KR20110055483A - 반도체 웨이퍼 폴리싱 장치 및 폴리싱 방법 - Google Patents

반도체 웨이퍼 폴리싱 장치 및 폴리싱 방법 Download PDF

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Publication number
KR20110055483A
KR20110055483A KR1020107026670A KR20107026670A KR20110055483A KR 20110055483 A KR20110055483 A KR 20110055483A KR 1020107026670 A KR1020107026670 A KR 1020107026670A KR 20107026670 A KR20107026670 A KR 20107026670A KR 20110055483 A KR20110055483 A KR 20110055483A
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KR
South Korea
Prior art keywords
wafer
polishing
pressure plate
support plate
polishing head
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
KR1020107026670A
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English (en)
Korean (ko)
Inventor
피터 디. 알브레츠
장 구오치앙
Original Assignee
엠이엠씨 일렉트로닉 머티리얼즈, 인크.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by 엠이엠씨 일렉트로닉 머티리얼즈, 인크. filed Critical 엠이엠씨 일렉트로닉 머티리얼즈, 인크.
Publication of KR20110055483A publication Critical patent/KR20110055483A/ko
Withdrawn legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
KR1020107026670A 2008-05-30 2009-05-19 반도체 웨이퍼 폴리싱 장치 및 폴리싱 방법 Withdrawn KR20110055483A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US12/130,190 US8192248B2 (en) 2008-05-30 2008-05-30 Semiconductor wafer polishing apparatus and method of polishing
US12/130,190 2008-05-30

Publications (1)

Publication Number Publication Date
KR20110055483A true KR20110055483A (ko) 2011-05-25

Family

ID=40941363

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020107026670A Withdrawn KR20110055483A (ko) 2008-05-30 2009-05-19 반도체 웨이퍼 폴리싱 장치 및 폴리싱 방법

Country Status (6)

Country Link
US (1) US8192248B2 (enExample)
EP (1) EP2293902A1 (enExample)
JP (1) JP2011522416A (enExample)
KR (1) KR20110055483A (enExample)
CN (1) CN102046331A (enExample)
WO (1) WO2009146274A1 (enExample)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10600634B2 (en) 2015-12-21 2020-03-24 Globalwafers Co., Ltd. Semiconductor substrate polishing methods with dynamic control
WO2017146006A1 (ja) * 2016-02-26 2017-08-31 株式会社フジミインコーポレーテッド 研磨方法、研磨パッド
US10350504B2 (en) * 2016-09-13 2019-07-16 Universal City Studios Llc Systems and methods for incorporating pneumatic robotic systems into amusement park attractions
CN108296931B (zh) * 2018-02-02 2024-06-21 成都精密光学工程研究中心 一种带磨损补偿的偏摆式平面抛光装置
US11081359B2 (en) 2018-09-10 2021-08-03 Globalwafers Co., Ltd. Methods for polishing semiconductor substrates that adjust for pad-to-pad variance
CN109454547A (zh) * 2018-12-27 2019-03-12 杭州众硅电子科技有限公司 一种用于cmp抛光垫寿命在线检测的系统和方法
CN112894594A (zh) * 2019-05-23 2021-06-04 黄彬庆 一种半导体晶片机械抛光加工系统及方法
CN110421479B (zh) * 2019-07-19 2021-01-26 许昌学院 一种电子器件用半导体晶片抛光设备
CN110587469A (zh) * 2019-09-29 2019-12-20 苏州光斯奥光电科技有限公司 一种用于液晶面板的研磨机构
CN111906600B (zh) * 2020-08-29 2021-09-28 中国航发南方工业有限公司 一种偏心型腔内端面磨削方法及装置
EP4063069B1 (en) * 2021-03-23 2022-12-07 Andrea Valentini Plate-like backing pad adapted for releasable attachment to a hand-held polishing or sanding power tool
CN114871941B (zh) * 2022-04-25 2024-04-05 季华实验室 一种抛光头及抛光机
CN116394153B (zh) * 2023-02-28 2023-10-24 名正(浙江)电子装备有限公司 一种晶圆研磨抛光系统

