JP2011522416A - 半導体ウェハの研磨装置及び研磨方法 - Google Patents

半導体ウェハの研磨装置及び研磨方法 Download PDF

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Publication number
JP2011522416A
JP2011522416A JP2011511709A JP2011511709A JP2011522416A JP 2011522416 A JP2011522416 A JP 2011522416A JP 2011511709 A JP2011511709 A JP 2011511709A JP 2011511709 A JP2011511709 A JP 2011511709A JP 2011522416 A JP2011522416 A JP 2011522416A
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JP
Japan
Prior art keywords
wafer
polishing
pressure plate
front surface
support plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2011511709A
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English (en)
Japanese (ja)
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JP2011522416A5 (enExample
Inventor
ピーター・ディ・アルブレヒト
チャン・グオキアン
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SunEdison Inc
Original Assignee
MEMC Electronic Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by MEMC Electronic Materials Inc filed Critical MEMC Electronic Materials Inc
Publication of JP2011522416A publication Critical patent/JP2011522416A/ja
Publication of JP2011522416A5 publication Critical patent/JP2011522416A5/ja
Pending legal-status Critical Current

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
JP2011511709A 2008-05-30 2009-05-19 半導体ウェハの研磨装置及び研磨方法 Pending JP2011522416A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US12/130,190 US8192248B2 (en) 2008-05-30 2008-05-30 Semiconductor wafer polishing apparatus and method of polishing
US12/130,190 2008-05-30
PCT/US2009/044501 WO2009146274A1 (en) 2008-05-30 2009-05-19 Semiconductor wafer polishing apparatus and method of polishing

Publications (2)

Publication Number Publication Date
JP2011522416A true JP2011522416A (ja) 2011-07-28
JP2011522416A5 JP2011522416A5 (enExample) 2012-06-28

Family

ID=40941363

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011511709A Pending JP2011522416A (ja) 2008-05-30 2009-05-19 半導体ウェハの研磨装置及び研磨方法

Country Status (6)

Country Link
US (1) US8192248B2 (enExample)
EP (1) EP2293902A1 (enExample)
JP (1) JP2011522416A (enExample)
KR (1) KR20110055483A (enExample)
CN (1) CN102046331A (enExample)
WO (1) WO2009146274A1 (enExample)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10600634B2 (en) 2015-12-21 2020-03-24 Globalwafers Co., Ltd. Semiconductor substrate polishing methods with dynamic control
WO2017146006A1 (ja) * 2016-02-26 2017-08-31 株式会社フジミインコーポレーテッド 研磨方法、研磨パッド
US10350504B2 (en) * 2016-09-13 2019-07-16 Universal City Studios Llc Systems and methods for incorporating pneumatic robotic systems into amusement park attractions
CN108296931B (zh) * 2018-02-02 2024-06-21 成都精密光学工程研究中心 一种带磨损补偿的偏摆式平面抛光装置
US11081359B2 (en) 2018-09-10 2021-08-03 Globalwafers Co., Ltd. Methods for polishing semiconductor substrates that adjust for pad-to-pad variance
CN109454547A (zh) * 2018-12-27 2019-03-12 杭州众硅电子科技有限公司 一种用于cmp抛光垫寿命在线检测的系统和方法
CN112894594A (zh) * 2019-05-23 2021-06-04 黄彬庆 一种半导体晶片机械抛光加工系统及方法
CN110421479B (zh) * 2019-07-19 2021-01-26 许昌学院 一种电子器件用半导体晶片抛光设备
CN110587469A (zh) * 2019-09-29 2019-12-20 苏州光斯奥光电科技有限公司 一种用于液晶面板的研磨机构
CN111906600B (zh) * 2020-08-29 2021-09-28 中国航发南方工业有限公司 一种偏心型腔内端面磨削方法及装置
EP4063069B1 (en) * 2021-03-23 2022-12-07 Andrea Valentini Plate-like backing pad adapted for releasable attachment to a hand-held polishing or sanding power tool
CN114871941B (zh) * 2022-04-25 2024-04-05 季华实验室 一种抛光头及抛光机
CN116394153B (zh) * 2023-02-28 2023-10-24 名正(浙江)电子装备有限公司 一种晶圆研磨抛光系统

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001179605A (ja) * 1999-10-15 2001-07-03 Ebara Corp ポリッシング装置および方法
JP2001205557A (ja) * 2000-01-26 2001-07-31 Fujikoshi Mach Corp ウェーハの研磨装置

