JP2012037203A - System for cooling and recovering exhaust heat of electronic apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To achieve a system for cooling and recovering exhaust heat of an electronic apparatus by which a high energy saving effect can be obtained.SOLUTION: This system is provided with a steam compression type freezer 20 with an evaporator 24 for directly cooling the heating element 11 of each heating apparatus 1, and an adsorbent freezer 30 with absorbents 31, 32, etc. The condensor 22 of the steam compression type freezer 20 and the absorbent 32 (for desorption) of the adsorbent freezer 30 are thermally coupled with each other by a heat medium (heating water 42, etc.) which circulates in a heat recovery pipe 43, thus a steam desorption process by the absorbent 32 is formed. On the other hand, in an evaporator 33, which generates steam to be adsorbed by the adsorbent 31(for adsorption), water is cooled by cooling action accompanying the heat of vaporization to generate cooling water 35. This cooling water 35 is utilized for cooling, etc.

Description

  The present invention relates to a cooling system for cooling a high-density heating element such as an electronic device.

  In electronic devices such as server devices and power supply devices installed in Internet data centers, etc., the power consumption is rapidly increasing due to the progress of the information society. It has been. For this reason, the heat generation density of electronic devices is steadily increasing, and a cooling technology that supports ultra-high density heat generation is required.

  Cooling means such as air cooling and liquid cooling have been applied to remove the heat generated by electronic equipment and keep electronic components such as semiconductor elements used below the specified temperature. There is a need for high performance cooling technology. Further, in order to save power by reducing power consumption, it is extremely important to reduce power consumption required for cooling together with high efficiency technology for reducing generation loss of electronic devices.

Currently, many electronic devices perform cooling by air cooling as exemplified in FIG.
In FIG. 6, the heat generating device 1 corresponds to an electronic device typified by a server device or a power supply device installed in the above-described Internet data center or the like. The heat generating device 1 is installed in an installation space (referred to as an electric room in FIG. 6) of an electronic device in the Internet data center or the like.

  Such air in the electric room is cooled by the air conditioning system shown in the drawing. The air conditioning system includes a compressor 71, a condenser 72, an expansion mechanism 73 (expansion valve), an evaporator 74, a refrigerant pipe 3, and the like, and these components 71 to 74 and the refrigerant pipe 3 are filled with refrigerant (evaporation and condensation). This is a well-known general vapor compression refrigeration machine in which a refrigerant that undergoes a phase change) circulates. Although not shown, naturally, a fan for blowing air to the evaporator 74 is also provided.

  Moreover, the cooling water is supplied with respect to the condenser 72 by the structure not shown to illustration. For the heat radiation in the condenser 72, cooling with cooling water is performed instead of air cooling. Due to the heat radiation in the condenser 72, the temperature of the cooling water rises to become warm water, and is returned to the configuration (not shown). In the configuration (not shown), the cooling water is returned to the cooling water and supplied to the condenser 72 again.

  Naturally, power consumption is required for the operation of the vapor compression refrigerator, and power consumption is also required for the generation of cooling water in the configuration (not shown). Moreover, in the said air conditioning system, the exhaust heat of the said vapor compression refrigerator is generally performed with the said condenser 72 and cooling water.

  The air cooling method as shown in FIG. 6 has a problem that the heat transfer performance is lower than that of the liquid cooling method, and a large heat sink is required, resulting in an increase in the size of the apparatus. In addition, a large-scale air conditioner is required to maintain the air temperature supplied to the heat exchange unit at a predetermined temperature, which leads to an increase in power consumption.

  Note that the prior art illustrated in FIG. 6 is disclosed in, for example, Patent Document 1.

Japanese Patent Laid-Open No. 2003-314859

  In the air cooling system that cools a large-scale electronic device system, measures such as a local air conditioning system that processes equipment heat without dispersing it in an installation space are taken. In this local air-conditioning system, the evaporating temperature can be set higher than in the conventional overall air-conditioning system, so that the operating efficiency of the air conditioner can be increased, and energy savings of 20 to 30% level can be expected.

  In order to further increase the cooling efficiency and achieve greater energy saving, the air cooling method by air conditioning is the limit, and a liquid cooling method that directly removes the heat generated by the device is being studied. In general, a water cooling method is adopted in which low-temperature water or the like is circulated and cooled.

  The disadvantage of this water-cooling method is that piping equipment for circulating water is necessary, and if this pipe is damaged by vibration or impact, the cooling water will cause poor insulation of the electronic equipment, causing serious malfunctions such as equipment malfunction and ignition. Leading to a serious accident. For this reason, a cooling system having high cooling performance and high safety and reliability is desired.

