JP2012047503A - Probe card - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a probe card and a probe device capable of suppressing an interval of probes from being considerably displaced with respect to an interval of electrodes on a semiconductor wafer, by causing the probe card to follow a temperature change of the semiconductor wafer.SOLUTION: A probe card is comprised of a probe substrate 122 and a heating sheet 124. On a first side of the probe substrate, probes 121 are formed and on a second side of the probe substrate, probe electrodes 122b conducted with the probes 121 via a wiring layer 122a are formed. The heating sheet 124 is disposed facing the second side of the probe substrate 122 and comprised of a sheet-like insulation member in which a resistor 35 for heating the probe substrate 122 is disposed. The heating sheet 124 has through-holes 33 for exposing the probe electrodes 122b, and an electrode part 34 for supplying power to the resistor 35, and the electrode part 34 is formed on a surface opposed to the probe substrate 122.

Description

  The present invention relates to a probe card, and more particularly, to a probe card in which a probe is brought into contact with an electronic circuit to be inspected in order to inspect the electrical characteristics of the electronic circuit formed on a semiconductor wafer.

  In general, when a semiconductor device is manufactured, electrical characteristics of each electronic circuit formed on a semiconductor wafer are inspected before dicing the semiconductor wafer. This inspection is performed by supplying a power source and an inspection signal to an electronic circuit to be inspected and detecting a response signal using a tester device. At this time, a probe card is used to connect a large number of minute electrodes formed on the semiconductor wafer to a large number of signal terminals of the tester device.

  The probe card includes a plurality of probes for contacting microelectrodes formed on an electronic circuit on a semiconductor wafer, and a wiring board for electrically connecting the probes and the tester device. A probe device is used when a probe on such a probe card is brought into contact with an electronic circuit on a semiconductor wafer. The probe device includes a wafer chuck that holds a semiconductor wafer, a probe card holder that holds a probe card, a chuck drive unit that moves the wafer chuck, and the like.

  Electronic circuit inspection includes a high temperature test and a low temperature test, and these tests are performed when the semiconductor wafer is in thermal equilibrium with the atmosphere by maintaining the atmosphere around the semiconductor wafer at a constant temperature. The distance between the electrodes of the electronic circuit expands during the high temperature test and contracts during the low temperature test due to the influence of the temperature change of the semiconductor wafer. Similarly, the probe interval also expands during the high temperature test and contracts during the low temperature test due to the temperature change of the probe card. For this reason, when the temperature of the semiconductor wafer and the probe card is deviated, the interval between the probes on the probe card and the interval between the electrodes of the electronic circuit are deviated, and the probe is correctly brought into contact with the electrodes of the electronic circuit. There was a problem that the case where it was not possible to occur. Normally, a heater for heating the semiconductor wafer is mounted on the wafer chuck, but when replacing the semiconductor wafer, the wafer chuck moves from the inspection position to the retracted position. When such a wafer chuck is retracted, the wafer chuck as a heat source moves away, and the temperature of the probe card may be lowered.

  Therefore, it is conceivable to heat the probe card using a heater. However, if the wiring board is locally heated, the wiring board is warped, and if it is heated too much, the probe is deformed. There was a problem. Furthermore, if a heater is formed on a wiring board together with a terminal electrode and wiring that are electrically connected to the probe, there is a problem that the manufacturing cost is remarkably increased.

  The present invention has been made in view of the above circumstances, and makes the probe card follow the temperature change of the semiconductor wafer and suppresses the gap between the probes from greatly deviating from the gap between the electrodes on the semiconductor wafer. The object is to provide a probe card that can be used. In particular, an object is to provide a probe card that can control the temperature distribution of the probe card without significantly increasing the manufacturing cost.

  A probe card according to a first aspect of the present invention is provided with a probe substrate having a probe formed on a first surface, and a resistor for heating the probe substrate, which is disposed to face the second surface of the probe substrate. And a heating sheet made of a sheet-like insulating member.

