JP2011507219A5 - - Google Patents

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Publication number
JP2011507219A5
JP2011507219A5 JP2010535188A JP2010535188A JP2011507219A5 JP 2011507219 A5 JP2011507219 A5 JP 2011507219A5 JP 2010535188 A JP2010535188 A JP 2010535188A JP 2010535188 A JP2010535188 A JP 2010535188A JP 2011507219 A5 JP2011507219 A5 JP 2011507219A5
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JP
Japan
Prior art keywords
wafer
substrate
optical
electro
double
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2010535188A
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English (en)
Japanese (ja)
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JP2011507219A (ja
JP5580207B2 (ja
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Application filed filed Critical
Priority claimed from PCT/CH2008/000487 external-priority patent/WO2009067832A1/en
Publication of JP2011507219A publication Critical patent/JP2011507219A/ja
Publication of JP2011507219A5 publication Critical patent/JP2011507219A5/ja
Application granted granted Critical
Publication of JP5580207B2 publication Critical patent/JP5580207B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2010535188A 2007-11-27 2008-11-18 ウェハ・スケール・パッケージおよびその製作方法、ならびに光学デバイスおよびその製作方法 Active JP5580207B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US99045107P 2007-11-27 2007-11-27
US60/990,451 2007-11-27
PCT/CH2008/000487 WO2009067832A1 (en) 2007-11-27 2008-11-18 Encapsulated lens stack

Publications (3)

Publication Number Publication Date
JP2011507219A JP2011507219A (ja) 2011-03-03
JP2011507219A5 true JP2011507219A5 (https=) 2012-01-12
JP5580207B2 JP5580207B2 (ja) 2014-08-27

Family

ID=40350035

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2010535188A Active JP5580207B2 (ja) 2007-11-27 2008-11-18 ウェハ・スケール・パッケージおよびその製作方法、ならびに光学デバイスおよびその製作方法

Country Status (7)

Country Link
US (1) US20110031510A1 (https=)
EP (1) EP2220684A1 (https=)
JP (1) JP5580207B2 (https=)
KR (1) KR101575915B1 (https=)
CN (1) CN101990711B (https=)
TW (1) TWI502693B (https=)
WO (1) WO2009067832A1 (https=)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010020062A1 (en) 2008-08-20 2010-02-25 Heptagon Oy Method of manufacturing a pluralty of optical devices
JP5352392B2 (ja) * 2009-09-14 2013-11-27 富士フイルム株式会社 ウェハレベルレンズアレイの製造方法、ウェハレベルレンズアレイ、レンズモジュール及び撮像ユニット
TWI425825B (zh) * 2009-12-31 2014-02-01 勝開科技股份有限公司 免調焦距影像感測器封裝結構
US8982269B2 (en) 2010-09-27 2015-03-17 Omnivision Technologies, Inc. Mechanical assembly for fine focus of a wafer-level camera module, and associated methods
CN103975436B (zh) 2011-07-19 2019-05-10 新加坡恒立私人有限公司 制造无源光学器件和包含该无源光学器件的装置的方法
WO2013020238A1 (en) 2011-08-10 2013-02-14 Heptagon Micro Optics Pte. Ltd. Opto-electronic module and method for manufacturing the same
SG10201606882XA (en) * 2011-08-25 2016-10-28 Heptagon Micro Optics Pte Ltd Wafer-level fabrication of optical devices, in particular of modules for computational cameras
SG11201400761UA (en) * 2011-10-05 2014-08-28 Heptagon Micro Optics Pte Ltd Micro-optical system and method of manufacture thereof
CN104106135B (zh) * 2011-12-22 2018-02-23 新加坡恒立私人有限公司 光电模块、尤其是闪光灯模块及其制造方法
US8791489B2 (en) 2012-04-05 2014-07-29 Heptagon Micro Optics Pte. Ltd. Opto-electronic module
CN107425030B (zh) 2012-08-20 2020-11-06 赫普塔冈微光有限公司 光学晶片的制造
US8606057B1 (en) 2012-11-02 2013-12-10 Heptagon Micro Optics Pte. Ltd. Opto-electronic modules including electrically conductive connections for integration with an electronic device
EP2939053B1 (en) * 2012-12-27 2019-03-20 Heptagon Micro Optics Pte. Ltd. Fabrication of optical elements
CN103050502A (zh) * 2012-12-28 2013-04-17 格科微电子（上海）有限公司 晶圆级镜头模组阵列、阵列组合及两者的制作方法
US9746349B2 (en) 2013-09-02 2017-08-29 Heptagon Micro Optics Pte. Ltd. Opto-electronic module including a non-transparent separation member between a light emitting element and a light detecting element
US9921393B2 (en) * 2014-09-04 2018-03-20 Omnivision Technologies, Inc. Wafer-level methods for making apertured lenses involving sequential layering of biplanar transparent film, opaque layer, spacer wafer, and lens wafer
US11808959B2 (en) * 2020-08-11 2023-11-07 Himax Technologies Limited Optical element and wafer level optical module