  On the other hand, the temperature of the exhaust heat from the electronic device is in the range of room temperature to about 80 ° C., and even if the amount of exhaust heat is enormous, there are hardly any means for effectively using this. This is difficult to be established from the economical point of view, because the use application of warm exhaust heat is heating and hot water supply, and the season and use time are limited.

  For this reason, it is necessary to convert the warm exhaust heat into other highly effective forms such as electricity. For example, when performing thermoelectric conversion, the energy conversion efficiency is extremely low due to the low temperature difference, and the investment recovery cannot be performed. There is.

  An object of the present invention is to utilize exhaust heat from an electronic device by providing a vapor compression refrigerator that cools an electronic device and an adsorption refrigerator that is thermally coupled to a condenser of the vapor compression refrigerator. As a result, it is possible to form a desorption process and generate cold water, thereby obtaining an energy saving effect. By using this cold water for cooling an electronic device installation space, for example, a high energy saving effect can be obtained. It is to provide a collection system.

  An electronic device cooling / exhaust heat recovery system of the present invention is a system for removing heat generated by an electronic device in an arbitrary indoor space, and includes a compressor, a first condenser, an expansion valve, a first evaporator, These are connected by a first pipe, and a refrigerant is sealed inside, and the first evaporator is in contact with the electronic device, and when one is for adsorption, the other is Two adsorbents to be detached, a second evaporator, an adsorption refrigerator having a second condenser, the first condenser of the vapor compression refrigerator, and the desorption of the adsorption refrigerator And a thermal coupling means for thermally coupling the adsorbent used to form a desorption process.

  In the electronic apparatus cooling / exhaust heat recovery system having the above-described configuration, for example, the desorbing adsorbent by heat supplied to the desorbing adsorbent from the vapor compression refrigerator side through the thermal connecting means. The water vapor is desorbed from the water, and the water formed by liquefying the water vapor by the second condenser flows into the second evaporator and is vaporized in the second evaporator to become water vapor. Cooling water may be generated by cooling the water in the second pipe passing through the second evaporator by the heat of vaporization.

  In addition, for example, the cooling water generated in the second evaporator is supplied to the heat exchanger installed in the arbitrary indoor space, so that the indoor space is cooled by the heat exchanger. You may make it perform.

  By exhaustively connecting the first condenser of the vapor compression refrigerator and the adsorbent which is the desorption of the adsorption refrigerator, exhaust heat from the vapor compression refrigerator side is utilized. The adsorbent desorption process can be formed, and cooling water can be generated with an adsorption refrigerator, which can be used to cool the indoor space, for example, and has a large energy saving effect. It will be obtained.

  Moreover, in the cooling / exhaust heat recovery system for an electronic device having the above-described configuration, for example, the thermal connection means has a circulation path for circulating a heat medium between the first condenser and the desorbing adsorbent. A heat radiation path is installed in parallel to the circulation path of the heat medium, and a part of the heat medium in the circulation path is flowed through the heat radiation path to be cooled in the heat radiation path to the circulation path. You may make it return.

  According to the electronic device cooling / exhaust heat recovery system and the like according to the present invention, a vapor compression refrigerator that cools the electronic device, and an adsorption refrigerator that is thermally coupled to the condenser of the vapor compression refrigerator are provided. This makes it possible to form a desorption process using the exhaust heat from the electronic device and generate cold water, and to obtain an energy saving effect. By using this cold water for cooling the electronic device installation space, a high energy saving effect is obtained. Is obtained.

It is a figure which shows the basic composition of the cooling and waste heat recovery system of the electronic device of this example. (A), (b) is a figure which shows operation | movement (principle) of an adsorption-type refrigerator. It is a figure for demonstrating the other characteristic (the 1) of the cooling / exhaust heat recovery system of the electronic device of this example. It is a figure for demonstrating the other characteristic (the 2) of the cooling and waste heat recovery system of the electronic device of this example. It is a figure for demonstrating the other characteristic (the 3) of the cooling and waste heat recovery system of the electronic device of this example. It is an example of composition of the exothermic device cooling system by the conventional air conditioning.

Embodiments of the present invention will be described below with reference to the drawings.
FIG. 1 is a diagram illustrating a basic configuration of an electronic device cooling / exhaust heat recovery system according to the present embodiment.
Note that, in FIG. 1, the same reference numerals are given to the components substantially the same as those shown in FIG.

