JP2011233552A5 - - Google Patents

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Publication number
JP2011233552A5
JP2011233552A5 JP2010099695A JP2010099695A JP2011233552A5 JP 2011233552 A5 JP2011233552 A5 JP 2011233552A5 JP 2010099695 A JP2010099695 A JP 2010099695A JP 2010099695 A JP2010099695 A JP 2010099695A JP 2011233552 A5 JP2011233552 A5 JP 2011233552A5
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JP
Japan
Prior art keywords
semiconductor light
light emitting
emitting device
circuit board
emitting element
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JP2010099695A
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English (en)
Japanese (ja)
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JP2011233552A (ja
JP5455764B2 (ja
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Publication of JP2011233552A5 publication Critical patent/JP2011233552A5/ja
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JP2010099695A 2010-04-23 2010-04-23 半導体発光装置及びその製造方法 Active JP5455764B2 (ja)

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Application Number Priority Date Filing Date Title
JP2010099695A JP5455764B2 (ja) 2010-04-23 2010-04-23 半導体発光装置及びその製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010099695A JP5455764B2 (ja) 2010-04-23 2010-04-23 半導体発光装置及びその製造方法

Publications (3)

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JP2011233552A JP2011233552A (ja) 2011-11-17
JP2011233552A5 true JP2011233552A5 (ru) 2013-01-17
JP5455764B2 JP5455764B2 (ja) 2014-03-26

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JP2010099695A Active JP5455764B2 (ja) 2010-04-23 2010-04-23 半導体発光装置及びその製造方法

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JP (1) JP5455764B2 (ru)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9391050B2 (en) 2012-02-02 2016-07-12 Citizen Holdings Co., Ltd. Semiconductor light emitting device and fabrication method for same
JP6089507B2 (ja) * 2012-08-31 2017-03-08 日亜化学工業株式会社 発光装置およびその製造方法
JP6226250B2 (ja) 2012-11-28 2017-11-08 エルジー・ケム・リミテッド 発光ダイオード
CN103545436B (zh) * 2013-09-29 2016-01-13 苏州东山精密制造股份有限公司 蓝宝石基led封装结构及其封装方法
KR102035511B1 (ko) * 2013-10-24 2019-10-23 도레이 카부시키가이샤 형광체 조성물, 형광체 시트, 형광체 시트 적층체와 그들을 사용한 led 칩, led 패키지 및 그 제조 방법
CN103928577A (zh) * 2014-04-02 2014-07-16 陕西光电科技有限公司 一种板式led的封装方法及采用该方法封装的led
JP6318844B2 (ja) * 2014-05-20 2018-05-09 日亜化学工業株式会社 発光装置
JP2017168808A (ja) * 2015-11-06 2017-09-21 株式会社カネカ Ｃｓｐ−ｌｅｄ用熱硬化性白色インク
JP6387954B2 (ja) 2015-12-24 2018-09-12 日亜化学工業株式会社 波長変換部材を用いた発光装置の製造方法
JP2017188592A (ja) 2016-04-06 2017-10-12 日亜化学工業株式会社 発光装置
KR102113374B1 (ko) * 2016-12-26 2020-05-20 김용일 광확산층을 갖는 조명용 led 모듈
JP6834469B2 (ja) 2016-12-27 2021-02-24 日亜化学工業株式会社 発光装置及びその製造方法
JP6897729B2 (ja) * 2017-10-12 2021-07-07 日亜化学工業株式会社 発光装置の製造方法
KR102211319B1 (ko) * 2019-09-11 2021-02-03 (주)솔라루체 Led 모듈

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7344952B2 (en) * 2005-10-28 2008-03-18 Philips Lumileds Lighting Company, Llc Laminating encapsulant film containing phosphor over LEDs
US7951625B2 (en) * 2007-02-21 2011-05-31 Panasonic Corporation Semiconductor light emitting element and method for manufacturing semiconductor light emitting device
JP2008277409A (ja) * 2007-04-26 2008-11-13 Matsushita Electric Ind Co Ltd 半導体発光装置の製造方法
JP2009218495A (ja) * 2008-03-12 2009-09-24 Mitsubishi Chemicals Corp 半導体発光素子および半導体発光装置

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