JP2012009745A5 - - Google Patents

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Publication number
JP2012009745A5
JP2012009745A5 JP2010146234A JP2010146234A JP2012009745A5 JP 2012009745 A5 JP2012009745 A5 JP 2012009745A5 JP 2010146234 A JP2010146234 A JP 2010146234A JP 2010146234 A JP2010146234 A JP 2010146234A JP 2012009745 A5 JP2012009745 A5 JP 2012009745A5
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JP
Japan
Prior art keywords
sealing resin
shield layer
semiconductor device
recess
forming
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2010146234A
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English (en)
Japanese (ja)
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JP5530830B2 (ja
JP2012009745A (ja
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Priority to JP2010146234A priority Critical patent/JP5530830B2/ja
Priority claimed from JP2010146234A external-priority patent/JP5530830B2/ja
Publication of JP2012009745A publication Critical patent/JP2012009745A/ja
Publication of JP2012009745A5 publication Critical patent/JP2012009745A5/ja
Application granted granted Critical
Publication of JP5530830B2 publication Critical patent/JP5530830B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2010146234A 2010-06-28 2010-06-28 半導体装置及びその製造方法 Expired - Fee Related JP5530830B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2010146234A JP5530830B2 (ja) 2010-06-28 2010-06-28 半導体装置及びその製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010146234A JP5530830B2 (ja) 2010-06-28 2010-06-28 半導体装置及びその製造方法

Publications (3)

Publication Number Publication Date
JP2012009745A JP2012009745A (ja) 2012-01-12
JP2012009745A5 true JP2012009745A5 (cg-RX-API-DMAC10.html) 2013-06-06
JP5530830B2 JP5530830B2 (ja) 2014-06-25

Family

ID=45539931

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2010146234A Expired - Fee Related JP5530830B2 (ja) 2010-06-28 2010-06-28 半導体装置及びその製造方法

Country Status (1)

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JP (1) JP5530830B2 (cg-RX-API-DMAC10.html)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5751079B2 (ja) * 2011-08-05 2015-07-22 富士通セミコンダクター株式会社 半導体装置及びその製造方法
JP2014146624A (ja) * 2013-01-25 2014-08-14 Murata Mfg Co Ltd モジュールおよびその製造方法
KR102060307B1 (ko) 2018-01-30 2019-12-30 공주대학교 산학협력단 반도체 패키지
WO2020196522A1 (ja) 2019-03-26 2020-10-01 株式会社村田製作所 モジュール
WO2021006141A1 (ja) * 2019-07-08 2021-01-14 株式会社村田製作所 モジュールおよびその製造方法
WO2021131774A1 (ja) 2019-12-27 2021-07-01 株式会社村田製作所 モジュール
WO2021220373A1 (ja) * 2020-04-27 2021-11-04 三菱電機株式会社 半導体装置
US11610847B2 (en) 2021-05-07 2023-03-21 STATS ChipPAC Pte. Ltd. Laser-based redistribution and multi-stacked packages

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5552821B2 (ja) * 2010-01-28 2014-07-16 Ｔｄｋ株式会社 回路モジュール

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