JP2012009745A5 - - Google Patents

Download PDF

Info

Publication number
JP2012009745A5
JP2012009745A5 JP2010146234A JP2010146234A JP2012009745A5 JP 2012009745 A5 JP2012009745 A5 JP 2012009745A5 JP 2010146234 A JP2010146234 A JP 2010146234A JP 2010146234 A JP2010146234 A JP 2010146234A JP 2012009745 A5 JP2012009745 A5 JP 2012009745A5
Authority
JP
Japan
Prior art keywords
sealing resin
shield layer
semiconductor device
recess
forming
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2010146234A
Other languages
English (en)
Japanese (ja)
Other versions
JP5530830B2 (ja
JP2012009745A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2010146234A priority Critical patent/JP5530830B2/ja
Priority claimed from JP2010146234A external-priority patent/JP5530830B2/ja
Publication of JP2012009745A publication Critical patent/JP2012009745A/ja
Publication of JP2012009745A5 publication Critical patent/JP2012009745A5/ja
Application granted granted Critical
Publication of JP5530830B2 publication Critical patent/JP5530830B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2010146234A 2010-06-28 2010-06-28 半導体装置及びその製造方法 Expired - Fee Related JP5530830B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2010146234A JP5530830B2 (ja) 2010-06-28 2010-06-28 半導体装置及びその製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010146234A JP5530830B2 (ja) 2010-06-28 2010-06-28 半導体装置及びその製造方法

Publications (3)

Publication Number Publication Date
JP2012009745A JP2012009745A (ja) 2012-01-12
JP2012009745A5 true JP2012009745A5 (cg-RX-API-DMAC7.html) 2013-06-06
JP5530830B2 JP5530830B2 (ja) 2014-06-25

Family

ID=45539931

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2010146234A Expired - Fee Related JP5530830B2 (ja) 2010-06-28 2010-06-28 半導体装置及びその製造方法

Country Status (1)

Country Link
JP (1) JP5530830B2 (cg-RX-API-DMAC7.html)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5751079B2 (ja) * 2011-08-05 2015-07-22 富士通セミコンダクター株式会社 半導体装置及びその製造方法
JP2014146624A (ja) * 2013-01-25 2014-08-14 Murata Mfg Co Ltd モジュールおよびその製造方法
KR102060307B1 (ko) 2018-01-30 2019-12-30 공주대학교 산학협력단 반도체 패키지
WO2020196522A1 (ja) 2019-03-26 2020-10-01 株式会社村田製作所 モジュール
WO2021006141A1 (ja) 2019-07-08 2021-01-14 株式会社村田製作所 モジュールおよびその製造方法
WO2021131774A1 (ja) * 2019-12-27 2021-07-01 株式会社村田製作所 モジュール
WO2021220373A1 (ja) * 2020-04-27 2021-11-04 三菱電機株式会社 半導体装置
US11610847B2 (en) * 2021-05-07 2023-03-21 STATS ChipPAC Pte. Ltd. Laser-based redistribution and multi-stacked packages

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5552821B2 (ja) * 2010-01-28 2014-07-16 Ｔｄｋ株式会社 回路モジュール

Similar Documents

Publication Publication Date Title
JP2012009745A5 (cg-RX-API-DMAC7.html)
JP2010245280A5 (cg-RX-API-DMAC7.html)
TWI502733B (zh) 電子封裝模組及其製造方法
TWI555454B (zh) 行動裝置與零件及其形成零件的方法
JP2016207957A5 (cg-RX-API-DMAC7.html)
JP2011238767A5 (cg-RX-API-DMAC7.html)
JP2010219210A5 (ja) 半導体装置
JP2012109350A5 (cg-RX-API-DMAC7.html)
JP2015233164A5 (cg-RX-API-DMAC7.html)
JP2016018806A5 (cg-RX-API-DMAC7.html)
JP2010267805A5 (cg-RX-API-DMAC7.html)
JP2013118255A5 (cg-RX-API-DMAC7.html)
JP5530830B2 (ja) 半導体装置及びその製造方法
JP2017183521A5 (cg-RX-API-DMAC7.html)
JP2011217547A5 (cg-RX-API-DMAC7.html)
JP2013093386A5 (cg-RX-API-DMAC7.html)
JP2014239187A5 (cg-RX-API-DMAC7.html)
JP2016096292A5 (cg-RX-API-DMAC7.html)
TWI546869B (zh) Manufacturing method of semiconductor device
JP2011222596A5 (cg-RX-API-DMAC7.html)
JP2011061116A5 (cg-RX-API-DMAC7.html)
JP2010192781A5 (cg-RX-API-DMAC7.html)
JP2016206655A5 (cg-RX-API-DMAC7.html)
JP2014049558A5 (cg-RX-API-DMAC7.html)
JP2013174728A5 (cg-RX-API-DMAC7.html)