 14 a of the bottom plate 14. With the upper end surface of the ejection tube 8 facing the central portion of the wafer W held by the lowermost wafer receiving portion 15 with a predetermined interval, the control unit 7 stops the elevation of the ejection tube 8. .

  The control unit 7 further starts air supply from the gas supply device 82 and ejects air from the ejection port 80 of the ejection pipe 8 at a predetermined flow rate (for example, 3 m / second). The air ejected from the ejection port 80 is blown to the central portion of the wafer W, and thereby the central portion of the wafer W is pushed up. The wafer W having a thickness of 200 μm or less has a central portion that is about 1.5 mm lower than the peripheral portion due to deflection due to its own weight. However, the air blown from the jet port 80 passes through the central portion of the wafer W. The deflection of the wafer W is corrected by pushing up to the same height as the peripheral edge held by the receiving portion 15.

  In this state, the control unit 7 inserts the transfer arm 2 below the wafer W held by the lowermost wafer receiving unit 15. At this time, since the deflection of the wafer W is corrected by the air ejected from the ejection port 80, the collision between the transfer arm 2 and the wafer W is prevented.

  After that, as described in the first embodiment, the control unit 7 raises the transfer arm 2 by about 1 mm, lifts the wafer W from the wafer receiving unit 15, and carries it out of the carrier 1 to the outside. Note that after the transfer arm 2 lifts the wafer W, the gas supply device 82 may be stopped until the next wafer W starts to be corrected.

  Similarly, all the wafers W held on the second wafer receiving unit 15 from the bottom to the wafer W held on the uppermost wafer receiving unit 15 are carried out of the carrier 1. After unloading all the wafers W from the carrier 1, the control unit 7 lowers the ejection pipe 8 and retracts it below the bottom plate 14 of the carrier 1. After that, the carrier 1 is removed from the mounting table 4, and the carrier 1 storing the wafer W is newly mounted on the mounting table 4.

  As described above, according to the present embodiment, the wafer W is taken out by the transfer arm 2 in a state where the center of the wafer W is pushed up by the air ejected from the ejection pipe 8 and the deflection is corrected. Even when the amount of bending is large, the collision between the wafer W and the transfer arm 2 can be prevented, whereby damage to the wafer W and the transfer arm 2 can be prevented.

  Further, since the ejection pipe 8 is configured to blow the air of the wafer W and lift it in a non-contact manner, the back surface of the wafer W is not damaged by contact.

  Further, the ejection tube 8 is configured to face the central portion of the wafer W, and the outer diameter d of the upper end surface 8a (the portion facing the wafer W) of the ejection tube 8 is equal to the outer diameter D of the wafer W. Since it is 1/5 or less, it is possible to reliably prevent interference between the ejection tube 8 and the tip end portion 21 of the transfer arm 2 when the wafer W is taken out.

  Further, since the wafers W are taken out in order from the lower stage of the carrier 1 (the stage on the side where the ejection pipe 8 is disposed), all the wafers W from the lowermost stage to the uppermost stage can be taken out while correcting the deflection. .

Third embodiment.
Next, a third embodiment of the present invention will be described.
FIGS. 11 and 12 are a front view and an XY cross-sectional view showing a basic configuration of a deflection correction device 3 (substrate deflection correction device) according to the third embodiment. The deflection correcting device 3 in the third embodiment is provided with a suction pipe 9 as an urging means (gas suction member) instead of the ejection pipe 8 in the second embodiment.

  The suction pipe 9 in the third embodiment is disposed above the carrier 1 mounted on the mounting table 4. The suction pipe 9 is, for example, a tubular member whose axial direction is the Z direction. The suction pipe 9 is driven in the Z direction by the motor 6 and from the position retracted upward from the top plate 13 of the carrier 1. It is configured to be movable in the Z direction to a position reaching the wafer receiving portion 15.

The suction pipe 9 has one or more suction ports 90 (suction ports) on the lower end surface facing the central portion of the wafer W accommodated in the carrier 1. Although the number of the suction ports 90 is four here, it is not limited to this. The opening area of each suction port 90 is, for example, 5 mm ² .