  Therefore, for example, the illustrated heat generating device 1 corresponds to an electronic device represented by a server device or a power supply device installed in the above-described Internet data center or the like. The heat generating device 1 is installed in an arbitrary installation space (electrical room), and recently has a high heat generation density as described above. Moreover, there are not a few cases where there are a plurality of heat generating devices 1 and a large number of them.

  The electronic device cooling / exhaust heat recovery system of this example shown in FIG. 1 cools the heat generating device 1 and directly cools each heat generating device 1 instead of the conventional air cooling system. The electronic device cooling / exhaust heat recovery system of the present example is an adsorption refrigeration unit that is thermally coupled to the vapor compression refrigerator 20 that cools the heating device 1 and the condenser 22 of the vapor compression refrigerator 20. Machine 30. This thermal coupling is realized by a thermal connecting portion (a heat recovery pipe 43, heating water 42, etc.) described later.

  As will be described in detail later, by this thermal connection portion, the condenser 22 of the vapor compression refrigerator 20 and the adsorbent (desorption) of the adsorption refrigerator 30 are thermally connected to desorb (water vapor). A process is formed.

Each heat generating device 1 has a heat generating element 11. The heat generating element 11 is a processor such as a CPU / MPU, for example, and is a main heat source in the heat generating device 1.
The vapor compression refrigerator 20 has a configuration in which a compressor 21, a condenser 22, an expansion valve 23, an evaporator 24, and these are connected by a refrigerant pipe 3, and a refrigerant that performs a phase change between evaporation and condensation is enclosed therein. ing.

  The overall configuration itself of such a vapor compression refrigerator 20 may be substantially the same as the conventional configuration shown in FIG. However, the detailed configuration of the evaporator 24 is different from that of the conventional evaporator 74. That is, the conventional evaporator 74 is for the air cooling system, but the evaporator 24 of this example is configured to directly remove the heat generated by the heat generating device 1 (the heat generating element 11). Thus, for example, the heating element 11 is mounted on the surface of the heat sink that forms the evaporator 24. The details will be described later with an example shown in FIG.

  As in the case of the conventional configuration, the refrigerant circulates in each of the above configurations 21 to 24 and the refrigerant pipe 3 so that the evaporator 24 is cooled. That is, when the liquid refrigerant is vaporized into gas in the evaporator 24, the surroundings are cooled by taking the heat of vaporization (heat of evaporation) from the surroundings. Conventionally, ambient air is cooled, but in this example, the heating element 11 is directly cooled.

  The refrigerant gasified in the evaporator 24 as described above is compressed by the compressor 21 and then sent to the condenser 22 to dissipate heat. For this heat dissipation, for example, a configuration is known in which cooling is performed by air cooling using a fan or the like (exchanging heat with the outside air), or a configuration using cooling water is known as described with reference to FIG. On the other hand, in this example, as will be described later, a thermal connecting portion (heat recovery pipe 43, heating water 42, etc.) is provided. As a result, the exhaust heat from the vapor compression refrigerator 20 side is used for the desorption process (water vapor) on the adsorption refrigerator 30 side, which will be described in detail later.

  As is well known, the amount of heat radiated by the condenser 22 is the sum of the amount of heat generated during compression by the compressor 21 and the amount of heat taken away from the surroundings (the heating element 11) by the evaporator 24. It is. If the amount of heat generated in the compressor 21 is not taken into consideration, the present system uses the heat deprived from the heating element 11 by the evaporator 24 (the amount of exhaust heat from the electronic device may be enormous as described in the problem), It can be said that it is used effectively on the adsorption refrigerator 30 side.

  The main feature of the cooling / exhaust heat recovery system of the electronic device of this example is that an adsorption refrigeration machine 30 thermally coupled to the condenser 22 in the vapor compression refrigeration machine 20 is provided. This thermally connects the condenser 22 to an adsorbent (desorption) constituting the adsorption refrigerator 30 and forms a desorption process of the adsorption refrigerator 30 using exhaust heat from the electronic equipment. It is what you want to do. Furthermore, since the cold water 35 mentioned later can be produced | generated by operation | movement of the adsorption type refrigerator 30, this cold water 35 can be utilized for some cooling. Conventionally, there have been problems such as limited use of exhaust heat and low conversion efficiency. However, in the embodiment of the present invention, such problems can be solved.