  According to such a configuration, since the probe substrate is heated by the heating sheet, when the temperature of the probe card is lowered, the probe substrate can be directly heated and held at a desired temperature. In particular, when the semiconductor wafer on which the electronic circuit to be inspected is formed is retracted from directly below the probe card, it is possible to suppress the temperature of the probe card from decreasing. Therefore, the probe card can be made to follow the temperature change of the semiconductor wafer, and thereby, it is possible to suppress the gap between the probes on the probe card from greatly deviating from the gap between the electrodes on the semiconductor wafer.

  In addition, since the sheet-like heating sheet is disposed so as to face the surface opposite to the probe formation surface of the probe substrate and the probe substrate is heated, the temperature distribution of the probe substrate can be appropriately controlled. In particular, since the heating sheet on which the resistor is disposed is arranged to face the probe substrate, the manufacturing cost is lower than when the heater is formed on the probe substrate together with the terminal electrodes and wiring that are electrically connected to the probe. The increase can be suppressed.

  In the probe card according to the second aspect of the present invention, in addition to the above configuration, the probe substrate is formed with a probe electrode that is electrically connected to the probe on the second surface, and the heating sheet exposes the probe electrode. And a power supply electrode for supplying power to the resistor, and the power supply electrode is formed on a surface opposite to the probe substrate.

  According to such a configuration, when the heating sheet is disposed so as to face the probe substrate, the probe electrode of the probe substrate is exposed from the heating sheet through the through hole of the heating sheet. It can be wired. Furthermore, since the power feeding electrode for supplying power to the resistor is formed on the surface of the heating sheet opposite to the probe substrate, the probe electrode and the power feeding electrode exposed from the heating sheet are the same on the heating sheet. Can be arranged in a plane. Therefore, it is possible to easily wire the probe electrode of the probe substrate and the power feeding electrode of the heating sheet.

  A probe card according to a third aspect of the present invention is arranged to face the surface of the heating sheet on the side opposite to the probe substrate, in addition to the configuration described above, and the first electrode for the probe and the second electrode for the resistor. A main substrate on which electrodes are formed, wherein the probe electrode and the power feeding electrode are electrically connected to the first electrode and the second electrode via connectors that are in elastic contact with each other, respectively. The

  According to such a configuration, when the probe or the heating sheet is connected to the tester device via the main substrate, the probe electrode and the power feeding electrode are respectively connected to the first electrode on the main substrate via the connector that is elastically contacted. Since the electrodes are electrically connected to the first electrode and the second electrode, these electrodes can be easily connected. In particular, when a plurality of probe electrodes are provided on the probe substrate or a plurality of power supply electrodes are provided on the heating sheet, each probe electrode can be easily connected to the first electrode, or each power supply electrode Can be easily connected to the second electrode.

  In the probe card according to a fourth aspect of the present invention, in addition to the above configuration, the heating sheet has a temperature sensor for detecting temperature and a third electrode for the temperature sensor, and the third electrode is on the main substrate. It is comprised so that it may be electrically connected to the 4th electrode provided in through the connector which contacts elastically.

  According to such a configuration, when the heating sheet is connected to the tester device via the main substrate, the power supply electrode and the temperature sensor second electrode provided on the heating sheet are connected via the elastically contacting connector. Since the three electrodes are electrically connected to the second electrode and the fourth electrode on the main board, respectively, these electrodes can be easily connected. In particular, when a plurality of third electrodes are provided on the heating sheet, each third electrode can be easily connected to the fourth electrode.

  According to the probe card of the present invention, since the probe substrate is heated by the heating sheet, when the temperature of the probe card is lowered, the probe substrate can be directly heated and held at a desired temperature. In particular, when the semiconductor wafer on which the electronic circuit to be inspected is formed is retracted from directly below the probe card, it is possible to suppress the temperature of the probe card from decreasing. Therefore, the probe card can be made to follow the temperature change of the semiconductor wafer, and thereby, it is possible to suppress the gap between the probes on the probe card from greatly deviating from the gap between the electrodes on the semiconductor wafer. Moreover, since the heating sheet is fixed to the surface of the probe substrate opposite to the probe forming surface, the temperature distribution of the probe card can be controlled without significantly increasing the manufacturing cost.

