JP2012040050A5 - - Google Patents
Download PDFInfo
- Publication number
- JP2012040050A5 JP2012040050A5 JP2010181172A JP2010181172A JP2012040050A5 JP 2012040050 A5 JP2012040050 A5 JP 2012040050A5 JP 2010181172 A JP2010181172 A JP 2010181172A JP 2010181172 A JP2010181172 A JP 2010181172A JP 2012040050 A5 JP2012040050 A5 JP 2012040050A5
- Authority
- JP
- Japan
- Prior art keywords
- stent
- nickel
- cobalt
- stent element
- alloy
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims 16
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims 8
- 229910045601 alloy Inorganic materials 0.000 claims 6
- 239000000956 alloy Substances 0.000 claims 6
- 229910052759 nickel Inorganic materials 0.000 claims 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 4
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims 4
- 229910017052 cobalt Inorganic materials 0.000 claims 4
- 239000010941 cobalt Substances 0.000 claims 4
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 claims 4
- 229910052802 copper Inorganic materials 0.000 claims 4
- 239000010949 copper Substances 0.000 claims 4
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims 4
- 229910052737 gold Inorganic materials 0.000 claims 4
- 239000010931 gold Substances 0.000 claims 4
- 229910052763 palladium Inorganic materials 0.000 claims 4
- 229910052709 silver Inorganic materials 0.000 claims 4
- 239000004332 silver Substances 0.000 claims 4
- 238000005323 electroforming Methods 0.000 claims 3
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 claims 2
- 229910000531 Co alloy Inorganic materials 0.000 claims 2
- 229910000990 Ni alloy Inorganic materials 0.000 claims 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 claims 1
- FEWJPZIEWOKRBE-JCYAYHJZSA-N Dextrotartaric acid Chemical compound OC(=O)[C@H](O)[C@@H](O)C(O)=O FEWJPZIEWOKRBE-JCYAYHJZSA-N 0.000 claims 1
- KCXVZYZYPLLWCC-UHFFFAOYSA-N EDTA Chemical compound OC(=O)CN(CC(O)=O)CCN(CC(O)=O)CC(O)=O KCXVZYZYPLLWCC-UHFFFAOYSA-N 0.000 claims 1
- QAOWNCQODCNURD-UHFFFAOYSA-L Sulfate Chemical compound [O-]S([O-])(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-L 0.000 claims 1
- 229910021529 ammonia Inorganic materials 0.000 claims 1
- 150000001875 compounds Chemical class 0.000 claims 1
- XLJMAIOERFSOGZ-UHFFFAOYSA-M cyanate Chemical compound [O-]C#N XLJMAIOERFSOGZ-UHFFFAOYSA-M 0.000 claims 1
- XPPKVPWEQAFLFU-UHFFFAOYSA-J diphosphate(4-) Chemical compound [O-]P([O-])(=O)OP([O-])([O-])=O XPPKVPWEQAFLFU-UHFFFAOYSA-J 0.000 claims 1
- 235000011180 diphosphates Nutrition 0.000 claims 1
- 238000004070 electrodeposition Methods 0.000 claims 1
- ACVYVLVWPXVTIT-UHFFFAOYSA-M phosphinate Chemical compound [O-][PH2]=O ACVYVLVWPXVTIT-UHFFFAOYSA-M 0.000 claims 1
- FDDDEECHVMSUSB-UHFFFAOYSA-N sulfanilamide Chemical class NC1=CC=C(S(N)(=O)=O)C=C1 FDDDEECHVMSUSB-UHFFFAOYSA-N 0.000 claims 1
- 229940095064 tartrate Drugs 0.000 claims 1
Priority Applications (6)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010181172A JP5713336B2 (ja) | 2010-08-12 | 2010-08-12 | ステント |
| US13/814,939 US20130138204A1 (en) | 2010-08-12 | 2011-08-10 | Stent |
| KR1020137006067A KR101597405B1 (ko) | 2010-08-12 | 2011-08-10 | 스텐트 |
| PCT/JP2011/068314 WO2012020812A1 (ja) | 2010-08-12 | 2011-08-10 | ステント |
| EP11816476.3A EP2604228A4 (en) | 2010-08-12 | 2011-08-10 | STENT |
| CN2011800393607A CN103079605A (zh) | 2010-08-12 | 2011-08-10 | 支架 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010181172A JP5713336B2 (ja) | 2010-08-12 | 2010-08-12 | ステント |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2012040050A JP2012040050A (ja) | 2012-03-01 |
| JP2012040050A5 true JP2012040050A5 (enExample) | 2013-08-29 |
| JP5713336B2 JP5713336B2 (ja) | 2015-05-07 |
Family
ID=45567773
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2010181172A Expired - Fee Related JP5713336B2 (ja) | 2010-08-12 | 2010-08-12 | ステント |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US20130138204A1 (enExample) |
| EP (1) | EP2604228A4 (enExample) |
| JP (1) | JP5713336B2 (enExample) |
| KR (1) | KR101597405B1 (enExample) |
| CN (1) | CN103079605A (enExample) |
| WO (1) | WO2012020812A1 (enExample) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102605390B (zh) * | 2012-03-31 | 2014-08-13 | 大连理工大学 | 电铸制备血管支架用可降解Fe-Zn合金管材的方法 |
