JP2011204975A - Component-mounting system and component-mounting method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a component-mounting system and a component-mounting method that prevent productivity from decreasing by eliminating the loss time generated as secular change correction processing on a component-mounting mechanism is executed.SOLUTION: Prior to the restart of mounting operation, at a start of production or after a self device M stops mounting operation for a preset predetermined time or longer, an operation remaining time Tr(t) needed to complete mounting operation executed at a present point (t) of time and a correction processing necessary time T2 needed to perform the secular change correction processing for correcting a drive error due to secular change are predicated and computed as processing start conditions to start executing the secular change correction processing, and the secular change correction processing begins to be executed, at such a timing that the operation remaining time Tr(t) transmitted from an upstream-side device M*, in real time, is longer than the time difference ΔT between the correction processing necessary time T2 and a substrate transfer time T1 of a substrate.

Description

  The present invention relates to a component mounting system for manufacturing a mounting board on which electronic components are mounted, and a component mounting method in the component mounting system.

  2. Description of the Related Art A component mounting system that manufactures a mounting substrate by mounting electronic components on a substrate is configured by connecting a plurality of devices such as a solder printing device, a component mounting device, and a reflow device. The board after solder printing is sequentially carried into a plurality of component mounting apparatuses connected to the downstream side, and becomes a target of component mounting work. The component mounting operation is performed by taking out a component from a component supply unit in which a plurality of parts feeders such as a tape feeder are arranged by a mounting head, and transporting and mounting the component on a predetermined mounting point of the substrate positioned and held on the substrate transport path. The component mounting mechanism for executing this component mounting operation is generally composed of a linear drive mechanism that moves the mounting head in the X direction and the Y direction, and the control unit controls the component mounting mechanism according to the mounting program created for each board type. By controlling the above, a predetermined component mounting operation is executed.

  With the recent miniaturization of electronic components, the mounting position accuracy required when mounting these components on a board has become much higher than before, which hinders the position accuracy in the operation process of the component mounting mechanism. It is required to eliminate as much as possible the factors that do this. As one of such factors, there is a position error due to a change with time of the linear motion drive mechanism constituting the component mounting mechanism. That is, in the process of continuously executing the component mounting operation by moving the mounting head, the temperature of the linear motion drive mechanism rises due to the frictional heat of the guide mechanism that slides at high speed. This causes thermal displacement due to thermal expansion of the components of the linear motion drive mechanism, and this thermal displacement causes an error in the positional accuracy of the mounting head.

  In order to correct the position accuracy error due to such thermal displacement and ensure the mounting position accuracy, the thermal displacement state due to the aging of the linear drive mechanism is detected at a predetermined timing and interval, and the mounting program only for the thermal displacement amount A temporal change correction process for correcting the above driving parameters is generally performed (see, for example, Patent Document 1). In the example shown in this patent document, a plurality of reference marks are provided at fixed positions such as a conveyor that conveys a substrate in a mounting machine, and these reference marks are imaged by a substrate recognition camera that moves integrally with the mounting head. To recognize. Then, by comparing the position recognition result with the position of the reference mark in the initial state, the state of thermal displacement of the component mounting mechanism at that time is detected and the drive parameter is corrected. Here, the reference mark is imaged in accordance with the timing when the substrate is carried in from the upstream device.

JP-A-8-18289

  In the current component mounting field, further improvement in mounting accuracy and productivity is desired, and the above-described temporal change correction processing is also required to be corrected more finely than in the past. For this reason, as a result of adopting a measure such as increasing the number of reference marks as compared with the conventional method, the time required for the temporal change correction process tends to increase. On the other hand, the time allotted to the transfer operation for loading the board tends to be shortened for speeding up, so the time-dependent correction process is not completed even when the board loading is completed, and the next mounting operation is not performed. This results in a loss time that cannot be started. Such a loss time occurs in all of a plurality of component mounting apparatuses constituting the component mounting system, and thus has been one of the factors that delay the total mounting work time. As described above, in the conventional component mounting system, there is a problem that a loss time is generated with the execution of the time-dependent correction process of the component mounting mechanism, and the productivity may be reduced.

