JP2011222264A - Protection element, battery controller, and battery pack - Google Patents

Protection element, battery controller, and battery pack Download PDF

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Publication number
JP2011222264A
JP2011222264A JP2010089613A JP2010089613A JP2011222264A JP 2011222264 A JP2011222264 A JP 2011222264A JP 2010089613 A JP2010089613 A JP 2010089613A JP 2010089613 A JP2010089613 A JP 2010089613A JP 2011222264 A JP2011222264 A JP 2011222264A
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insulating layer
protection element
charge
point metal
battery
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JP5260592B2 (en
Inventor
Koichi Mukai
幸市 向
Masahiko Ishimaru
誠彦 石丸
Takahiro Asada
隆広 浅田
Kazutomo Komori
千智 小森
Shoko Nagaki
翔子 長木
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Dexerials Corp
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Sony Chemical and Information Device Corp
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Priority to JP2010089613A priority Critical patent/JP5260592B2/en
Application filed by Sony Chemical and Information Device Corp filed Critical Sony Chemical and Information Device Corp
Priority to US13/639,966 priority patent/US9184609B2/en
Priority to PCT/JP2011/058845 priority patent/WO2011126091A1/en
Priority to KR1020127028095A priority patent/KR101382942B1/en
Priority to EP11765991A priority patent/EP2557581A1/en
Priority to CN201180017851.1A priority patent/CN102822929B/en
Priority to TW100112146A priority patent/TWI443701B/en
Publication of JP2011222264A publication Critical patent/JP2011222264A/en
Priority to HK13103153.2A priority patent/HK1176160A1/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H37/00—Thermally-actuated switches
    • H01H37/74—Switches in which only the opening movement or only the closing movement of a contact is effected by heating or cooling
    • H01H37/76—Contact member actuated by melting of fusible material, actuated due to burning of combustible material or due to explosion of explosive material
    • H01H37/761—Contact member actuated by melting of fusible material, actuated due to burning of combustible material or due to explosion of explosive material with a fusible element forming part of the switched circuit
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H85/00—Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive
    • H01H85/02—Details
    • H01H85/04—Fuses, i.e. expendable parts of the protective device, e.g. cartridges
    • H01H85/041—Fuses, i.e. expendable parts of the protective device, e.g. cartridges characterised by the type
    • H01H85/046—Fuses formed as printed circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H85/00—Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive
    • H01H85/02—Details
    • H01H85/46—Circuit arrangements not adapted to a particular application of the protective device
    • H01H85/463—Circuit arrangements not adapted to a particular application of the protective device with printed circuit fuse
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M10/00—Secondary cells; Manufacture thereof
    • H01M10/42—Methods or arrangements for servicing or maintenance of secondary cells or secondary half-cells
    • H01M10/425—Structural combination with electronic components, e.g. electronic circuits integrated to the outside of the casing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M10/00—Secondary cells; Manufacture thereof
    • H01M10/42—Methods or arrangements for servicing or maintenance of secondary cells or secondary half-cells
    • H01M10/425—Structural combination with electronic components, e.g. electronic circuits integrated to the outside of the casing
    • H01M10/4264—Structural combination with electronic components, e.g. electronic circuits integrated to the outside of the casing with capacitors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M10/00—Secondary cells; Manufacture thereof
    • H01M10/42—Methods or arrangements for servicing or maintenance of secondary cells or secondary half-cells
    • H01M10/48—Accumulators combined with arrangements for measuring, testing or indicating the condition of cells, e.g. the level or density of the electrolyte
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02J—CIRCUIT ARRANGEMENTS OR SYSTEMS FOR SUPPLYING OR DISTRIBUTING ELECTRIC POWER; SYSTEMS FOR STORING ELECTRIC ENERGY
    • H02J7/00—Circuit arrangements for charging or depolarising batteries or for supplying loads from batteries
    • H02J7/0029—Circuit arrangements for charging or depolarising batteries or for supplying loads from batteries with safety or protection devices or circuits
    • H02J7/00308—Overvoltage protection
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02J—CIRCUIT ARRANGEMENTS OR SYSTEMS FOR SUPPLYING OR DISTRIBUTING ELECTRIC POWER; SYSTEMS FOR STORING ELECTRIC ENERGY
    • H02J7/00—Circuit arrangements for charging or depolarising batteries or for supplying loads from batteries
    • H02J7/0029—Circuit arrangements for charging or depolarising batteries or for supplying loads from batteries with safety or protection devices or circuits
    • H02J7/0031—Circuit arrangements for charging or depolarising batteries or for supplying loads from batteries with safety or protection devices or circuits using battery or load disconnect circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H85/00—Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive
    • H01H85/02—Details
    • H01H85/0241—Structural association of a fuse and another component or apparatus
    • H01H2085/0275—Structural association with a printed circuit board
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H85/00—Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive
    • H01H85/02—Details
    • H01H85/46—Circuit arrangements not adapted to a particular application of the protective device
    • H01H2085/466—Circuit arrangements not adapted to a particular application of the protective device with remote controlled forced fusing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H61/00—Electrothermal relays
    • H01H61/02—Electrothermal relays wherein the thermally-sensitive member is heated indirectly, e.g. resistively, inductively
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M2200/00—Safety devices for primary or secondary batteries
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M2200/00—Safety devices for primary or secondary batteries
    • H01M2200/10—Temperature sensitive devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M2200/00—Safety devices for primary or secondary batteries
    • H01M2200/10—Temperature sensitive devices
    • H01M2200/108—Normal resistors
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
    • Y02E60/10—Energy storage using batteries

Abstract

PROBLEM TO BE SOLVED: To transmit heat of a heating resistor efficiently to a low melting point metal via a heat transfer path.SOLUTION: A protection element to be connected onto the current path of an electric circuit has an insulating substrate 60, a heating resistor 64 formed on one surface of the insulating substrate 60 with a first insulation layer 62 interposed therebetween, a low melting point metal 67 arranged above the heating resistor 64 with a second insulation layer 65 interposed therebetween and constituting a part of the current path, and connections 611 and 612 which are connected to the opposite ends of the low melting point metal 67 and connect the current path electrically with the low melting point metal 67. The connections 611 and 612 are provided on one surface of the insulating substrate 60 with a first glass layer 70 interposed therebetween.

Description

本発明は、充放電可能なバッテリセルからなるバッテリと充放電制御回路とを保護する保護素子と、この保護素子が組み込まれたバッテリ制御装置及びバッテリパックに関する。   The present invention relates to a protection element that protects a battery composed of chargeable / dischargeable battery cells and a charge / discharge control circuit, and a battery control device and a battery pack incorporating the protection element.

過電流だけでなく過電圧も防止することができ、携帯型電子機器用のバッテリパックなどに有用な保護素子として、バッテリセルの充放電電流経路上に低融点金属体を介在させるとともに、この低融点金属体の近傍に発熱抵抗体を配置した保護素子が用いられている。図９に示すように、この種の保護素子１００は、一般に、アルミナ等のセラミックスを用いた絶縁基板１０１上に発熱抵抗体１０２を設け、発熱抵抗体１０２上に低融点金属体１０４を配置している。   Not only overcurrent but also overvoltage can be prevented, and as a protective element useful for battery packs for portable electronic devices, a low melting point metal body is interposed on the charge / discharge current path of the battery cell, and this low melting point A protection element in which a heating resistor is disposed in the vicinity of a metal body is used. As shown in FIG. 9, this type of protection element 100 is generally provided with a heating resistor 102 on an insulating substrate 101 using ceramics such as alumina, and a low melting point metal body 104 is arranged on the heating resistor 102. ing.

低融点金属体１０４は、絶縁基板１０１に設けられ、バッテリセルとバッテリセルの充放電電流経路となる充放電回路との間に接続された導電層１０６に接続されている。導電層１０６は、絶縁基板１０１の表面に相対向して設けられた一対の表面電極１０６ａと、絶縁基板１０１の裏面に相対向して設けられた一対の裏面電極１０６ｂと、各表面電極１０６ａ及び裏面電極１０６ｂをそれぞれ接続する端子電極１０６ｃとを備える。裏面電極１０６ｂは、一方がバッテリセルに接続され、他方が充放電回路に接続されている。   The low-melting-point metal body 104 is provided on the insulating substrate 101 and is connected to a conductive layer 106 connected between the battery cell and a charge / discharge circuit serving as a charge / discharge current path of the battery cell. The conductive layer 106 includes a pair of front surface electrodes 106a provided opposite to the surface of the insulating substrate 101, a pair of back surface electrodes 106b provided opposite to the back surface of the insulating substrate 101, the front surface electrodes 106a, A terminal electrode 106c for connecting the back electrode 106b. One of the back electrodes 106b is connected to the battery cell, and the other is connected to the charge / discharge circuit.

