JP2011216914A - Iii族窒化物半導体レーザ素子、及びiii族窒化物半導体レーザ素子を作製する方法 - Google Patents
Iii族窒化物半導体レーザ素子、及びiii族窒化物半導体レーザ素子を作製する方法 Download PDFInfo
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- JP2011216914A JP2011216914A JP2011164402A JP2011164402A JP2011216914A JP 2011216914 A JP2011216914 A JP 2011216914A JP 2011164402 A JP2011164402 A JP 2011164402A JP 2011164402 A JP2011164402 A JP 2011164402A JP 2011216914 A JP2011216914 A JP 2011216914A
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- nitride semiconductor
- group iii
- iii nitride
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- degrees
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 304
- 150000004767 nitrides Chemical class 0.000 title claims description 201
- 238000004519 manufacturing process Methods 0.000 title claims description 16
- 239000000758 substrate Substances 0.000 claims description 113
- 229910002601 GaN Inorganic materials 0.000 claims description 52
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 claims description 52
- 238000000034 method Methods 0.000 claims description 50
- 238000005253 cladding Methods 0.000 claims description 38
- 230000010287 polarization Effects 0.000 claims description 23
- 238000003825 pressing Methods 0.000 claims description 14
- 229910002704 AlGaN Inorganic materials 0.000 claims description 9
- 238000000926 separation method Methods 0.000 claims description 5
- 229910017083 AlN Inorganic materials 0.000 claims description 4
- 230000000149 penetrating effect Effects 0.000 claims description 3
- 238000005121 nitriding Methods 0.000 claims 1
- 230000007704 transition Effects 0.000 abstract description 12
- 238000003776 cleavage reaction Methods 0.000 abstract description 8
- 238000001312 dry etching Methods 0.000 abstract description 8
- 230000007017 scission Effects 0.000 abstract description 8
- 230000010355 oscillation Effects 0.000 description 19
- 239000013078 crystal Substances 0.000 description 7
- 230000015572 biosynthetic process Effects 0.000 description 5
- 150000002500 ions Chemical class 0.000 description 5
- 238000005259 measurement Methods 0.000 description 5
- 230000003287 optical effect Effects 0.000 description 5
- 230000008569 process Effects 0.000 description 5
- 230000004888 barrier function Effects 0.000 description 4
- 238000005136 cathodoluminescence Methods 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 4
- 238000000576 coating method Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 238000007796 conventional method Methods 0.000 description 3
- 238000001020 plasma etching Methods 0.000 description 3
- 238000001228 spectrum Methods 0.000 description 3
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 2
- 229910004298 SiO 2 Inorganic materials 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 230000000903 blocking effect Effects 0.000 description 2
- 239000000969 carrier Substances 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 229910003460 diamond Inorganic materials 0.000 description 2
- 239000010432 diamond Substances 0.000 description 2
- 230000001678 irradiating effect Effects 0.000 description 2
- 230000007246 mechanism Effects 0.000 description 2
- 239000013307 optical fiber Substances 0.000 description 2
- 238000005498 polishing Methods 0.000 description 2
- 238000002310 reflectometry Methods 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- JLTRXTDYQLMHGR-UHFFFAOYSA-N trimethylaluminium Chemical compound C[Al](C)C JLTRXTDYQLMHGR-UHFFFAOYSA-N 0.000 description 2
- XCZXGTMEAKBVPV-UHFFFAOYSA-N trimethylgallium Chemical compound C[Ga](C)C XCZXGTMEAKBVPV-UHFFFAOYSA-N 0.000 description 2