  Therefore, an object of the present invention is to provide a component mounting system and a component mounting method that can eliminate a loss time caused by the execution of a process for correcting a change in a component mounting mechanism and prevent a decrease in productivity. .

  The component mounting system of the present invention is a component mounting system configured by connecting a plurality of component mounting apparatuses for mounting components on a board, and sequentially carrying the board into the component mounting apparatus and executing a predetermined component mounting operation. The component mounting apparatus includes: a board holding unit that is provided in a board transfer mechanism that transfers a board delivered from an upstream apparatus and holds and positions the board; and the presence / absence of the board at a predetermined position of the board transfer mechanism A component that supplies the component by moving a mounting head that holds the component by a head moving mechanism, a substrate detection unit that detects the substrate, a plurality of reference marks formed at fixed positions around the substrate holding unit A component mounting mechanism that takes out components from the supply unit by the mounting head and transfers and mounts the components on the substrate positioned and held by the substrate holding unit; and the mounting head integrated And a camera that images the substrate positioned and held by the substrate holding unit and the plurality of reference marks, and a position of the substrate and the plurality of reference marks is detected by recognizing an image acquired by the camera. A correction processing unit that compares the detected positions of the plurality of reference marks with the original positions of the reference marks stored in the storage unit, thereby correcting a drive error caused by a temporal change of the head moving mechanism; A time-dependent change correction process for correcting a drive error caused by a time-dependent change of the head moving mechanism by controlling a calculation processing unit that performs a correction calculation, and the head moving mechanism, camera, recognition processing unit, and calculation processing unit. A time-varying correction processing unit for executing the component mounting operation by controlling the component mounting mechanism in consideration of the result of the correction calculation. A mounting control unit; and a device information transmission unit that transmits device information indicating a state of the board in the device itself to another device that constitutes the component mounting system. Prior to resuming the mounting work operation after the device has stopped the mounting work operation for a predetermined time or more set in advance, the board of the upstream device indicated by the device information transmitted from the upstream device of the own device The state does not delay the start of the next board mounting operation in the device by the time-dependent correction process, and allows a time lag from the end of the time-dependent correction process to the start of the next board mounting operation. When the processing start condition set in advance as the minimum condition in the range is met, the execution of the time-dependent change correction process is started.

  The component mounting method of the present invention is a component mounting system configured by connecting a plurality of component mounting apparatuses for mounting components on a board, and sequentially carrying the board into the component mounting apparatus to execute a predetermined component mounting operation. A component mounting method, a substrate transport positioning step of transporting and positioning a substrate delivered from an upstream device by a substrate transport mechanism, and a substrate detection step of detecting the presence or absence of the substrate at a predetermined position of the substrate transport mechanism; An imaging operation for imaging a plurality of reference marks formed at fixed positions around the substrate holding unit by a camera that moves integrally with the mounting head, and the plurality of images obtained by recognizing images acquired by the camera Recognition processing for detecting the position of the reference mark, and the original position of the reference mark stored in the storage unit for the positions of the plurality of detected reference marks By comparing, a temporal change correction processing step for performing a temporal change correction process including a calculation process for performing a correction calculation for correcting a drive error due to a temporal change of the head moving mechanism, and the correction calculation result In addition, by controlling the component mounting mechanism, the mounting head that has taken out the component from the component supply unit that supplies the component is moved by the head moving mechanism, and the component is transferred to the substrate that is positioned and held by the substrate holding unit. A mounting control process for executing the mounting work operation to be mounted, and in the aging correction processing process, the mounting work operation after the start of production or after the self-device has stopped the mounting work operation for a predetermined time or more set in advance Prior to restarting, the state of the substrate in the upstream device is changed to the actual state of the next substrate in the own device by the aging correction process. If the start of the work operation is not delayed and the processing start condition set in advance as a condition for minimizing the time lag from the end of the time-dependent correction process to the start of the next board mounting work operation is possible. For example, the time-dependent change correction process is started.

