JP2011501418A5 - - Google Patents

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Publication number
JP2011501418A5
JP2011501418A5 JP2010529041A JP2010529041A JP2011501418A5 JP 2011501418 A5 JP2011501418 A5 JP 2011501418A5 JP 2010529041 A JP2010529041 A JP 2010529041A JP 2010529041 A JP2010529041 A JP 2010529041A JP 2011501418 A5 JP2011501418 A5 JP 2011501418A5
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JP
Japan
Prior art keywords
cooling channel
pattern
pack
grooves
electrostatic chuck
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2010529041A
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English (en)
Japanese (ja)
Other versions
JP5523326B2 (ja
JP2011501418A (ja
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Publication date
Priority claimed from US11/871,807 external-priority patent/US7649729B2/en
Application filed filed Critical
Publication of JP2011501418A publication Critical patent/JP2011501418A/ja
Publication of JP2011501418A5 publication Critical patent/JP2011501418A5/ja
Application granted granted Critical
Publication of JP5523326B2 publication Critical patent/JP5523326B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2010529041A 2007-10-12 2008-10-09 静電チャックアセンブリ Active JP5523326B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US11/871,807 2007-10-12
US11/871,807 US7649729B2 (en) 2007-10-12 2007-10-12 Electrostatic chuck assembly
PCT/US2008/079357 WO2009049054A1 (en) 2007-10-12 2008-10-09 Electrostatic chuck assembly

Publications (3)

Publication Number Publication Date
JP2011501418A JP2011501418A (ja) 2011-01-06
JP2011501418A5 true JP2011501418A5 (cg-RX-API-DMAC7.html) 2013-03-21
JP5523326B2 JP5523326B2 (ja) 2014-06-18

Family

ID=40533966

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2010529041A Active JP5523326B2 (ja) 2007-10-12 2008-10-09 静電チャックアセンブリ

Country Status (5)

Country Link
US (1) US7649729B2 (cg-RX-API-DMAC7.html)
JP (1) JP5523326B2 (cg-RX-API-DMAC7.html)
KR (1) KR101135242B1 (cg-RX-API-DMAC7.html)
TW (1) TWI399825B (cg-RX-API-DMAC7.html)
WO (1) WO2009049054A1 (cg-RX-API-DMAC7.html)

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US11047035B2 (en) 2018-02-23 2021-06-29 Applied Materials, Inc. Protective yttria coating for semiconductor equipment parts
KR102640172B1 (ko) 2019-07-03 2024-02-23 삼성전자주식회사 기판 처리 장치 및 이의 구동 방법
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