CN102046331A - 半导体晶片抛光装置和抛光方法 - Google Patents

半导体晶片抛光装置和抛光方法 Download PDF

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Publication number
CN102046331A
CN102046331A CN2009801202686A CN200980120268A CN102046331A CN 102046331 A CN102046331 A CN 102046331A CN 2009801202686 A CN2009801202686 A CN 2009801202686A CN 200980120268 A CN200980120268 A CN 200980120268A CN 102046331 A CN102046331 A CN 102046331A
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CN
China
Prior art keywords
wafer
pressing plate
polishing
rubbing head
front surface
Prior art date
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Pending
Application number
CN2009801202686A
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English (en)
Chinese (zh)
Inventor
P·D·阿尔布雷克特
Z·郭强
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SunEdison Inc
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SunEdison Inc
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Filing date
Publication date
Application filed by SunEdison Inc filed Critical SunEdison Inc
Publication of CN102046331A publication Critical patent/CN102046331A/zh
Pending legal-status Critical Current

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
CN2009801202686A 2008-05-30 2009-05-19 半导体晶片抛光装置和抛光方法 Pending CN102046331A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US12/130,190 US8192248B2 (en) 2008-05-30 2008-05-30 Semiconductor wafer polishing apparatus and method of polishing
US12/130,190 2008-05-30
PCT/US2009/044501 WO2009146274A1 (en) 2008-05-30 2009-05-19 Semiconductor wafer polishing apparatus and method of polishing

Publications (1)

Publication Number Publication Date
CN102046331A true CN102046331A (zh) 2011-05-04

Family

ID=40941363

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2009801202686A Pending CN102046331A (zh) 2008-05-30 2009-05-19 半导体晶片抛光装置和抛光方法

Country Status (6)

Country Link
US (1) US8192248B2 (enExample)
EP (1) EP2293902A1 (enExample)
JP (1) JP2011522416A (enExample)
KR (1) KR20110055483A (enExample)
CN (1) CN102046331A (enExample)
WO (1) WO2009146274A1 (enExample)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108296931A (zh) * 2018-02-02 2018-07-20 成都精密光学工程研究中心 一种带磨损补偿的偏摆式平面抛光装置
CN110026885A (zh) * 2018-12-27 2019-07-19 杭州众硅电子科技有限公司 一种抛光垫寿命在线检测的系统和方法
CN110228003A (zh) * 2019-05-23 2019-09-13 黄彬庆 基于双位定位原理的半导体晶片机械抛光加工装置
CN110421479A (zh) * 2019-07-19 2019-11-08 许昌学院 一种电子器件用半导体晶片抛光设备
CN110587469A (zh) * 2019-09-29 2019-12-20 苏州光斯奥光电科技有限公司 一种用于液晶面板的研磨机构
CN111906600A (zh) * 2020-08-29 2020-11-10 中国航发南方工业有限公司 一种偏心型腔内端面磨削方法及装置
CN114871941A (zh) * 2022-04-25 2022-08-09 季华实验室 一种抛光头及抛光机
CN115106898A (zh) * 2021-03-23 2022-09-27 安德里亚·瓦伦蒂尼 适用于与手持抛光或砂光动力工具可拆卸附接的板状垫板

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10600634B2 (en) 2015-12-21 2020-03-24 Globalwafers Co., Ltd. Semiconductor substrate polishing methods with dynamic control
WO2017146006A1 (ja) * 2016-02-26 2017-08-31 株式会社フジミインコーポレーテッド 研磨方法、研磨パッド
US10350504B2 (en) * 2016-09-13 2019-07-16 Universal City Studios Llc Systems and methods for incorporating pneumatic robotic systems into amusement park attractions
US11081359B2 (en) 2018-09-10 2021-08-03 Globalwafers Co., Ltd. Methods for polishing semiconductor substrates that adjust for pad-to-pad variance
CN116394153B (zh) * 2023-02-28 2023-10-24 名正(浙江)电子装备有限公司 一种晶圆研磨抛光系统

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WO1996036459A1 (en) * 1995-05-18 1996-11-21 Exclusive Design Company, Inc. Improved method and apparatus for chemical mechanical polishing
JP2891068B2 (ja) * 1993-10-18 1999-05-17 信越半導体株式会社 ウエーハの研磨方法および研磨装置
US6174221B1 (en) * 1998-09-01 2001-01-16 Micron Technology, Inc. Polishing chucks, semiconductor wafer polishing chucks, abrading methods, polishing methods, semiconductor wafer polishing methods, and methods of forming polishing chucks
CN1352587A (zh) * 1999-03-31 2002-06-05 Memc电子材料有限公司 修整抛光垫的设备和方法
WO2002066206A2 (en) * 2000-11-16 2002-08-29 Motorola, Inc. Wafer carrier and method of material removal from a semiconductor wafer

