JP2012079484A - Organic electroluminescent element and manufacturing method thereof - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an organic electroluminescent element and a manufacturing method thereof capable of achieving high brightness, low voltage, and long life by improving flatness in a pixel in a simple method and reducing a burden on a local material.SOLUTION: A manufacturing method of an organic electroluminescent element composed of a first electrode, a partition wall which partitions the first electrode, a light-emitting medium layer including at least a luminescent layer formed on the first electrode, and a second electrode on the light-emitting medium layer on a substrate includes a step of forming the light-emitting medium layer. This step comprises a step of forming a coating film in a wet coating method, a step of selectively curing a part of the coating film by applying a light energy to the coating film, and a step of removing an uncured part of the coating film.

Description

The present invention relates to an organic electroluminescence element (hereinafter referred to as “organic EL element”) utilizing an electroluminescence phenomenon of an organic material, and in particular, an organic electroluminescence display device (hereinafter referred to as “organic EL element”) arranged in a pixel shape. Display device). In particular, the present invention relates to a method for manufacturing an organic electroluminescence display device in which flatness in a pixel is improved by a simple process to achieve high luminance, low voltage, and long life.

In the organic EL element, a voltage is applied to a conductive light emitter to recombine injected electrons and holes, and the light emitter is caused to emit light upon this recombination. Generally, this organic EL element is configured by providing an anode made of a transparent electrode such as ITO on a translucent substrate, and sequentially laminating a light emitting layer and a cathode thereon.

Thus, although both electrodes can be directly laminated on both sides of the light emitting layer, for the purpose of increasing the light emission efficiency, a hole injection layer, a hole transport layer or a hole between the anode and the light emitting layer is used. In many cases, both layers are provided, or an electron injection layer or an electron transport layer is provided between the cathode and the light emitting layer. The whole of these hole injection layers sandwiched between both electrodes is called a light emitting medium layer.

The type of organic EL element depends on the organic light emitting material used for the light emitting layer, and an organic EL element using a low molecular organic light emitting material (hereinafter abbreviated as a low molecular organic EL element) and an organic EL element using a high molecular organic light emitting material ( Hereinafter, it is roughly classified into a polymer organic EL device. The low molecular organic EL element is formed mainly using a dry coating method such as a vacuum deposition method. When patterning is required, patterning is performed using a metal mask or the like. However, the larger the size, the worse the accuracy, and the problem is that the throughput is poor because the film is formed in vacuum. However, the flatness in the pixel is very high, and the light emission unevenness is small.

The polymer organic EL element can be formed by a wet process by using a solution dissolved in a material constituting each functional layer. As a film formation method by a wet process, there are a spin coating method, an ink jet method, a printing method, and the like, but none of them requires a vacuum, and thus is advantageous in terms of energy cost and material cost, and particularly has a large area and high definition. It is effective for patterning.

When painting with high-definition patterning or R (red), G (green), and B (blue) colors, the pixels are separated from each other by an insulating layer to prevent color mixing. It is necessary to partition the pixel by providing a partition wall. When each functional layer is formed using a wet process, the applied solution wets the partition wall surface, and the film thickness in the vicinity of the partition wall becomes extremely thick with respect to the center of the pixel (FIG. 5A). There is a problem that the applied solution is repelled from the surface of the partition wall, and the central portion of the pixel becomes extremely thick with respect to the film thickness in the vicinity of the partition wall (FIG. 6A) to deteriorate the flatness in the pixel. Due to the deterioration of flatness, current concentrates in the thin film area in the pixel, and light emission is strong only in the thin film area and light emission does not occur in the thick film area, and the load is applied only to the thin film area. Therefore, the uniform deterioration does not proceed and the life is shortened.

On the other hand, although there is a method for suppressing the wetting and repelling of the solution prepared by applying the liquid-repellent part and the hydrophilic part to the partition wall (Patent Document 1), the conditions vary greatly depending on the type and concentration of the material. It is difficult to control. In addition, there is a method of providing partition walls in a stepped manner to suppress the unevenness of the solution (Patent Document 2), but there are problems that the pattern of the partition walls is limited or that patterning is difficult.

JP-A-2005-326799 JP2008-112658

The present invention has been made in view of the above problems, and by improving the flatness in the pixel by a simpler method and reducing the load on the local material, it is possible to achieve high brightness, low voltage, and long life. Provided are an organic EL element that can be made and a manufacturing method thereof.

The invention according to claim 1, which is proposed to solve the above problem, comprises: a substrate; a first electrode; a partition partitioning the first electrode; and at least a light emitting layer formed on the first electrode. A method for producing an organic electroluminescence device comprising: a light emitting medium layer including a second electrode on the light emitting medium layer, wherein the step of forming the light emitting medium layer is a step of forming a coating film by a wet coating method. And a step of selectively curing a part of the coating film by applying light energy to the coating film, and a step of removing an uncured portion of the coating film. It is a manufacturing method.
When a film is formed using the wet coating method, the applied solution wets the partition wall surface, the film thickness in the vicinity of the partition wall becomes extremely thick with respect to the center of the pixel (FIG. 5A), The central portion of the pixel that is repelled from the partition wall surface becomes extremely thicker than the thickness in the vicinity of the partition wall (FIG. 6A), and the flatness in the pixel is deteriorated. In the present invention, at least one layer of the luminescent medium layer is formed using a wet coating method, and the step of selectively curing the luminescent medium layer by light energy and the step of removing the uncured portion are performed uniformly. It is possible to form a simple film. Heating methods for curing the light emitting medium layer include heat conduction and heat convection, but in any case, heat is transmitted to the entire surface of the film, making it difficult to selectively cure (FIG. 7). In the present invention, only a desired portion is selectively cured regardless of the shape of the formed film, so that a uniform film can be obtained by removing the uncured portion (FIGS. 5 and 6).
The invention according to claim 2 is the method for producing an organic electroluminescent element according to claim 1, wherein the wet coating method is any one of a relief printing method, a gravure printing method, and an ink jet method. is there.
The invention according to claim 3 is the method for producing an organic electroluminescent element according to claim 1, wherein the light emitting medium layer is an interlayer layer or a light emitting layer.
The invention according to claim 4 is the method for producing an organic electroluminescent element according to any one of claims 1 to 3, wherein the light energy is fluorescence and phosphorescence of an organic material and an inorganic material. is there.
The invention according to claim 5 is the method for producing an organic electroluminescent element according to any one of claims 1 to 3, wherein the light energy is a laser.
The invention according to claim 6 is the organic electroluminescence device according to any one of claims 1 to 5, wherein the light energy is condensed by a lens and applied to the light emitting medium layer. It is a manufacturing method.
In the invention according to claim 7, the step of removing the uncured portion of the coating film is a step of removing the uncured portion of the coating film by washing with an organic solvent or an inorganic solvent, or a mixed solution thereof. It is a manufacturing method of the organic electroluminescent element in any one of Claims 1 thru | or 6 characterized by the above-mentioned.
In the invention according to claim 8, the step of removing the uncured portion of the coating film is performed by exposing the uncured portion of the coating film to an organic solvent, an inorganic solvent, or a vapor of a mixed solution thereof. A method for producing an organic electroluminescent element according to any one of claims 1 to 6.
The invention according to claim 9 is an organic electroluminescence device manufactured by the manufacturing method according to any one of claims 1 to 8, wherein the first electrode and the first electrode are disposed on a substrate. In the organic electroluminescence device comprising partition walls partitioning, a light emitting medium layer including at least a light emitting layer formed on the first electrode, and a second electrode on the light emitting medium layer, the light emitting medium layer includes the light It is an organic electroluminescent element characterized by including the material hardened | cured by energy.