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is an explanatory view schematically showing an example of a schematic configuration of a prober system 1 according to an embodiment of the present invention, and shows a state when a semiconductor wafer 11 is inspected. FIG. 2 is a diagram showing an example of the operation of the prober system 1 of FIG. 1, and shows a state when the wafer chuck 21 is retracted. It is the external view which showed one structural example of the probe card 12 in the prober system 1 of FIG. It is sectional drawing which showed the cut surface at the time of cut | disconnecting the probe card 12 of FIG. 3 by an AA cutting line. FIG. 4 is a plan view showing a configuration example of a main part of the probe card 12 of FIG. 3, and shows a heating sheet 124 for heating the probe substrate 122. It is sectional drawing which showed the cut surface at the time of cut | disconnecting the heating sheet 124 of FIG. 5 by a BB cutting line. FIG. 2 is a block diagram showing a configuration example of a main part of the prober 13 of FIG.

<Prober system>
1 and 2 are explanatory views schematically showing an example of a schematic configuration of the prober system 1 according to the embodiment of the present invention, and shows a state of a cut surface when the prober 13 is cut by a vertical surface. ing. FIG. 1 shows a state in which the electronic circuit on the semiconductor wafer 11 is inspected by bringing the probe 121 on the probe card 12 into contact. FIG. 2 shows a state when the wafer chuck 21 is retracted.

  The prober system 1 includes a semiconductor wafer 11 on which an electronic circuit is formed, a probe card 12 on which a plurality of probes 121 are formed, and a prober 13 that brings the probe 121 on the probe card 12 into contact with the electronic circuit on the semiconductor wafer 11. And a tester device 14 and an interposer 15.

  The semiconductor wafer 11 is a substrate made of a semiconductor such as silicon, and a plurality of electronic circuits are formed in advance. The probe card 12 includes a plurality of probes 121 that are brought into contact with microelectrodes in an electronic circuit, a probe substrate 122 on which these probes 121 are disposed, and a probe substrate 122 disposed on the lower surface and held by the prober 13. Main substrate 123.

  The prober 13 is a probe device including a wafer chuck 21, a probe card holder 22, a chuck vertical drive unit 23, and a chuck horizontal drive unit 24. The wafer chuck 21 is a wafer holding unit for holding the semiconductor wafer 11 horizontally, and includes a horizontal mounting table on which the semiconductor wafer 11 is mounted, a claw portion that sandwiches the semiconductor wafer 11, and the like. The semiconductor wafer 11 is held by the wafer chuck 21 with the electronic circuit formation surface facing upward.

  The probe card holder 22 is a probe card holding part for holding the probe card 12 horizontally, and the peripheral part of the main board 123 is supported. The probe card 12 is held by the probe card holder 22 with the formation surface of the probe 121 facing downward.

  The chuck vertical drive unit 23 is a moving means for moving the wafer chuck 21 to move the wafer chuck 21 in the vertical direction (vertical direction) in order to position the semiconductor wafer 11 in the vertical direction. If the wafer chuck 21 is moved upward by the chuck vertical drive unit 23, the probe 121 can be brought into contact with the terminal electrode of the electronic circuit.

  The chuck horizontal driving unit 24 is a moving unit for moving the wafer chuck 21 from the inspection position for inspecting the semiconductor wafer 11 to the retracted position. The inspection position is a position where the semiconductor wafer 11 faces the lower surface of the probe card 12 immediately below the probe card 12. The retracted position is a position farther from the probe card 12 than the inspection position.

  Here, the retracted position of the wafer chuck 21 is formed at a position horizontally spaced from the inspection position immediately below the probe card 12, and the chuck horizontal drive unit 24 moves the wafer chuck 21 and the chuck vertical drive unit 23 in the horizontal direction. It consists of a horizontal axis drive mechanism to be moved.