  According to the present invention, as a process start condition for starting execution of a time-dependent correction process for correcting a drive error due to a time-dependent change of the head moving mechanism, at the start of production or at a predetermined time that is set by the device itself in advance Prior to resuming the mounting work operation after stopping the mounting work operation, the state of the board in the upstream device does not delay the start of the mounting work operation of the next board in the own device by the aging correction process and Loss time that accompanies the execution of the time-dependent correction process of the component mounting mechanism by setting in advance a condition that minimizes the time lag from the end of the time-dependent correction process to the start of the next board mounting operation. Can be eliminated to prevent a decrease in productivity.

Configuration explanatory diagram of a component mounting system according to an embodiment of the present invention Configuration explanatory diagram of an inspection / mounting apparatus in a component mounting system according to an embodiment of the present invention The top view of the component mounting apparatus in the component mounting system of one embodiment of this invention The block diagram which shows the structure of the control system of the mounting apparatus in the component mounting system of one embodiment of this invention The flowchart explaining the time-dependent change correction process performed at the time of the production start in the component mounting method of one embodiment of this invention The flowchart explaining the time-dependent change correction process performed at the time of a board | substrate waiting in the component mounting method of one embodiment of this invention A time chart for explaining the processing start condition of the aging correction process in the component mounting method according to the embodiment of the present invention

  Next, embodiments of the present invention will be described with reference to the drawings. First, a component mounting system 1 that manufactures a mounting board by mounting electronic components on a board will be described with reference to FIG. In FIG. 1, a component mounting system 1 includes a printing device M1, a board delivery device M2, an inspection / mounting device M3, component mounting devices M4, M5, an inspection / mounting device M6, a board delivery device M7, and a reflow device M8. Mainly a component mounting line that is connected in the board conveyance direction (X direction). Each device constituting the component mounting line is connected by the communication network 2 and controlled by the host device 3 having the function of a management computer.

  The printing apparatus M <b> 1 screen-prints a solder paste for component bonding on the component connection land of the substrate 4. The substrate delivery device M2 delivers the printed substrate 4 received from the printing device M1 to the downstream device at a predetermined timing (arrow a). The inspection / mounting apparatus M3, the component mounting apparatuses M4 and M5, and the inspection / mounting apparatus M6 are all provided on both sides of the board transfer mechanism 6 (see FIG. 2) for transferring the board 4 in the board transfer direction. It has a configuration in which a work operation mechanism such as is arranged.

  The inspection / mounting apparatus M3 includes an inspection apparatus M3A and a component mounting apparatus M3B as work operation mechanisms. The inspection apparatus M3A images the printed board 4 and inspects the solder printing state. The component mounting apparatus M3B mounts components on the board 4 after the solder printing inspection. Each of the component mounting apparatuses M4 and M5 includes two component mounting apparatuses M4A and M4B and component mounting apparatuses M5A and M5B that can perform work operations independently, and components are sequentially applied to the substrate 4 by these component mounting apparatuses. Implement. The inspection / mounting apparatus M6 includes an inspection apparatus M6A and a component mounting apparatus M6B. The component mounting apparatus M6B mounts components on the board 4, and the inspection apparatus M6A finishes the component mounting work by each upstream component mounting apparatus. The mounted substrate 4 is imaged and the mounting state is inspected. The inspected substrate 4 is carried into the reflow device M8 via the substrate transfer device M7 (arrow b), and the solder is melted and solidified by heating here, and the component is soldered to the substrate 4. That is, the component mounting system 1 is configured by connecting a plurality of component mounting apparatuses for mounting components on the board 4, and sequentially carries the board 4 into the component mounting apparatus and executes a predetermined component mounting operation.

