JP2011523212A - 半導体波長変換器が接合された発光ダイオード - Google Patents
半導体波長変換器が接合された発光ダイオード Download PDFInfo
- Publication number
- JP2011523212A JP2011523212A JP2011512493A JP2011512493A JP2011523212A JP 2011523212 A JP2011523212 A JP 2011523212A JP 2011512493 A JP2011512493 A JP 2011512493A JP 2011512493 A JP2011512493 A JP 2011512493A JP 2011523212 A JP2011523212 A JP 2011523212A
- Authority
- JP
- Japan
- Prior art keywords
- wavelength
- light
- photoluminescent
- region
- photoluminescent element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/81—Bodies
- H10H20/813—Bodies having a plurality of light-emitting regions, e.g. multi-junction LEDs or light-emitting devices having photoluminescent regions within the bodies
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
- H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10H20/00
- H01L25/0756—Stacked arrangements of devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/851—Wavelength conversion means
- H10H20/8511—Wavelength conversion means characterised by their material, e.g. binder
- H10H20/8512—Wavelength conversion materials
- H10H20/8513—Wavelength conversion materials having two or more wavelength conversion materials
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US5907308P | 2008-06-05 | 2008-06-05 | |
| US61/059,073 | 2008-06-05 | ||
| PCT/US2009/041521 WO2009148717A2 (en) | 2008-06-05 | 2009-04-23 | Light emitting diode with bonded semiconductor wavelength converter |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2011523212A true JP2011523212A (ja) | 2011-08-04 |
| JP2011523212A5 JP2011523212A5 (enExample) | 2012-06-14 |
Family
ID=41398751
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2011512493A Withdrawn JP2011523212A (ja) | 2008-06-05 | 2009-04-23 | 半導体波長変換器が接合された発光ダイオード |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US20110186877A1 (enExample) |
| EP (1) | EP2301087A2 (enExample) |
| JP (1) | JP2011523212A (enExample) |
| KR (1) | KR20110019390A (enExample) |
| CN (1) | CN102057504A (enExample) |
| TW (1) | TW201006013A (enExample) |
| WO (1) | WO2009148717A2 (enExample) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2016517537A (ja) * | 2013-03-11 | 2016-06-16 | コーニンクレッカ フィリップス エヌ ヴェKoninklijke Philips N.V. | 調光可能な発光装置 |
| JP2017513225A (ja) * | 2014-04-01 | 2017-05-25 | サントル ナショナル ドゥ ラ ルシェルシュ シアンティフィク | 半導体画素、このような画素のマトリクス、このような画素を製造するための半導体構造、およびそれらの製作方法 |
| JP2022543821A (ja) * | 2019-08-06 | 2022-10-14 | プレッシー・セミコンダクターズ・リミテッド | Ledアレイおよびledアレイを形成する方法 |
Families Citing this family (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP2380217A2 (en) | 2008-12-24 | 2011-10-26 | 3M Innovative Properties Company | Method of making double-sided wavelength converter and light generating device using same |
| WO2010074987A2 (en) * | 2008-12-24 | 2010-07-01 | 3M Innovative Properties Company | Light generating device having double-sided wavelength converter |
| JP2012526391A (ja) | 2009-05-05 | 2012-10-25 | スリーエム イノベイティブ プロパティズ カンパニー | インジウム空乏機構を利用してインジウム含有基板上で成長した半導体素子 |
| KR20120015337A (ko) | 2009-05-05 | 2012-02-21 | 쓰리엠 이노베이티브 프로퍼티즈 컴파니 | Led에서 사용하기 위한 재방출 반도체 캐리어 디바이스 및 제조 방법 |
| EP2427922A1 (en) | 2009-05-05 | 2012-03-14 | 3M Innovative Properties Company | Re-emitting semiconductor construction with enhanced extraction efficiency |
| EP2449609A1 (en) | 2009-06-30 | 2012-05-09 | 3M Innovative Properties Company | Cadmium-free re-emitting semiconductor construction |
| EP2449856A1 (en) | 2009-06-30 | 2012-05-09 | 3M Innovative Properties Company | White light electroluminescent devices with adjustable color temperature |
| EP2449608A1 (en) | 2009-06-30 | 2012-05-09 | 3M Innovative Properties Company | Electroluminescent devices with color adjustment based on current crowding |
| US8710533B2 (en) | 2010-06-04 | 2014-04-29 | 3M Innovative Properties Company | Multicolored light converting LED with minimal absorption |
| US8835963B2 (en) | 2010-06-04 | 2014-09-16 | 3M Innovative Properties Company | Light converting and emitting device with minimal edge recombination |
