JP2012064966A - 多結晶シリコン半導体素子及びその製造方法 - Google Patents
多結晶シリコン半導体素子及びその製造方法 Download PDFInfo
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 49
- 239000004065 semiconductor Substances 0.000 title claims abstract description 27
- 229910021420 polycrystalline silicon Inorganic materials 0.000 title abstract description 28
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims abstract description 17
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 17
- 239000010703 silicon Substances 0.000 claims abstract description 17
- 238000000034 method Methods 0.000 claims description 48
- 239000000758 substrate Substances 0.000 claims description 21
- 239000012535 impurity Substances 0.000 claims description 17
- 239000002210 silicon-based material Substances 0.000 claims description 15
- 229910021417 amorphous silicon Inorganic materials 0.000 claims description 11
- 238000000059 patterning Methods 0.000 claims description 9
- 239000000463 material Substances 0.000 claims description 8
- 239000011810 insulating material Substances 0.000 claims description 5
- 238000000151 deposition Methods 0.000 claims description 3
- 230000008021 deposition Effects 0.000 claims description 3
- 238000005530 etching Methods 0.000 claims description 2
- 239000007769 metal material Substances 0.000 claims description 2
- 230000003071 parasitic effect Effects 0.000 abstract description 8
- 239000010409 thin film Substances 0.000 abstract description 4
- 239000000126 substance Substances 0.000 abstract 3
- 239000010410 layer Substances 0.000 description 79
- 229910004298 SiO 2 Inorganic materials 0.000 description 25
- 239000010408 film Substances 0.000 description 13
- 238000004544 sputter deposition Methods 0.000 description 11
- 229910052751 metal Inorganic materials 0.000 description 9
- 239000002184 metal Substances 0.000 description 9
- 239000011159 matrix material Substances 0.000 description 6
- 238000001312 dry etching Methods 0.000 description 4
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 238000005229 chemical vapour deposition Methods 0.000 description 3
- 229920001621 AMOLED Polymers 0.000 description 2
- 238000000137 annealing Methods 0.000 description 2
- 238000002425 crystallisation Methods 0.000 description 2
- 230000008025 crystallization Effects 0.000 description 2
- 238000009616 inductively coupled plasma Methods 0.000 description 2
- 238000005224 laser annealing Methods 0.000 description 2
- 238000005234 chemical deposition Methods 0.000 description 1
- 230000000295 complement effect Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 229910021419 crystalline silicon Inorganic materials 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- -1 for example Inorganic materials 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 230000008054 signal transmission Effects 0.000 description 1
- 150000003376 silicon Chemical class 0.000 description 1
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
- H01L27/124—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition, shape or layout of the wiring layers specially adapted to the circuit arrangement, e.g. scanning lines in LCD pixel circuits
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
- G02F1/1362—Active matrix addressed cells
- G02F1/136286—Wiring, e.g. gate line, drain line
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/41—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions
- H01L29/417—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions carrying the current to be rectified, amplified or switched
- H01L29/41725—Source or drain electrodes for field effect devices
- H01L29/41733—Source or drain electrodes for field effect devices for thin film transistors with insulated gate
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/41—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions
- H01L29/423—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions not carrying the current to be rectified, amplified or switched