  Next, the structure of the inspection / mounting apparatuses M3 and M6 will be described with reference to FIG. In FIG. 2, a substrate transport mechanism 6 having two transport rails is disposed in the X direction at the center of the base 5. The substrate transport mechanism 6 transports the substrate 4 loaded from the upstream device to the downstream side. The substrate transport mechanism is provided with a substrate holder 6a and a substrate detector 6b. The substrate holder 6a positions and holds the substrate 4 transported by the substrate transport mechanism 6 at a working position in the apparatus. The substrate detection unit 6 b detects the presence or absence of the substrate 4 at a predetermined position of the substrate transport mechanism 6 using an optical sensor. Then, a predetermined work operation is executed by the inspection device M3A, the component mounting device M3B, the inspection device M6A, and the component mounting device M6B on the substrate 4 positioned and held by the substrate holding portion 6a of each substrate transport mechanism 6.

  In the component mounting apparatuses M3B and M6B, a component supply unit 7 is disposed, and a carriage 19 having a plurality of tape feeders 8 mounted in parallel is disposed in the component supply unit 7. The tape feeder 8 supplies a component to a pickup position by a component mounting portion described below by pulling out and feeding a carrier tape holding the component from a tape supply reel 19a set on the carriage 19.

  A Y-axis moving table 9 having a linear motion mechanism using a linear motor is disposed in the Y direction at one end of the base 5 in the X direction. Similarly, on the Y-axis moving table 9, a front X-axis moving table 10A and a rear X-axis moving table 10B having linear motion mechanisms using linear motors are mounted so as to extend in the X direction and move freely in the Y direction. Yes. The front X-axis movement table 10A and the rear X-axis movement table 10B correspond to the inspection apparatus M3A, the component mounting apparatus M3B, the inspection apparatus M6A, and the component mounting apparatus M6B, respectively.

  A mounting head 15 having a plurality of unit mounting heads 16 is mounted on the rear X-axis moving table 10B so as to be movable in the X direction. Further, on the lower surface side of the rear X-axis moving table 10B, a mounting head is mounted. A board camera 17 for board imaging that moves integrally with the board 15 is disposed. An imaging head 11 having an inspection camera 12 is mounted on the front X-axis moving table 10A so as to be movable in the X direction. The inspection apparatus M3A, M6A is equipped with a carriage 13 having a built-in image recognition unit 14.

  The operation of the component mounting apparatuses M3B and M6B will be described. By driving the Y-axis moving table 9 and the rear X-axis moving table 10B, the mounting head 15 moves horizontally in the X direction and the Y direction, and thereby the suction nozzle 16a mounted on the lower end portion of the unit mounting head 16. The component is taken out from the tape feeder 8 of the component supply unit 7 and mounted on the substrate 4 positioned and held by the substrate transport mechanism 6. The Y-axis movement table 9, the rear X-axis movement table 10 B, and the mounting head 15 take out components from the component supply unit 7 by the mounting head 15, and transfer and mount them on the mounting position of the substrate 4 that is positioned and held by the substrate transport mechanism 6. A component mounting mechanism is configured. Then, by moving the substrate camera 17 integrally with the mounting head 15, the substrate camera 17 moves above the substrate 4 and images the substrate 4. And the recognition mark provided in the board | substrate 4 and the component mounting position are recognized by recognizing the image acquired by imaging.

  A component camera 18 is disposed on the moving path of the mounting head 15 between the component supply unit 7 and the substrate transport mechanism 6. The mounting head 15 holding the component by the suction nozzle 16 a moves in the X direction above the component camera 18, thereby imaging the component held by the mounting head 15 by the component camera 18. And the positional information which shows the position shift from the normal position of components is acquired by carrying out the recognition process of the image acquired by imaging. In the component mounting operation on the board 4, the mounting position is corrected based on the position information.

  The operation of the inspection apparatuses M3A and M6A will be described. By driving the Y-axis movement table 9 and the front X-axis movement table 10A, the imaging head 11 moves horizontally in the X direction and the Y direction. As a result, the inspection apparatuses M3A and M6A image the inspection range to be inspected on the substrate 4 positioned and held by the substrate transport mechanism 6 by the inspection camera 12 before and after the component mounting, respectively. get.