発熱抵抗体１０２は、絶縁基板１０１に設けられた図示しない導電パターンを介して電流制御素子と接続されるとともに、低融点金属体１０４を介して充放電電流経路と接続されている。また、発熱抵抗体１０２は、絶縁基板１０１の表面にガラス層からなる第１の絶縁層１０７を介して設けられるとともに、上方にガラス層からなる第２の絶縁層１０８が設けられている。また低融点金属体１０４は、導体１０９を介して第２の絶縁層１０８上に設けられるとともに、発熱抵抗体１０２とも接続されている。   The heating resistor 102 is connected to a current control element through a conductive pattern (not shown) provided on the insulating substrate 101 and is connected to a charge / discharge current path through a low melting point metal body 104. The heating resistor 102 is provided on the surface of the insulating substrate 101 via a first insulating layer 107 made of a glass layer, and a second insulating layer 108 made of a glass layer is provided on the upper side. The low melting point metal body 104 is provided on the second insulating layer 108 via the conductor 109 and is also connected to the heating resistor 102.

そして、保護素子１００は、バッテリセルの過充電や過放電などの異常時に発熱抵抗体１０２へ過電流が流れると、電流制御素子によりバッテリセルから発熱抵抗体１０２に電流が流れるように制御され、発熱抵抗体１０２から発生した熱によって低融点金属体１０４を溶融させ、充放電電流経路を遮断する。   The protection element 100 is controlled such that when an overcurrent flows to the heating resistor 102 in the event of an abnormality such as overcharge or overdischarge of the battery cell, a current flows from the battery cell to the heating resistor 102 by the current control element. The low melting point metal body 104 is melted by the heat generated from the heating resistor 102 and the charge / discharge current path is interrupted.

特開２００９−２５９７２４号公報JP 2009-259724 A

かかる保護素子１００においては、発熱抵抗体１０２から発生した熱で低融点金属体１０４を溶融させることによりバッテリセルから流れる充放電電流経路を遮断することから、異常時において充放電電流経路を速やかに遮断するためには、発熱抵抗体１０２の熱を効率よく低融点金属体１０４に伝達させることが必要となる。   In such a protection element 100, the low-melting point metal body 104 is melted by the heat generated from the heating resistor 102 to cut off the charge / discharge current path flowing from the battery cell. In order to cut off, it is necessary to efficiently transfer the heat of the heating resistor 102 to the low melting point metal body 104.

しかし、従来の保護素子１００では、低融点金属体１０４の周囲に設けられている第１、第２の絶縁層１０７，１０８がガラスによって形成されていることから、熱伝導率が低く、効率的に発熱抵抗体１０２の熱を低融点金属体１０４に伝達させることができなかった。   However, in the conventional protection element 100, since the first and second insulating layers 107 and 108 provided around the low melting point metal body 104 are formed of glass, the thermal conductivity is low and efficient. In addition, the heat of the heating resistor 102 could not be transferred to the low melting point metal body 104.

また、従来の保護素子１００は、発熱抵抗体１０２から発生した熱が、低融点金属体１０４及び表面電極１０６ａを介して絶縁基板１０１に伝達され、また、第１の絶縁層１０７を介しても絶縁基板１０１に伝達される。従来の保護素子１００は、絶縁基板１０１がアルミナ等の熱伝導率の高い材料が用いられていることから、発熱抵抗体１０２から発生した熱が、第１の絶縁層１０７を介して絶縁基板１０１へ伝達される伝熱経路と、導電層１０６を介して絶縁基板１０１へ伝達する伝熱経路とができてしまい、効率的に低融点金属体１０４の温度を上昇させることができなかった。   In the conventional protection element 100, the heat generated from the heating resistor 102 is transmitted to the insulating substrate 101 via the low melting point metal body 104 and the surface electrode 106 a, and also via the first insulating layer 107. It is transmitted to the insulating substrate 101. In the conventional protection element 100, since the insulating substrate 101 is made of a material having high thermal conductivity such as alumina, the heat generated from the heating resistor 102 is passed through the first insulating layer 107 through the insulating substrate 101. As a result, a heat transfer path transmitted to the insulating substrate 101 via the conductive layer 106 and a heat transfer path transferred to the insulating substrate 101 could be formed, and the temperature of the low melting point metal body 104 could not be increased efficiently.

そこで、本発明は、発熱抵抗体から発生した熱が保護素子の伝熱経路を通じて逃げることなく効率的に低融点金属体へ伝達させ、バッテリセルの過充電や過放電などの異常時に速やかにバッテリセルの充放電電流経路を遮断することができる保護素子、バッテリ制御装置、及び、バッテリパックを提供することを目的とする。   Therefore, the present invention efficiently transfers heat generated from the heating resistor to the low-melting-point metal body without escaping through the heat transfer path of the protective element, so that the battery can be promptly used in the event of an abnormality such as overcharge or overdischarge of the battery cell. It is an object of the present invention to provide a protection element, a battery control device, and a battery pack that can interrupt a charge / discharge current path of a cell.

上述した課題を解決するために、本発明に係る保護素子は、電気回路の電流経路上に接続される保護素子において、絶縁基板と、上記絶縁基板の一面に、第１の絶縁層を介して形成された発熱抵抗体と、上記発熱抵抗体の上方に第２の絶縁層を介して配設され、電流経路の一部を構成する低融点金属体と、上記低融点金属体の両端と接続され、上記電流経路と上記低融点金属体とを電気的に接続する接続部とを有し、上記接続部は、上記絶縁基板の上記一面に、第３の絶縁層を介して設けられているものである。   In order to solve the above-described problem, a protection element according to the present invention is a protection element connected to a current path of an electric circuit, and includes an insulating substrate and a first insulating layer on one surface of the insulating substrate. The formed heating resistor, the low melting point metal body that is disposed above the heating resistor via the second insulating layer and forms a part of the current path, and is connected to both ends of the low melting point metal body And a connecting portion for electrically connecting the current path and the low melting point metal body, and the connecting portion is provided on the one surface of the insulating substrate via a third insulating layer. Is.

また、本発明に係るバッテリ制御装置は、充放電可能なバッテリセルからなるバッテリの充放電電流経路上に接続され、該バッテリの充放電を制御する充放電制御回路と、上記バッテリセルの電圧値を検出する検出回路と、上記検出回路により検出されるバッテリセルの電圧値が所定の範囲外となったときに上記充放電電流経路を遮断する保護素子と、上記保護素子を駆動する電流制御素子とを備え、上記保護素子は、絶縁基板と、上記絶縁基板の一面に第１の絶縁層を介して形成された発熱抵抗体と、上記発熱抵抗体の上方に第２の絶縁層を介して配設され、上記充放電電流経路の一部を構成する低融点金属体と、上記低融点金属体の両端と接続され、上記充放電電流経路と上記低融点金属体とを電気的に接続する接続部とを有し、上記接続部は、上記絶縁基板の上記一面に、第３の絶縁層を介して設けられているものである。   The battery control device according to the present invention is connected to a charge / discharge current path of a battery composed of chargeable / dischargeable battery cells, and controls the charge / discharge of the battery, and the voltage value of the battery cell. , A protection element that cuts off the charge / discharge current path when the voltage value of the battery cell detected by the detection circuit falls outside a predetermined range, and a current control element that drives the protection element The protective element includes an insulating substrate, a heating resistor formed on one surface of the insulating substrate via a first insulating layer, and a second insulating layer above the heating resistor. The low melting point metal body that is disposed and constitutes a part of the charge / discharge current path is connected to both ends of the low melting point metal body, and electrically connects the charge / discharge current path to the low melting point metal body. Connecting portion, and Parts are in the one surface of the insulating substrate, in which are provided via a third insulating layer.

また、本発明に係るバッテリパックは、充放電可能なバッテリセルからなるバッテリと、上記バッテリの充放電電流経路上に接続され、該バッテリの充放電を制御する充放電制御回路と、上記バッテリセルの電圧値を検出する検出回路と、上記検出回路により検出されるバッテリセルの電圧値が所定の範囲外となったときに上記充放電電流経路を遮断する保護素子と、上記保護素子を駆動する電流制御素子とを備え、上記保護素子は、絶縁基板と、上記絶縁基板の一面に第１の絶縁層を介して形成された発熱抵抗体と、上記発熱抵抗体の上方に第２の絶縁層を介して配設され、上記充放電電流経路の一部を構成する低融点金属体と、上記低融点金属体の両端と接続され、上記充放電電流経路と上記低融点金属体とを電気的に接続する接続部とを有し、上記接続部は、上記絶縁基板の上記一面に、第３の絶縁層を介して設けられているものである。   The battery pack according to the present invention includes a battery composed of chargeable / dischargeable battery cells, a charge / discharge control circuit that is connected to a charge / discharge current path of the battery and controls charge / discharge of the battery, and the battery cell. A detection circuit for detecting a voltage value of the battery, a protection element for cutting off the charge / discharge current path when the voltage value of the battery cell detected by the detection circuit is outside a predetermined range, and driving the protection element A current control element, and the protection element includes an insulating substrate, a heating resistor formed on one surface of the insulating substrate via a first insulating layer, and a second insulating layer above the heating resistor. A low-melting point metal body that is part of the charge / discharge current path and is connected to both ends of the low-melting point metal body, and electrically connects the charge / discharge current path and the low-melting point metal body. With a connection to connect to A, the connecting portion to the one surface of the insulating substrate, in which are provided via a third insulating layer.