Hereinafter, the configuration and operation of the adsorption refrigerator 30 will be described.
First, as shown in FIG. 1, the adsorption refrigerator 30 includes an adsorbent (adsorption) 31, an adsorbent (desorption) 32, an evaporator 33, a condenser 34, and the like, and can produce cold water 35. In addition, although the cooling water 36 is required here, the cooling water 36 is not essential. The adsorption refrigerator itself is an existing publicly known technique, and therefore, the structure of the adsorption refrigerator 30 is not particularly illustrated or described here. Further, referring to FIGS. 2 (a) and 2 (b), The operation principle will be described.

  The structure of the adsorption refrigeration machine 30 is disclosed in Reference Document 1 (Japanese Patent Laid-Open No. 8-42935), Reference Document 2 (Japanese Patent Laid-Open No. 2004-232929), or the like, and is disclosed at the following URL or the like. Yes.

http://www.chuden.co.jp/corpo/publicity/press2002/0220_2_3.html
2A and 2B show the refrigeration cycle operation of the adsorption refrigeration machine 30. FIG.
First, in FIG. 1, “adsorbent (adsorption) 31”, “adsorbent (desorption) 32” and the like are described, but these two adsorbents are “adsorption” by switching valves by a valve not shown. "For" and "desorption" are alternately switched, one for "adsorption" and the other for "desorption".

  In FIGS. 2A and 2B, one is referred to as an adsorbent A31 and the other as an adsorbent B32. 2A, the adsorbent A31 is used for "adsorption" and the adsorbent B32 is used for "desorption" in FIG. 2A, and the adsorbent A31 is used for "desorption" in FIG. 2B. Agent B32 is for “adsorption”. This cannot be realized only by switching the valve by a valve (not shown) as described above, and further, it is necessary to perform supply switching control of the heating water 42 and the cooling water 36 by a pipe and a valve (not shown). Here, there is no particular illustration or explanation. In any case, the heating water 42 is supplied for “desorption” and the cooling water 36 is supplied for “adsorption”.

  Thus, in the state shown in FIG. 2A, the cooling water 36 is supplied to the adsorbent A31 and the heating water 42 is supplied to the adsorbent B32. On the contrary, in the state shown in FIG. 2B, the heating water 42 is supplied to the adsorbent A31 and the cooling water 36 is supplied to the adsorbent B32.

  FIG. 1 shows a thermal connection portion that performs thermal connection between the adsorbent B32 and the condenser 22 in the state shown in FIG. The thermal connection portion includes a heat recovery pipe 43 passing through the adsorbent B 32 and the condenser 22, heating water 42 flowing through the heat recovery pipe 43, and circulating the heating water 42 through the heat recovery pipe 43. It consists of a pump 41 and the like.

  An arbitrary heat medium (heat medium) is circulated in the heat recovery pipe 43, and the heating water 42 is an example of the heat medium, but is not limited to this example. The thermal connection portion forms a circulation path for circulating the heat medium between the condenser 22 and the desorbing adsorbent.

  The heating water 42 is basically water having a temperature higher than that of the conventional cooling water shown in FIG. 6, and although there is no clear definition, for example, it may be considered as about 40 ° C. to 60 ° C., for example. For example, the condenser 22 receives heat and rises in temperature (for example, 45 ° C. → 50 ° C.), and the 50 ° C. heating water 42 is supplied to the adsorbent B 32 side to heat the adsorbent B 32. As a result, a desorption step (water vapor) in the adsorbent B32 is formed, and the temperature of the heated water 42 is lowered (for example, 50 ° C. → 45 ° C.). Then, this 45 ° C. heated water 42 is supplied to the condenser 22 and again receives heat radiation in the condenser 22 as described above to increase the temperature (for example, 45 ° C. → 50 ° C.).

  The heated water 42 is water heated by heat radiation by the condenser 22 of the vapor compression refrigerator 20 (for example, hot water of about 50 ° C.), and is supplied to the adsorbent (desorption) by the pump 41. The water adsorbed on the adsorbent B32 is desorbed by the heat of the heated water 42 to become the water vapor 38.

  The adsorbents A31 and B32 are, for example, silica gel. As is well known, adsorbents such as silica gel need to be supplied with water vapor while cooling with cooling water when used for “adsorption”, and when used for “desorption”. First, it is necessary that the adsorbent itself contains a certain amount of water, and water vapor is released from the adsorbent by heating with, for example, warm water of about 40 ° C. to 80 ° C.