According to the present invention, the flatness in the pixel is improved, the effective light emitting area in the pixel is increased, and the load on the local light emitting material is reduced, thereby increasing the brightness, lowering the voltage, and extending the lifetime. It is possible to provide an organic EL element or a display device that enables the above.

The cross-sectional schematic diagram of the organic electroluminescent display apparatus of this invention. The cross-sectional schematic diagram which shows another example of the organic electroluminescent display apparatus of this invention. The plane schematic diagram which shows the electrode structure of a passive type organic electroluminescence display. The cross-sectional schematic diagram which shows the laminated structure of the organic EL element of this invention. (A) is a bottom emission type organic EL element, and (B) is a top emission type organic EL element. The cross-sectional schematic diagram in the hardening process and removal process of the organic electroluminescent element display apparatus of this invention. (A) is before processing. (B) after the curing step. (C) is after the removal step. The cross-sectional schematic diagram in the hardening process and removal process of the organic electroluminescent element display apparatus of this invention. (A) is before processing. (B) after the curing step. (C) is after the removal step. The cross-sectional schematic diagram of the organic electroluminescence display which showed the hardening state by heat conduction and a heat convection. (A) Heat conduction. (B) Thermal convection.

Hereinafter, embodiments of the present invention will be described with reference to the drawings. The drawings referred to in the following description of the embodiments are for explaining the configuration of the present invention, and the size, thickness, ratio of dimensions, etc. of the respective parts shown in the drawings represent the embodiments as they are. is not.

FIG. 1 is a cross-sectional view of an organic EL display device for explaining an example of an embodiment of the present invention. In the display device 200 using the organic EL element according to the embodiment of the present invention shown in FIG. 1, a first electrode (anode) 102 provided for each pixel and a pixel of the first electrode are partitioned on a substrate 101. A partition wall 203; a hole transport layer 104 formed above the first electrode; an interlayer layer 105 formed on the hole transport layer; a light-emitting layer 106 formed on the interlayer layer; A second electrode (cathode) 107 formed so as to cover the entire surface of the light emitting layer and a sealing body in contact with the substrate so as to cover the second electrode are provided. The layer including the hole transport layer, the interlayer, and the light emitting layer may be the light emitting medium layer 109, and the light emitting medium layer 109 may include an electron transport layer formed between the light emitting layer and the second electrode. . As the sealing body, the organic EL element is covered with a sealing cap 206 as shown in FIG. 1 and the inside of the sealing cap is sealed with an inert gas, or the sealing material 209 is resin layer 210 as shown in FIG. The thing stuck together through is mentioned.

In addition, as a substrate, a TFT substrate formed so that a switching element (thin film transistor: TFT) for controlling each pixel is connected to the first electrode can be used. Not particularly shown. In addition, as shown in FIG. 3, it is good also as a passive matrix type organic electroluminescent display apparatus which makes a predetermined pixel light by making a stripe-shaped 1st electrode and 2nd electrode cross. Hereinafter, a region in which the light emitting medium layer is sandwiched between the first electrode and the second electrode is referred to as a light emitting region or an organic EL element, and the entire array of organic EL elements including a partition is referred to as a display region.

Here, the luminescent medium layer 109 is a layer sandwiched between the first electrode (anode) 102 and the second electrode (cathode) 107. In the element of FIG. 1, the hole transport layer 104, the interlayer layer 105, and the light emitting layer 106 correspond to the light emitting medium layer 109. In addition to this, layers such as a hole injection layer, an electron transport layer, and an electron injection layer may be appropriately added. For example, in the example of FIG. 1, the hole transport layer 104, the interlayer layer 105, and the light emitting layer 106 are sequentially stacked on the transparent electrode (anode) 102. It can also consist of two layers. In addition, a light emitting medium layer having a three-layer structure in which a hole injection layer, a hole transport layer, and a light emitting layer are sequentially stacked can be used. One layer may have a plurality of these functions. For example, the light-emitting layer may have a hole transport function. Or it can also be set as the structure which consists of a positive hole injection layer and an electron carrying layer, and light-emits at an interface.

The light emitting medium layer 109 has a thickness of 1000 nm or less, preferably 50 to 300 nm as a whole, regardless of whether the light emitting medium layer 109 is formed of a single light emitting layer or a multilayer structure.

In the configuration of the organic EL display device of FIGS. 1 and 2, the light emitting layer is patterned for each of the patterned electrodes so as to correspond to the emission wavelengths of red (R), green (G), and blue (B). By forming the layers 106R, 106G, and 106B, a full-color display panel is realized. As other methods, a dye conversion method using a blue light emitting layer and a dye conversion layer may be used, or a white light emitting layer may be used and a color filter may be provided on a substrate or a sealing substrate.

4A and 4B are cross-sectional views of a laminated portion, that is, a light emitting region of the organic EL element of the present invention. FIG. 4A shows an example of a bottom emission type organic electroluminescence element, in which a first electrode 102, a light emitting medium layer 109, and a second electrode 107a are laminated on a substrate 101 in this order. As long as the light-emitting medium layers are stacked in this order, in addition to the hole transport layer 104, the interlayer layer 105, and the light-emitting layer 106, other functional layers may be stacked between them. The second electrode is a light-impermeable electrode. By using a highly reflective material such as metal, the first electrode is a light-transmissive electrode that reflects light emitted to the second electrode side by the second electrode. The light extraction efficiency is good because the light can be emitted from the electrode side to the outside.