本発明によれば、基板と接続部との間に第３の絶縁層を設けているため、発熱抵抗体の熱が低融点金属体を経て接続部より絶縁基板側へ放熱されることを抑制することができ、効率よく低融点金属体に蓄熱させ、素早く溶断できる。   According to the present invention, since the third insulating layer is provided between the substrate and the connection portion, the heat of the heating resistor is prevented from being radiated from the connection portion to the insulating substrate side through the low melting point metal body. The heat can be efficiently stored in the low melting point metal body and can be melted quickly.

本発明が適用されたバッテリパックの全体構成を示す図である。It is a figure which shows the whole structure of the battery pack to which this invention was applied. 本発明が適用されたバッテリパックの回路構成を示す図である。It is a figure which shows the circuit structure of the battery pack to which this invention was applied. 本発明が適用された保護素子の断面図である。It is sectional drawing of the protection element to which this invention was applied. 本発明が適用された保護素子の層構成を説明する平面図である。It is a top view explaining the layer structure of the protection element to which this invention was applied. 本発明が適用された保護素子の温度特性を説明するためのグラフである。It is a graph for demonstrating the temperature characteristic of the protection element to which this invention was applied. 本発明が適用された他の保護素子の断面図である。It is sectional drawing of the other protection element to which this invention was applied. 本発明が適用された他の保護素子の回路構成を示す図である。It is a figure which shows the circuit structure of the other protection element to which this invention was applied. 本発明が適用された他の保護素子の層構成を説明する平面図である。It is a top view explaining the layer structure of the other protection element to which this invention was applied. 従来の保護素子の断面図である。It is sectional drawing of the conventional protection element.

以下、本発明が適用された保護素子、バッテリ制御装置、及び、バッテリパックについて、図面を参照しながら詳細に説明する。なお、本発明は、以下の実施形態のみに限定されるものではなく、本発明の要旨を逸脱しない範囲内において種々の変更が可能であることは勿論である。   Hereinafter, a protection element, a battery control device, and a battery pack to which the present invention is applied will be described in detail with reference to the drawings. It should be noted that the present invention is not limited to the following embodiments, and various modifications can be made without departing from the scope of the present invention.

本発明が適用された保護素子は、例えば、充放電可能なバッテリセルからなるバッテリと充放電制御回路とを保護する素子であって、図１に示すように、複数の、ここでは合計４個の充放電可能なバッテリセル１１〜１４からなるバッテリ１０を有するバッテリパック１に組み込まれて使用される。   The protection element to which the present invention is applied is, for example, an element that protects a battery composed of chargeable / dischargeable battery cells and a charge / discharge control circuit, and includes a plurality of, here, a total of four, as shown in FIG. The battery pack 1 having the battery 10 including the chargeable / dischargeable battery cells 11 to 14 is used.

バッテリパック１は、バッテリ１０と、バッテリ１０の充放電を制御する充放電制御回路２０と、バッテリ１０と充放電制御回路２０とを保護する保護素子３０と、各バッテリセル１１〜１４の電圧を検出する検出回路４０と、検出回路４０の検出結果に応じて保護素子３０の動作を制御する電流制御素子５０とを備える。   The battery pack 1 includes a battery 10, a charge / discharge control circuit 20 that controls charge / discharge of the battery 10, a protection element 30 that protects the battery 10 and the charge / discharge control circuit 20, and the voltages of the battery cells 11 to 14. The detection circuit 40 to detect and the current control element 50 which controls operation | movement of the protection element 30 according to the detection result of the detection circuit 40 are provided.

バッテリ１０は、上述したように、例えばリチウムイオン二次電池のような過充電及び過放電状態とならないような制御を要するバッテリセル１１〜１４が直列接続されたものであって、バッテリパック１の正極端子１ａ、負極端子１ｂを介して、着脱可能に充電装置２に接続され、充電装置２からの充電電圧が印加される。   As described above, the battery 10 includes battery cells 11 to 14 that need to be controlled so as not to be overcharged and overdischarged, such as a lithium ion secondary battery. The charging device 2 is detachably connected to the charging device 2 through the positive electrode terminal 1a and the negative electrode terminal 1b, and a charging voltage from the charging device 2 is applied thereto.

充放電制御回路２０は、バッテリ１０から充電装置２に流れる充放電電流経路に直列接続された２つの電流制御素子２１、２２と、これらの電流制御素子２１、２２の動作を制御する制御部２３とを備える。電流制御素子２１、２２は、例えば電界効果トランジスタ（以下、ＦＥＴと呼ぶ。）により構成され、制御部２３により制御されるゲート電圧によって、バッテリ１０の充放電電流経路の導通と遮断とを制御する。制御部２３は、充電装置２から電力供給を受けて動作し、検出回路４０による検出結果に応じて、バッテリ１０が過放電又は過充電であるとき、充放電電流経路を遮断するように、電流制御素子２１、２２の動作を制御する。   The charge / discharge control circuit 20 includes two current control elements 21 and 22 connected in series to a charge / discharge current path that flows from the battery 10 to the charging device 2, and a control unit 23 that controls operations of these current control elements 21 and 22. With. The current control elements 21 and 22 are configured by, for example, field effect transistors (hereinafter referred to as FETs), and control conduction and interruption of the charge / discharge current path of the battery 10 by a gate voltage controlled by the control unit 23. . The control unit 23 operates by receiving power supply from the charging device 2, and according to the detection result by the detection circuit 40, when the battery 10 is overdischarged or overcharged, the current is so cut off as to charge / discharge current path. The operation of the control elements 21 and 22 is controlled.

保護素子３０は、バッテリ１０と充放電制御回路２０との間の充放電電流経路上に接続され、その動作が電流制御素子５０によって制御される。   The protection element 30 is connected on a charge / discharge current path between the battery 10 and the charge / discharge control circuit 20, and its operation is controlled by the current control element 50.

検出回路４０は、各バッテリセル１１〜１４と接続され、各バッテリセル１１〜１４の電圧値を検出して、各電圧値を充放電制御回路２０の制御部２３に供給する。また、検出回路４０は、いずれか１つのバッテリセル１１〜１４が過充電電圧又は過放電電圧になったときに電流制御素子５０を制御する制御信号を出力する。   The detection circuit 40 is connected to each of the battery cells 11 to 14, detects the voltage value of each of the battery cells 11 to 14, and supplies each voltage value to the control unit 23 of the charge / discharge control circuit 20. The detection circuit 40 outputs a control signal for controlling the current control element 50 when any one of the battery cells 11 to 14 becomes an overcharge voltage or an overdischarge voltage.

電流制御素子５０は、バッテリセル１１〜１４の電圧値が所定の範囲外となったとき、具体的には過放電又は過充電状態になったとき、検出回路４０から出力される制御信号に応じて、保護素子３０を動作させて、バッテリ１０の充放電電流経路を遮断するように制御する。   The current control element 50 responds to a control signal output from the detection circuit 40 when the voltage values of the battery cells 11 to 14 are out of a predetermined range, specifically, when the battery cells 11 to 14 are overdischarged or overcharged. Then, the protection element 30 is operated to control the charge / discharge current path of the battery 10 to be cut off.

次いで、保護素子３０の構成について具体的に説明する。本発明が適用された保護素子３０は、幅広いバッテリ１０の電圧変動に対応して、抵抗体の熱により確実にヒューズを溶融して、バッテリ１０の充放電電流経路を遮断するものであり、図２に示すような回路構成を有する。   Next, the configuration of the protection element 30 will be specifically described. The protection element 30 to which the present invention is applied responds to a wide range of voltage fluctuations of the battery 10 and melts the fuse reliably by the heat of the resistor to interrupt the charging / discharging current path of the battery 10. 2 has a circuit configuration.

すなわち、保護素子３０は、図２に示すように、加熱により溶断される低融点金属体からなるヒューズ３１ａ，３１ｂと、通電するとヒューズ３１ａ，３１ｂを溶融する熱を発する抵抗体３２とを備える。   That is, as shown in FIG. 2, the protection element 30 includes fuses 31 a and 31 b made of a low melting point metal body that is melted by heating, and a resistor 32 that generates heat that melts the fuses 31 a and 31 b when energized.

ヒューズ３１ａ，３１ｂは、例えば、物理的に１つの低融点金属体を回路構成上で分離して、接続点Ｐ１を介して直列接続されるようにした素子であって、バッテリ１０と充放電制御回路２０との間の充放電電流経路上に直列接続される。例えば、ヒューズ３１ａは、ヒューズ３１ｂと接続されていない接続点Ａ３を介して充放電制御回路２０と接続され、ヒューズ３１ｂは、ヒューズ３１ａと接続されていない接続点Ａ１を介してバッテリ１０と接続される。   The fuses 31a and 31b are elements in which, for example, one low melting point metal body is physically separated on the circuit configuration and connected in series via the connection point P1, and charge / discharge control with the battery 10 is performed. They are connected in series on the charge / discharge current path between the circuit 20 and the circuit 20. For example, the fuse 31a is connected to the charge / discharge control circuit 20 via a connection point A3 that is not connected to the fuse 31b, and the fuse 31b is connected to the battery 10 via a connection point A1 that is not connected to the fuse 31a. The

抵抗体３２は、一端にヒューズ３１ａ，３１ｂとの接続点Ｐ１が設けられ、他端が電流制御素子５０と接続される端子部３３と接続されている。そして、抵抗体３２は、電流制御素子５０によって通電されると、ヒューズ３１ａ，３１ｂを構成する低融点金属体を融解する熱を発する。   One end of the resistor 32 is provided with a connection point P1 with the fuses 31a and 31b, and the other end is connected to a terminal portion 33 connected to the current control element 50. When the resistor 32 is energized by the current control element 50, the resistor 32 generates heat that melts the low-melting-point metal bodies constituting the fuses 31a and 31b.