  The tester device 14 is an inspection device that generates an inspection signal for inspecting an electronic circuit on the semiconductor wafer 11 and analyzes a response signal from the electronic circuit, and includes a tester head 14a and a transmission cable 14b. The tester head 14 a is an input / output unit for inputting and outputting inspection signals and response signals to the main board 123 of the probe card 12 via a relay board such as the interposer 15, and is mounted on the prober 13. . The tester head 14a is connected to the main unit via a transmission cable 14b.

<Probe card>
FIG. 3 is an external view showing a configuration example of the probe card 12 in the prober system 1 of FIG. 1, and shows a state of the lower surface of the probe card 12. The main board 123 is a wiring board that is detachably attached to the prober 13, and is formed of a circular PCB (printed circuit board).

  The main board 123 is provided with a probe board holder 123a for holding the probe board 122 and a plurality of external terminals 123b to which signal terminals of the tester device 14 are connected. The probe substrate holder 123 a is a holding means for holding the probe substrate 122 for holding the probe substrate 122, and a peripheral portion of the probe substrate 122 is supported.

  The external terminal 123 b is formed on the peripheral edge of the main substrate 123. The external terminal 123 b is electrically connected to the probe 121 through each wiring on the main board 123 and the probe board 122.

  The probe substrate 122 is a sub-substrate disposed on the main substrate 123, and here is made of a rectangular insulating substrate. The probe 121 is a probe for making contact with minute electrodes, and is arranged in alignment with the arrangement of terminal electrodes of an electronic circuit to be inspected.

  In this example, the horizontally long probe substrate 122 is a substrate common to a plurality of probes 121 arranged in a state of being separated from each other, and four probe rows including 12 probes 121 are formed on the probe substrate 122. Has been.

<A-A cross section>
4 is a cross-sectional view showing a cut surface when the probe card 12 of FIG. 3 is cut along an AA cutting line. The probe card 12 includes a probe board 122, a heating sheet 124, a connection unit 125, a main board 123, and a reinforcing plate 126.

  The probe substrate 122 has a probe 121 fixed to the lower surface thereof, and the probe electrode 122b and the probe 121 formed on the upper surface are electrically connected via a wiring layer 122a penetrating the probe substrate 122. The probe electrode 122 b is a terminal electrode that contacts the connection pin 125 a of the connection unit 125, and is provided for each probe 121.

  The heating sheet 124 is a heater circuit made of a sheet-like insulating member that heats the probe substrate 122, and is disposed to face the upper surface of the probe substrate 122. The heating sheet 124 is provided with a resistor as a heating element, an electrode portion for the resistor, a temperature sensor, and a terminal electrode for the temperature sensor. The heating sheet 124 is fixed to the upper surface of the probe substrate 122 via an adhesive sheet, for example.

  The connection unit 125 is a relay unit for conducting the probe board 122 and the main board 123, and is configured by a plurality of connection pins 125a and a guide plate 125b in which a through hole in which the connection pins 125a are arranged is formed. .

  The connection pin 125a is a connector for electrically connecting the terminal electrode on the main board 123 and the terminal electrode on the probe board 122 or the heating sheet 124, and elastically contacts these terminal electrodes. To do. The connection pin 125a is a rod-like connector that is elastically biased in the axial direction by a biasing means such as a spring, and is made of a conductive metal.

  The guide plate 125b is a flat plate made of an insulator such as ceramic, and is sometimes referred to as an ST (space transformer) substrate. The guide plate 125 b is disposed with its lower surface facing the upper surface of the probe substrate 122 on which the heating sheet 124 is disposed and with its upper surface facing the lower surface of the main substrate 123.

  The connection pin 125a is accommodated in the through hole of the guide plate 125b, and its lower end protrudes from the lower surface of the guide plate 125b and its upper end protrudes from the upper surface of the guide plate 125b. In addition, the upper end part and lower end part of the connection pin 125a are arrange | positioned coaxially, and are mutually connected. The guide plate 125b is provided with connection pins 125a for the probe, for the resistor of the heating sheet 124, and for the temperature sensor.