- H01L29/42312—Gate electrodes for field effect devices
- H01L29/42316—Gate electrodes for field effect devices for field-effect transistors
- H01L29/4232—Gate electrodes for field effect devices for field-effect transistors with insulated gate
- H01L29/42384—Gate electrodes for field effect devices for field-effect transistors with insulated gate for thin film field effect transistors, e.g. characterised by the thickness or the shape of the insulator or the dimensions, the shape or the lay-out of the conductor
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- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
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- H10K59/131—Interconnections, e.g. wiring lines or terminals
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Abstract
【解決手段】ゲート共通化ラインに存在するシリコン物質層による寄生キャパシタンスを減少させるために、製造工程中にゲート以外の他の部分の不要なシリコン物質を除去する。シリコン物質層は、ゲートの下部のみに局地的に存在し、したがって、寄生キャパシタンスの減少によって信号遅延が抑制されて良好な電気的特性を有する薄膜トランジスタの多結晶シリコン半導体素子が得られる。
【選択図】図2
Description
(TFT及びその製造方法)
(CMOSトランジスタ及びその製造方法)
20 TFT
21 ゲート
22 ソース
23 ドレイン
X ゲート共通化ライン
Y ソース共通化ライン
X’ メインパーライン
X” ジャンパーライン
Claims (9)
- 基板と、
不純物ドーピングによって形成されたドレインとソース及びその間のチャンネル領域をそれぞれ有するシリコンフィルム層と、前記チャンネル領域に対応するゲートと、前記ゲートとチャンネルとの間に介在されるゲート絶縁層と、を備える一組のトランジスタと、
前記両トランジスタのゲートに共に接続される別途の入力ラインと、
前記両トランジスタのうち第1トランジスタのソースと第2トランジスタのドレインとに共に連結される別途の出力ラインと、
前記第1トランジスタのドレインに連結される別途の駆動電圧ラインと、
前記第2トランジスタのソースに連結される接地ラインと、を備えることを特徴とする半導体素子。 - 前記トランジスタ上に前記トランジスタのゲート、ソース、ドレインに対応するコンタクトホールを有する絶縁層が形成されており、前記絶縁層上に前記入力ライン、出力ライン、駆動電圧ライン及び接地ラインが形成されていることを特徴とする請求項1に記載の半導体素子。
- 前記第1トランジスタ及び第2トランジスタのゲートとその下部のゲート絶縁層とは同じパターンを有することを特徴とする請求項1に記載の半導体素子。
- 前記入力ライン、前記出力ライン、前記駆動電圧ライン及び前記接地ラインは、同一物質より形成されていることを特徴とする請求項1に記載の半導体素子。
- 前記第1トランジスタ及び第2トランジスタの各ゲートの下部の全体領域にシリコンフィルム層のチャンネル領域が形成されていることを特徴とする請求項1に記載の半導体素子。
- 基板と、不純物ドーピングによって形成されたドレインとソース及びその間のチャンネル領域を有するシリコンフィルム層と、前記チャンネル領域に対応するゲート及びゲートの下部に設けられるゲート絶縁層と、を含む第1トランジスタ及び第2トランジスタを備える半導体素子の製造方法において、
基板にシリコン物質層を形成する段階と、
前記シリコン物質層上にゲート絶縁物質層を形成する段階と、
前記ゲート絶縁層上にゲート物質層を形成する段階と、
前記ゲート物質層とその下部のゲート絶縁物質層とをパターニングして、前記第1トランジスタ及び第2トランジスタのゲートとその下部のゲート絶縁層とを形成する段階と、
前記第1トランジスタのチャンネルと、その両側のソース及びドレインに対応する領域を除外した部分に所定の第1不純物を注入する段階と、
前記第2トランジスタのチャンネルと、その両側のソース及びドレインに対応する領域を除外した部分に所定の第2不純物を注入する段階と、
前記シリコン物質層をパターニングして、前記第1トランジスタ及び第2トランジスタの各ゲートに覆われたチャンネル領域と各ゲートに覆われていないソース及びドレインとをそれぞれ形成する段階と、
前記積層構造物上に絶縁層を形成する段階と、
前記積層構造物上の絶縁層上に前記第1トランジスタ及び第2トランジスタのソース、ドレイン及びゲートに電気的に連結される電気的連結部を形成する段階と、を含むことを特徴とする半導体素子の製造方法。 - 前記電気的連結部を形成する段階は、
前記絶縁層に前記第1トランジスタ及び第2トランジスタのソース、ドレイン及びゲートに対応するコンタクトホールを形成する段階と、
前記絶縁層上に金属物質層を形成した後に、所定パターンでエッチングする段階と、をさらに含むことを特徴とする請求項6に記載の半導体素子の製造方法。 - 前記基板にシリコン物質層を形成する段階は、
非晶質シリコンの蒸着段階と、
非晶質シリコンの結晶化段階と、をさらに含むことを特徴とする請求項6に記載の半導体素子の製造方法。 - 前記第1不純物はp−型、第2不純物はn−型であることを特徴とする請求項6に記載の半導体素子の製造方法。
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Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
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JPS62229873A (ja) * | 1986-03-29 | 1987-10-08 | Hitachi Ltd | 薄膜半導体装置の製造方法 |
JPH0918005A (ja) * | 1995-06-30 | 1997-01-17 | Citizen Watch Co Ltd | 液晶表示装置用薄膜トランジスター |
JPH09139502A (ja) * | 1995-11-13 | 1997-05-27 | Sharp Corp | 半導体装置およびその製造方法 |
JPH11145483A (ja) * | 1991-05-16 | 1999-05-28 | Semiconductor Energy Lab Co Ltd | 絶縁ゲイト型電界効果半導体装置 |
JP2002033483A (ja) * | 2000-07-17 | 2002-01-31 | Sony Corp | 薄膜半導体装置の製造方法 |
JP2002299631A (ja) * | 2001-03-30 | 2002-10-11 | Fujitsu Ltd | 表示装置及びその製造方法 |
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JPS62229873A (ja) * | 1986-03-29 | 1987-10-08 | Hitachi Ltd | 薄膜半導体装置の製造方法 |
JPH11145483A (ja) * | 1991-05-16 | 1999-05-28 | Semiconductor Energy Lab Co Ltd | 絶縁ゲイト型電界効果半導体装置 |
JPH0918005A (ja) * | 1995-06-30 | 1997-01-17 | Citizen Watch Co Ltd | 液晶表示装置用薄膜トランジスター |
JPH09139502A (ja) * | 1995-11-13 | 1997-05-27 | Sharp Corp | 半導体装置およびその製造方法 |
JP2002033483A (ja) * | 2000-07-17 | 2002-01-31 | Sony Corp | 薄膜半導体装置の製造方法 |
JP2002299631A (ja) * | 2001-03-30 | 2002-10-11 | Fujitsu Ltd | 表示装置及びその製造方法 |
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Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |