JP2011529277A5 - - Google Patents
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- Publication number
- JP2011529277A5 JP2011529277A5 JP2011520319A JP2011520319A JP2011529277A5 JP 2011529277 A5 JP2011529277 A5 JP 2011529277A5 JP 2011520319 A JP2011520319 A JP 2011520319A JP 2011520319 A JP2011520319 A JP 2011520319A JP 2011529277 A5 JP2011529277 A5 JP 2011529277A5
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor chip
- optoelectronic semiconductor
- current spreading
- spreading layer
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 claims 21
- 230000005693 optoelectronics Effects 0.000 claims 15
- 239000000758 substrate Substances 0.000 claims 3
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 claims 2
- 238000009792 diffusion process Methods 0.000 claims 2
- 229910052751 metal Inorganic materials 0.000 claims 2
- 239000002184 metal Substances 0.000 claims 2
- 230000005670 electromagnetic radiation Effects 0.000 claims 1
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 claims 1
- 230000005855 radiation Effects 0.000 claims 1
- YVTHLONGBIQYBO-UHFFFAOYSA-N zinc indium(3+) oxygen(2-) Chemical compound [O--].[Zn++].[In+3] YVTHLONGBIQYBO-UHFFFAOYSA-N 0.000 claims 1
- 239000011787 zinc oxide Substances 0.000 claims 1
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102008035110.5 | 2008-07-28 | ||
| DE102008035110A DE102008035110A1 (de) | 2008-07-28 | 2008-07-28 | Optoelektronischer Halbleiterchip |
| PCT/DE2009/000917 WO2010012256A1 (de) | 2008-07-28 | 2009-06-29 | Optoelektronischer halbleiterchip |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2011529277A JP2011529277A (ja) | 2011-12-01 |
| JP2011529277A5 true JP2011529277A5 (https=) | 2012-08-16 |
| JP5514819B2 JP5514819B2 (ja) | 2014-06-04 |
Family
ID=41279336
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2011520319A Expired - Fee Related JP5514819B2 (ja) | 2008-07-28 | 2009-06-29 | オプトエレクトロニクス半導体チップ |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US8841685B2 (https=) |
| EP (1) | EP2313935A1 (https=) |
| JP (1) | JP5514819B2 (https=) |
| KR (1) | KR101606604B1 (https=) |
| CN (1) | CN102106008B (https=) |
| DE (1) | DE102008035110A1 (https=) |
| TW (1) | TWI415297B (https=) |
| WO (1) | WO2010012256A1 (https=) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1961613B (zh) * | 2004-03-26 | 2011-06-29 | 松下电工株式会社 | 有机发光器件 |
| DE102008048648B4 (de) | 2008-09-24 | 2025-05-15 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Optoelektronischer Halbleiterchip |
| DE102011017196A1 (de) | 2011-04-15 | 2012-10-18 | Osram Opto Semiconductors Gmbh | Polarisierte Strahlung emittierender Halbleiterchip |
| DE102015109786A1 (de) | 2015-06-18 | 2016-12-22 | Osram Opto Semiconductors Gmbh | Verfahren zur Herstellung eines optoelektronischen Halbleiterbauelements sowie optoelektronisches Halbleiterbauelement |
| CN105609596A (zh) * | 2015-09-11 | 2016-05-25 | 映瑞光电科技(上海)有限公司 | 具有电流阻挡结构的led垂直芯片及其制备方法 |
| DE102019103638A1 (de) | 2019-02-13 | 2020-08-13 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Optoelektronisches halbleiterbauelement mit abschnitten einer leitfähigen schicht und verfahren zur herstellung eines optoelektronischen halbleiterbauelements |
Family Cites Families (24)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11168239A (ja) * | 1997-12-05 | 1999-06-22 | Matsushita Electric Ind Co Ltd | 窒化ガリウム系化合物半導体発光素子 |
| US6287947B1 (en) * | 1999-06-08 | 2001-09-11 | Lumileds Lighting, U.S. Llc | Method of forming transparent contacts to a p-type GaN layer |
| US6420736B1 (en) * | 2000-07-26 | 2002-07-16 | Axt, Inc. | Window for gallium nitride light emitting diode |
| US6906352B2 (en) | 2001-01-16 | 2005-06-14 | Cree, Inc. | Group III nitride LED with undoped cladding layer and multiple quantum well |
| US6445007B1 (en) | 2001-03-19 | 2002-09-03 | Uni Light Technology Inc. | Light emitting diodes with spreading and improving light emitting area |
| DE10147886B4 (de) * | 2001-09-28 | 2006-07-13 | Osram Opto Semiconductors Gmbh | Lumineszenzdiode mit vergrabenem Kontakt und Herstellungsverfahren |
| US6784462B2 (en) | 2001-12-13 | 2004-08-31 | Rensselaer Polytechnic Institute | Light-emitting diode with planar omni-directional reflector |
| KR100909733B1 (ko) | 2002-01-28 | 2009-07-29 | 니치아 카가쿠 고교 가부시키가이샤 | 지지기판을 갖는 질화물 반도체소자 및 그 제조방법 |
| JP4635985B2 (ja) | 2002-10-03 | 2011-02-23 | 日亜化学工業株式会社 | 発光ダイオード |
| DE10261676A1 (de) | 2002-12-31 | 2004-07-22 | Osram Opto Semiconductors Gmbh | Leuchtdioden-Chip mit strahlungsdurchlässiger elektrischer Stromaufweitungsschicht |
| JP4259268B2 (ja) | 2003-10-20 | 2009-04-30 | 豊田合成株式会社 | 半導体発光素子 |
| US7119372B2 (en) * | 2003-10-24 | 2006-10-10 | Gelcore, Llc | Flip-chip light emitting diode |
| US7012281B2 (en) | 2003-10-30 | 2006-03-14 | Epistar Corporation | Light emitting diode device and manufacturing method |
| KR100586949B1 (ko) * | 2004-01-19 | 2006-06-07 | 삼성전기주식회사 | 플립칩용 질화물 반도체 발광소자 |
| CN100411209C (zh) | 2004-01-26 | 2008-08-13 | 奥斯兰姆奥普托半导体有限责任公司 | 具有电流扩展结构的薄膜led |
| DE102004025610A1 (de) | 2004-04-30 | 2005-11-17 | Osram Opto Semiconductors Gmbh | Optoelektronisches Bauelement mit mehreren Stromaufweitungsschichten und Verfahren zu dessen Herstellung |
| JP2007207869A (ja) | 2006-01-31 | 2007-08-16 | Rohm Co Ltd | 窒化物半導体発光素子 |
| TWI288979B (en) | 2006-02-23 | 2007-10-21 | Arima Optoelectronics Corp | Light emitting diode bonded with metal diffusion and manufacturing method thereof |
| JP2007281037A (ja) | 2006-04-03 | 2007-10-25 | Dowa Holdings Co Ltd | 半導体発光素子及びその製造方法 |
| DE102006034847A1 (de) * | 2006-04-27 | 2007-10-31 | Osram Opto Semiconductors Gmbh | Optoelektronischer Halbleiterchip |
| TWI322522B (en) | 2006-12-18 | 2010-03-21 | Delta Electronics Inc | Electroluminescent device, and fabrication method thereof |
| US7683380B2 (en) | 2007-06-25 | 2010-03-23 | Dicon Fiberoptics, Inc. | High light efficiency solid-state light emitting structure and methods to manufacturing the same |
| JP2009260316A (ja) * | 2008-03-26 | 2009-11-05 | Panasonic Electric Works Co Ltd | 半導体発光素子およびそれを用いる照明装置 |
| DE102008035900A1 (de) | 2008-04-30 | 2009-11-05 | Osram Opto Semiconductors Gmbh | Leuchtdiodenchip |
-
2008
- 2008-07-28 DE DE102008035110A patent/DE102008035110A1/de not_active Withdrawn
-
2009
- 2009-06-29 JP JP2011520319A patent/JP5514819B2/ja not_active Expired - Fee Related
- 2009-06-29 CN CN200980129527.1A patent/CN102106008B/zh not_active Expired - Fee Related
- 2009-06-29 KR KR1020117004570A patent/KR101606604B1/ko not_active Expired - Fee Related
- 2009-06-29 WO PCT/DE2009/000917 patent/WO2010012256A1/de not_active Ceased
- 2009-06-29 EP EP09775928A patent/EP2313935A1/de not_active Withdrawn
- 2009-06-29 US US13/056,589 patent/US8841685B2/en not_active Expired - Fee Related
- 2009-07-24 TW TW098124990A patent/TWI415297B/zh not_active IP Right Cessation
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