JP2011507284A5 - - Google Patents

Download PDF

Info

Publication number
JP2011507284A5
JP2011507284A5 JP2010538308A JP2010538308A JP2011507284A5 JP 2011507284 A5 JP2011507284 A5 JP 2011507284A5 JP 2010538308 A JP2010538308 A JP 2010538308A JP 2010538308 A JP2010538308 A JP 2010538308A JP 2011507284 A5 JP2011507284 A5 JP 2011507284A5
Authority
JP
Japan
Prior art keywords
wafer
plate
functional elements
awning plate
holes
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2010538308A
Other languages
English (en)
Japanese (ja)
Other versions
JP2011507284A (ja
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/CH2008/000532 external-priority patent/WO2009076788A1/en
Publication of JP2011507284A publication Critical patent/JP2011507284A/ja
Publication of JP2011507284A5 publication Critical patent/JP2011507284A5/ja
Pending legal-status Critical Current

Links

JP2010538308A 2007-12-19 2008-12-16 ウェハ積層体、一体化された光学装置およびこれを作製するための方法 Pending JP2011507284A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US1480807P 2007-12-19 2007-12-19
PCT/CH2008/000532 WO2009076788A1 (en) 2007-12-19 2008-12-16 Wafer stack, integrated optical device and method for fabricating the same

Publications (2)

Publication Number Publication Date
JP2011507284A JP2011507284A (ja) 2011-03-03
JP2011507284A5 true JP2011507284A5 (https=) 2012-02-02

Family

ID=40430188

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2010538308A Pending JP2011507284A (ja) 2007-12-19 2008-12-16 ウェハ積層体、一体化された光学装置およびこれを作製するための方法

Country Status (7)

Country Link
US (1) US8289635B2 (https=)
EP (1) EP2223338A1 (https=)
JP (1) JP2011507284A (https=)
KR (1) KR20100106480A (https=)
CN (1) CN101971341B (https=)
TW (1) TW200937642A (https=)
WO (1) WO2009076788A1 (https=)

Families Citing this family (31)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101872033B (zh) * 2009-04-24 2014-04-30 鸿富锦精密工业（深圳）有限公司 遮光片阵列、遮光片阵列制造方法及镜头模组阵列
CN102045494A (zh) * 2009-10-22 2011-05-04 国碁电子(中山)有限公司 相机模组及其制作方法
WO2011156926A1 (en) * 2010-06-14 2011-12-22 Heptagon Oy Method of manufacturing a plurality of optical devices
WO2011156928A2 (en) 2010-06-14 2011-12-22 Heptagon Oy Camera, and method of manufacturing a plurality of cameras
JPWO2012173252A1 (ja) * 2011-06-17 2015-02-23 コニカミノルタ株式会社 ウェハーレンズの製造方法及びウェハーレンズ、並びにレンズユニットの製造方法及びレンズユニット
SG193151A1 (en) * 2011-07-19 2013-09-30 Heptagon Micro Optics Pte Ltd Opto-electronic modules and methods of manufacturing the same and appliances and devices comprising the same
SG11201400761UA (en) * 2011-10-05 2014-08-28 Heptagon Micro Optics Pte Ltd Micro-optical system and method of manufacture thereof
TWI567953B (zh) 2011-12-20 2017-01-21 新加坡恒立私人有限公司 光電模組及包含該模組之裝置
CN104106135B (zh) * 2011-12-22 2018-02-23 新加坡恒立私人有限公司 光电模块、尤其是闪光灯模块及其制造方法
CN107845650B (zh) * 2012-05-17 2021-10-26 赫普塔冈微光有限公司 晶片堆叠的组装
US9793152B2 (en) 2012-07-03 2017-10-17 Heptagon Micro Optics Pte. Ltd. Use of vacuum chucks to hold a wafer or wafer sub-stack
US8606057B1 (en) 2012-11-02 2013-12-10 Heptagon Micro Optics Pte. Ltd. Opto-electronic modules including electrically conductive connections for integration with an electronic device
EP2939053B1 (en) * 2012-12-27 2019-03-20 Heptagon Micro Optics Pte. Ltd. Fabrication of optical elements
US9613939B2 (en) 2013-01-10 2017-04-04 Heptagon Micro Optics Pte. Ltd. Opto-electronic modules including features to help reduce stray light and/or optical cross-talk
JP2014186006A (ja) * 2013-03-25 2014-10-02 Toshiba Corp 赤外線撮像装置および赤外線撮像モジュール
US9923008B2 (en) * 2013-04-12 2018-03-20 Omnivision Technologies, Inc. Wafer-level array cameras and methods for fabricating the same
US9543354B2 (en) 2013-07-30 2017-01-10 Heptagon Micro Optics Pte. Ltd. Optoelectronic modules that have shielding to reduce light leakage or stray light, and fabrication methods for such modules
US9746349B2 (en) * 2013-09-02 2017-08-29 Heptagon Micro Optics Pte. Ltd. Opto-electronic module including a non-transparent separation member between a light emitting element and a light detecting element
US9640709B2 (en) * 2013-09-10 2017-05-02 Heptagon Micro Optics Pte. Ltd. Compact opto-electronic modules and fabrication methods for such modules
US9880391B2 (en) * 2013-10-01 2018-01-30 Heptagon Micro Optics Pte. Ltd. Lens array modules and wafer-level techniques for fabricating the same
TWI638465B (zh) * 2013-12-09 2018-10-11 Heptagon Micro Optics Pte. Ltd. 具有包括位在光電裝置上方不同高度之光學元件之多個光通道的模組
US9121994B2 (en) * 2013-12-17 2015-09-01 Anteryon Wafer Optics B.V. Method of fabricating a wafer level optical lens assembly
US9176261B2 (en) * 2014-02-17 2015-11-03 Genius Electronic Optical Co., Ltd. Optical lens assembly, array type lens module and method of making the array type lens module
US9711552B2 (en) * 2014-08-19 2017-07-18 Heptagon Micro Optics Pte. Ltd. Optoelectronic modules having a silicon substrate, and fabrication methods for such modules
EP3660902A1 (en) 2014-11-19 2020-06-03 Ams Ag Semiconductor device comprising an aperture array
US10437025B2 (en) * 2015-01-26 2019-10-08 Omnivision Technologies, Inc. Wafer-level lens packaging methods, and associated lens assemblies and camera modules
US10455131B2 (en) 2015-01-26 2019-10-22 Omnivision Technologies, Inc. Wafer-level methods for packing camera modules, and associated camera modules
TWI677991B (zh) * 2015-11-04 2019-11-21 美商豪威科技股份有限公司 用於封裝相機模組的晶圓級方法及相關的相機模組
CN109155258B (zh) * 2016-04-08 2022-04-26 赫普塔冈微光有限公司 具有孔径的薄光电模块及其制造
JP2018109716A (ja) * 2017-01-05 2018-07-12 ソニーセミコンダクタソリューションズ株式会社 レンズモジュールおよびレンズモジュールの製造方法、撮像装置、並びに電子機器
US10734184B1 (en) 2019-06-21 2020-08-04 Elbit Systems Of America, Llc Wafer scale image intensifier