  The suction port 90 is connected to a vent hole (not shown) formed inside the suction pipe 9, and air is sucked from a gas suction device 92 such as a pump. The flow rate of air sucked from the suction port 90 may be a flow rate that can correct the deflection of the wafer W, and is 3 m / second here. For example, the gas suction device 92 is controlled by the control unit 7. The gas sucked from the suction port 90 is not limited to air but may be other gas.

  The shape of the lower end surface 9a of the suction pipe 9 may be any shape, but as an example, a circular shape is preferred, and its outer diameter d is 1/5 or less of the outer diameter D of the wafer W. Preferably there is.

  In the present embodiment, since the suction pipe 9 as the biasing means is disposed above the carrier 1, the suction pipe 9 and the motor 6 are supported above the carrier 1 by a support portion (not shown). It shall be. The top plate 13 of the carrier 1 is provided with an opening 13a for allowing the suction pipe 9 to pass therethrough. These suction pipe 9, gas suction device 92 and motor 6 constitute a deflection correction device 3 in the present embodiment. Other components are as described in the second embodiment.

  Next, a method for taking out the wafer W from the carrier 1 in the present embodiment will be described. First, as in the first embodiment, after the carrier 1 containing a plurality of wafers W is placed on the placing table 4, the controller 7 drives the motor 6 to lower the suction pipe 9. Then, it penetrates into the carrier 1 through the opening 13 a of the top plate 13. The control unit 7 stops the lowering of the suction pipe 9 with the lower end surface of the suction pipe 9 facing the central part of the wafer W held by the uppermost wafer receiving part 15 at a predetermined interval. .

  The control unit 7 further starts air suction by the gas suction device 92 and sucks air from the suction port 90 of the suction pipe 9 at a predetermined flow rate (for example, 3 m / second). The central portion of the wafer W is pushed up by the negative pressure generated by the suction of air from the suction port 90. The wafer W having a thickness of 200 μm or less has a central portion that is about 1.5 mm lower than the peripheral portion due to deflection due to its own weight. However, due to air suction from the suction port 90, the central portion of the wafer W is The wafer W is pushed up to the same height as the peripheral edge held by the receiving portion 15, and the deflection of the wafer W is corrected.

  In this state, the control unit 7 inserts the transfer arm 2 below the wafer W held by the uppermost wafer receiving unit 15. At this time, since the deflection of the wafer W is corrected by air suction from the suction port 90, the collision between the transfer arm 2 and the wafer W is prevented.

  After that, as described in the first embodiment, the control unit 7 raises the transfer arm 2 by about 1 mm, lifts the wafer W from the wafer receiving unit 15, and carries it out of the carrier 1 to the outside. Note that the gas suction device 92 may be stopped after the transfer arm 2 lifts the wafer W until the next wafer W is corrected for deflection.

  Similarly, all the wafers W held on the second wafer receiving unit 15 from the top to the wafer W held on the lowermost wafer receiving unit 15 are carried out of the carrier 1. After all the wafers W are unloaded from the carrier 1, the control unit 7 raises the suction pipe 9 and retracts it above the top plate 13 of the carrier 1. After that, the carrier 1 is removed from the mounting table 4, and the carrier 1 storing the wafer W is newly mounted on the mounting table 4.

  As described above, according to the present embodiment, the wafer W is taken out by the transfer arm 2 in a state where the deflection of the wafer W is corrected by pushing up the central portion of the wafer W by air suction from the suction pipe 9. Even when the amount of bending is large, the collision between the wafer W and the transfer arm 2 can be prevented, and thereby damage to the wafer W and the transfer arm 2 can be prevented. Furthermore, the adhesion of particles to the surface of the wafer W can be suppressed by sucking air from the suction pipe 9.

  Further, since the suction pipe 9 pushes up the wafer W in a non-contact manner by sucking air at a position facing the wafer W, the surface of the wafer W is not damaged by contact.

  Further, the suction tube 9 is configured to face the center portion of the wafer W, and the outer diameter d of the lower end surface 9a (the portion facing the wafer W) of the suction tube 9 is equal to the outer diameter D of the wafer W. Therefore, interference between the suction pipe 9 and the front end portion 21 of the transfer arm 2 when the wafer W is taken out can be reliably prevented.