FIG. 4B shows an example of a top emission type organic EL element, in which a reflective layer 301, a first electrode 102, a hole transport layer 104, an interlayer layer 105, a light emitting layer 106, and a second electrode 107b are arranged in this order on a substrate 101. Are stacked. As long as they are laminated in this order, other layers may be laminated between them. The second electrode is a light transmissive electrode, and the light emitted to the first electrode side is transmitted through the first electrode, reflected by the reflective layer, and emitted from the second electrode side to the outside. On the other hand, the light emitted to the second electrode side is transmitted through the second electrode and emitted to the outside. The following description is based on a bottom emission type organic electroluminescence element, but is also applicable to a top emission type in which the second electrode is a transparent conductive film.

Hereinafter, each component and manufacturing method when the curing process by light energy irradiation of the present invention and the uncured portion removal process of the present invention are applied to the interlayer layer 105 will be described. However, the configuration of the present invention is not limited thereto. It is not something that can be done. The curing step by irradiation with light energy and the removal step of the uncured portion may be used for the hole transport layer, the hole injection layer, and the light emitting layer, or may be simultaneously used for a plurality of layers such as the interlayer layer and the light emitting layer.

First, the material of the substrate 101 is, for example, a plastic film or sheet such as glass, quartz, polypropylene, polyethersulfone, polycarbonate, cycloolefin polymer, polyarylate, polyamide, polymethyl methacrylate, polyethylene terephthalate, polyethylene naphthalate, or the like. In addition, in the case of a top emission type organic light emitting field device, in addition to the above plastic film or sheet, metal oxides such as silicon oxide and aluminum oxide, and metal fluorides such as aluminum fluoride and magnesium fluoride. , A light-transmitting group in which a single layer or a layer of a polymer resin film such as a metal nitride such as silicon nitride or aluminum nitride, a metal oxynitride such as silicon oxynitride, an acrylic resin, an epoxy resin, a silicone resin, or a polyester resin Materials and A light-impermeable base material in which a metal film such as aluminum, copper, nickel, stainless steel or the like is laminated on a metal foil such as aluminum or stainless steel, a sheet, a plate, a plastic film or a sheet can be used in the present invention. It is not limited.

In the bottom emission type, the surface from which the organic electroluminescence display device 200 performs light extraction may be performed from the electrode side adjacent to the substrate 101. In the top emission type, it may be performed from the electrode side facing the substrate 101. The substrate 101 made of these materials has a moisture-proofing or hydrophobic property by forming an inorganic film or applying a resin on the entire surface or one surface of the substrate 101 in order to prevent moisture or oxygen from entering the organic electroluminescence display device 200. It is preferable to have processed. In particular, in order to prevent moisture from entering the light emitting medium layer 109, it is preferable to reduce the moisture content and gas permeability coefficient of the substrate 101.

Next, the first electrode 102 is formed. The first electrode 102 is formed on the substrate 101 and patterned as necessary. The first electrode 102 is partitioned by a partition wall 203 and becomes a pixel electrode corresponding to each pixel (sub-pixel).

Examples of the material of the first electrode 102 include metal composite oxides such as ITO (indium tin composite oxide), IZO (indium zinc composite oxide), and AZO (zinc aluminum composite oxide), and metal materials such as gold and platinum. Alternatively, either a single layer or a laminate of fine particle dispersion films in which fine particles of these metal oxides or metal materials are dispersed in an epoxy resin or an acrylic resin can be used. Alternatively, a precursor such as indium octylate or indium acetone can be formed on the substrate by a coating pyrolysis method in which an oxide is formed by thermal decomposition.

When the first electrode 102 is used as an anode, it is preferable to select a material having a high work function such as ITO. In the TFT-driven organic electroluminescence display device, the resistance may be low, and if the sheet resistance is 20 Ω · sq or less, it can be suitably used.

As the formation method of the first electrode 102, depending on the material, dry film formation methods such as resistance heating evaporation method, electron beam evaporation method, reactive evaporation method, ion plating method, sputtering method, ink jet printing method, gravure, etc. Existing film forming methods such as a wet film forming method such as a printing method and a screen printing method can be used, but the present invention is not limited to these. Note that an extraction electrode (not shown) can be formed in the same process and with the same material.

As a patterning method of the first electrode 102, an existing patterning method such as a mask vapor deposition method, a photolithography method, a wet etching method, or a dry etching method can be used depending on a material and a film forming method.

In addition, the surface of the first electrode 102 may be activated by UV treatment, plasma treatment, or the like as necessary.

In the case of the top emission type, it is preferable to form the reflective layer 301 (see FIG. 4) below the first electrode. The material of the reflective layer is preferably high reflectivity and low resistance, single film and laminated film containing one or more of Cr, Mo, Al, Ag, Ta, Cu, Ti, Ni, alloy film, the material A film in which a protective film such as SiO, SiO ₂ , or TiO ₂ is formed can be used. The reflectance may be 80% or more as a total average in the visible light wavelength region, and if it is 90% or more, it can be suitably used. This is not the case when the light emitting medium layer 109 or the first electrode 102 is made of a light-impermeable material.

As the forming method, depending on the material, dry film forming methods such as resistance heating evaporation method, electron beam evaporation method, reactive evaporation method, ion plating method, sputtering method, ink jet printing method, gravure printing method, screen printing, etc. An existing film forming method such as a wet film forming method such as a method can be used, but the present invention is not limited thereto.

As a patterning method of the reflective layer, an existing patterning method such as a mask vapor deposition method, a photolithography method, a wet etching method, or a dry etching method can be used depending on the material and the film forming method.

Next, the partition wall 203 is formed. The partition wall 203 according to the embodiment of the present invention can be formed so as to partition a light emitting region corresponding to each pixel. When the light emitting medium layer is patterned by a wet coating method, particularly when each pixel is separately coated. In addition, it serves as a partition for each pixel to prevent color mixing.

The partition 203 is preferably formed so as to cover the end portion of the first electrode 102. In general, in the active matrix driving type organic electroluminescence display device 200, the first electrode 102 is formed for each pixel, and each pixel tries to occupy as large an area as possible. It is formed to cover. Therefore, the most preferable shape of the partition wall 203 is basically a lattice shape that divides the pixel electrodes 102 by the shortest distance.