  The main board 123 is formed with a resistor terminal electrode 123c, a probe terminal electrode 123d, a temperature sensor terminal electrode 123e, a through hole through which the engaging portion 125c of the guide plate 125b passes. The terminal electrode 123c is a terminal electrode for supplying power to the resistor of the heating sheet 124, and includes an electrode pad that contacts the connection pin 125a.

  The terminal electrode 123d is a terminal electrode that is electrically connected to the probe 121, and includes an electrode pad that contacts the connection pin 125a. The terminal electrode 123e is a terminal electrode for conducting with the temperature sensor of the heating sheet 124, and includes an electrode pad that contacts the connection pin 125a.

  The terminal electrodes 123c, 123d, and 123e are all formed on the lower surface of the main substrate 123. For each probe 121, the lower end of the connection pin 125a is elastically biased downward and is pressure-connected to the probe electrode 122b. On the other hand, the upper end portion of the connection pin 125a is elastically biased upward and is pressure-connected to the terminal electrode 123d.

  In this manner, the connection pin 125a contacts the probe electrode 122b and the terminal electrode 123d, whereby the probe electrode 122b and the terminal electrode 123d are electrically connected via the connection pin 125a. The resistor terminal electrode 123c and the temperature sensor terminal electrode 123e also have the same connection structure as the connection structure described for the probe terminal electrode 123d.

  The reinforcing plate 126 is a flat plate for preventing the deformation of the main substrate 123 and is fixed to the upper surface of the main substrate 123. The guide plate 125 is fixed to the main substrate 123 by attaching an engaging portion 125 c that penetrates the through hole of the main substrate 123 to the reinforcing plate 126 using the fastening component 127. On the other hand, the peripheral edge of the probe substrate 122 is held by the probe substrate holder 123a of the main substrate 123, and the downward movement is restricted.

<Heating sheet>
FIG. 5 is a plan view showing a configuration example of the main part of the probe card 12 of FIG. 3, and shows a heating sheet 124 for heating the probe substrate 122. The heating sheet 124 is composed of a circuit board having substantially the same shape and size as the probe board 122, and includes a plurality of temperature sensors 31, detection signal output electrodes 32, a plurality of resistors 35, and power supply electrodes to the resistors 35. A part 34 and a through hole 33 for the probe electrode are formed.

  The through hole 33 is formed to expose the probe electrode 122 b on the probe substrate 122 from the heating sheet 124, and the connection pin 125 a of the connection unit 125 contacts the probe electrode 122 b through the through hole 33. The through hole 33 is an opening common to the plurality of probes 121 constituting the probe row, and has a vertically long rectangular shape.

  The resistor 35 is a heating element (heater) for heating the probe substrate 122, and is made of a predetermined conductive metal that generates heat when a current flows. The resistor 35 is formed of a patterned conductor layer, and power supply electrode portions 34 are respectively formed at both ends and the center of the resistor pattern. The power supply electrode portion 34 is composed of a terminal electrode for supplying power to the resistor 35. In this example, such resistors 35 are arranged on the right side and the left side of the through-hole 33, respectively. That is, the resistor 35 is two-dimensionally arranged in the entire heating sheet 124.

  The temperature sensor 31 is a temperature detection device for detecting the temperature of the probe substrate 122, and a thermocouple is used as the detection element, for example. The detection signal output electrode 32 is a terminal electrode for outputting a detection signal of the temperature sensor 31, and includes an electrode pad for contacting the connection pin 125 a of the connection unit 125. The electrode 32 is formed on the surface of the heating sheet 124 opposite to the probe substrate side.

  In this example, two electrodes 32 are provided for one temperature sensor 31, and the electrodes 32 and the temperature sensor 31 are electrically connected via a wiring pattern. Such a temperature sensor 31 is provided for each probe row and is disposed in the vicinity of the through hole 33.