  In the present embodiment, since the wafers W are taken out in order from the upper stage of the carrier 1 (the stage on the side where the suction pipe 9 is arranged), the interference between the support bar 5 and the transfer arm 2 does not occur and the wafer W is removed. All wafers up to the lower wafer W can be taken out.

Modified example.
Note that the above-described embodiments can be appropriately combined. For example, when the first embodiment and the third embodiment are combined (that is, provided with both the support bar 5 and the suction pipe 9), the wafer W is taken out from the lower stage of the carrier 1 in order. When the deflection correction using the support bar 5 (FIG. 1) is performed and the wafer W is to be taken out from the upper stage of the carrier 1 in order, the deflection correction using the suction pipe 9 (FIG. 11) can be selected. become. Similarly, the second embodiment and the third embodiment may be combined.

  In each of the above-described embodiments and modifications thereof, a wafer having a thickness of 200 μm or less has been described as an example of a substrate. However, the present invention can be applied to any type of wafer, and other than a wafer. The present invention can also be applied to other substrates (for example, glass substrates).

  DESCRIPTION OF SYMBOLS 1 Carrier, 15 Wafer receiving part, 16 Opening, 2 Transfer arm, 21 Front-end | tip part, 3 Deflection correction apparatus (Substrate bending correction apparatus), 4 Mounting stand, 5 Support bar (Burning means, contact member), 6 Motor (Drive means), 7 control unit, 8 ejection pipe (biasing means, gas ejection member), 80 ejection port, 82 gas supply device, 9 suction pipe (biasing means, gas suction member), 90 suction port, 92 gas Inhaler, W wafer.

Claims (9)

An urging means capable of moving in a direction substantially perpendicular to the surface of the substrate stored in the carrier;
The biasing means moves to a position where it contacts or faces the central portion of the substrate housed in the carrier, and biases the central portion of the substrate, thereby correcting the deflection of the substrate. A substrate deflection correction apparatus. The biasing means is movable in a direction substantially orthogonal to the surface of the substrate, and has a contact member movable into the carrier from the lower side of the carrier,
2. The substrate according to claim 1, wherein the abutting member abuts on a central portion of the substrate housed in the carrier and corrects the deflection of the substrate by pushing up the central portion of the substrate. Deflection correction device. The urging means is movable in a direction substantially orthogonal to the surface of the substrate, and has a gas ejection member movable into the carrier from the lower side of the carrier,
The gas ejection member has an ejection port on a surface facing the substrate,
The gas ejection member moves to a position where the ejection port faces the central portion of the substrate housed in the carrier, and corrects the deflection of the substrate by blowing gas from the ejection port to the substrate. The board | substrate deflection correction apparatus of Claim 1 characterized by these. The biasing means has a gas suction member that is movable in a direction substantially orthogonal to the surface of the substrate and movable into the carrier from above the carrier,
The gas suction member has a suction port on a surface facing the substrate;
The gas suction member corrects bending of the substrate by moving the suction port to a position facing the central portion of the substrate housed in the carrier and sucking gas from the suction port. The substrate bending correction apparatus according to claim 1.   5. The outer diameter of a portion where the urging means contacts or faces the substrate is 1/5 or less of the outer diameter of the substrate. 6. Substrate deflection correction device.   6. The urging means is movable from a retracted position retracted to the lower side of the carrier to a position in contact with or opposed to a substrate accommodated in the carrier. The board | substrate deflection correction apparatus of any one of Claims.   The said board | substrate is a wafer, The bending correction apparatus of the board | substrate of any one of Claim 1-6 characterized by the above-mentioned. Using the substrate bending correction device according to any one of claims 1 to 7,
A method for taking out a substrate, comprising: inserting a transfer arm under the substrate whose deflection has been corrected by the substrate deflection correcting device and taking out the substrate from the carrier. Using a carrier that stores multiple substrates in multiple stages,
In the step of removing the substrate from the carrier,
9. The method for taking out a substrate according to claim 8, wherein a plurality of the substrates are taken out in order from the stage on the side where the biasing means of the carrier is arranged.

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