The photosensitive material for forming the partition wall 203 may be either a positive resist or a negative resist, and may be a commercially available one, but it needs to have insulating properties. If the partition wall does not have sufficient insulation, a current flows to the adjacent pixel electrode through the partition wall, resulting in a display defect. Specific examples include polyimide, acrylic resin, novolac resin, and fluorene, but the present invention is not limited thereto. Further, for the purpose of improving the display quality of the organic EL element, a light shielding material may be included in the photosensitive material.

The photosensitive resin that forms the partition wall 203 is applied using a known coating method such as a spin coater, bar coater, roll coater, die coater, or gravure coater. Next, in the step of pattern exposure and development to form the partition wall pattern, the partition wall pattern can be formed by a conventionally known exposure and development method. Regarding firing, firing can be performed by a conventionally known method using an oven, a hot plate or the like.

Examples of the patterning method for the partition wall 203 include a method in which a photosensitive resin is applied on a substrate and a predetermined pattern is formed by a photolithography method. However, the present invention is not limited thereto. If necessary, the resist and the photosensitive resin may be subjected to surface treatment such as plasma irradiation or UV irradiation, and by performing these surface treatments, the wettability of the partition wall surface is controlled, and the liquid repellency and lyophilicity are controlled. can do. Further, by adding a liquid repellent material in the photosensitive resin, the partition wall surface can be made liquid repellent.

Further, the partition wall 203 may have a multi-stage shape. In that case, the partition wall 203 includes a first-stage partition wall formed in a lattice shape so as to divide pixels, and a second-stage partition wall formed on the first-stage partition wall. Different materials may be used for the first-stage material and the second-stage material. For example, an inorganic material such as SiO ₂ or SiNx can be used for the first stage material, and an organic material such as a photosensitive resin can be used for the second stage, and these are patterned by photolithography as described above. I can do it.

The thickness of the partition wall 203 is desirably in the range of 0.5 μm to 5.0 μm. By providing the partition wall 11 between adjacent pixel electrodes, it is possible to suppress the spread of the hole transport ink printed on each pixel electrode and to prevent the occurrence of a short circuit from the end of the transparent electrode (anode) 2. If the partition wall is too low, the effect of preventing a short circuit may not be obtained. If the partition wall is too high, when the counter electrode (cathode) 6 is formed in a direction perpendicular to the partition wall, the counter electrode (cathode) 6 is broken and displayed. It becomes defective.

Next, as a substrate pretreatment process, UV treatment, plasma treatment, or the like is performed. The main purpose is to clean the ITO surface used as the anode and to adjust the work function. In order to inject holes into the luminescent medium layer efficiently, the work function of the anode surface in contact with the luminescent medium layer is preferably close. Therefore, the work function of the anode surface after the surface treatment step is preferably 0.5 eV or less, more preferably 0.2 eV or less, with respect to the work function of the light emitting medium layer in contact with the anode. In the case of ITO, the work function before the surface treatment is 4.8 eV, and when a hole transport layer or a hole injection layer is formed on the anode as a light emitting medium layer as described later, for example, the work function of molybdenum oxide is 5 .5 eV. Therefore, in the initial state, since the work function difference is too large, the hole injection barrier becomes high and it becomes difficult to inject holes. Therefore, the work function of the anode is increased by the surface treatment, and the work function of the hole transport layer is increased. Move closer.

Moreover, as a light source for UV treatment, there are a low-pressure mercury lamp, a high-pressure mercury lamp, an excimer lamp, etc., but any light source may be used in the present invention. When oxygen plasma treatment is used, the work function of the anode can be controlled to any state by adjusting the power, pressure, and irradiation time. However, when oxygen plasma treatment is used, the partition wall is simultaneously formed with the surface treatment of the anode. In addition, care should be taken because some etching effect is exerted.

Since the oxidized ITO surface returns to its original state with the passage of time, the treatment of the anode surface is preferably performed immediately before the hole transport layer 104 is formed.

Next, the hole transport layer 104 is formed on the first electrode. The hole transport layer 104 is a layer having a function of injecting holes from the transparent electrode (anode) into the light emitting layer. These layers may have both a hole injection function and a hole transport function, and are referred to by either or both names depending on the degree. In the present invention, the hole transport layer includes a hole injection layer.

The physical property value of the hole transport layer 104 preferably has a work function equal to or higher than that of the anode (first electrode 102). This is because holes are efficiently injected from the anode into the light emitting medium layer (interlayer). Although it varies depending on the material of the anode, 4.5 eV or more and 6.5 eV or less can be used. When the anode is ITO or IZO, 5.0 eV or more and 6.0 eV or less can be suitably used. Further, in the bottom emission structure, emitted light is extracted from the first electrode side. If the light transmittance is low, the extraction efficiency is lowered. Therefore, the total average in the visible light wavelength region is preferably 75% or more, and if it is 85% or more. It can be preferably used.

Examples of the material constituting such a hole injection layer or hole transport layer include polymers such as polyaniline, polythiophene, polyvinyl carbazole, a mixture of poly (3,4-ethylenedioxythiophene) and polystyrenesulfonic acid. Materials can be used. In addition, a conductive polymer having a conductivity of 10 ⁻² to 10 ⁻⁶ S / cm can be preferably used. A polymer material is preferably used in that a layer can be formed by a wet method. These can be used in the form of a solution or dispersion using water or a solvent. In the case of using an inorganic material as a hole transport _{material, Cu 2 O, Cr 2 O} 3, Mn 2 O 3, FeOx (x~0.1), NiO, CoO, Bi 2 O 3, SnO 2, ThO 2, Nb ₂ O ₅ , Pr ₂ O ₃ , Ag ₂ O, MoO ₂ , ZnO, TiO ₂ , V ₂ O ₅ , Nb ₂ O ₅ , Ta ₂ O ₅ , MoO ₃ , WO ₃ , MnO _2, or the like may be used. it can.

The hole transport layer 104 can be collectively formed on the entire display region by a simple method such as a spin coating method, a die coating method, a dipping method, or a slit coating method. When forming the hole transport layer 3, the hole transport material can be dissolved in water, an organic solvent, or a mixed solvent thereof to obtain an ink. As the organic solvent, toluene, xylene, anisole, mesitylene, tetralin, acetone, methyl ethyl ketone, methyl isobutyl ketone, cyclohexanone, methanol, ethanol, isopropyl alcohol, ethyl acetate, butyl acetate and the like can be used. In addition, surfactants, antioxidants, viscosity modifiers, ultraviolet absorbers and the like may be added to the ink. In the case of an inorganic material, it can be formed using a dry process such as resistance heating vapor deposition, electron beam vapor deposition, reactive vapor deposition, ion plating, or sputtering.