  In this way, the temperature distribution of the entire probe substrate 122 can be controlled by arranging the resistors 35 two-dimensionally. In particular, by arranging the resistor 35 and the temperature sensor 31 in association with the probe rows on the probe substrate 122, the vicinity of each probe row can be appropriately heated and controlled. Further, even when a temperature gradient occurs in the probe substrate 122 due to the influence of the surrounding environment, the temperature of the entire probe substrate 122 can be made uniform.

  In addition, since the sheet-like heating sheet 124 is fixed to the surface opposite to the probe formation surface of the probe substrate 122 and heated, the temperature distribution of the probe substrate 122 can be appropriately controlled. That is, it is possible to suppress the probe substrate 122 from being locally heated and to prevent the probe 121 from being deformed due to excessive heating.

  Further, since the heating sheet 124 on which the resistor 35 is disposed is fixed to the probe substrate 122, the heater is manufactured on the probe substrate 122 together with the terminal electrode and wiring that are electrically connected to the probe 121. An increase in cost can be suppressed. Moreover, since the probe electrode 122b is exposed from the heating sheet 124 through the through-hole 33, the conduction | electrical_connection performance between the connection pin 125a and the probe electrode 122b is securable.

  FIG. 6 is a cross-sectional view showing a cut surface when the heating sheet 124 of FIG. 5 is cut along a BB cutting line. The heating sheet 124 includes an insulating layer 41, a conductor layer 42 and an insulating layer 43. The conductor layer 42 is made of a conductive metal that constitutes the resistor 35, for example, an alloy mainly composed of nickel (Ni) and chromium (Cr). The insulating layer 41 is formed on the opposite side of the conductor layer 42 from the probe substrate 122 side, and an electrode hole 34a for exposing a part of the surface of the conductor layer 42 is formed.

  Since the heating sheet 124 has a structure in which the conductor layer 42 is provided between the insulating layers 41 and 43, as a whole, the heating sheet 124 has better thermal conductivity than the probe substrate 122 and controls the temperature distribution of the probe substrate 122. It is suitable for.

  The power supply electrode portion 34 to the resistor 35 is constituted by an electrode hole 34 a and a coating film 34 b formed on the surface of the conductor layer 42. The coating film 34b is a conductive metal film formed on the conductor layer 42 in order to improve the contact property when the connection pin 125a is brought into contact. The coating film 34b is a metal that is difficult to oxidize, such as gold (Au), rhodium ( Rh) or palladium (Pd).

  When the lower end of the connection pin 125a of the connection unit 125 is in contact with the coating film 34b of the power supply electrode portion 34, the power supply electrode portion 34 and the terminal electrode 123c on the main substrate 123 are electrically connected via the connection pin 125a. . The electrode 32 has a connection structure similar to that of the power supply electrode portion 34, and the lower end of the connection pin 125 a comes into contact with the electrode 32, whereby the electrode 32 and the terminal electrode 123 e on the main substrate 123 are connected via the connection pin 125 a. And conduct.

<Control unit>
FIG. 7 is a block diagram showing a configuration example of a main part of the prober 13 of FIG. 1, and shows a control unit for adjusting the temperature of the probe card 12. The control unit includes a temperature adjustment unit 51 and a target temperature storage unit 52, and controls the power supply to the resistor 35 based on the temperature detected by each temperature sensor 31.

  The temperature adjustment unit 51 adjusts the amount of heat generated by each resistor 35 by controlling power supply to the resistor 35, thereby adjusting the temperature of the probe card 12. Specifically, the amount of generated heat is adjusted so that the detected temperature of the temperature sensor 31 approaches the target temperature previously stored in the target temperature storage unit 52. In the temperature adjustment unit 51, power supply to each resistor 35 is controlled so that the temperature of the probe substrate 122 is uniform.

  According to the present embodiment, since the probe substrate 122 is heated by the heating sheet 124, when the temperature of the probe card 12 is lowered, the probe substrate 122 can be directly heated and held at a desired temperature. . In particular, it is possible to prevent the temperature of the probe card 12 from being lowered when the semiconductor wafer 11 is retracted from directly below the probe card 12. Accordingly, the probe card 12 can follow the temperature change of the semiconductor wafer 11, thereby suppressing the gap between the probes 121 on the probe card 12 from greatly deviating from the gap between the electrodes on the semiconductor wafer 11. can do.

