TWI502693B - 封裝式鏡片組 - Google Patents

封裝式鏡片組 Download PDF

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Publication number
TWI502693B
TWI502693B TW097144531A TW97144531A TWI502693B TW I502693 B TWI502693 B TW I502693B TW 097144531 A TW097144531 A TW 097144531A TW 97144531 A TW97144531 A TW 97144531A TW I502693 B TWI502693 B TW I502693B
Authority
TW
Taiwan
Prior art keywords
substrate
optical
transparent
spacer
substrates
Prior art date
Application number
TW097144531A
Other languages
English (en)
Chinese (zh)
Other versions
TW200929456A (en
Inventor
馬克思 羅西
哈馬特 盧德曼
維爾 凱特尼
Original Assignee
新加坡恒立私人有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 新加坡恒立私人有限公司 filed Critical 新加坡恒立私人有限公司
Publication of TW200929456A publication Critical patent/TW200929456A/zh
Application granted granted Critical
Publication of TWI502693B publication Critical patent/TWI502693B/zh

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/806—Optical elements or arrangements associated with the image sensors
    • H10F39/8063—Microlenses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29D—PRODUCING PARTICULAR ARTICLES FROM PLASTICS OR FROM SUBSTANCES IN A PLASTIC STATE
    • B29D11/00—Producing optical elements, e.g. lenses or prisms
    • B29D11/00009—Production of simple or compound lenses
    • B29D11/00278—Lenticular sheets
    • B29D11/00307—Producing lens wafers
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B3/00—Simple or compound lenses
    • G02B3/0006—Arrays
    • G02B3/0037—Arrays characterized by the distribution or form of lenses
    • G02B3/0062—Stacked lens arrays, i.e. refractive surfaces arranged in at least two planes, without structurally separate optical elements in-between
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
    • G02B7/02—Mountings, adjusting means, or light-tight connections, for optical elements for lenses
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/011—Manufacture or treatment of image sensors covered by group H10F39/12
    • H10F39/024—Manufacture or treatment of image sensors covered by group H10F39/12 of coatings or optical elements

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Ophthalmology & Optometry (AREA)
  • Health & Medical Sciences (AREA)
  • Lens Barrels (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)
  • Studio Devices (AREA)
  • Semiconductor Lasers (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Packaging Frangible Articles (AREA)
TW097144531A 2007-11-27 2008-11-18 封裝式鏡片組 TWI502693B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US99045107P 2007-11-27 2007-11-27

Publications (2)

Publication Number Publication Date
TW200929456A TW200929456A (en) 2009-07-01
TWI502693B true TWI502693B (zh) 2015-10-01

Family

ID=40350035

Family Applications (1)

Application Number Title Priority Date Filing Date
TW097144531A TWI502693B (zh) 2007-11-27 2008-11-18 封裝式鏡片組

Country Status (7)

Country Link
US (1) US20110031510A1 (https=)
EP (1) EP2220684A1 (https=)
JP (1) JP5580207B2 (https=)
KR (1) KR101575915B1 (https=)
CN (1) CN101990711B (https=)
TW (1) TWI502693B (https=)
WO (1) WO2009067832A1 (https=)

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WO2010020062A1 (en) 2008-08-20 2010-02-25 Heptagon Oy Method of manufacturing a pluralty of optical devices
JP5352392B2 (ja) * 2009-09-14 2013-11-27 富士フイルム株式会社 ウェハレベルレンズアレイの製造方法、ウェハレベルレンズアレイ、レンズモジュール及び撮像ユニット
TWI425825B (zh) * 2009-12-31 2014-02-01 勝開科技股份有限公司 免調焦距影像感測器封裝結構
US8982269B2 (en) 2010-09-27 2015-03-17 Omnivision Technologies, Inc. Mechanical assembly for fine focus of a wafer-level camera module, and associated methods
CN103975436B (zh) 2011-07-19 2019-05-10 新加坡恒立私人有限公司 制造无源光学器件和包含该无源光学器件的装置的方法
WO2013020238A1 (en) 2011-08-10 2013-02-14 Heptagon Micro Optics Pte. Ltd. Opto-electronic module and method for manufacturing the same
SG10201606882XA (en) * 2011-08-25 2016-10-28 Heptagon Micro Optics Pte Ltd Wafer-level fabrication of optical devices, in particular of modules for computational cameras
SG11201400761UA (en) * 2011-10-05 2014-08-28 Heptagon Micro Optics Pte Ltd Micro-optical system and method of manufacture thereof
CN104106135B (zh) * 2011-12-22 2018-02-23 新加坡恒立私人有限公司 光电模块、尤其是闪光灯模块及其制造方法
US8791489B2 (en) 2012-04-05 2014-07-29 Heptagon Micro Optics Pte. Ltd. Opto-electronic module
CN107425030B (zh) 2012-08-20 2020-11-06 赫普塔冈微光有限公司 光学晶片的制造
US8606057B1 (en) 2012-11-02 2013-12-10 Heptagon Micro Optics Pte. Ltd. Opto-electronic modules including electrically conductive connections for integration with an electronic device
EP2939053B1 (en) * 2012-12-27 2019-03-20 Heptagon Micro Optics Pte. Ltd. Fabrication of optical elements
CN103050502A (zh) * 2012-12-28 2013-04-17 格科微电子（上海）有限公司 晶圆级镜头模组阵列、阵列组合及两者的制作方法
US9746349B2 (en) 2013-09-02 2017-08-29 Heptagon Micro Optics Pte. Ltd. Opto-electronic module including a non-transparent separation member between a light emitting element and a light detecting element
US9921393B2 (en) * 2014-09-04 2018-03-20 Omnivision Technologies, Inc. Wafer-level methods for making apertured lenses involving sequential layering of biplanar transparent film, opaque layer, spacer wafer, and lens wafer
US11808959B2 (en) * 2020-08-11 2023-11-07 Himax Technologies Limited Optical element and wafer level optical module