  Next, the configuration of the component mounting apparatuses M4 and M5 will be described with reference to FIG. Each of the component mounting apparatuses M4 and M5 has a configuration in which two component mounting apparatuses M4A and M4B and component mounting apparatuses M5A and M5B that can work independently are disposed opposite to each other with the substrate transport mechanism 6 interposed therebetween. The structure of the component mounting apparatuses M4A, M4B, M5A, and M5B is the same as that of the component mounting apparatuses M3B and M6B shown in FIG. In FIG. 3, a Y-axis movement table 9 and a front-side X-axis movement table 10A constitute a front-side head movement mechanism that moves the mounting head 15 in the horizontal direction. The Y-axis movement table 9 and the rear-side X-axis movement table 10B A rear head moving mechanism for moving the mounting head 15 in the horizontal direction is configured.

  The drive shaft motor that drives these head moving mechanisms includes an encoder 21, and the shaft position of each drive shaft can be transmitted to the control device 20 by a feedback pulse signal from the encoder 21. The head moving mechanism and the mounting head 15 are such that the component is taken out from the component supply unit 7 by the mounting head 15 by moving the mounting head 15 holding the component by the head moving mechanism, and is positioned and held in the substrate holding unit 6a. 4 constitutes a component mounting mechanism to be transported and mounted.

  On the upper surface of the base 5, the position of the reference mark m for position calibration of the mounting head 15 is fixed with respect to the base 5 around each diagonal position of the substrate 4 held by the substrate holder 6 a. Is formed. By moving the substrate camera 17 integrally with the mounting head 15, the substrate camera 17 can be moved above the plurality of reference marks m and the reference marks m can be imaged. That is, the substrate camera 17 moves integrally with the mounting head 15 and images the substrate 4 and the plurality of reference marks m that are positioned and held by the substrate holding portion 6a.

  The recognition processing unit 22 (see FIG. 4) performs recognition processing on the imaging result, thereby detecting the position of the reference mark m at the time of imaging. Then, by comparing this position detection result with the original position stored in advance, it is possible to detect a drive error caused by a change with time of the drive state of the mounting head 15 by the head moving mechanism. That is, by comparing the feedback pulse value from the encoder 21 with the position error of the reference mark m, the drive error at that time is detected.

  Next, the configuration of the control system will be described with reference to FIG. In FIG. 4, the control device 20 includes an arithmetic processing unit 20a as an internal control function, a aging correction processing unit 20b, a mounting control unit 20c, and a device information transmission unit 20d. The control device 20 includes a substrate transport mechanism 6, a substrate holding unit 6a, a substrate detection unit 6b, a Y-axis movement table 9, a front head movement mechanism including a front X-axis movement table 10A, a Y-axis movement table 9, and a rear X-axis. It is connected to the rear head moving mechanism consisting of the moving table 10B, the component supply unit 7, the nozzle suction mechanism 15a, the nozzle drive mechanism 15b, the recognition processing unit 22, the storage unit 23, and the communication unit 24, and operates each mechanism and each unit. A command is transmitted and a detection signal and a processing result from each part are received.

  The nozzle suction mechanism 15 a and the nozzle drive mechanism 15 b perform a suction operation and a lifting operation by the suction nozzle 16 a mounted on the mounting head 15. The recognition processing unit 22 performs recognition processing on images acquired by the board camera 17 and the component camera 18. Thereby, the positions of the substrate 4 and the plurality of reference marks m are detected, and the components held by the mounting head 15 are recognized. The storage unit 23 stores programs and data necessary for executing component mounting work and aging correction processing by the apparatus. These data include data indicating the original position of the reference mark m formed for the position calibration of the mounting head 15. The communication unit 24 transmits and receives control command signals and data to and from other devices constituting the component mounting system 1 via the communication network 2.