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JPS6242558A (ja) * 1985-08-20 1987-02-24 Matsushita Electronics Corp 固体撮像装置
US6096155A (en) * 1996-09-27 2000-08-01 Digital Optics Corporation Method of dicing wafer level integrated multiple optical elements
US6235141B1 (en) * 1996-09-27 2001-05-22 Digital Optics Corporation Method of mass producing and packaging integrated optical subsystems
US6381072B1 (en) * 1998-01-23 2002-04-30 Proxemics Lenslet array systems and methods
US6426829B1 (en) * 1998-03-26 2002-07-30 Digital Optics Corp. Integrated micro-optical systems
JPH11330442A (ja) * 1998-05-20 1999-11-30 Sony Corp 光学装置
JP2000314876A (ja) * 1999-04-28 2000-11-14 Hitachi Ltd 液晶表示素子および液晶表示装置
US6285064B1 (en) * 2000-03-28 2001-09-04 Omnivision Technologies, Inc. Chip scale packaging technique for optical image sensing integrated circuits
JP2002252338A (ja) * 2000-12-18 2002-09-06 Canon Inc 撮像装置及び撮像システム
JP2002368235A (ja) * 2001-03-21 2002-12-20 Canon Inc 半導体装置及びその製造方法
US6635941B2 (en) * 2001-03-21 2003-10-21 Canon Kabushiki Kaisha Structure of semiconductor device with improved reliability
JP2002290842A (ja) * 2001-03-23 2002-10-04 Sanyo Electric Co Ltd 固体撮像素子の製造方法
JP4190204B2 (ja) * 2002-05-16 2008-12-03 オリンパス株式会社 接合レンズアレイ
KR20070096020A (ko) * 2002-09-17 2007-10-01 앤터온 비.브이. 카메라 디바이스, 카메라 디바이스 제조 방법, 웨이퍼스케일 패키지 및 광학 어셈블리
JP2004233483A (ja) * 2003-01-29 2004-08-19 Sanyo Electric Co Ltd カメラモジュール
CN1875617A (zh) * 2003-10-27 2006-12-06 皇家飞利浦电子股份有限公司 相机模块以及该相机模块的制造方法
WO2008011003A2 (en) * 2006-07-17 2008-01-24 Tessera North America, Inc. Camera system and associated methods
KR100539259B1 (ko) * 2004-04-26 2005-12-27 삼성전자주식회사 자동으로 정렬되는 렌즈를 포함하는 이미지 센서 모듈, 그제조방법 및 렌즈의 자동 초점 조절방법
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US20070114643A1 (en) * 2005-11-22 2007-05-24 Honeywell International Inc. Mems flip-chip packaging
US7692256B2 (en) * 2007-03-23 2010-04-06 Heptagon Oy Method of producing a wafer scale package

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