| WO2012042452A2 (en) | 2010-09-29 | 2012-04-05 | Koninklijke Philips Electronics N.V. | Wavelength converted light emitting device |
| DE102011050450A1 (de) * | 2011-05-18 | 2012-11-22 | Osram Opto Semiconductors Gmbh | Optoelektronischer Halbleiterchip, optoelektronisches Halbleiterbauelement und Verfahren zur Herstellung eines optoelektronischen Halbleiterbauelements |
| CN106410006B (zh) * | 2016-06-22 | 2018-08-17 | 厦门乾照光电股份有限公司 | 一种集成可见光指示装置的紫外发光二极管及其生产方法 |
| FR3076080B1 (fr) * | 2017-12-27 | 2019-11-29 | Aledia | Pseudo-substrat pour dispositif optoelectronique et son procede de fabrication |
| WO2020251078A1 (ko) * | 2019-06-12 | 2020-12-17 | 서울바이오시스 주식회사 | 발광 적층체 및 이를 포함한 표시 장치 |
| CN115172544A (zh) * | 2022-06-22 | 2022-10-11 | 广东中民工业技术创新研究院有限公司 | 一种基于全氮化物的外延芯片结构和发光器件 |
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| US5483085A (en) * | 1994-05-09 | 1996-01-09 | Motorola, Inc. | Electro-optic integrated circuit with diode decoder |
| US5424560A (en) * | 1994-05-31 | 1995-06-13 | Motorola, Inc. | Integrated multicolor organic led array |
| US5915193A (en) * | 1995-05-18 | 1999-06-22 | Tong; Qin-Yi | Method for the cleaning and direct bonding of solids |
| DE19645035C1 (de) * | 1996-10-31 | 1998-04-30 | Siemens Ag | Mehrfarbiges Licht abstrahlende Bildanzeigevorrichtung |
| US5898185A (en) * | 1997-01-24 | 1999-04-27 | International Business Machines Corporation | Hybrid organic-inorganic semiconductor light emitting diodes |
| US6212213B1 (en) * | 1999-01-29 | 2001-04-03 | Agilent Technologies, Inc. | Projector light source utilizing a solid state green light source |
| JP4024431B2 (ja) * | 1999-07-23 | 2007-12-19 | 株式会社東芝 | 双方向半導体発光素子及び光伝送装置 |
| US7202506B1 (en) * | 1999-11-19 | 2007-04-10 | Cree, Inc. | Multi element, multi color solid state LED/laser |
| US6737801B2 (en) * | 2000-06-28 | 2004-05-18 | The Fox Group, Inc. | Integrated color LED chip |
| US6563133B1 (en) * | 2000-08-09 | 2003-05-13 | Ziptronix, Inc. | Method of epitaxial-like wafer bonding at low temperature and bonded structure |
| JP2002170989A (ja) * | 2000-12-04 | 2002-06-14 | Sharp Corp | 窒化物系化合物半導体発光素子 |
| JP2002222989A (ja) * | 2001-01-26 | 2002-08-09 | Toshiba Corp | 半導体発光素子 |
| FR2824228B1 (fr) * | 2001-04-26 | 2003-08-01 | Centre Nat Rech Scient | Dispositif electroluminescent a extracteur de lumiere |
| US6870311B2 (en) * | 2002-06-07 | 2005-03-22 | Lumileds Lighting U.S., Llc | Light-emitting devices utilizing nanoparticles |
| US7005679B2 (en) * | 2003-05-01 | 2006-02-28 | Cree, Inc. | Multiple component solid state white light |
| US7071905B1 (en) * | 2003-07-09 | 2006-07-04 | Fan Nong-Qiang | Active matrix display with light emitting diodes |
| CN1275337C (zh) * | 2003-09-17 | 2006-09-13 | 北京工大智源科技发展有限公司 | 高效高亮度多有源区隧道再生白光发光二极管 |
| TWI243489B (en) * | 2004-04-14 | 2005-11-11 | Genesis Photonics Inc | Single chip light emitting diode with red, blue and green three wavelength light emitting spectra |
| US7119377B2 (en) * | 2004-06-18 | 2006-10-10 | 3M Innovative Properties Company | II-VI/III-V layered construction on InP substrate |
| US7161188B2 (en) * | 2004-06-28 | 2007-01-09 | Matsushita Electric Industrial Co., Ltd. | Semiconductor light emitting element, semiconductor light emitting device, and method for fabricating semiconductor light emitting element |
| US7471040B2 (en) * | 2004-08-13 | 2008-12-30 | Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. | Mixed-color light emitting diode apparatus, and method for making same |
| US20060094322A1 (en) * | 2004-10-29 | 2006-05-04 | Ouderkirk Andrew J | Process for manufacturing a light emitting array |
| US7404756B2 (en) * | 2004-10-29 | 2008-07-29 | 3M Innovative Properties Company | Process for manufacturing optical and semiconductor elements |
| US7719015B2 (en) * | 2004-12-09 | 2010-05-18 | 3M Innovative Properties Company | Type II broadband or polychromatic LED's |
| US7402831B2 (en) * | 2004-12-09 | 2008-07-22 | 3M Innovative Properties Company | Adapting short-wavelength LED's for polychromatic, broadband, or “white” emission |