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US5036630A (en) * 1990-04-13 1991-08-06 International Business Machines Corporation Radial uniformity control of semiconductor wafer polishing
US5486129A (en) * 1993-08-25 1996-01-23 Micron Technology, Inc. System and method for real-time control of semiconductor a wafer polishing, and a polishing head
US5658183A (en) * 1993-08-25 1997-08-19 Micron Technology, Inc. System for real-time control of semiconductor wafer polishing including optical monitoring
JP2891068B2 (ja) * 1993-10-18 1999-05-17 信越半導体株式会社 ウエーハの研磨方法および研磨装置
US5584746A (en) 1993-10-18 1996-12-17 Shin-Etsu Handotai Co., Ltd. Method of polishing semiconductor wafers and apparatus therefor
JP3311116B2 (ja) * 1993-10-28 2002-08-05 株式会社東芝 半導体製造装置
US5624299A (en) * 1993-12-27 1997-04-29 Applied Materials, Inc. Chemical mechanical polishing apparatus with improved carrier and method of use
US5664987A (en) * 1994-01-31 1997-09-09 National Semiconductor Corporation Methods and apparatus for control of polishing pad conditioning for wafer planarization
US5908530A (en) 1995-05-18 1999-06-01 Obsidian, Inc. Apparatus for chemical mechanical polishing
US5816900A (en) * 1997-07-17 1998-10-06 Lsi Logic Corporation Apparatus for polishing a substrate at radially varying polish rates
US5934974A (en) * 1997-11-05 1999-08-10 Aplex Group In-situ monitoring of polishing pad wear
US6531397B1 (en) * 1998-01-09 2003-03-11 Lsi Logic Corporation Method and apparatus for using across wafer back pressure differentials to influence the performance of chemical mechanical polishing
US6174221B1 (en) * 1998-09-01 2001-01-16 Micron Technology, Inc. Polishing chucks, semiconductor wafer polishing chucks, abrading methods, polishing methods, semiconductor wafer polishing methods, and methods of forming polishing chucks
US6176764B1 (en) * 1999-03-10 2001-01-23 Micron Technology, Inc. Polishing chucks, semiconductor wafer polishing chucks, abrading methods, polishing methods, simiconductor wafer polishing methods, and methods of forming polishing chucks
US6120350A (en) * 1999-03-31 2000-09-19 Memc Electronic Materials, Inc. Process for reconditioning polishing pads
JP4056205B2 (ja) * 1999-10-15 2008-03-05 株式会社荏原製作所 ポリッシング装置および方法
JP4307674B2 (ja) * 2000-01-26 2009-08-05 不二越機械工業株式会社 ウェーハの研磨装置
EP1268129A1 (en) * 2000-03-30 2003-01-02 Memc Electronic Materials S.P.A. Method of polishing wafers
US7140956B1 (en) * 2000-03-31 2006-11-28 Speedfam-Ipec Corporation Work piece carrier with adjustable pressure zones and barriers and a method of planarizing a work piece
US6616513B1 (en) * 2000-04-07 2003-09-09 Applied Materials, Inc. Grid relief in CMP polishing pad to accurately measure pad wear, pad profile and pad wear profile
US6592434B1 (en) 2000-11-16 2003-07-15 Motorola, Inc. Wafer carrier and method of material removal from a semiconductor wafer
KR20040011433A (ko) * 2000-11-21 2004-02-05 엠이엠씨 일렉트로닉 머티리얼스 쏘시에떼 퍼 아찌오니 반도체 웨이퍼, 연마 장치 및 방법
US6764387B1 (en) * 2003-03-07 2004-07-20 Applied Materials Inc. Control of a multi-chamber carrier head
US7207871B1 (en) * 2005-10-06 2007-04-24 Applied Materials, Inc. Carrier head with multiple chambers

Also Published As

Publication number Publication date
CN102046331A (zh) 2011-05-04
EP2293902A1 (en) 2011-03-16
US20090298399A1 (en) 2009-12-03
JP2011522416A (ja) 2011-07-28
WO2009146274A1 (en) 2009-12-03
US8192248B2 (en) 2012-06-05

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Legal Events

Date Code Title Description
PA0105 International application

Patent event date: 20101129

Patent event code: PA01051R01D

Comment text: International Patent Application

PG1501 Laying open of application
PC1203 Withdrawal of no request for examination
WITN Application deemed withdrawn, e.g. because no request for examination was filed or no examination fee was paid