以上のような回路構成からなる保護素子３０は、例えば図３及び図４に示すような構造体により実現される。図３は、三次元直交座標ＸＹＺ軸を基準として配置された保護素子３０のＸＺ平面から見た断面図である。また、図４は、ＸＹ平面から見た保護素子３０の積層構造について説明するための図である。   The protection element 30 having the circuit configuration as described above is realized by a structure as shown in FIGS. 3 and 4, for example. FIG. 3 is a cross-sectional view of the protection element 30 arranged on the basis of the three-dimensional orthogonal coordinate XYZ axis as seen from the XZ plane. FIG. 4 is a diagram for explaining a laminated structure of the protection element 30 as viewed from the XY plane.

保護素子３０は、セラミックスなどの絶縁性の矩形形状の基板６０の一面６０ａ上に、絶縁層を介して形成された発熱抵抗体６４と、発熱抵抗体６４の上方に絶縁層を介して配設され、充放電電流経路の一部を構成する低融点金属体６７と、低融点金属体６７の両端と接続され、充放電電流経路と低融点金属体６７とを接続する接続部６１１〜６１３とを有する。そして、保護素子３０は、接続部６１１，６１２が、基板６０に、低熱伝導性のガラス層７０，７１を介して設けられている。   The protective element 30 is disposed on one surface 60a of an insulating rectangular substrate 60 such as ceramics via an insulating layer, and disposed above the heating resistor 64 via an insulating layer. A low melting point metal body 67 constituting a part of the charge / discharge current path, and connecting portions 611 to 613 connected to both ends of the low melting point metal body 67 to connect the charge / discharge current path and the low melting point metal body 67; Have In the protection element 30, the connection portions 611 and 612 are provided on the substrate 60 via the low thermal conductivity glass layers 70 and 71.

絶縁基板６０は、例えば機械的強度の高いアルミナ等のセラミックスが用いられる。アルミナは、基板６０の機械的な強度が高く、加工や取り扱いの容易さに優れる反面、熱伝導率が約２５Ｗ／ｍ・Ｋと高い。また、基板６０は、アルミナとガラス系材料を混合したガラスセラミックス等の熱伝導率が比較的低い材料を用いることもできるが、ガラス等を含有させた分だけ脆弱となるため、加工性や耐久性等を損なうほか、ガラス系材料が均一に混合されない場合には強度や熱伝導率にばらつきも生じ、また製造コストもあがる。保護素子３０では、後述するように、基板６０の両面にガラス層７０，７１を設けた積層構造により、効率的に発熱抵抗体６４の熱を低融点金属体６７へ伝達させているため、基板６０にアルミナを用いることもできる。   The insulating substrate 60 is made of ceramics such as alumina having high mechanical strength, for example. Alumina is high in mechanical strength of the substrate 60 and excellent in processing and handling, but has a high thermal conductivity of about 25 W / m · K. In addition, the substrate 60 may be made of a material having a relatively low thermal conductivity such as glass ceramic mixed with alumina and a glass-based material. In addition to impairing the properties and the like, if the glass-based material is not uniformly mixed, variations in strength and thermal conductivity occur, and the manufacturing cost also increases. In the protective element 30, the heat of the heating resistor 64 is efficiently transmitted to the low melting point metal body 67 by the laminated structure in which the glass layers 70 and 71 are provided on both surfaces of the substrate 60, as will be described later. Alumina can also be used for 60.

このように、機械的強度、熱伝導率を考慮すると、基板６０に用いることができる材料としては、例えば、アルミナ（Ａｌ２Ｏ３、熱伝導率２５Ｗ／ｍ・Ｋ）、アルミナ７０％にムライト（３Ａｌ２Ｏ３・２ＳｉＯ２）３０％を混合させたもの（熱伝導率７Ｗ／ｍ・Ｋ）、アルミナ５０％にムライト５０％を混合させたもの（熱伝導率４Ｗ／ｍ・Ｋ）、ジルコニア（ＺｒＯ２、熱伝導率３Ｗ／ｍ・Ｋ）等が上げられる。 Thus, considering the mechanical strength and thermal conductivity, examples of materials that can be used for the substrate 60 include alumina (Al 2 O 3 , thermal conductivity 25 W / m · K), 70% alumina, and mullite. (3Al 2 O 3 · 2SiO 2 ) those obtained by mixing 30% (thermal conductivity of 7W / m · K), which was mixed with 50% mullite to 50% alumina (thermal conductivity 4W / m · K), Zirconia (ZrO 2 , thermal conductivity 3 W / m · K) and the like can be raised.

このうち、熱伝導率が５Ｗ／ｍ・Ｋ以下であるアルミナ５０％にムライト５０％を混合させたものや、ジルコニアを基板６０の材料として用いた場合、ガラス層７０，７１による放熱の抑制に加え、基板６０による放熱が抑制され、発熱抵抗体６４の熱をさらに効率よく低融点金属体６７へ伝達させることができる。   Of these, when mullite 50% is mixed with 50% alumina having a thermal conductivity of 5 W / m · K or less, or when zirconia is used as the material of the substrate 60, the heat dissipation by the glass layers 70 and 71 is suppressed. In addition, heat dissipation by the substrate 60 is suppressed, and the heat of the heating resistor 64 can be transmitted to the low melting point metal body 67 more efficiently.

また、図３において、ＸＹ平面上に位置する基板６０には、側面部に、保護素子３０と充電装置２、バッテリ１０及び電流制御素子５０とを接続する接続部６１１〜６１３が形成されている。接続部６１１〜６１３は、それぞれ、基板６０の一面６０ａに形成された導体６１ｂと、基板６０の他面６０ｂに形成された導体６１ｃと、これら基板６０内をＺ方向に貫通するようにして形成され導体６１ｂ及び導体６１ｃを接続するスルーホール６１ａを有する。   In FIG. 3, connection portions 611 to 613 that connect the protection element 30, the charging device 2, the battery 10, and the current control element 50 are formed on the side surface of the substrate 60 positioned on the XY plane. . The connecting portions 611 to 613 are formed so as to penetrate the Z-direction through the conductor 61b formed on the one surface 60a of the substrate 60, the conductor 61c formed on the other surface 60b of the substrate 60, respectively. And a through hole 61a for connecting the conductor 61b and the conductor 61c.

これらの３つの接続部６１１〜６１３のうち、対向する２つの接続部６１１、６１２は、各導体６１ｃがバッテリ１０と充放電制御回路２０とそれぞれ接続される接点となる。また、他の接続部６１３は、導体６１ｃが電流制御素子５０と接続される端子部３３として機能する。   Of these three connection portions 611 to 613, the two connection portions 611 and 612 facing each other serve as contact points where the conductors 61c are connected to the battery 10 and the charge / discharge control circuit 20, respectively. The other connection portion 613 functions as the terminal portion 33 where the conductor 61c is connected to the current control element 50.

接続部６１１〜６１３は、導体６１ｂ、導体６１ｃ及びスルーホール６１ａが基板６０の所定箇所に導電ペーストを印刷することにより形成される。接続部６１１〜６１３を構成する導電材料としては、例えば銀、銅、タングステン（Ｗ）を用いることができる。   The connection portions 611 to 613 are formed by printing the conductive paste on the predetermined portions of the substrate 60 with the conductors 61b, the conductors 61c, and the through holes 61a. For example, silver, copper, or tungsten (W) can be used as the conductive material constituting the connection portions 611 to 613.

接続部６１１，６１２は、それぞれ導体６１ｂが絶縁層となる第１のガラス層７０を介して基板６０の一面６０ａ上に形成されている。また、接続部６１１，６１２は、それぞれ導体６１ｃが絶縁層となる第２のガラス層７１を介して基板６０の他面６０ｂ上に形成されている。   The connecting portions 611 and 612 are formed on the one surface 60a of the substrate 60 via the first glass layer 70 in which the conductor 61b serves as an insulating layer. The connection portions 611 and 612 are formed on the other surface 60b of the substrate 60 via the second glass layer 71 in which the conductor 61c serves as an insulating layer.