| JP6175283B2 (ja) * | 2013-06-03 | 2017-08-02 | 東邦金属株式会社 | ステント |
| EP3087958B1 (en) | 2013-12-24 | 2019-10-30 | Nipro Corporation | Stent |
| JP6756733B2 (ja) * | 2015-03-30 | 2020-09-16 | シー・アール・バード・インコーポレーテッドＣ Ｒ Ｂａｒｄ Ｉｎｃｏｒｐｏｒａｔｅｄ | 医療用装置、カテーテルアセンブリ、医療用装置用のルアーコネクタ、及び医療用装置の製造方法 |
Family Cites Families (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5024733A (en) * | 1989-08-29 | 1991-06-18 | At&T Bell Laboratories | Palladium alloy electroplating process |
| US6019784A (en) * | 1996-04-04 | 2000-02-01 | Electroformed Stents, Inc. | Process for making electroformed stents |
| US5906759A (en) * | 1996-12-26 | 1999-05-25 | Medinol Ltd. | Stent forming apparatus with stent deforming blades |
| US6248190B1 (en) * | 1998-06-15 | 2001-06-19 | Scimed Life Systems, Inc. | Process of making composite stents with gold alloy cores |
| JP3323132B2 (ja) * | 1998-06-25 | 2002-09-09 | 株式会社 旺電舎 | ステントおよびその製造方法 |
| US6506211B1 (en) * | 2000-11-13 | 2003-01-14 | Scimed Life Systems, Inc. | Stent designs |
| US20030044307A1 (en) * | 2001-08-27 | 2003-03-06 | Crombie Edwin Alfred | Palladium/platinum alloy |
| WO2004100827A2 (en) * | 2003-05-07 | 2004-11-25 | Advanced Bio Prosthetic Surfaces, Ltd. | Metallic implantable grafts and method of making same |
| US20050090888A1 (en) * | 2003-10-28 | 2005-04-28 | Hines Richard A. | Pleated stent assembly |
| US7901451B2 (en) * | 2004-09-24 | 2011-03-08 | Biosensors International Group, Ltd. | Drug-delivery endovascular stent and method for treating restenosis |
| US20060100692A1 (en) * | 2004-11-09 | 2006-05-11 | Robert Burgermeister | Cobalt-chromium-molybdenum fatigue resistant alloy for intravascular medical devices |
| CN100358482C (zh) * | 2005-01-31 | 2008-01-02 | 武汉理工大学 | 多功能医用金属支架及制备方法 |
| US20060259126A1 (en) * | 2005-05-05 | 2006-11-16 | Jason Lenz | Medical devices and methods of making the same |
| JP5078271B2 (ja) * | 2006-03-30 | 2012-11-21 | テルモ株式会社 | 生体器官拡張用ステントおよびその製造方法 |
| WO2009041691A1 (ja) * | 2007-09-28 | 2009-04-02 | Terumo Kabushiki Kaisha | 生体内留置物 |
| JP5927405B2 (ja) * | 2008-09-19 | 2016-06-01 | フォート ウェイン メタルス リサーチ プロダクツ コーポレーション | 耐疲労損傷性ワイヤおよびその製造方法 |
-
2010
- 2010-08-12 JP JP2010181172A patent/JP5713336B2/ja not_active Expired - Fee Related
-
2011
- 2011-08-10 KR KR1020137006067A patent/KR101597405B1/ko not_active Expired - Fee Related
- 2011-08-10 EP EP11816476.3A patent/EP2604228A4/en not_active Withdrawn
- 2011-08-10 CN CN2011800393607A patent/CN103079605A/zh active Pending
- 2011-08-10 WO PCT/JP2011/068314 patent/WO2012020812A1/ja not_active Ceased
- 2011-08-10 US US13/814,939 patent/US20130138204A1/en not_active Abandoned
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2010174373A5 (enExample) | ||
| JP2012529341A5 (enExample) | ||
| EP1892321A3 (en) | A Hard Gold Alloy Plating Bath | |
| JP2013100592A5 (enExample) | ||
| JP2015045094A5 (enExample) | ||
| JP2008518209A5 (enExample) | ||
| IN2014CN04166A (enExample) | ||
| EP2626449A3 (en) | Plating bath and method | |
| JP2011029636A5 (enExample) | ||
| JP2017163169A5 (ja) | 複層ワイヤ | |
| PH12014502330B1 (en) | Copper-nickel alloy electroplating bath and plating method | |
| CN105848611B (zh) | 支架 | |
| RU2018120328A (ru) | Имплантируемый эндолюминальный протез | |
| JP2021502259A5 (enExample) | ||
| EA201171424A1 (ru) | Катод для электролитических процессов | |
| EP2879169A3 (en) | Method of manufacturing a silver alloy bump for a semiconductor structure using a cyanide-based plating bath | |
| IL284987A (en) | Electrodeposition of a cobalt or copper alloy, and use in microelectronics | |
| WO2017210060A3 (en) | Light-driven synthesis of plasmonic nanoparticles and nanomaterials | |
| CN104127269B (zh) | 一种血管支架 | |
| CO6801793A2 (es) | Electrorecuperación de oro y plata a partir de soluciones lixiviantes mediante depósito catódico y anódico simultáneo | |
| Efimova et al. | Electrodeposition of Copper-Silver Alloys from Aqueous Solutions: A Prospective Process for Miscellaneous Usages | |
| GB201320147D0 (en) | Part comprising a coating over a metal substrate made of a superalloy, said coating including a metal sublayer | |
| CN202671688U (zh) | 一种电镀槽 | |
| CN103173816A (zh) | 一种无氰电镀银溶液 | |
| CN204982044U (zh) | 镀膜治具 |