JP2012004247A5 - - Google Patents

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Publication number
JP2012004247A5
JP2012004247A5 JP2010136491A JP2010136491A JP2012004247A5 JP 2012004247 A5 JP2012004247 A5 JP 2012004247A5 JP 2010136491 A JP2010136491 A JP 2010136491A JP 2010136491 A JP2010136491 A JP 2010136491A JP 2012004247 A5 JP2012004247 A5 JP 2012004247A5
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JP
Japan
Prior art keywords
substrates
cooling
heating
temperature
dedicated
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JP2010136491A
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English (en)
Japanese (ja)
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JP2012004247A (ja
JP5569169B2 (ja
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Priority to JP2010136491A priority Critical patent/JP5569169B2/ja
Priority claimed from JP2010136491A external-priority patent/JP5569169B2/ja
Publication of JP2012004247A publication Critical patent/JP2012004247A/ja
Publication of JP2012004247A5 publication Critical patent/JP2012004247A5/ja
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Publication of JP5569169B2 publication Critical patent/JP5569169B2/ja
Expired - Fee Related legal-status Critical Current
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JP2010136491A 2010-06-15 2010-06-15 基板貼り合せ装置の制御方法、基板貼り合せ装置、積層半導体装置製造方法及び積層半導体装置 Expired - Fee Related JP5569169B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2010136491A JP5569169B2 (ja) 2010-06-15 2010-06-15 基板貼り合せ装置の制御方法、基板貼り合せ装置、積層半導体装置製造方法及び積層半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010136491A JP5569169B2 (ja) 2010-06-15 2010-06-15 基板貼り合せ装置の制御方法、基板貼り合せ装置、積層半導体装置製造方法及び積層半導体装置

Publications (3)

Publication Number Publication Date
JP2012004247A JP2012004247A (ja) 2012-01-05
JP2012004247A5 true JP2012004247A5 (https=) 2013-11-14
JP5569169B2 JP5569169B2 (ja) 2014-08-13

Family

ID=45535939

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2010136491A Expired - Fee Related JP5569169B2 (ja) 2010-06-15 2010-06-15 基板貼り合せ装置の制御方法、基板貼り合せ装置、積層半導体装置製造方法及び積層半導体装置

Country Status (1)

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JP (1) JP5569169B2 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101617920B1 (ko) * 2013-03-20 2016-05-03 주식회사 엘지화학 라미네이터장치

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5347318B2 (ja) * 2008-04-28 2013-11-20 株式会社ニコン 基板接合装置及び基板接合方法

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