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US4918869A (en) * 1987-10-28 1990-04-24 Fujikoshi Machinery Corporation Method for lapping a wafer material and an apparatus therefor
US5036630A (en) * 1990-04-13 1991-08-06 International Business Machines Corporation Radial uniformity control of semiconductor wafer polishing
US5486129A (en) * 1993-08-25 1996-01-23 Micron Technology, Inc. System and method for real-time control of semiconductor a wafer polishing, and a polishing head
US5658183A (en) * 1993-08-25 1997-08-19 Micron Technology, Inc. System for real-time control of semiconductor wafer polishing including optical monitoring
JP2891068B2 (ja) * 1993-10-18 1999-05-17 信越半導体株式会社 ウエーハの研磨方法および研磨装置
US5584746A (en) 1993-10-18 1996-12-17 Shin-Etsu Handotai Co., Ltd. Method of polishing semiconductor wafers and apparatus therefor
JP3311116B2 (ja) * 1993-10-28 2002-08-05 株式会社東芝 半導体製造装置
US5624299A (en) * 1993-12-27 1997-04-29 Applied Materials, Inc. Chemical mechanical polishing apparatus with improved carrier and method of use
US5664987A (en) * 1994-01-31 1997-09-09 National Semiconductor Corporation Methods and apparatus for control of polishing pad conditioning for wafer planarization
US5908530A (en) 1995-05-18 1999-06-01 Obsidian, Inc. Apparatus for chemical mechanical polishing
US5816900A (en) * 1997-07-17 1998-10-06 Lsi Logic Corporation Apparatus for polishing a substrate at radially varying polish rates
US5934974A (en) * 1997-11-05 1999-08-10 Aplex Group In-situ monitoring of polishing pad wear
US6531397B1 (en) * 1998-01-09 2003-03-11 Lsi Logic Corporation Method and apparatus for using across wafer back pressure differentials to influence the performance of chemical mechanical polishing
US6174221B1 (en) * 1998-09-01 2001-01-16 Micron Technology, Inc. Polishing chucks, semiconductor wafer polishing chucks, abrading methods, polishing methods, semiconductor wafer polishing methods, and methods of forming polishing chucks
US6176764B1 (en) * 1999-03-10 2001-01-23 Micron Technology, Inc. Polishing chucks, semiconductor wafer polishing chucks, abrading methods, polishing methods, simiconductor wafer polishing methods, and methods of forming polishing chucks
US6120350A (en) * 1999-03-31 2000-09-19 Memc Electronic Materials, Inc. Process for reconditioning polishing pads
EP1268129A1 (en) * 2000-03-30 2003-01-02 Memc Electronic Materials S.P.A. Method of polishing wafers
US7140956B1 (en) * 2000-03-31 2006-11-28 Speedfam-Ipec Corporation Work piece carrier with adjustable pressure zones and barriers and a method of planarizing a work piece
US6616513B1 (en) * 2000-04-07 2003-09-09 Applied Materials, Inc. Grid relief in CMP polishing pad to accurately measure pad wear, pad profile and pad wear profile
US6592434B1 (en) 2000-11-16 2003-07-15 Motorola, Inc. Wafer carrier and method of material removal from a semiconductor wafer
KR20040011433A (ko) * 2000-11-21 2004-02-05 엠이엠씨 일렉트로닉 머티리얼스 쏘시에떼 퍼 아찌오니 반도체 웨이퍼, 연마 장치 및 방법
US6764387B1 (en) * 2003-03-07 2004-07-20 Applied Materials Inc. Control of a multi-chamber carrier head
US7207871B1 (en) * 2005-10-06 2007-04-24 Applied Materials, Inc. Carrier head with multiple chambers

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001179605A (ja) * 1999-10-15 2001-07-03 Ebara Corp ポリッシング装置および方法
JP2001205557A (ja) * 2000-01-26 2001-07-31 Fujikoshi Mach Corp ウェーハの研磨装置

Also Published As

Publication number Publication date
CN102046331A (zh) 2011-05-04
EP2293902A1 (en) 2011-03-16
US20090298399A1 (en) 2009-12-03
WO2009146274A1 (en) 2009-12-03
US8192248B2 (en) 2012-06-05
KR20110055483A (ko) 2011-05-25

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