  In FIG. 2A, the adsorbent A31 adsorbs the water vapor 37 and the adsorbent B32 desorbs the water vapor 38. The water vapor 38 desorbed from the adsorbent B32 flows into the condenser 34 through a valve (not shown) and is liquefied in the condenser 34 (becomes condensed water 39). The cooling water pipe 40 (FIG. 1) for supplying the cooling water 36 to the adsorbent for “adsorption” also passes through the condenser 34, and cooling by the cooling water 36 against the heat radiation in the condenser 34. Is done.

  The condensed water 39 is supplied to the evaporator 33 through a pipe (not shown), and is evaporated (vaporized) in the evaporator 33 to become the water vapor 37 and supplied to the adsorbent A31. Accordingly, as described above, the adsorbent A31 adsorbs the water vapor 37.

  The evaporator 33 is deprived of heat of vaporization by the water vapor 37 and becomes a low temperature (takes heat of vaporization from the surroundings when the water vaporizes and becomes water vapor), and thereby water in the water pipe 48 passing through the evaporator 33. Is cooled to become the cold water 35 shown in FIGS. 1 and 2. On the other hand, in the condenser 34, the water vapor 38 is liquefied and releases latent heat. The cooling water 36 prevents the adsorbent temperature from rising due to the heat of adsorption during the adsorption process and lowers the adsorption speed, and then absorbs the condensation heat (the released latent heat) by the condenser 34. Thereafter, the cooling water 36 is cooled by a cooling water supply device (not shown) and supplied again to the adsorbent (here, adsorbent A31) and the condenser 34.

  Next, FIG. 2B will be described. First, the water vapor 38 shown in FIG. 2B is slightly different from the water vapor 38 in FIG. 2A (the water vapor 38 in FIG. 2A is an adsorbent). The water vapor desorbed from B32 is the water vapor 38 in FIG. 2 (b) is the water vapor desorbed from the adsorbent A31). Here, the same reference numerals are used for explanation.

  For example, after the desorption step is completed in the state of FIG. 2A, the water vapor 37 is supplied to the adsorbent B32 by switching the valve (not shown), and the water vapor 38 desorbed from the adsorbent A31 is condensed into the condenser. The route that flows into 34 opens. Furthermore, by switching the valve (not shown) or the like, the heating water 42 passes through the adsorbent A31, and the cooling water 36 passes through the adsorbent B32. It becomes the state shown. The cooling water 36 is also supplied to the condenser 34 as in the case of FIG.

  In the state of FIG. 2B, the adsorbent A <b> 31 generates water vapor 38 by desorbing moisture held by the heat of the heating water 42. On the other hand, the adsorbent B32 adsorbs the water vapor 37. In this adsorption process, the adsorbent temperature rises due to the heat of adsorption, so it is necessary to cool with the cooling water 36. Although the adsorbing speed is decreased by increasing the adsorbent temperature, this can be prevented.

  Further, even in the state of FIG. 2B, cold water 35 is generated in the evaporator 33. Actually, the state of FIG. 2 (a) and the state of FIG. 2 (b) are alternately switched periodically (for example, every 5 minutes). A desorption process is formed using heat, and cold water 35 is generated in the evaporator 33. By switching the valve (not shown) or switching the supply destination of the cooling water 36 and the heating water 42, the state of FIG. 2 (a) and the state of FIG. 2 (b) are alternately repeated, and the cold water 35 can be generated continuously. .

  As described above, the configuration of the heat generating device 1, the vapor compression refrigerator 20 and the adsorption refrigerator 30 shown in FIG. 1 and the operation method shown in FIGS. Thus, it is possible to form a desorption process using the exhaust heat due to the effective cooling, and further, the cold water 35 is generated, so that it can be used for some kind of cooling.

  Here, when exhaust heat from the heat generating device 1 accompanying cooling of the electronic device or the like (heat generating device 1) is to be used for something, it has been conventionally considered to be used for heating or hot water supply, for example. Especially when the season is other than winter, there is almost no use. In particular, the amount of heat exhausted from electronic devices such as large-scale servers installed in Internet data centers (heat generating device 1) is enormous, and even if the season is winter, it can be used up only by heating and hot water supply. It will be difficult to use.

  On the other hand, particularly in Internet data centers and the like, there is always a demand for cooling and cooling water, and the demand is large. For example, even if there is a system for directly cooling each heat generating device 1 (the heat generating element 11) as shown in FIG. 1, an air conditioner for cooling the air in the installation space (electric room) of the heat generating device 1 group is not necessary. Do not mean. There is also a type using such cold water for such an air conditioner, and the generated cold water 35 can be used, thereby obtaining an energy saving effect related to the air conditioner. Details will be described later with reference to FIG.