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040040648A1 (en) * 1997-10-03 2004-03-04 Brian Harden Method for replicating optical elements, particularly on a wafer level, and replicas formed thereby
WO2005041561A1 (en) * 2003-10-27 2005-05-06 Koninklijke Philips Electronics N.V. Camera module and manufacturing method for such a camera module
TW200723469A (en) * 2005-11-22 2007-06-16 Honeywell Int Inc MEMS flip-chip packaging

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JPS6242558A (ja) * 1985-08-20 1987-02-24 Matsushita Electronics Corp 固体撮像装置
US6235141B1 (en) * 1996-09-27 2001-05-22 Digital Optics Corporation Method of mass producing and packaging integrated optical subsystems
US6381072B1 (en) * 1998-01-23 2002-04-30 Proxemics Lenslet array systems and methods
US6426829B1 (en) * 1998-03-26 2002-07-30 Digital Optics Corp. Integrated micro-optical systems
JPH11330442A (ja) * 1998-05-20 1999-11-30 Sony Corp 光学装置
JP2000314876A (ja) * 1999-04-28 2000-11-14 Hitachi Ltd 液晶表示素子および液晶表示装置
US6285064B1 (en) * 2000-03-28 2001-09-04 Omnivision Technologies, Inc. Chip scale packaging technique for optical image sensing integrated circuits
JP2002252338A (ja) * 2000-12-18 2002-09-06 Canon Inc 撮像装置及び撮像システム
JP2002368235A (ja) * 2001-03-21 2002-12-20 Canon Inc 半導体装置及びその製造方法
US6635941B2 (en) * 2001-03-21 2003-10-21 Canon Kabushiki Kaisha Structure of semiconductor device with improved reliability
JP2002290842A (ja) * 2001-03-23 2002-10-04 Sanyo Electric Co Ltd 固体撮像素子の製造方法
JP4190204B2 (ja) * 2002-05-16 2008-12-03 オリンパス株式会社 接合レンズアレイ
KR20070096020A (ko) * 2002-09-17 2007-10-01 앤터온 비.브이. 카메라 디바이스, 카메라 디바이스 제조 방법, 웨이퍼스케일 패키지 및 광학 어셈블리
JP2004233483A (ja) * 2003-01-29 2004-08-19 Sanyo Electric Co Ltd カメラモジュール
WO2008011003A2 (en) * 2006-07-17 2008-01-24 Tessera North America, Inc. Camera system and associated methods
KR100539259B1 (ko) * 2004-04-26 2005-12-27 삼성전자주식회사 자동으로 정렬되는 렌즈를 포함하는 이미지 센서 모듈, 그제조방법 및 렌즈의 자동 초점 조절방법
JP4421962B2 (ja) * 2004-07-13 2010-02-24 カンタツ株式会社 携帯電話搭載用小型撮像モジュール
US7692256B2 (en) * 2007-03-23 2010-04-06 Heptagon Oy Method of producing a wafer scale package

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040040648A1 (en) * 1997-10-03 2004-03-04 Brian Harden Method for replicating optical elements, particularly on a wafer level, and replicas formed thereby
WO2005041561A1 (en) * 2003-10-27 2005-05-06 Koninklijke Philips Electronics N.V. Camera module and manufacturing method for such a camera module
TW200723469A (en) * 2005-11-22 2007-06-16 Honeywell Int Inc MEMS flip-chip packaging

Also Published As

Publication number Publication date
KR101575915B1 (ko) 2015-12-08
EP2220684A1 (en) 2010-08-25
TW200929456A (en) 2009-07-01
CN101990711A (zh) 2011-03-23
KR20100087755A (ko) 2010-08-05
US20110031510A1 (en) 2011-02-10
JP2011507219A (ja) 2011-03-03
WO2009067832A1 (en) 2009-06-04
CN101990711B (zh) 2017-05-17
JP5580207B2 (ja) 2014-08-27

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