また、基板６０の一面６０ａの中央部には、板状の第１の絶縁層６２が形成されている。この第１の絶縁層６２の表面６２ａには、導体パターン６３ａと、導体パターン６３ａと接続された発熱抵抗体６４と、発熱抵抗体６４と接続された導体パターン６３ｂとが実装されている。ここで、導体パターン６３ｂは、端子部３３として機能する接続部６１３の導体６１ｂと接続され、導体パターン６３ａは、導体６６を介して低融点金属体６７と接続される。このような接続関係によって、保護素子３０は、端子部３３として機能する接続部６１３が、導体パターン６３ｂ、発熱抵抗体６４、導体パターン６３ａを介して、導体６６を経て、低融点金属体６７と接続されている。   A plate-like first insulating layer 62 is formed at the center of the one surface 60 a of the substrate 60. A conductor pattern 63a, a heating resistor 64 connected to the conductor pattern 63a, and a conductor pattern 63b connected to the heating resistor 64 are mounted on the surface 62a of the first insulating layer 62. Here, the conductor pattern 63 b is connected to the conductor 61 b of the connection portion 613 that functions as the terminal portion 33, and the conductor pattern 63 a is connected to the low melting point metal body 67 through the conductor 66. With such a connection relationship, the protective element 30 has the connection portion 613 functioning as the terminal portion 33 via the conductor pattern 63b, the heating resistor 64, and the conductor pattern 63a, the conductor 66, and the low melting point metal body 67. It is connected.

発熱抵抗体６４は、例えば、ルテニウム（Ｒｕ）、炭化珪素（ＳｉＣ、比抵抗：１０Ω・ｃｍ）、ケイ化モリブデン（ＭｏＳｉ２、比抵抗：２．Ｅ＋０．５Ω・ｃｍ）、ランタン・クロム酸化物（ＬａＣｒｏ３）、カーボン（Ｃ、比抵抗：１．００Ｅ−３Ω・ｃｍ）を用いることができる。 The heating resistor 64 is, for example, ruthenium (Ru), silicon carbide (SiC, specific resistance: 10 Ω · cm), molybdenum silicide (MoSi 2 , specific resistance: 2.E + 0.5 Ω · cm), lanthanum / chromium oxide (LaCro 3 ) and carbon (C, specific resistance: 1.00E-3 Ω · cm) can be used.

導体パターン６３ａ、６３ｂ及び発熱抵抗体６４は、第２の絶縁層６５によって被覆されている。さらにこの第２の絶縁層６５の被覆面には、導体６６を介して、低融点金属体６７が実装される。なお、導体６６と低融点金属体６７とは半田（図示せず）によって接続される。   The conductor patterns 63 a and 63 b and the heating resistor 64 are covered with the second insulating layer 65. Further, a low melting point metal body 67 is mounted on the covering surface of the second insulating layer 65 via a conductor 66. The conductor 66 and the low melting point metal body 67 are connected by solder (not shown).

また、導体パターン６３ａの一方の端部Ｐ１１は、導体６６のＰ１２を介して低融点金属体６７と接続される。具体的に、このような接続を行うには、保護素子３０を−Ｚ方向から見た図４（Ａ）に示すように、第１の絶縁層６２の上に、導体パターン６３ａ、６３ｂと、発熱抵抗体６４が実装された実装面の、導体パターン６３ａの端部に接点Ｐ１１を設ける。そして、図４（Ｂ）に示すように、この接点Ｐ１１と、導体６６の接点Ｐ１２とが接続されるように、導体６６を第２の絶縁層６５を介して被覆し、さらに導体６６の上に、低融点金属体６７を実装する。すなわち、端部Ｐ１１を発熱抵抗体６４の外周部より外側に配置し、端部Ｐ１２を第２の絶縁層６５の外周部の外側に配置して、各部材を積層したときに端部Ｐ１１、Ｐ１２が一致するようにする。   Further, one end portion P11 of the conductor pattern 63a is connected to the low melting point metal body 67 through P12 of the conductor 66. Specifically, in order to make such a connection, as shown in FIG. 4A when the protection element 30 is viewed from the −Z direction, conductor patterns 63a and 63b are formed on the first insulating layer 62, and A contact P11 is provided at the end of the conductor pattern 63a on the mounting surface on which the heating resistor 64 is mounted. Then, as shown in FIG. 4B, the conductor 66 is covered with a second insulating layer 65 so that the contact P11 and the contact P12 of the conductor 66 are connected. Then, the low melting point metal body 67 is mounted. That is, the end portion P11 is disposed outside the outer peripheral portion of the heating resistor 64, the end portion P12 is disposed outside the outer peripheral portion of the second insulating layer 65, and the end portions P11, Let P12 match.

低融点金属体６７は、半田を介して、バッテリ１０及び充放電制御回路２０と接続される接点として機能する接続部６１１、６１２の各導体６１ｂと接続される。また、低融点金属体６７の上面には、フラックス６８が設けられる。また、低融点金属体６７は、上部が、キャップ６９により覆われる。   The low melting point metal body 67 is connected to the conductors 61b of the connection portions 611 and 612 functioning as contacts connected to the battery 10 and the charge / discharge control circuit 20 via solder. A flux 68 is provided on the upper surface of the low melting point metal body 67. Further, the upper portion of the low melting point metal body 67 is covered with a cap 69.

このような保護素子３０は、検出回路４０が電圧を検出することによりバッテリセル１１〜１４の過充電や過放電などの異常を検出すると、電流制御素子５０に制御信号を出力する。電流制御素子５０は、制御信号を受けると、発熱抵抗体６４を通電、発熱させる。保護素子３０は、発熱抵抗体６４の熱が第２の絶縁層６５、導体６６を介して低融点金属体６７へ伝達し、低融点金属体６７が融解する。これにより、保護素子３０は、接続部６１１，６１２の各導体６１ｂ間が切断され、バッテリ１０の充放電電流経路を遮断する。   Such a protection element 30 outputs a control signal to the current control element 50 when the detection circuit 40 detects an abnormality such as overcharge or overdischarge of the battery cells 11 to 14 by detecting the voltage. When receiving the control signal, the current control element 50 energizes the heating resistor 64 to generate heat. In the protection element 30, the heat of the heating resistor 64 is transmitted to the low melting point metal body 67 through the second insulating layer 65 and the conductor 66, and the low melting point metal body 67 is melted. Thereby, the protection element 30 cuts between the conductors 61b of the connection portions 611 and 612, and interrupts the charge / discharge current path of the battery 10.

ここで、保護素子３０は、発熱抵抗体６４の熱が伝達される経路として、図３に示すように、第１の絶縁層６２を介して基板６０側へ放熱される第１の伝熱経路Ａと、第２の絶縁層６５、導体６６、低融点金属体６７及び導体６１ｂを介して基板６０側へ放熱される第２の伝熱経路Ｂとを有する。また、保護素子３０は、電流制御素子５０の動作に即応して充放電電流経路を遮断することが必要であることから、発熱抵抗体６４の熱を効率よく低融点金属体６７へ伝達させることが望ましい。   Here, as shown in FIG. 3, the protection element 30 radiates heat toward the substrate 60 through the first insulating layer 62 as a path through which the heat of the heating resistor 64 is transmitted. A, and a second heat transfer path B that radiates heat to the substrate 60 side via the second insulating layer 65, the conductor 66, the low melting point metal body 67, and the conductor 61b. Further, since the protection element 30 needs to cut off the charge / discharge current path in response to the operation of the current control element 50, the heat of the heating resistor 64 is efficiently transmitted to the low melting point metal body 67. Is desirable.

そして、保護素子３０は、第２の伝熱経路Ｂ上に位置する導体６１ｂと基板６０の一面６０ａとの間に第３の絶縁層となる第１のガラス層７０を介在させ、また、第２の伝熱経路Ｂ上に位置する導体６１ｃと基板６０の他面６０ｂとの間に第４の絶縁層となる第２のガラス層７１を介在させている。これにより、保護素子３０は、発熱抵抗体６４が発した熱が低融点金属体６７及び導体６１ｂを介して熱伝導率の高い基板６０側へ放熱することを抑制し、また、熱伝導率の高い基板６０より導体６１ｃ側へ放熱することを抑制している。なお、第３の絶縁層、第４の絶縁層となる第１，第２のガラス層７０，７１としては、種々のガラス類を好ましく用いることができる。   The protective element 30 has a first glass layer 70 as a third insulating layer interposed between the conductor 61b located on the second heat transfer path B and the one surface 60a of the substrate 60. A second glass layer 71 serving as a fourth insulating layer is interposed between the conductor 61 c located on the second heat transfer path B and the other surface 60 b of the substrate 60. Thereby, the protection element 30 suppresses that the heat generated by the heating resistor 64 is dissipated through the low melting point metal body 67 and the conductor 61b to the substrate 60 side having a high thermal conductivity, and the thermal conductivity is reduced. Heat dissipation from the high substrate 60 toward the conductor 61c is suppressed. Various glasses can be preferably used as the first and second glass layers 70 and 71 to be the third insulating layer and the fourth insulating layer.