  In general, adsorption refrigerators are known to have high initial installation costs, which has been one of the factors that hinder their spread. If this is the case, the initial cost can be recovered, so this system is also effective from an economic point of view.

The basic features of the electronic device cooling / exhaust heat recovery system of this example have been described above.
Hereinafter, other features or applied features of the cooling / waste heat recovery system for the electronic device of this example will be described with reference to FIGS.

FIG. 3 is a diagram for explaining another feature (No. 1) of the cooling / exhaust heat recovery system of the electronic apparatus of this example.
FIG. 3 shows a specific example of the configuration of the evaporator 24, which will be described first. Here, the evaporator 24 has a configuration in which an illustrated cooling plate 241 that cools the heat generating element 11 and a heat exchanger 242 for cooling the equipment are connected in series. The refrigerant pipe 3 passes through the cooling plate 241 and the heat exchanger 242. The cooling plate 241 is in contact with the heating element 11, takes heat directly from the heating element 11, and cools the heating element 11. The cooling plate 241 and the heat exchanger 242 itself are existing configurations and will not be described in further detail.

  Here, in the configuration shown in FIG. 3, in the configuration of the vapor compression refrigerator 20 that cools the heat generating device 1, the refrigerant pipe 3 is branched halfway to form a plurality of branched pipes 3 ′. An evaporator 24 (cooling plate 241 and heat exchanger 242) is provided for each branch pipe 3 '. Thus, as shown in the figure, a plurality of evaporators 24 are installed in parallel.

  In such a configuration, in the other feature (part 1), first, the flow resistance is made variable by installing the flow rate adjusting valve 231 at the refrigerant inlet of each evaporator 24 on each branch pipe 3 ′. Yes. Thereby, for example, the refrigerant flow rate adjustment corresponding to the change in the heat generation load can be performed. That is, for example, when the heat generation amount of the heating element 11 increases due to an increase in the processing load of the arbitrary heating element 11, the valve of the flow rate adjustment valve 231 corresponding to the evaporator 24 that cools the heating element 11 By increasing the opening, the amount of refrigerant flowing into the evaporator 24 can be increased.

  Although not shown or described, a local cooling system that performs local cooling of electronic devices conventionally has a controller (including a CPU / MPU, a memory, various input / output interfaces, etc.) for managing and controlling the entire system. ing. Accordingly, the flow rate adjusting valve 231 may be controlled by, for example, the controller (not shown). The processing in the controller is not shown in detail, but is schematically as described above as an example.

  Alternatively (or in addition), as shown in FIG. 3, electromagnetic valves 232 may be installed on the refrigerant inlet side and the refrigerant outlet side of each evaporator 24 on each branch pipe 3 ′. Thus, when an abnormality occurs in any evaporator 24, the refrigerant flow path is blocked by closing both the electromagnetic valve 232 on the refrigerant inlet side and the electromagnetic valve 232 on the refrigerant outlet side of the evaporator 24. . As a result, it is possible to prevent other evaporators 24 from being affected and maintain the cooling state.

  The above-described control of the electromagnetic valve 232 is not described in detail, but may be executed by the controller (not shown), for example. Further, an alarm may be sounded to notify a worker or the like that an abnormality has occurred in the evaporator 24. As a result, the evaporator 24 in which an abnormality has occurred is repaired / replaced.

  In the configuration example shown in FIG. 3, a receiver 25 is installed between the compressor 21 and the evaporator 24 to perform gas-liquid separation, and the refrigerant liquid is sucked into the compressor 21 due to a sudden decrease in the cooling load, causing failure. The structure which prevents this is taken. As is well known, in the normal state, the refrigerant liquid is evaporated and vaporized in each evaporator 24, and the vaporized refrigerant flows into the compressor 21. If a part of the refrigerant liquid does not vaporize and flows into the compressor 21 in a liquid state, the compressor 21 may break down. In order to prevent this, a receiver 25 is installed, and if there is a refrigerant liquid, it is stored in the receiver 25 so as not to flow into the compressor 21.

The receiver 25 is also called a gas-liquid separator.
Further, in order to cope with a large change in the cooling load, a means for controlling the rotation speed of the compressor 21 by an inverter can be taken. Although this control is not described in detail, it may be executed by the controller (not shown), for example.

FIG. 4 is a diagram for explaining another feature (No. 2) of the cooling / exhaust heat recovery system of the electronic apparatus of this example.
In the example shown in FIG. 4, a plurality of the compressors 21 are installed.

