JP2011233571A5 - - Google Patents
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- JP2011233571A5 JP2011233571A5 JP2010099986A JP2010099986A JP2011233571A5 JP 2011233571 A5 JP2011233571 A5 JP 2011233571A5 JP 2010099986 A JP2010099986 A JP 2010099986A JP 2010099986 A JP2010099986 A JP 2010099986A JP 2011233571 A5 JP2011233571 A5 JP 2011233571A5
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Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010099986A JP5576173B2 (ja) | 2010-04-23 | 2010-04-23 | 半導体装置の製造装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010099986A JP5576173B2 (ja) | 2010-04-23 | 2010-04-23 | 半導体装置の製造装置 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2011233571A JP2011233571A (ja) | 2011-11-17 |
| JP2011233571A5 true JP2011233571A5 (https=) | 2013-06-13 |
| JP5576173B2 JP5576173B2 (ja) | 2014-08-20 |
Family
ID=45322643
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2010099986A Expired - Fee Related JP5576173B2 (ja) | 2010-04-23 | 2010-04-23 | 半導体装置の製造装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP5576173B2 (https=) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5554133B2 (ja) * | 2010-04-23 | 2014-07-23 | 芝浦メカトロニクス株式会社 | 半導体装置の製造装置及び半導体装置の製造方法 |
| JP6009217B2 (ja) * | 2012-05-18 | 2016-10-19 | 株式会社ディスコ | 保護部材の貼着方法 |
| JP6018528B2 (ja) * | 2013-03-13 | 2016-11-02 | 株式会社Screenホールディングス | 基板処理装置 |
| JP6105985B2 (ja) * | 2013-03-14 | 2017-03-29 | 株式会社Screenホールディングス | 吐出検査装置および基板処理装置 |
| KR101567195B1 (ko) | 2013-03-14 | 2015-11-06 | 가부시키가이샤 스크린 홀딩스 | 토출 검사 장치 및 기판 처리 장치 |
| KR102247118B1 (ko) * | 2013-09-26 | 2021-04-30 | 가부시키가이샤 스크린 홀딩스 | 기판 처리 장치 및 토출 검사 장치 |
| JP6126505B2 (ja) * | 2013-09-26 | 2017-05-10 | 株式会社Screenホールディングス | 基板処理装置 |
| JP6756600B2 (ja) * | 2016-12-14 | 2020-09-16 | 株式会社Screenホールディングス | 基板処理装置および基板処理方法 |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH071792Y2 (ja) * | 1990-05-07 | 1995-01-18 | 株式会社エンヤシステム | ウエーハ貼付装置 |
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2010
- 2010-04-23 JP JP2010099986A patent/JP5576173B2/ja not_active Expired - Fee Related
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