したがって、保護素子３０は、第２の伝熱経路Ｂにおける放熱を抑えることで発熱抵抗体６４の温度を効率よく上昇させ、電流制御素子５０により通電されると、直ちに低融点金属体６７を融解させ、充放電電流経路を遮断することができる。また、保護素子３０は、発熱抵抗体６４の熱を効率よく低融点金属体６７へ伝達できることから、発熱抵抗体６４を小さくしても十分に低融点金属体６７を融解させることができ、保護素子３０全体の小型化を図ることができる。さらに、保護素子３０は、発熱抵抗体６４の熱を効率よく低融点金属体６７へ伝達できることから、発熱抵抗体６４へ通電させる電流量を抑え、省電力化を図ることもできる。   Therefore, the protection element 30 efficiently raises the temperature of the heating resistor 64 by suppressing heat dissipation in the second heat transfer path B, and immediately melts the low melting point metal body 67 when energized by the current control element 50. The charge / discharge current path can be interrupted. Further, since the protection element 30 can efficiently transfer the heat of the heating resistor 64 to the low melting point metal body 67, the low melting point metal body 67 can be sufficiently melted even if the heating resistor 64 is made small. The entire element 30 can be reduced in size. Furthermore, since the protection element 30 can efficiently transmit the heat of the heating resistor 64 to the low melting point metal body 67, the amount of current passed through the heating resistor 64 can be suppressed, and power saving can be achieved.

なお、保護素子３０は、第１のガラス層７０及び第２のガラス層７１が導体６１ｂ及び導体６１ｃと重畳する位置にのみ形成され、基板６０の他面６０ｂの第２のガラス層７１に挟まれた第１の伝熱経路Ａ上には空気層が設けられている。空気層は、非常に熱伝導率が低いため（０．０２４１W／m・K）、これにより、第２のガラス層７１に挟まれた第１の伝熱経路Ａによる放熱を抑制することができ、その分、第２の伝熱経路Ｂへ熱を伝達することができる。   The protective element 30 is formed only at a position where the first glass layer 70 and the second glass layer 71 overlap with the conductor 61b and the conductor 61c, and is sandwiched between the second glass layer 71 on the other surface 60b of the substrate 60. An air layer is provided on the first heat transfer path A. Since the air layer has a very low thermal conductivity (0.0241 W / m · K), it is possible to suppress heat dissipation by the first heat transfer path A sandwiched between the second glass layers 71. Therefore, heat can be transferred to the second heat transfer path B.

また、保護素子３０は、第１、第２の絶縁層６２，６５としてガラスを用いると共に、第２の伝熱経路Ｂ上に位置する第２の絶縁層６５の熱伝導率が、第１の伝熱経路Ａ上に位置する第１の絶縁層６２の熱伝導率以上であることが好ましい。かかる構成を備えることにより、保護素子３０は、発熱抵抗体６４で発生した熱が第１の伝熱経路Ａ側に多く放熱されてしまうこと自体を防止できる。   The protective element 30 uses glass as the first and second insulating layers 62 and 65, and the thermal conductivity of the second insulating layer 65 located on the second heat transfer path B is the first It is preferable that the thermal conductivity of the first insulating layer 62 located on the heat transfer path A is equal to or higher than that. With this configuration, the protection element 30 can prevent the heat generated by the heating resistor 64 from being radiated to the first heat transfer path A side.

また、保護素子３０は、第２の伝熱経路Ｂ上に位置する第２の絶縁層６５として、第１の伝熱経路Ａ上に位置する第１の絶縁層６２よりも相対的に熱伝導率が高いガラスを用いることがより好ましい。かかる構成を備えることにより、保護素子３０は、発熱抵抗体６４で発生した熱が低融点金属体６７と反対側の基板６０側へ放熱することを抑制することができる。したがって、保護素子３０は、その分、発熱抵抗体６４で発生した熱を第２の伝熱経路Ｂ側へ伝達させ、効率よく低融点金属体６７の温度を上昇させることができる。   In addition, the protective element 30 is more thermally conductive as the second insulating layer 65 positioned on the second heat transfer path B than the first insulating layer 62 positioned on the first heat transfer path A. It is more preferable to use a glass having a high rate. By providing such a configuration, the protection element 30 can suppress the heat generated by the heating resistor 64 from radiating to the substrate 60 side opposite to the low melting point metal body 67. Therefore, the protection element 30 can transmit the heat generated by the heat generating resistor 64 to the second heat transfer path B and increase the temperature of the low melting point metal body 67 efficiently.

このように、第１の絶縁層６２を構成する熱伝導率が相対的に低いガラスとしては、例えばＳｉＯ２・Ｂ２Ｏ３・ＲＯ（熱伝導率０．８３Ｗ／ｍ・Ｋ）や、ＳｉＯ２・Ｂ２Ｏ３・ＰｂＯ（熱伝導率１．４２Ｗ／ｍ・Ｋ）を用いることができる。また、第２の絶縁層６５を構成する熱伝導率が相対的に高いガラスとしては、例えばＳｉＯ２・Ｂ２Ｏ３・ＲＯ（熱伝導率２．１Ｗ／ｍ・Ｋ）を用いることができる。 As described above, examples of the glass having a relatively low thermal conductivity constituting the first insulating layer 62 include SiO 2 .B 2 O 3 .RO (thermal conductivity 0.83 W / m · K), SiO 2 2 · B 2 O 3 · PbO (thermal conductivity 1.42 W / m · K) can be used. As the glass having relatively high thermal conductivity constituting the second insulating layer 65, for example, SiO 2 · B 2 O 3 · RO (thermal conductivity 2.1 W / m · K) can be used. .

なお、第１の絶縁層６２を構成するガラスは、第２の絶縁層６５を構成するガラスに対して、相対的に熱伝導率が低ければよいため、例えば第１の絶縁層６２を構成するガラスとしてＳｉＯ２・Ｂ２Ｏ３・ＲＯ（熱伝導率０．８３Ｗ／ｍ・Ｋ）を用いた場合には、第２の絶縁層６５を構成するガラスとしてＳｉＯ２・Ｂ２Ｏ３・ＰｂＯ（熱伝導率１．４２Ｗ／ｍ・Ｋ）を用いてもよい。 In addition, since the glass which comprises the 1st insulating layer 62 should just have relatively low heat conductivity with respect to the glass which comprises the 2nd insulating layer 65, it comprises the 1st insulating layer 62, for example. When SiO 2 · B 2 O 3 · RO (thermal conductivity 0.83 W / m · K) is used as the glass, the glass constituting the second insulating layer 65 is SiO 2 · B 2 O 3 · PbO. (Thermal conductivity 1.42 W / m · K) may be used.

このような保護素子３０は、以下のように製造される。先ず、アルミナや、アルミナ５０％にムライト５０％を混合させたもの、あるいはジルコニア等のセラミックス材料によって基板６０を形成する。次いで、導体６１ｂ及び導体６１ｃを接続するスルーホール６１ａを構成する貫通孔を形成し、第３の絶縁層となる第１のガラス層７０及び第１の絶縁層６２を構成するガラスペーストをスクリーン印刷等により印刷し、焼成することにより第１の絶縁層６２及び第１のガラス層７０を同一平面に形成する。すなわち、保護素子３０は、第１の絶縁層６２を構成するガラスと、第１のガラス層７０を構成するガラスは同じ材料となる。   Such a protection element 30 is manufactured as follows. First, the substrate 60 is formed of alumina, a mixture of 50% alumina and 50% mullite, or a ceramic material such as zirconia. Next, through-holes constituting the through holes 61a connecting the conductors 61b and 61c are formed, and the glass paste constituting the first glass layer 70 and the first insulating layer 62 serving as the third insulating layer is screen-printed. The first insulating layer 62 and the first glass layer 70 are formed on the same plane by printing and baking with the like. That is, in the protective element 30, the glass constituting the first insulating layer 62 and the glass constituting the first glass layer 70 are made of the same material.

同様にして、第４の絶縁層となる第２のガラス層７１を形成する。次いで、導電ペーストを印刷、焼成することにより第１のガラス層７０上に導体６１ｂを形成すると共に、スルーホール６１ａを形成し、また、発熱抵抗体６４、導体パターン６３ａ及び導体パターン６３ｂを形成する。また、導電ペーストを印刷、焼成することにより、第２のガラス層７１上に導体６１ｃを形成する。   Similarly, a second glass layer 71 to be a fourth insulating layer is formed. Next, the conductor 61b is formed on the first glass layer 70 by printing and baking the conductive paste, and the through hole 61a is formed, and the heating resistor 64, the conductor pattern 63a, and the conductor pattern 63b are formed. . Moreover, the conductor 61c is formed on the 2nd glass layer 71 by printing and baking an electrically conductive paste.

次いで、ガラスペーストを印刷、焼成することにより第２の絶縁層６５を形成し、導体６６、低融点金属体６７、フラックス６８を実装した後、キャップ６９で覆う。以上により、保護素子３０が製造される。   Next, a second insulating layer 65 is formed by printing and baking a glass paste, and after mounting the conductor 66, the low melting point metal body 67, and the flux 68, it is covered with a cap 69. Thus, the protection element 30 is manufactured.