  As shown in the figure, in the configuration of the compressor 21 of the vapor compression refrigerator 20 that cools the heat generating device 1, the refrigerant pipe 3 is branched in the middle to form a plurality of branch pipes 3 ″. A plurality of compressors 21 are installed in parallel by installing a compressor 21 for each ''. By setting it as such a structure, the refrigerant | coolant flow volume adjustment corresponding to a heat_generation | fever change can be performed, for example. Although such refrigerant flow rate adjustment control is not described in detail, it may be executed by, for example, the controller (not shown).

  Alternatively, by adopting the configuration shown in FIG. 4, even when a part (about one unit / 2 units) of the plurality of compressors 21 fails, the cooling operation is performed by another normal compressor 21. It is also possible to configure a redundant system that can be continued. This control is not specifically described in detail, but may be executed by the controller (not shown), for example.

FIG. 5 is a diagram for explaining another feature (No. 3) and an application example of the cooling / exhaust heat recovery system for the electronic device of this example.
First, an application example will be described. This application example is an example of a method of using the cold water 35 generated by the adsorption refrigeration machine 30 as already briefly described, and here is an example used for air conditioning of an electric room (cooling of indoor air). .

  In FIG. 5, the configuration relating to this application example is an evaporator 33, an indoor heat exchanger 53, a pump 51, and a cold water pipe 54. As already described, the cold water 35 is generated in the evaporator 33 of the adsorption refrigerator 30. The cold water 35 is supplied to the indoor heat exchanger 53 through the cold water pipe 54, and heat exchange with the indoor air in the electric room is performed in the indoor heat exchanger 53, thereby cooling the indoor air and cooling water 35. The temperature of the cold water 52 is increased to the temperature of the illustrated cold water 52 (the temperature of the cold water 52> the temperature of the cold water 35; the cold water 52 may be referred to as the hot water 52 or the like). The cold water 52 is returned to the evaporator 33 through the cold water pipe 54 and cooled, whereby the cold water 35 is generated again. Such cold water is circulated by the pump 51.

  Thus, in the cooling / exhaust heat recovery system for the electronic device of this example, the vapor compression refrigerator 20 that directly cools the heat generating device 1 and the condenser 22 of the vapor compression refrigerator 20 are thermally coupled. A combined adsorption refrigeration machine 30, forming an adsorbent desorption process in the adsorption refrigeration machine 30 as exhaust heat utilization from the heat generating device 1, and cooling water 35 in the evaporator 33 of the adsorption refrigeration machine 30. The energy saving effect is obtained by generating. There are various ways of using the generated cold water 35. For example, by using the cold water 35 for air conditioning (cooling) of the electric room, a very large energy saving effect can be obtained. In other words, the exhaust heat of the heat generating device 1 can be recovered and effectively used for cooling, and significant energy saving can be realized.

  Further, in another feature (No. 3) of the cooling / exhaust heat recovery system of the electronic apparatus of the present example, the above-described basic configuration, that is, the condenser 22 of the vapor compression refrigeration machine 20 is used as the adsorption refrigeration machine 30. In the exhaust heat recovery system that forms a desorption process of the adsorption refrigeration machine 30 by being thermally connected to the agent, for example, as shown in FIG. 5, a heat radiation circuit 44 is installed in parallel at the thermal connection part. .

  As shown in the figure, the heat dissipation circuit 44 includes two three-way valves 47 provided at two locations on the heat recovery pipe 43 of the thermal connection portion, a pipe 46, a cooling tower 45, and the like. As shown in the drawing, a part of the pipe 46 passes through the cooling tower 45, and both ends thereof are connected to the two three-way valves 47. As shown in the figure, the cooling tower 45 has a configuration for cooling the cooling water 36, which is not shown in FIG. 1, and is an existing configuration in that sense. The inside of the cooling tower 45 is filled with, for example, a large amount of water.

  According to the heat dissipation circuit 44, for example, by adjusting and controlling the valve opening degree of the three-way valve 47, a part of the heating water 42 flows into the heat dissipation circuit 44 and is supplied to the adsorption refrigeration machine 30 (its adsorbent). The amount of heated water 42 to be adjusted can be adjusted. Of course, the heated water 42 that has flowed into the heat radiation circuit 44 is cooled in the cooling tower 45, returned to the heat recovery pipe 43, and flows into the condenser 22.