Next, the interlayer layer 105 is formed. The interlayer layer 105 according to the embodiment of the present invention functions as an electron blocking layer and can be laminated between the organic light emitting layer and the hole transport layer to improve the light emission lifetime of the device. In the top emission type element structure, the hole transport layer 104 can be stacked after the formation. Usually, the hole transport layer 104 is formed so as to cover it, but patterning may be performed as necessary.

As a material of the interlayer layer 105, as an organic material, a polymer containing an aromatic amine such as polyvinyl carbazole or a derivative thereof, a polyarylene derivative having an aromatic amine in a side chain or a main chain, an arylamine derivative, a triphenyldiamine derivative, or the like. Etc. When these structures have a thermal crosslinking site, they are crosslinked when a temperature equal to or higher than the crosslinking temperature is applied, and become uncrosslinked below the crosslinking temperature. When the crosslinking reaction further proceeds, the solubility or dispersibility in the solvent that has been dissolved or dispersed at the time of uncrosslinking is lowered to become a cured state, and the portion that is not sufficiently crosslinked becomes an uncured portion that dissolves in the removal solvent described later.

These organic materials mentioned as the interlayer material are dissolved or stably dispersed in a solvent to form an organic interlayer ink. Examples of the solvent for dissolving or dispersing the organic interlayer material include toluene, xylene, acetone, anisole, methyl ethyl ketone, methyl isobutyl ketone, and cyclohexanone alone or a mixed solvent thereof. Of these, aromatic organic solvents such as toluene, xylene, and anisole are preferable from the viewpoint of solubility of the organic interlayer material. Moreover, surfactant, antioxidant, a viscosity modifier, a ultraviolet absorber, etc. may be added to organic interlayer ink as needed.

As these interlayer materials, it is preferable to select a material having a work function equal to or higher than that of the hole transport layer 104, and more preferable to have a work function equal to or lower than that of the organic light emitting layer 106. This is because an unnecessary injection barrier is not formed when carriers are injected from the hole transport layer 104 into the organic light emitting layer 106. Further, in order to obtain an effect of confining charges that could not contribute to light emission from the organic light emitting layer 106, the band gap is preferably 3.0 eV or more, and more preferably 3.5 eV or more.

As the wet coating method for forming the interlayer layer 105, specifically, a printing method such as an ink jet printing method, a relief printing method, a gravure printing method, a screen printing method, or the like can be used. Can be applied. By these wet coating methods, an interlayer ink coating film is formed on the hole transport layer 104 between at least the partition walls 203.

Next, the coating film of the interlayer ink formed by the wet coating method is cured to form the interlayer layer 105. As a curing process of the interlayer layer 105, light energy irradiation is performed. Any light source may be used as the light source of the light energy to be irradiated as long as it includes the absorption wavelength of the material used for the interlayer layer. For example, luminescence obtained by exciting a dye such as Bis-MSB, Coumarin 102, Rhodamine 6G, or DCM with a laser may be used, or a laser such as an excimer laser, a dye laser, or a YAG laser may be used directly. However, the present invention is not limited to these.

FIGS. 5 and 6 show a curing process of the interlayer layer 105 and a removal process of the uncured portion using a laser. FIG. 5 shows a case where the partition wall is lyophilic and the interlayer ink is wetted on the partition wall surface. FIG. 6 shows a state in which the partition ink is repellent and the interlayer ink is repelled by the partition.

For the interlayer layer 105 (FIGS. 5A and 6A) formed in the pixel, the light energy emitted from the light source is condensed using the lens 302 with the focal point as the focal point. The surrounding interlayer layer irradiated with light energy is cured (FIGS. 5B and 6B). At this time, it is necessary to move the focal point so that the irradiated portion becomes flat.
In the condensed irradiation light 303, the interlayer layer absorbs the irradiation light and converts the light energy into heat, and adjusts the lens and the light energy intensity so as to be equal to or higher than the crosslinking temperature only at the irradiation portion. Let the hardened interlayer layer be 105a. Since the progress speed of the crosslinking reaction varies depending on the intensity of light energy, the position to be collected, the range, and the irradiation time, the irradiation site can be arbitrarily selected. If the temperature is low or the irradiation time is short, the crosslinking reaction will not proceed sufficiently and curing will be insufficient. Conversely, if the temperature is too high or the irradiation time is long, an undesired crosslinking reaction will occur and the flatness of the interlayer layer will be reduced. Damaged.

As a step of removing the uncrosslinked portion 105b of the interlayer layer 105, the uncrosslinked portion is dissolved and removed in an organic solvent, an inorganic solvent, or a mixed solvent thereof (FIGS. 5C and 6C). The type of the solvent can be the ink solvent at the time of applying the interlayer layer, but is not limited as long as the solvent has sufficient solubility. Toluene, xylene, acetone, anisole, methyl ethyl ketone, methyl isobutyl ketone, cyclohexanone, etc. can be used alone or in combination. Of these, aromatic organic solvents such as toluene, xylene, and anisole are preferable from the viewpoint of solubility and dispersibility of the organic light-emitting material. These solvents may be applied to the substrate 1 and washed away, or may be washed away by heating these solvents and applying steam. Subsequently, the uncured portion is washed away with a solvent, and then the remaining solvent is dried and baked to sufficiently advance the crosslinking reaction, whereby a flat interlayer layer 105 is formed.

Assuming that the ratio of the area of the thinnest film thickness in the pixel + the area where the film thickness is 10 nm or less is the flat rate, the flat rate after removing the uncrosslinked portion is 70 to 100% is preferable, and 85 to 100% is more preferable. As the flatness ratio is higher, uniform light emission can be obtained within the pixel, local deterioration of the material can be prevented, and higher brightness, lower voltage, and longer life can be achieved.

Next, the light emitting layer 106 is formed. The light emitting layer 106 is formed between the first electrode 102 and the second electrode 107, and recombines electrons and holes injected by applying a voltage between the two electrodes in the light emitting layer. It emits light. The emitted light is emitted outside through the translucent side. When different light emitting layers are formed in each pixel, for example, in the case of RGB full color, each light emitting layer 106R, 106G, 106B is formed in a pattern on the pixel portion on the first electrode 102, respectively.

Materials used for the light emitting layer 106 include coumarin, perylene, pyran, anthrone, porphyrin, quinacridone, N, N′-dialkyl substituted quinacridone, naphthalimide, N, N′-diaryl substituted pyrrolopyrrole. A material obtained by dissolving a luminescent dye such as a polyaniline in a polymer such as polystyrene, polymethyl methacrylate, polyvinyl carbazole or the like can be used. It is also possible to use a dendrimer material, a polymer light emitting material such as PPV, PAF, or polyparaphenylene. Preferably, the material is soluble in water or a solvent and can be made into a solution.

Polymers containing aromatic amines such as polyvinyl carbazole or derivatives thereof, polyarylene derivatives having aromatic amines in the side chain or main chain, arylamine derivatives, triphenyldiamine derivatives, etc., mentioned as the material of the above-mentioned interlayer 105 Etc. may be used.

These light emitting layer materials are dissolved or stably dispersed in a solvent to form an organic light emitting ink. Examples of the solvent for dissolving or dispersing the organic light emitting material include toluene, xylene, acetone, anisole, methyl ethyl ketone, methyl isobutyl ketone, cyclohexanone, or a mixed solvent thereof. Of these, aromatic organic solvents such as toluene, xylene, and anisole are preferable from the viewpoint of solubility and dispersibility of the organic light-emitting material. Moreover, surfactant, antioxidant, a viscosity modifier, a ultraviolet absorber, etc. may be added to organic luminescent ink as needed.

Each of the light emitting layers 106 is formed by a wet coating method, and specifically, can be formed by a printing method such as a screen printing method, an ink jet method, a gravure printing method, a relief printing method or the like.

The electron injection layer is a layer having a function of transporting electrons from the cathode, and the electron transport layer is a layer having a function of transporting electrons to the light emitting layer. These layers may have both an electron transport function and an electron injection function, and are referred to by either or both names depending on the degree. Examples of the material constituting such an electron injection layer or electron transport layer include nitro-substituted fluorenes such as 1,2,4-triazole derivatives (TAZ), diphenylxone derivatives, and the like.

Next, a second electrode (counter electrode) 107 is formed on the light emitting medium layer 109. In the case of an active matrix driving type organic EL display device, the second electrode is formed on the entire surface of the display area, that is, on the entire surface of the light emitting medium layer and the partition wall. As a specific material for the second electrode 107, a single metal such as Mg, Al, or Yb is used, or a compound such as Li, oxidized Li, or LiF is sandwiched about 1 nm at the interface in contact with the light emitting medium layer 109. Al or Cu having high conductivity may be laminated and used. Alternatively, in order to achieve both electron injection efficiency and stability, one or more metals such as Li, Mg, Ca, Sr, La, Ce, Er, Eu, Sc, Y, and Yb having a low work function and stable Ag, An alloy system with a metal element such as Al or Cu may be used. Specifically, alloys such as MgAg, AlLi, and CuLi can be used. A transparent conductive film such as a metal composite oxide such as ITO (indium tin composite oxide), IZO (indium zinc composite oxide), or AZO (zinc aluminum composite oxide) can be used.

Since these second electrodes 107 in the top emission structure transmit the display light emitted from the light emitting medium layer 109, the second electrodes 107 need to have a light transmission property with respect to the visible light wavelength region. In the case of simple metals such as Mg, Al, and Yb, the thickness is preferably 20 nm or less, and more preferably within 2-7 nm. The transparent conductive film can be suitably used by adjusting the film thickness so that the average light transmittance in the visible light wavelength region is maintained at 85% or more.

Depending on the material, the second electrode 107 may be formed by a dry film formation method such as a resistance heating vapor deposition method, an electron beam vapor deposition method, a reactive vapor deposition method, an ion plating method, or a sputtering method, an ink jet printing method, or a gravure. Existing film forming methods such as a wet film forming method such as a printing method and a screen printing method can be used, but the present invention is not limited to these.

Next, a sealing body is formed. The sealing body is sealed by, for example, bonding the sealing body 208 and the substrate to the periphery of the substrate 101 on which the first electrode 102, the partition wall 203, the light emitting medium layer 109, and the second electrode 107 are formed. Is done. At this time, in the top emission structure, since the display light emitted from the light emitting medium layer through the sealing body on the side opposite to the substrate 101 is taken out, light transmittance is required for the visible light wavelength region. The light transmittance is preferably 85% or more as the average light transmittance in the visible light wavelength region.

The sealing body uses, for example, a sealing cap 206 such as a glass cap or a metal cap having a recess with respect to the substrate 101 on which the first electrode 102, the partition wall 203, the light emitting medium layer 109, and the second electrode 107 are formed. The first electrode, the organic light emitting medium layer, and the second electrode are sealed so that a recess is formed in the space, and the cap and the substrate are adhered to each other with an adhesive. A hygroscopic agent is formed in the recess, and sealing under an inert gas such as nitrogen gas or under vacuum can prevent element deterioration due to moisture, gas, or the like.

Further, the sealing body is provided with a resin layer 210 on a sealing material 209 on the substrate 101 on which the first electrode 102, the partition 203, the light emitting medium layer 109, and the second electrode 107 are formed, for example. It is also possible to perform the process by attaching the sealing material and the substrate together at 210.

At this time, the material for the sealing material 209 needs to be a base material having low light permeability of moisture and oxygen. Examples of the material include ceramics such as alumina, silicon nitride, and boron nitride, glass such as alkali-free glass and alkali glass, quartz, and moisture resistant film. Examples of moisture-resistant films include films formed by CVD of SiOx on both sides of a plastic substrate, films with low light transmission and water-absorbing films, or polymer films coated with a water-absorbing agent. The water vapor light permeability of the film is preferably 1 × 10 ⁻⁶ g / m ² / day or less.

Examples of the resin layer 210 include a photo-curing adhesive resin made of an epoxy resin, an acrylic resin, a silicone resin, a thermosetting adhesive resin, a two-component curable adhesive resin, an ethylene ethyl acrylate (EEA) polymer, and the like. Acrylic resins, vinyl resins such as ethylene vinyl acetate (EVA), thermoplastic resins such as polyamide and synthetic rubber, and thermoplastic adhesive resins such as acid-modified products of polyethylene and polypropylene. As an example of a method for forming the resin layer 210 on the sealing material, a solvent solution method, an extrusion lamination method, a melting / hot melt method, a calendar method, a nozzle coating method, a screen printing method, a vacuum laminating method, a hot roll laminating method And so on. A material having a hygroscopic property or an oxygen absorbing property may be contained as necessary. The thickness of the resin layer 210 formed on the sealing material 209 is arbitrarily determined depending on the size and shape of the organic EL element to be sealed, but is preferably about 5 to 500 μm.