次いで、保護素子３０の実施例について説明する。この実施例では、保護素子３０において、第１のガラス層７０及び第２のガラス層７１を備え、各ガラス層７０，７１の厚みが１０μｍであるもの（実施例１）と、各ガラス層７０，７１の厚みが２０μｍであるもの（実施例２）と、各ガラス層７０，７１の厚みが４０μｍであるもの（実施例３）を用意した。また、保護素子３０において、第１のガラス層７０のみを備え、ガラス層７０の厚みが１０μｍであるもの（実施例４）と、ガラス層７０の厚みが２０μｍであるもの（実施例５）と、ガラス層７０の厚みが４０μｍであるもの（実施例６）を用意した。そして、比較例として、図９に示す、絶縁基板１０１上にガラス層を設けることなく導電層１０６を形成した保護素子１００を用意した。   Next, an example of the protection element 30 will be described. In this embodiment, the protective element 30 includes a first glass layer 70 and a second glass layer 71, each of which has a thickness of 10 μm (Example 1), and each glass layer 70. , 71 has a thickness of 20 μm (Example 2) and each glass layer 70, 71 has a thickness of 40 μm (Example 3). Moreover, in the protective element 30, only the 1st glass layer 70 is provided, the thickness of the glass layer 70 is 10 micrometers (Example 4), and the thickness of the glass layer 70 is 20 micrometers (Example 5). A glass layer 70 having a thickness of 40 μm (Example 6) was prepared. As a comparative example, a protective element 100 in which the conductive layer 106 was formed without providing a glass layer on the insulating substrate 101 shown in FIG. 9 was prepared.

これら実施例１〜６及び比較例１について、所定の温度に到達するまでの時間を計測した。温度の計測点は、発熱抵抗体６４の下部で、低融点金属体６７の略中央部分とした。   About these Examples 1-6 and the comparative example 1, the time until it reached | attained predetermined temperature was measured. The temperature was measured at the lower portion of the heating resistor 64 and at the substantially central portion of the low melting point metal body 67.

図５に示すように、計測点が例えば８００℃まで上昇する時間を計測すると、実施例１〜６では約２０秒以内であったのに対して、比較例では約３０秒かかった。   As shown in FIG. 5, when the time for the measurement point to rise to, for example, 800 ° C. was measured, it took less than 20 seconds in Examples 1 to 6, while it took about 30 seconds in the comparative example.

また、実施例の中では、実施例３が最も早く温度が上昇し、次いで実施例６、実施例２、実施例５、実施例１、実施例４の順に温度が上昇した。これより、基板６０の一面６０ａのみにガラス層を設けた場合でも、その厚さを厚くすることで、発熱抵抗体６４による熱が基板６０側へ放熱されることを抑制し、効果的に低融点金属体６７へ熱を伝えることができることがわかる。   Among the examples, the temperature rose rapidly in Example 3, and then the temperature rose in the order of Example 6, Example 2, Example 5, Example 1, and Example 4. As a result, even when a glass layer is provided only on one surface 60a of the substrate 60, by increasing the thickness, heat from the heating resistor 64 can be prevented from being radiated to the substrate 60 side, and effectively reduced. It can be seen that heat can be transferred to the melting point metal body 67.

なお、保護素子３０は、発熱抵抗体６４と電流制御素子５０とを接続する接続部６１３の導体６１ｂと、基板６０の一面６０ａとの間にも第１のガラス層７０を設けてもよい。この場合、第１のガラス層７０は、発熱抵抗体６４の熱が導体パターン６３ｂを介して接続部６１３の導体６１ｂ及び基板６０へ放熱されることを抑制することができる。   In the protection element 30, the first glass layer 70 may also be provided between the conductor 61 b of the connection portion 613 that connects the heating resistor 64 and the current control element 50 and the one surface 60 a of the substrate 60. In this case, the first glass layer 70 can suppress the heat of the heating resistor 64 from being radiated to the conductor 61b and the substrate 60 of the connection portion 613 through the conductor pattern 63b.

また、保護素子３０は、図６に示すように、第２のガラス層７１を形成せず、基板６０の他面６０ｂに接続部６１１，６１２の導体６１ｃを形成してもよい。この場合も、保護素子３０は、第２の伝熱経路Ｂ上に位置する導体６１ｂと基板６０の一面６０ａとの間に第１のガラス層７０を介在させることにより、発熱抵抗体６４が発した熱が低融点金属体６７及び導体６１ｂを介して熱伝導率の高い基板６０側へ放熱することを抑制できる。   Further, as shown in FIG. 6, the protection element 30 may form the conductors 61 c of the connection portions 611 and 612 on the other surface 60 b of the substrate 60 without forming the second glass layer 71. In this case as well, the protective element 30 causes the heating resistor 64 to be generated by interposing the first glass layer 70 between the conductor 61b located on the second heat transfer path B and the one surface 60a of the substrate 60. It is possible to suppress the heat dissipated to the substrate 60 side having high thermal conductivity through the low melting point metal body 67 and the conductor 61b.

したがって、保護素子３０は、第２の伝熱経路Ｂにおける放熱を抑えることで発熱抵抗体６４の温度を効率よく上昇させ、電流制御素子５０により通電されると、直ちに低融点金属体６７を融解させ、充放電電流経路を遮断することができる。   Therefore, the protection element 30 efficiently raises the temperature of the heating resistor 64 by suppressing heat dissipation in the second heat transfer path B, and immediately melts the low melting point metal body 67 when energized by the current control element 50. The charge / discharge current path can be interrupted.

また、保護素子３０は、第１の絶縁層６２のガラス材料と、第１のガラス層７０のガラス材料を変えて、第１のガラス層７０の熱伝導率が、第１の絶縁層６２の熱伝導率よりも小さくなるようにしてもよい。かかる構成を備えることにより、第１の伝熱経路Ａ上の第１の絶縁層６２から第２の伝熱経路Ｂ上の第１のガラス層７０側への放熱を抑制することができる。この場合、第１の絶縁層６２と第１のガラス層７０とは、別工程で材質の異なるガラスが印刷、焼成されることにより形成される。   In addition, the protection element 30 changes the glass material of the first insulating layer 62 and the glass material of the first glass layer 70 so that the thermal conductivity of the first glass layer 70 is the same as that of the first insulating layer 62. You may make it become smaller than heat conductivity. By providing such a configuration, heat radiation from the first insulating layer 62 on the first heat transfer path A to the first glass layer 70 side on the second heat transfer path B can be suppressed. In this case, the first insulating layer 62 and the first glass layer 70 are formed by printing and baking different glass materials in different steps.

また、保護素子３０は、図７に示すように、抵抗体３２を回路構成上、複数備え（例えば図７では２つ）、各抵抗体３２ａ，３２ｂの接点Ｐ２より端子部３３ａを延設するとともに、抵抗体３２ｂの端部より端子部３３ｂを延設し、バッテリセルの数に応じて電流制御素子５０と接続する端子部を選択することにより、抵抗体３２の発熱量を切り換えてもよい。この場合、保護素子３０は、例えば図８に示すように、第１の絶縁層６２上に導体パターンを複数形成し発熱抵抗体６４を複数に分割し（図８では６４ａと６４ｂの２つ）、導体６６と接続されていない残りの導体パターン６３ｂ、６３ｃの端部を基板６０の側面に形成した接続部６１３，６１４と接続する。そして、バッテリセルの数に応じて電流制御素子５０と接続される接続部を選択することにより、保護素子３０の通電時に導通する発熱抵抗体の抵抗値を増減させ、発熱量を調整することができる。   Further, as shown in FIG. 7, the protection element 30 includes a plurality of resistors 32 (for example, two in FIG. 7) in the circuit configuration, and the terminal portion 33a extends from the contact point P2 of each resistor 32a, 32b. In addition, the amount of heat generated by the resistor 32 may be switched by extending the terminal portion 33b from the end of the resistor 32b and selecting a terminal portion connected to the current control element 50 according to the number of battery cells. . In this case, for example, as shown in FIG. 8, the protection element 30 forms a plurality of conductor patterns on the first insulating layer 62 and divides the heating resistor 64 into a plurality of pieces (in FIG. 8, two of 64a and 64b). The end portions of the remaining conductor patterns 63 b and 63 c that are not connected to the conductor 66 are connected to connection portions 613 and 614 formed on the side surface of the substrate 60. Then, by selecting a connection portion connected to the current control element 50 according to the number of battery cells, the resistance value of the heating resistor that is conductive when the protective element 30 is energized can be increased or decreased, and the amount of generated heat can be adjusted. it can.

すなわち、保護素子３０は、バッテリ１０の電圧値の変動帯域に応じて、発熱させる抵抗体の数を調整することで多段階に発熱抵抗体全体の抵抗値を調整することができ、発熱抵抗体６４に対してバッテリの数に応じて変動する電圧値が過大となり発熱抵抗体６４が損傷する事態を防止することができる。これにより、保護素子３０は、例えば２セルのバッテリパックに用いる場合には、１つの発熱抵抗体６４に通電し、４セルのバッテリパックに用いる場合には２つの発熱抵抗体６４に通電することができるなど、一つの素子で複数のバッテリパックに対応することができる。   That is, the protection element 30 can adjust the resistance value of the entire heating resistor in multiple stages by adjusting the number of resistors that generate heat according to the fluctuation range of the voltage value of the battery 10, and the heating resistor As a result, it is possible to prevent the heating resistor 64 from being damaged due to an excessive voltage value that varies depending on the number of batteries. Thus, the protection element 30 energizes one heating resistor 64 when used in, for example, a 2-cell battery pack, and energizes two heating resistors 64 when used in a 4-cell battery pack. It is possible to handle a plurality of battery packs with a single element.