  Further, when the heating sheet 124 is disposed so as to face the probe substrate 122, the probe electrode 122b is exposed from the heating sheet 124 through the through hole 33 of the heating sheet 124, so that wiring is easily performed to the probe electrode 122b. be able to. Furthermore, since the electrode part 34 for supplying electric power to the resistor 35 is formed on the surface of the heating sheet 124 opposite to the probe substrate 122, the probe electrode 122b and the electrode part 34 exposed from the heating sheet 124 are provided. Can be arranged on the same surface of the heating sheet 124. Therefore, it is possible to easily wire the probe electrode 122b of the probe substrate 122 and the electrode portion 34 of the heating sheet 124. Furthermore, since the power supply to each resistor 35 is controlled based on the temperature detected by the temperature sensor 31 so that the temperature of the probe substrate 122 is uniform, the temperature distribution of the probe substrate 122 can be controlled.

  In addition, since the heating sheet 124 is affixed to the probe substrate 122 after the probe substrate 122 is formed, the productivity of the probe card 12 can be improved compared to the case where a resistor is provided in the probe substrate 122.

  In the present embodiment, an example in which the retreat position is formed at a position separated in the horizontal direction from directly below the probe card 12 and the probe card 12 is heated when the wafer chuck 21 is retracted has been described. However, the present invention does not limit the method of retracting the wafer chuck 21 to the above configuration. For example, the position separated from directly below the probe card 12 is set as the retreat position, and the probe substrate 122 of the probe card 12 is heated by the heating sheet 124 when the wafer chuck 21 moves to the retreat position. There may be.

DESCRIPTION OF SYMBOLS 1 Prober system 11 Semiconductor wafer 12 Probe card 121 Probe 122 Probe board 122a Wiring layer 122b Probe electrode 123 Main board 123a Probe board holder 123b External terminal 123c Resistor terminal electrode 123d Probe terminal electrode 123e Temperature sensor terminal electrode 124 Heating sheet 125 Connection unit 125a Connection pin 125b Guide plate 125c Engaging portion 126 Reinforcing plate 127 Fastening component 13 Prober 14 Tester device 14a Tester head 14b Transmission cable 15 Interposer 21 Wafer chuck 22 Probe card holder 23 Chuck vertical drive unit 24 Chuck horizontal Drive portion 31 Temperature sensor 32 Temperature sensor terminal electrode 33 Probe electrode through hole 34 Resistor electrode portion 34a Electrode hole 34 b Coating film 35 Resistor 41 Insulating layer 42 Conductor layer 43 Insulating layer 51 Temperature adjustment unit 52 Target temperature storage unit

Claims (4)

A probe substrate having a probe formed on the first surface;
A probe card comprising: a heating sheet made of a sheet-like insulating member disposed opposite to the second surface of the probe substrate and provided with a resistor for heating the probe substrate. . The probe substrate has a probe electrode formed on the second surface to be electrically connected to the probe,
The heating sheet has a through hole for exposing the probe electrode and a power supply electrode for supplying power to the resistor, and the power supply electrode is a surface opposite to the probe substrate. The probe card according to claim 1, wherein the probe card is formed as follows. The heating sheet is disposed so as to face the surface opposite to the probe substrate, and includes a main substrate on which the first electrode for the probe and the second electrode for the resistor are formed,
The probe card according to claim 2, wherein the probe electrode and the power feeding electrode are electrically connected to the first electrode and the second electrode through connectors that are elastically in contact with each other.   The heating sheet has a temperature sensor for detecting temperature and a third electrode for the temperature sensor, and the third electrode is in contact with the fourth electrode provided on the main substrate in elastic contact. The probe card according to claim 3, wherein the probe card is electrically connected via a child.

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