JP2011233571A5 - - Google Patents
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- Publication number
- JP2011233571A5 JP2011233571A5 JP2010099986A JP2010099986A JP2011233571A5 JP 2011233571 A5 JP2011233571 A5 JP 2011233571A5 JP 2010099986 A JP2010099986 A JP 2010099986A JP 2010099986 A JP2010099986 A JP 2010099986A JP 2011233571 A5 JP2011233571 A5 JP 2011233571A5
- Authority
- JP
- Japan
- Prior art keywords
- hand
- application
- center
- application object
- stage
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Claims (1)
前記塗布対象物と前記ハンドとの位置合わせを行う位置合わせ部と、
前記塗布対象物が載置されるステージを有し、前記ハンドにより前記ステージ上に載置された前記塗布対象物に接着剤を塗布する塗布部と、
を備え、
前記位置合わせ部は、前記ハンドに支持されて前記ステージに搬送される前記塗布対象物を前記ハンドに対して位置合わせするものであって、前記塗布対象物の中心を前記ハンドの中心に合わせるセンタリング部を具備しており、
前記センタリング部は、
前記塗布対象物を支持する支持台と、
前記支持台上の前記塗布対象物を押して移動させ、前記支持台に対して位置決めされた前記ハンドの中心に前記塗布対象物の中心を合わせる複数の押圧部と、
を具備していることを特徴とする半導体装置の製造装置。 A hand that supports a coating object, and a transport unit that transports the coating object by the hand;
An alignment unit for aligning the application object and the hand;
An application unit that has a stage on which the application object is placed, and that applies an adhesive to the application object placed on the stage by the hand;
With
The alignment unit is configured to align the application target supported by the hand and conveyed to the stage with respect to the hand, and centering the center of the application target to the center of the hand Have
The centering part is
A support base for supporting the application object;
A plurality of pressing parts that push and move the application object on the support base and align the center of the application object with the center of the hand positioned with respect to the support base;
An apparatus for manufacturing a semiconductor device, comprising:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010099986A JP5576173B2 (en) | 2010-04-23 | 2010-04-23 | Semiconductor device manufacturing equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010099986A JP5576173B2 (en) | 2010-04-23 | 2010-04-23 | Semiconductor device manufacturing equipment |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2011233571A JP2011233571A (en) | 2011-11-17 |
| JP2011233571A5 true JP2011233571A5 (en) | 2013-06-13 |
| JP5576173B2 JP5576173B2 (en) | 2014-08-20 |
Family
ID=45322643
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2010099986A Active JP5576173B2 (en) | 2010-04-23 | 2010-04-23 | Semiconductor device manufacturing equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP5576173B2 (en) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5554133B2 (en) * | 2010-04-23 | 2014-07-23 | 芝浦メカトロニクス株式会社 | Semiconductor device manufacturing apparatus and semiconductor device manufacturing method |
| JP6009217B2 (en) * | 2012-05-18 | 2016-10-19 | 株式会社ディスコ | Method of sticking protective member |
| JP6018528B2 (en) * | 2013-03-13 | 2016-11-02 | 株式会社Ｓｃｒｅｅｎホールディングス | Substrate processing equipment |
| JP6105985B2 (en) * | 2013-03-14 | 2017-03-29 | 株式会社Ｓｃｒｅｅｎホールディングス | Discharge inspection apparatus and substrate processing apparatus |
| KR101567195B1 (en) | 2013-03-14 | 2015-11-06 | 가부시키가이샤 스크린 홀딩스 | Ejection inspection apparatus and substrate processing apparatus |
| JP6126505B2 (en) * | 2013-09-26 | 2017-05-10 | 株式会社Ｓｃｒｅｅｎホールディングス | Substrate processing equipment |
| KR102247118B1 (en) * | 2013-09-26 | 2021-04-30 | 가부시키가이샤 스크린 홀딩스 | Substrate processing apparatus and ejection inspection apparatus |
| JP6756600B2 (en) * | 2016-12-14 | 2020-09-16 | 株式会社Ｓｃｒｅｅｎホールディングス | Substrate processing equipment and substrate processing method |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH071792Y2 (en) * | 1990-05-07 | 1995-01-18 | 株式会社エンヤシステム | Wafer pasting device |
-
2010
- 2010-04-23 JP JP2010099986A patent/JP5576173B2/en active Active
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