- IBEFSUTVZWZJEL-UHFFFAOYSA-N trimethylindium Chemical compound C[In](C)C IBEFSUTVZWZJEL-UHFFFAOYSA-N 0.000 description 2
- 102100025250 C-X-C motif chemokine 14 Human genes 0.000 description 1
- 240000006829 Ficus sundaica Species 0.000 description 1
- 101000858068 Homo sapiens C-X-C motif chemokine 14 Proteins 0.000 description 1
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 1
- 229910010413 TiO 2 Inorganic materials 0.000 description 1
- 229910021529 ammonia Inorganic materials 0.000 description 1
- 238000004364 calculation method Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000009795 derivation Methods 0.000 description 1
- 230000001066 destructive effect Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000010894 electron beam technology Methods 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 230000001747 exhibiting effect Effects 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 238000002248 hydride vapour-phase epitaxy Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000007935 neutral effect Effects 0.000 description 1
- 238000000879 optical micrograph Methods 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 229910000077 silane Inorganic materials 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 239000002002 slurry Substances 0.000 description 1
- 238000001771 vacuum deposition Methods 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- 238000000927 vapour-phase epitaxy Methods 0.000 description 1
- 238000001039 wet etching Methods 0.000 description 1
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Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011164402A JP2011216914A (ja) | 2011-07-27 | 2011-07-27 | Iii族窒化物半導体レーザ素子、及びiii族窒化物半導体レーザ素子を作製する方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011164402A JP2011216914A (ja) | 2011-07-27 | 2011-07-27 | Iii族窒化物半導体レーザ素子、及びiii族窒化物半導体レーザ素子を作製する方法 |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2010008414A Division JP4793494B2 (ja) | 2010-01-18 | 2010-01-18 | Iii族窒化物半導体レーザ素子を作製する方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2011216914A true JP2011216914A (ja) | 2011-10-27 |
| JP2011216914A5 JP2011216914A5 (https=) | 2012-12-27 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2011164402A Pending JP2011216914A (ja) | 2011-07-27 | 2011-07-27 | Iii族窒化物半導体レーザ素子、及びiii族窒化物半導体レーザ素子を作製する方法 |
Country Status (1)
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| JP (1) | JP2011216914A (https=) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004235626A (ja) * | 2003-01-10 | 2004-08-19 | Toshiba Corp | 半導体装置の製造装置及びその製造方法 |
| JP2008109066A (ja) * | 2006-09-29 | 2008-05-08 | Rohm Co Ltd | 発光素子 |
| JP2008543089A (ja) * | 2005-06-01 | 2008-11-27 | ザ リージェンツ オブ ザ ユニバーシティ オブ カリフォルニア | 半極性(Ga,Al,In,B)N薄膜、ヘテロ構造およびデバイスの成長と作製のための方法及び装置 |
| JP2009099681A (ja) * | 2007-10-15 | 2009-05-07 | Shinko Electric Ind Co Ltd | 基板の個片化方法 |
| JP4475357B1 (ja) * | 2009-06-17 | 2010-06-09 | 住友電気工業株式会社 | Iii族窒化物半導体レーザ素子、及びiii族窒化物半導体レーザ素子を作製する方法 |
-
2011
- 2011-07-27 JP JP2011164402A patent/JP2011216914A/ja active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004235626A (ja) * | 2003-01-10 | 2004-08-19 | Toshiba Corp | 半導体装置の製造装置及びその製造方法 |
| JP2008543089A (ja) * | 2005-06-01 | 2008-11-27 | ザ リージェンツ オブ ザ ユニバーシティ オブ カリフォルニア | 半極性(Ga,Al,In,B)N薄膜、ヘテロ構造およびデバイスの成長と作製のための方法及び装置 |
| JP2008109066A (ja) * | 2006-09-29 | 2008-05-08 | Rohm Co Ltd | 発光素子 |
| JP2009099681A (ja) * | 2007-10-15 | 2009-05-07 | Shinko Electric Ind Co Ltd | 基板の個片化方法 |
| JP4475357B1 (ja) * | 2009-06-17 | 2010-06-09 | 住友電気工業株式会社 | Iii族窒化物半導体レーザ素子、及びiii族窒化物半導体レーザ素子を作製する方法 |
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