そして、保護素子３０は、図８に示す構成においても、各接続部６１１，６１２の他、接続部６１３，６１４の導体６１ｂと基板６０の一面６０ａとの間にも第１のガラス層７０を設け、また、接続部６１３，６１４の導体６１ｃと基板６０の他面６０ｂとの間にも第２のガラス層７１を設けることで、導体パターン６３ｂ、６３ｃを介した放熱をも抑制し、発熱抵抗体６４の熱を効率よく低融点金属体に蓄熱させることができる。また、保護素子３０は、少ない発熱量でも低融点金属体６７を溶断でき、発熱抵抗体６４の小型化、省電力化を図ることができる。   In the configuration shown in FIG. 8, the protective element 30 also includes the first glass layer 70 between the conductors 61 b of the connection portions 613 and 614 and the one surface 60 a of the substrate 60 in addition to the connection portions 611 and 612. In addition, by providing the second glass layer 71 between the conductor 61c of the connecting portions 613 and 614 and the other surface 60b of the substrate 60, heat dissipation through the conductor patterns 63b and 63c is also suppressed, and heat is generated. The heat of the resistor 64 can be efficiently stored in the low melting point metal body. Further, the protective element 30 can melt the low melting point metal body 67 even with a small amount of heat generation, and the heat generating resistor 64 can be reduced in size and power can be saved.

以上、バッテリパック内に配設されたバッテリセルの充放電電流経路上に設けられた保護素子３０について説明したが、保護素子３０は、バッテリの充放電回路以外にも、過電流や、過電圧から保護すべきあらゆる電気回路に適用することができる。   As described above, the protection element 30 provided on the charge / discharge current path of the battery cell disposed in the battery pack has been described. However, the protection element 30 is not limited to the battery charge / discharge circuit, but from an overcurrent or an overvoltage. It can be applied to any electrical circuit to be protected.

１ バッテリパック、２ 充電装置、１０ バッテリ、１１〜１４ バッテリセル、２０ 充放電制御回路、２１，２２ 電流制御素子、２３ 制御部、３０ 保護素子、３１ ヒューズ、３２ 抵抗体、３３ 端子部、４０ 検出回路、５０ 電流制御素子、６０ 基板、６１ａ スルーホール、６１ｂ，６１ｃ 導体、６２ 第１の絶縁層、６３ 導体パターン、６４ 発熱抵抗体、６５ 第２の絶縁層、６６ 導体、６７ 低融点金属体、６８ フラックス、６９ キャップ、７０ 第１のガラス層、７１ 第２のガラス層 DESCRIPTION OF SYMBOLS 1 Battery pack, 2 Charging apparatus, 10 Battery, 11-14 Battery cell, 20 Charge / discharge control circuit, 21, 22 Current control element, 23 Control part, 30 Protection element, 31 Fuse, 32 Resistor, 33 Terminal part, 40 Detection circuit, 50 current control element, 60 substrate, 61a through hole, 61b, 61c conductor, 62 first insulating layer, 63 conductor pattern, 64 heating resistor, 65 second insulating layer, 66 conductor, 67 low melting point metal Body, 68 flux, 69 cap, 70 first glass layer, 71 second glass layer

Claims (10)

電気回路の電流経路上に接続される保護素子において、
絶縁基板と、
上記絶縁基板の一面に、第１の絶縁層を介して形成された発熱抵抗体と、
上記発熱抵抗体の上方に第２の絶縁層を介して配設され、電流経路の一部を構成する低融点金属体と、
上記低融点金属体の両端と接続され、上記電流経路と上記低融点金属体とを電気的に接続する接続部とを有し、
上記接続部は、上記絶縁基板の上記一面に、第３の絶縁層を介して設けられている保護素子。 In the protective element connected on the current path of the electric circuit,
An insulating substrate;
A heating resistor formed on one surface of the insulating substrate via a first insulating layer;
A low-melting-point metal body that is disposed above the heating resistor via a second insulating layer and forms a part of a current path;
Connected to both ends of the low-melting-point metal body, and having a connection part for electrically connecting the current path and the low-melting-point metal body,
The connecting portion is a protective element provided on the one surface of the insulating substrate via a third insulating layer. 上記接続部の下部のみに上記第３の絶縁層が形成されている請求項１記載の保護素子。   The protection element according to claim 1, wherein the third insulating layer is formed only at a lower portion of the connection portion. 上記接続部は、上記絶縁基板の上記一面と対向する他面に第４の絶縁層を介して設けられている請求項１又は請求項２記載の保護素子。   The protection element according to claim 1, wherein the connection portion is provided on the other surface of the insulating substrate facing the one surface via a fourth insulating layer. 上記接続部と重畳する位置のみに上記第３，第４の絶縁層が形成されている請求項３記載の保護素子。   The protection element according to claim 3, wherein the third and fourth insulating layers are formed only at positions overlapping with the connection portion. 上記第２の絶縁層の熱伝導率が、上記第１の絶縁層の熱伝導率以上である請求項１〜請求項４の何れか１項に記載の保護素子。   The protective element according to any one of claims 1 to 4, wherein the thermal conductivity of the second insulating layer is equal to or higher than the thermal conductivity of the first insulating layer. 上記第１、第２の絶縁層は、ガラス層である請求項５記載の保護素子。   The protection element according to claim 5, wherein the first and second insulating layers are glass layers. 上記第３、第４の絶縁層は、ガラス層である請求項１〜請求項６の何れか１項に記載の保護素子。   The protective element according to any one of claims 1 to 6, wherein the third and fourth insulating layers are glass layers. 上記第３の絶縁層の熱伝導率は、上記第１の絶縁層の熱伝導率よりも小さい請求項１〜請求項７の何れか１項に記載の保護素子。   The protection element according to any one of claims 1 to 7, wherein the thermal conductivity of the third insulating layer is smaller than the thermal conductivity of the first insulating layer. 充放電可能なバッテリセルからなるバッテリの充放電電流経路上に接続され、該バッテリの充放電を制御する充放電制御回路と、
上記バッテリセルの電圧値を検出する検出回路と、
上記検出回路により検出されるバッテリセルの電圧値が所定の範囲外となったときに上記充放電電流経路を遮断する保護素子と、
上記保護素子を駆動する電流制御素子とを備え、
上記保護素子は、絶縁基板と、上記絶縁基板の一面に第１の絶縁層を介して形成された発熱抵抗体と、上記発熱抵抗体の上方に第２の絶縁層を介して配設され、上記充放電電流経路の一部を構成する低融点金属体と、上記低融点金属体の両端と接続され、上記充放電電流経路と上記低融点金属体とを電気的に接続する接続部とを有し、上記接続部は、上記絶縁基板の上記一面に、第３の絶縁層を介して設けられているバッテリ制御装置。 A charge / discharge control circuit connected to a charge / discharge current path of a battery composed of chargeable / dischargeable battery cells to control charge / discharge of the battery;
A detection circuit for detecting a voltage value of the battery cell;
A protection element that cuts off the charge / discharge current path when the voltage value of the battery cell detected by the detection circuit is out of a predetermined range;
A current control element for driving the protection element,
The protection element is disposed via an insulating substrate, a heating resistor formed on one surface of the insulating substrate via a first insulating layer, and a second insulating layer above the heating resistor, A low melting point metal body constituting a part of the charge / discharge current path; and a connecting portion connected to both ends of the low melting point metal body and electrically connecting the charge / discharge current path and the low melting point metal body. And a battery control device, wherein the connecting portion is provided on the one surface of the insulating substrate via a third insulating layer. 充放電可能なバッテリセルからなるバッテリと、
上記バッテリの充放電電流経路上に接続され、該バッテリの充放電を制御する充放電制御回路と、
上記バッテリセルの電圧値を検出する検出回路と、
上記検出回路により検出されるバッテリセルの電圧値が所定の範囲外となったときに上記充放電電流経路を遮断する保護素子と、
上記保護素子を駆動する電流制御素子とを備え、
上記保護素子は、絶縁基板と、上記絶縁基板の一面に第１の絶縁層を介して形成された発熱抵抗体と、上記発熱抵抗体の上方に第２の絶縁層を介して配設され、上記充放電電流経路の一部を構成する低融点金属体と、上記低融点金属体の両端と接続され、上記充放電電流経路と上記低融点金属体とを電気的に接続する接続部とを有し、上記接続部は、上記絶縁基板の上記一面に、第３の絶縁層を介して設けられているバッテリパック。 A battery comprising chargeable / dischargeable battery cells;
A charge / discharge control circuit that is connected to the charge / discharge current path of the battery and controls charge / discharge of the battery;
A detection circuit for detecting a voltage value of the battery cell;
A protection element that cuts off the charge / discharge current path when the voltage value of the battery cell detected by the detection circuit is outside a predetermined range;
A current control element for driving the protection element,
The protection element is disposed via an insulating substrate, a heating resistor formed on one surface of the insulating substrate via a first insulating layer, and a second insulating layer above the heating resistor, A low melting point metal body constituting a part of the charge / discharge current path; and a connecting portion connected to both ends of the low melting point metal body and electrically connecting the charge / discharge current path and the low melting point metal body. And a battery pack provided on the one surface of the insulating substrate via a third insulating layer.
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