The substrate 101 on which the first electrode 102, the partition wall 203, the light emitting medium layer 109, and the second electrode 107 are formed and the sealing body 208 are bonded together in a sealing chamber. When the sealing body 208 has a two-layer structure of a sealing material 209 and a resin layer 210 and a thermoplastic resin is used for the resin layer 210, it is preferable to perform only pressure bonding with a heated roll. When a thermosetting adhesive resin is used, it is preferable to perform heat curing at a curing temperature after pressure bonding with a heated roll. In the case where a photocurable adhesive resin is used, curing can be performed by further irradiating light after pressure bonding with a roll. Note that although the resin layer 210 is formed over the sealing material 209 here, the resin layer 210 may be formed over the substrate and bonded to the sealing material 209.

Before or after sealing using the sealing material 209, for example, as a passivation film, a sealing body made of an inorganic thin film such as a silicon oxide film or a silicon nitride film using a dry process such as an EB vapor deposition method or a CVD method 208 may be used, or a combination thereof may be used. The passivation film needs to be provided to prevent each layer of the organic EL element from coming into contact with air or moisture, and is preferably formed so as to cover the entire surface of the second electrode. The thickness of the passivation film is preferably 1000 to 5000 nm. In the top emission type structure, it is necessary to consider light transmittance in addition to the above characteristics, and it can be suitably used if the total average in the visible light wavelength region is 70% or more.

Examples of the organic thin film electroluminescence display device of the present invention will be described below, but the present invention is not limited to the following examples.

[Example 1]
An ITO (indium-tin oxide) thin film is formed on a glass substrate having a diagonal size of 5.0 inches using a glass substrate as a translucent substrate by sputtering, and the ITO film is formed by photolithography and etching with an acid solution. The pixel electrode was formed by patterning. The line pattern of the pixel electrode was a pattern in which a line width of 136 μm, a space of 30 μm, and 192 lines were formed in about 32 mm square.

Next, the partition was formed as follows. On the glass substrate on which the pixel electrode was formed, photo- Nice DL-1000 manufactured by Positive Photosensitive Polyimide Toray Industries, Inc. was spin coated. The spin coating conditions were rotated at 150 rpm for 5 seconds and then rotated at 500 rpm for 20 seconds to form a single coating, and the partition wall height was 1.5 μm. The photosensitive material applied on the entire surface was exposed and developed by photolithography to form a partition having a line pattern between the pixel electrodes. Thereafter, the partition walls were baked in an oven at 230 ° C. for 30 minutes.

Next, as a surface treatment of ITO, UV irradiation was performed for 3 minutes on a glass substrate on which a partition wall was formed with a UV / O ₃ cleaning device manufactured by Oak Manufacturing. The work function of ITO changed from 4.8 eV before irradiation to 5.3 eV.

Next, a hole transport layer 204 was formed. As an inorganic material, molybdenum oxide was formed to a thickness of 50 nm by sputtering so that the entire display region was formed. For the patterning, a metal mask having an opening of 77 mm × 103 mm was used.

Next, the interlayer layer 105 was printed by the relief printing method according to the line pattern just above the pixel electrode sandwiched between the partition walls. The shape in the pixel is a thick-walled shape as it goes from the central part to the vicinity of the partition wall, the film thickness in the center part is 30 nm, the vicinity of the partition wall is formed to 150 nm, and the flatness is 60%. .

Next, as a step of curing the interlayer layer 105, a solution in which the coumarin 102 was dissolved was emitted by laser irradiation, and the fluorescence was collected by an optical microscope and irradiated in accordance with the printed line pattern of the interlayer layer. The lens 302 is adjusted so that the light is focused on the area where the thickness of the interlayer layer is about 10 nm in the vertical direction from the pixel electrode, and the laser intensity is adjusted so that the highest energy density is 180 ° C. The pattern was scanned and crosslinked at a speed of 10 μm / s.

Next, as a step of removing the uncured portion of the interlayer layer, toluene was applied to the substrate, and the uncured portion was washed away. Thereafter, the remaining toluene was dried and baked at 180 degrees for 30 minutes in order to sufficiently advance the crosslinking reaction. When the pattern state after firing was observed, the interlayer layer of each pixel had a uniform film shape, the film thickness in the center of the pixel was 20 nm, the film thickness in the vicinity of the partition wall was 33 nm, and the flatness ratio was 93%.

Next, a light emitting layer was printed by a relief printing method on an interlayer layer formed immediately above the pixel electrode sandwiched between the partition walls. The thickness of the light emitting layer after printing and baking was 80 nm.

A cathode layer made of Ba and Al was formed thereon by mask evaporation using a resistance heating evaporation method in a line pattern orthogonal to the line pattern of the pixel electrode. Finally, in order to protect these organic EL constituents from external oxygen and moisture, they were hermetically sealed using a glass cap and an adhesive to produce an organic EL display panel.

In the periphery of the display portion of the obtained organic EL display panel, there are an anode-side extraction electrode and a cathode-side extraction electrode connected to each pixel electrode, and these were obtained by connecting them to a power source. The lighting display of the organic EL display panel was confirmed.

When the obtained organic EL display panel was driven, the inside of the pixel emitted light uniformly, the luminance was 250 cd / cm ² at a driving voltage of 7 V, and the lifetime at an initial luminance of 1000 cd / m ² was 500 h.

[Example 2]
In Example 2, an excimer laser was used for the light energy to be irradiated, the light was condensed by an optical microscope, and the interlayer layer was irradiated. Adjust the lens so that the layer thickness in the vertical direction from the pixel electrode is about 10 nm and adjust the laser intensity so that the highest energy density is 180 ° C. Scanning and crosslinking were performed at a speed of 20 μm / s in accordance with the line pattern. Other conditions are the same as in the first embodiment. When the pattern state after removing the uncrosslinked portion and drying the solvent was observed, the interlayer layer of each pixel had a uniform film shape, the film thickness in the center of the pixel was 20 nm, the film thickness in the vicinity of the partition wall was 33 nm, and the flatness ratio Was 93%.