  As described above, the thermal connection portion forms a circulation path for circulating the heat medium between the condenser 22 and the desorbing adsorbent. In the above configuration, heat is dissipated with respect to the circulation path of the heat medium. A path (heat dissipating circuit 44) is installed in parallel, and a part of the heat medium in the circulation path flows through the heat dissipating path, is cooled in the heat dissipating path, and is returned to the circulation path.

  Further, for example, when the adsorption refrigeration machine 30 fails, all of the heating water 42 is caused to flow into the heat radiating circuit 44 so that the exhaust heat is dissipated to the atmosphere in the cooling tower 45 and the operation of the vapor compression refrigeration machine 20 is maintained. It is also possible to prevent the cooling of the heat generating device 1 from occurring.

DESCRIPTION OF SYMBOLS 1 Heat generating apparatus 3 Refrigerant piping 3 'Branch piping 11 Heating element 20 Vapor compression refrigerator 21 Compressor 22 Condenser 23 Expansion valve 24 Evaporator 25 Receiver 30 Adsorption type refrigerator 31 Adsorbent A
32 Adsorbent B
33 Evaporator 34 Condenser 35 Chilled Water 36 Cooling Water 37 Steam 38 Steam 39 Condensed Water 40 Cooling Water Pipe 41 Pump 42 Heated Water 43 Heat Recovery Pipe 44 Heat Dissipation Circuit 45 Cooling Tower 46 Pipe 47 Three Way Valve 48 Water Pipe 51 Pump 52 Cooling Water 53 Indoor Heat Exchanger 231 Flow rate adjustment valve 232 Solenoid valve 241 Cooling plate 242 Heat exchanger

Claims (7)

A system for removing heat generated by electronic equipment in an arbitrary indoor space,
A compressor, a first condenser, an expansion valve, a first evaporator, and these are connected by a first pipe, and a refrigerant is sealed therein, and the first evaporator contacts the electronic device. A vapor compression refrigerator,
Two adsorbents, one of which is for adsorption when the other is desorbed, a second evaporator, an adsorption refrigerator having a second condenser,
Thermal connection means for thermally connecting the first condenser of the vapor compression refrigerator and the adsorbent that is desorbed of the adsorption refrigerator to form a desorption step;
An electronic device cooling / exhaust heat recovery system characterized by comprising:   Water vapor is desorbed from the desorbing adsorbent by the heat supplied to the desorbing adsorbent from the vapor compression refrigerator side through the thermal coupling means, and the water vapor is desorbed by the second condenser. The liquefied water flows into the second evaporator and is vaporized in the second evaporator to become water vapor, and the second heat passing through the second evaporator by the heat of vaporization taken away at that time. The cooling / exhaust heat recovery system for an electronic device according to claim 1, wherein cooling water is generated by cooling water in the pipe.   The cooling water generated in the second evaporator is supplied to a heat exchanger installed in the arbitrary indoor space, so that the indoor space is air-cooled by the heat exchanger. The cooling / exhaust heat recovery system for electronic equipment according to claim 2. The thermal connection means forms a circulation path for circulating a heat medium between the first condenser and the desorbing adsorbent,
A heat radiation path is installed in parallel to the circulation path of the heat medium, and a part of the heat medium in the circulation path is flowed through the heat radiation path to be cooled in the heat radiation path and returned to the circulation path. The electronic device cooling / exhaust heat recovery system according to claim 1.   The electronic device includes a plurality of branches, the first pipe is branched to form the same number of branch pipes as the electronic equipment, the first evaporator is provided for each branch pipe, and the first evaporation is performed. 2. The electronic apparatus according to claim 1, wherein a valve is installed at a refrigerant inlet of the evaporator to make the flow path resistance variable, and the refrigerant flow rate adjustment corresponding to the heat generation change of the heat generating apparatus is performed for each first evaporator. Cooling and exhaust heat recovery system.   The electronic device includes a plurality of branches, and the first pipe is branched to form the same number of branch pipes as the electronic equipment, and the first evaporator is provided for each branch pipe and the first evaporator 2. The electronic device according to claim 1, wherein an electromagnetic valve is installed on a refrigerant inlet side and a refrigerant outlet side of the first electronic device, and when an abnormality occurs in any first evaporator, the electromagnetic valve is closed to block the refrigerant flow path. Cooling and exhaust heat recovery system. 2. The electronic device according to claim 1, wherein a plurality of compressors are installed in parallel by branching the first pipe to form a plurality of branch pipes and providing the compressor for each branch pipe. Cooling and exhaust heat recovery system.