| US7745814B2 (en) * | 2004-12-09 | 2010-06-29 | 3M Innovative Properties Company | Polychromatic LED's and related semiconductor devices |
| TWI267212B (en) * | 2004-12-30 | 2006-11-21 | Ind Tech Res Inst | Quantum dots/quantum well light emitting diode |
| TWI245440B (en) * | 2004-12-30 | 2005-12-11 | Ind Tech Res Inst | Light emitting diode |
| US7045375B1 (en) * | 2005-01-14 | 2006-05-16 | Au Optronics Corporation | White light emitting device and method of making same |
| US7646367B2 (en) * | 2005-01-21 | 2010-01-12 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device, display device and electronic apparatus |
| US20070116423A1 (en) * | 2005-11-22 | 2007-05-24 | 3M Innovative Properties Company | Arrays of optical elements and method of manufacturing same |
| JP4771800B2 (ja) * | 2005-12-02 | 2011-09-14 | スタンレー電気株式会社 | 半導体発光装置及びその製造方法 |
| US7795600B2 (en) * | 2006-03-24 | 2010-09-14 | Goldeneye, Inc. | Wavelength conversion chip for use with light emitting diodes and method for making same |
| KR100723233B1 (ko) * | 2006-03-31 | 2007-05-29 | 삼성전기주식회사 | 백색 발광 소자 |
| US8141384B2 (en) * | 2006-05-03 | 2012-03-27 | 3M Innovative Properties Company | Methods of making LED extractor arrays |
| US7423297B2 (en) * | 2006-05-03 | 2008-09-09 | 3M Innovative Properties Company | LED extractor composed of high index glass |
| US7952110B2 (en) * | 2006-06-12 | 2011-05-31 | 3M Innovative Properties Company | LED device with re-emitting semiconductor construction and converging optical element |
| US20070284565A1 (en) * | 2006-06-12 | 2007-12-13 | 3M Innovative Properties Company | Led device with re-emitting semiconductor construction and optical element |
| KR100901947B1 (ko) * | 2006-07-14 | 2009-06-10 | 삼성전자주식회사 | 반도체 나노결정을 이용하는 백색 발광 다이오드 및 그의제조방법 |
| US8363307B2 (en) * | 2007-02-28 | 2013-01-29 | Ravenbrick, Llc | Multicolor light emitting device incorporating tunable quantum confinement devices |
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| TWI416757B (zh) * | 2008-10-13 | 2013-11-21 | Advanced Optoelectronic Tech | 多波長發光二極體及其製造方法 |
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| KR100982994B1 (ko) * | 2008-10-15 | 2010-09-17 | 삼성엘이디 주식회사 | Led 패키지 모듈 |
| RU2515185C2 (ru) * | 2009-02-05 | 2014-05-10 | СиСиЭс ИНК. | Светодиодное светоизлучающее устройство |
| KR101182442B1 (ko) * | 2010-01-27 | 2012-09-12 | 삼성디스플레이 주식회사 | 유기 발광 디스플레이 장치 및 그의 제조 방법 |
-
2009
- 2009-04-23 KR KR1020107029679A patent/KR20110019390A/ko not_active Withdrawn
- 2009-04-23 CN CN200980121095XA patent/CN102057504A/zh active Pending
- 2009-04-23 EP EP09758880A patent/EP2301087A2/en not_active Withdrawn
- 2009-04-23 US US12/995,655 patent/US20110186877A1/en not_active Abandoned
- 2009-04-23 JP JP2011512493A patent/JP2011523212A/ja not_active Withdrawn
- 2009-04-23 WO PCT/US2009/041521 patent/WO2009148717A2/en not_active Ceased
- 2009-05-06 TW TW098114999A patent/TW201006013A/zh unknown
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2016517537A (ja) * | 2013-03-11 | 2016-06-16 | コーニンクレッカ フィリップス エヌ ヴェKoninklijke Philips N.V. | 調光可能な発光装置 |
| JP2017513225A (ja) * | 2014-04-01 | 2017-05-25 | サントル ナショナル ドゥ ラ ルシェルシュ シアンティフィク | 半導体画素、このような画素のマトリクス、このような画素を製造するための半導体構造、およびそれらの製作方法 |
| JP2022543821A (ja) * | 2019-08-06 | 2022-10-14 | プレッシー・セミコンダクターズ・リミテッド | Ledアレイおよびledアレイを形成する方法 |
| JP7387871B2 (ja) | 2019-08-06 | 2023-11-28 | プレッシー・セミコンダクターズ・リミテッド | Ledアレイおよびledアレイを形成する方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2009148717A3 (en) | 2010-02-18 |
| EP2301087A2 (en) | 2011-03-30 |
| WO2009148717A2 (en) | 2009-12-10 |
| KR20110019390A (ko) | 2011-02-25 |
| TW201006013A (en) | 2010-02-01 |
| US20110186877A1 (en) | 2011-08-04 |
| CN102057504A (zh) | 2011-05-11 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20120419 |
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| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20120419 |
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| A761 | Written withdrawal of application |
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