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US4918869A (en) * 1987-10-28 1990-04-24 Fujikoshi Machinery Corporation Method for lapping a wafer material and an apparatus therefor
US5036630A (en) * 1990-04-13 1991-08-06 International Business Machines Corporation Radial uniformity control of semiconductor wafer polishing
US5486129A (en) * 1993-08-25 1996-01-23 Micron Technology, Inc. System and method for real-time control of semiconductor a wafer polishing, and a polishing head
US5658183A (en) * 1993-08-25 1997-08-19 Micron Technology, Inc. System for real-time control of semiconductor wafer polishing including optical monitoring
US5584746A (en) 1993-10-18 1996-12-17 Shin-Etsu Handotai Co., Ltd. Method of polishing semiconductor wafers and apparatus therefor
JP3311116B2 (ja) * 1993-10-28 2002-08-05 株式会社東芝 半導体製造装置
US5624299A (en) * 1993-12-27 1997-04-29 Applied Materials, Inc. Chemical mechanical polishing apparatus with improved carrier and method of use
US5664987A (en) * 1994-01-31 1997-09-09 National Semiconductor Corporation Methods and apparatus for control of polishing pad conditioning for wafer planarization
US5816900A (en) * 1997-07-17 1998-10-06 Lsi Logic Corporation Apparatus for polishing a substrate at radially varying polish rates
US5934974A (en) * 1997-11-05 1999-08-10 Aplex Group In-situ monitoring of polishing pad wear
US6531397B1 (en) * 1998-01-09 2003-03-11 Lsi Logic Corporation Method and apparatus for using across wafer back pressure differentials to influence the performance of chemical mechanical polishing
US6176764B1 (en) * 1999-03-10 2001-01-23 Micron Technology, Inc. Polishing chucks, semiconductor wafer polishing chucks, abrading methods, polishing methods, simiconductor wafer polishing methods, and methods of forming polishing chucks
JP4056205B2 (ja) * 1999-10-15 2008-03-05 株式会社荏原製作所 ポリッシング装置および方法
JP4307674B2 (ja) * 2000-01-26 2009-08-05 不二越機械工業株式会社 ウェーハの研磨装置
EP1268129A1 (en) * 2000-03-30 2003-01-02 Memc Electronic Materials S.P.A. Method of polishing wafers
US7140956B1 (en) * 2000-03-31 2006-11-28 Speedfam-Ipec Corporation Work piece carrier with adjustable pressure zones and barriers and a method of planarizing a work piece
US6616513B1 (en) * 2000-04-07 2003-09-09 Applied Materials, Inc. Grid relief in CMP polishing pad to accurately measure pad wear, pad profile and pad wear profile
KR20040011433A (ko) * 2000-11-21 2004-02-05 엠이엠씨 일렉트로닉 머티리얼스 쏘시에떼 퍼 아찌오니 반도체 웨이퍼, 연마 장치 및 방법
US6764387B1 (en) * 2003-03-07 2004-07-20 Applied Materials Inc. Control of a multi-chamber carrier head
US7207871B1 (en) * 2005-10-06 2007-04-24 Applied Materials, Inc. Carrier head with multiple chambers

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2891068B2 (ja) * 1993-10-18 1999-05-17 信越半導体株式会社 ウエーハの研磨方法および研磨装置
WO1996036459A1 (en) * 1995-05-18 1996-11-21 Exclusive Design Company, Inc. Improved method and apparatus for chemical mechanical polishing
US6174221B1 (en) * 1998-09-01 2001-01-16 Micron Technology, Inc. Polishing chucks, semiconductor wafer polishing chucks, abrading methods, polishing methods, semiconductor wafer polishing methods, and methods of forming polishing chucks
CN1352587A (zh) * 1999-03-31 2002-06-05 Memc电子材料有限公司 修整抛光垫的设备和方法
WO2002066206A2 (en) * 2000-11-16 2002-08-29 Motorola, Inc. Wafer carrier and method of material removal from a semiconductor wafer

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108296931A (zh) * 2018-02-02 2018-07-20 成都精密光学工程研究中心 一种带磨损补偿的偏摆式平面抛光装置
CN110026885A (zh) * 2018-12-27 2019-07-19 杭州众硅电子科技有限公司 一种抛光垫寿命在线检测的系统和方法
CN110228003A (zh) * 2019-05-23 2019-09-13 黄彬庆 基于双位定位原理的半导体晶片机械抛光加工装置
CN110421479A (zh) * 2019-07-19 2019-11-08 许昌学院 一种电子器件用半导体晶片抛光设备
CN110587469A (zh) * 2019-09-29 2019-12-20 苏州光斯奥光电科技有限公司 一种用于液晶面板的研磨机构
CN111906600A (zh) * 2020-08-29 2020-11-10 中国航发南方工业有限公司 一种偏心型腔内端面磨削方法及装置
CN111906600B (zh) * 2020-08-29 2021-09-28 中国航发南方工业有限公司 一种偏心型腔内端面磨削方法及装置
CN115106898A (zh) * 2021-03-23 2022-09-27 安德里亚·瓦伦蒂尼 适用于与手持抛光或砂光动力工具可拆卸附接的板状垫板
CN115106898B (zh) * 2021-03-23 2024-01-30 安德里亚·瓦伦蒂尼 适用于与手持抛光或砂光动力工具可拆卸附接的板状垫板
CN114871941A (zh) * 2022-04-25 2022-08-09 季华实验室 一种抛光头及抛光机
CN114871941B (zh) * 2022-04-25 2024-04-05 季华实验室 一种抛光头及抛光机

Also Published As

Publication number Publication date
EP2293902A1 (en) 2011-03-16
US20090298399A1 (en) 2009-12-03
JP2011522416A (ja) 2011-07-28
WO2009146274A1 (en) 2009-12-03
US8192248B2 (en) 2012-06-05
KR20110055483A (ko) 2011-05-25

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Application publication date: 20110504