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58141562A (ja) * 1982-02-17 1983-08-22 Fujitsu Ltd 冷却型光電変換装置の製造方法
JPH1065132A (ja) * 1996-08-14 1998-03-06 Sony Corp 半導体撮像装置
US6324010B1 (en) * 1999-07-19 2001-11-27 Eastman Kodak Company Optical assembly and a method for manufacturing lens systems
DE20100418U1 (de) 2000-01-15 2001-04-26 Agilent Technologies, Inc., Palo Alto, Calif. Photodetektor
JP3887162B2 (ja) * 2000-10-19 2007-02-28 富士通株式会社 撮像用半導体装置
US6635941B2 (en) 2001-03-21 2003-10-21 Canon Kabushiki Kaisha Structure of semiconductor device with improved reliability
JP2002368235A (ja) * 2001-03-21 2002-12-20 Canon Inc 半導体装置及びその製造方法
JP4030047B2 (ja) * 2002-03-28 2008-01-09 シチズン電子株式会社 小型撮像モジュール
JP2004029554A (ja) * 2002-06-27 2004-01-29 Olympus Corp 撮像レンズユニットおよび撮像装置
JP2004200965A (ja) * 2002-12-18 2004-07-15 Sanyo Electric Co Ltd カメラモジュール及びその製造方法
JP3981348B2 (ja) * 2003-05-30 2007-09-26 松下電器産業株式会社 撮像装置およびその製造方法
JP4499385B2 (ja) * 2003-07-29 2010-07-07 浜松ホトニクス株式会社 裏面入射型光検出素子及び裏面入射型光検出素子の製造方法
CN1875617A (zh) * 2003-10-27 2006-12-06 皇家飞利浦电子股份有限公司 相机模块以及该相机模块的制造方法
EP1712087B1 (en) * 2004-01-26 2021-03-10 DigitalOptics Corporation Thin camera having sub-pixel resolution
JP2005227500A (ja) * 2004-02-12 2005-08-25 Fujinon Corp 撮像装置
WO2008011003A2 (en) 2006-07-17 2008-01-24 Tessera North America, Inc. Camera system and associated methods
JP2007129164A (ja) * 2005-11-07 2007-05-24 Sharp Corp 光学装置用モジュール、光学装置用モジュールの製造方法、及び、構造体
JP2011180293A (ja) * 2010-02-26 2011-09-15 Fujifilm Corp レンズアレイ

Similar Documents

Publication Publication Date Title
JP2011507284A5 (https=)
WO2009158105A3 (en) Imaging module with symmetrical lens system and method of manufacture
JP5540120B2 (ja) スタック型レンズアレイ及びレンズモジュール
JP2018525684A5 (https=)
JP2010512027A5 (https=)
JP2013072951A5 (https=)
JP2014032960A5 (ja) 表示装置の作製方法
WO2007109568A3 (en) Method and structure for fabricating solar cells
JP2011216780A5 (https=)
WO2009114190A3 (en) Photovoltaic cell module and method of forming same
EP2407575A4 (en) CLEAR CONDUCTIVE TRANSPARENT TRANSPARENT CONDUCTIVE FILM AND LAMINATE, METHODS OF MAKING SAME, AND SILICON THIN FILM SOLAR CELL
WO2011048794A3 (en) Optical member and method for making the same
WO2008124154A3 (en) Photovoltaics on silicon
JP2008304379A5 (https=)
WO2006101741A3 (en) Scalable photovoltaic cell and solar panel manufacturing with improved wiring
MX2015008470A (es) Lentes oftalmicas laminadas en pelicula con rendimiento de biselado con muela mejorado.
JP2008527460A5 (https=)
JP2013188968A5 (https=)
BRPI0615585B8 (pt) método de fabricação de uma estrutura de conjunto de células
JP2010231969A5 (https=)
WO2012099794A3 (en) Optical film stack
WO2011043610A3 (ko) 태양광 발전장치 및 이의 제조방법
TW201325904A (zh) 可撓式元件的取下方法
WO2008096605A1 (ja) 積層体の製造装置および製造方法
CN103201838A (zh) 制造多个光学设备的方法