When the obtained organic EL display panel was driven, the inside of the pixel emitted light uniformly, the luminance was 250 cd / cm ² at a driving voltage of 7 V, and the lifetime at an initial luminance of 1000 cd / m ² was 500 h.

[Example 3]
In Example 3, the lens was adjusted so that light was condensed in the vertical direction from the pixel electrode so that the thickness of the interlayer layer was around 20 nm, and scanning was performed at a speed of 10 μm / s according to the line pattern. Other conditions are the same as in the first embodiment. When the pattern state after removing the uncrosslinked portion and drying the solvent was observed, the interlayer layer of each pixel had a uniform film shape, the film thickness in the center of the pixel was 40 nm, the film thickness in the vicinity of the partition wall was 55 nm, and the flatness ratio Was 90%.

When the obtained organic EL display panel was driven, the inside of the pixels emitted light uniformly, the luminance was 200 cd / cm ² at a driving voltage of 7 V, and the lifetime at an initial luminance of 1000 cd / m ² was 600 h.

[Comparative Example 1]
In Comparative Example 1, the uncrosslinked portion was not removed after the interlayer layer was formed. Other conditions are the same as in the first embodiment. When the pattern state was observed, the interlayer layer of each pixel was shaped like a granite, the film thickness at the center of the pixel was 20 nm, the film thickness near the partition was 150 nm, and the flatness was 55%. When the obtained organic EL display panel was driven, only the central portion emitted light within the pixel, and the vicinity of the partition walls did not emit light. The lifetime at a luminance of 100 cd / cm ² at a driving voltage of 7 V and an initial luminance of 1000 cd / m ² was reduced to 100 h.

[Comparative Example 2]
In Comparative Example 2, the condensed light energy is irradiated in accordance with the line pattern on which the interlayer layer is printed, so that the light is condensed at a position where the thickness of the interlayer layer is about 10 nm in the vertical direction from the pixel electrode. The lens was adjusted to adjust the laser intensity so that the portion with the highest energy density was 180 ° C., and was scanned and crosslinked at a speed of 80 μm / s according to the line pattern. Other conditions are the same as in the first embodiment. When the pattern state was observed, the crosslinking reaction was insufficient, the film was dissolved, and the desired film thickness was not obtained. The inter-layer layer of each pixel has a granite shape, the film thickness at the center of the pixel is 13 nm, the film thickness near the partition wall is 100 nm, and the flatness is 60%. When the obtained organic EL display panel was driven, only the central portion emitted light within the pixel, and the vicinity of the partition walls did not emit light. The lifetime at a luminance of 120 cd / cm ² at a driving voltage of 7 V and an initial luminance of 1000 cd / m ² was reduced to 80 h.

[Comparative Example 3]
In Comparative Example 3, the condensed light energy is irradiated in accordance with the line pattern on which the interlayer layer is printed, so that the light is condensed at a position where the thickness of the interlayer layer is about 10 nm in the vertical direction from the pixel electrode. The lens was adjusted to adjust the laser intensity so that the portion with the highest energy density was 150 ° C., and was scanned and crosslinked at a speed of 10 μm / s according to the line pattern. Other conditions are the same as in the first embodiment. When the pattern state was observed, the crosslinking reaction was insufficient, the film was dissolved, and the desired film thickness was not obtained. The interlayer layer of each pixel was shaped like a granite, the film thickness at the center of the pixel was 15 nm, the film thickness near the partition was 120 nm, and the flatness was 60%. When the obtained organic EL display panel was driven, only the central portion emitted light within the pixel, and the vicinity of the partition walls did not emit light. The lifetime at a luminance of 110 cd / cm ² at a driving voltage of 7 V and an initial luminance of 1000 cd / m ² was reduced to 90 h.

The conditions and evaluation results of each example are summarized in Table 1.

DESCRIPTION OF SYMBOLS 100 ... Organic EL element 101 ... Base material 102 ... 1st electrode 104 ... Hole transport layer / hole injection layer 105 ... Interlayer layer 105a ... Interlayer layer bridge | crosslinking part 105b .. Interlayer non-crosslinked portion / removed portion 106... Light emitting layer 107... Second electrode 107 a... Light impermeable second electrode 107 b. Layer 109a... Light emitting medium layer 109b formed on partition wall... Patterned light emitting medium layer 110... Resin layer 200... Organic electroluminescence display device 203. ... Cathode extraction electrode 209 ... Sealing material 210 ... Resin layer 301 ... Reflective layer 302 ... Lens 303 ... Condensed light energy

Claims (9)

On the substrate, a first electrode, a partition partitioning the first electrode, a light emitting medium layer including at least a light emitting layer formed on the first electrode, and a second electrode on the light emitting medium layer A method for producing an organic electroluminescent device comprising:
The step of forming the light emitting medium layer includes a step of forming a coating film by a wet coating method, a step of selectively curing a part of the coating film by applying light energy to the coating film, Removing uncured portions;
The manufacturing method of the organic electroluminescent element characterized by including. The method for producing an organic electroluminescent element according to claim 1, wherein the wet coating method is any one of a relief printing method, a gravure printing method, and an inkjet method. The method for producing an organic electroluminescence element according to claim 1, wherein the light emitting medium layer is an interlayer layer or a light emitting layer. 4. The method of manufacturing an organic electroluminescence element according to claim 1, wherein the light energy is fluorescence and phosphorescence of an organic material and an inorganic material. 4. The method of manufacturing an organic electroluminescent element according to claim 1, wherein the light energy is a laser. 6. The method of manufacturing an organic electroluminescence element according to claim 1, wherein the light energy is collected by a lens and applied to the light emitting medium layer. The step of removing the uncured portion of the coating film is a step of removing the uncured portion of the coating film by washing it with an organic solvent, an inorganic solvent, or a mixed solution thereof. 6. A method for producing an organic electroluminescent element according to any one of 6 above. 7. The step of removing the uncured portion of the coating film is performed by exposing the uncured portion of the coating film to an organic solvent, an inorganic solvent, or a vapor of a mixed solution thereof. The manufacturing method of the organic electroluminescent element in any one of. It is an organic electroluminescent element manufactured by the manufacturing method in any one of Claims 1 thru | or 8, Comprising: On a board | substrate, on a 1st electrode, the partition which divides said 1st electrode, On said 1st electrode In an organic electroluminescence device comprising a luminescent medium layer including at least a luminescent layer to be formed, and a second electrode on the luminescent medium layer,
The organic light-emitting device, wherein the light-emitting medium layer includes a material that is cured by the light energy.