  A control function of the control device 20 will be described. The arithmetic processing unit 20a compares the positions of the plurality of reference marks m detected by the recognition processing unit 22 with the original positions of the reference marks m stored in the storage unit 23, whereby the Y-axis movement table 9 and the front X A correction calculation is performed to correct a drive error caused by a change with time of the head moving mechanism including the axis moving table 10A and the rear X-axis moving table 10B. The temporal change correction processing unit 20b controls the above-described head moving mechanism, the substrate camera 17, the recognition processing unit 22, and the arithmetic processing unit 20a to execute a temporal change correction process for correcting the above-described drive error. have. The temporal change correction processing unit 20b predicts and calculates the remaining work time Tr (t) required to complete the mounting work operation being performed at that time and the correction processing required time T2 required to execute the temporal change correction process. A time calculation function is provided (see FIG. 7).

  Further, the temporal change correction processing unit 20b performs processing for monitoring the presence / absence of a substrate in the upstream device based on the detection result indicated by the device information detected by the substrate detection unit 6b of the upstream device and transmitted to the own device. The mounting control unit 20c performs the component mounting operation by controlling the component mounting mechanism having the above-described configuration in consideration of the result of the correction calculation by the aging correction processing unit 20b. The device information transmission unit 20d transmits the device information indicating the state of the substrate 4 in the own device to other devices constituting the component mounting system 1 via the communication unit 24.

  Next, referring to FIG. 5 and FIG. 6, the time-dependent correction process required in the component mounting method in which the component mounting system 1 sequentially carries the board 4 into the component mounting apparatus and executes a predetermined component mounting operation. The execution timing will be described. This temporal change correction process is executed by the processing function of the temporal change correction processing unit 20b for the purpose of correcting a drive error caused by thermal displacement due to heat generation such as a moving table of the head moving mechanism. Here, an example is shown that is executed prior to resuming the mounting work operation after temporarily stopping the mounting work operation for a predetermined time or more at the start of production or during production continuation.

  With reference to FIG. 5, a description will be given of the temporal change correction process executed at the start of production. When starting production in the own device, first, upstream device information transmitted from the upstream device is acquired (ST1). Next, it is determined whether the acquired upstream device information matches a processing start condition described later (ST2). Here, if the processing start condition is not met, the process returns to (ST1) to continue monitoring the upstream device information. If it is determined in (ST2) that the processing start condition is met, it is determined whether or not a predetermined time has elapsed since the end of the previous production (ST3). Here, the predetermined time is a time when it is assumed that a change in mounting position accuracy over time due to continued apparatus stoppage exceeds an allowable level, such as mounting accuracy required for the board type to be produced. Are set individually and stored in the storage unit 23.

  Here, when the predetermined time has elapsed, it is determined that the temporal change of the mounting position accuracy exceeds the allowable level, and the temporal change correction process is executed (ST4). That is, an imaging operation for imaging a plurality of reference marks m formed at fixed positions around the substrate holding unit 6a by the substrate camera 17 that moves integrally with the mounting head 15 and an image acquired by the substrate camera 17 are recognized. A recognition process for detecting the positions of a plurality of reference marks m by processing, and a head movement by comparing the positions of the detected plurality of reference marks m with the original positions of the reference marks m stored in the storage unit 23. A temporal change correction process including a calculation process for performing a correction calculation for correcting a drive error due to a temporal change of the mechanism is executed (a temporal change correction process step).

  If the predetermined time has not elapsed in (ST3), it is determined that the change in mounting position accuracy due to the stop of the apparatus is within an allowable range, and the standby process is performed without executing the change with time change process. After completion (ST5), substrate loading is performed (ST6). Thereafter, the component mounting operation is repeatedly executed by the component mounting mechanism of the device itself for the board 4 that is sequentially loaded.

  Next, with reference to FIG. 6, a processing flow in the case where the time-dependent correction process is executed prior to the resumption of the mounting work operation after the own apparatus has stopped the mounting work operation for a predetermined time or more set in advance will be described. To do. This process is started by loading the substrate 4 into the apparatus shown in (ST6) in FIG. That is, after the substrate carrying in (ST11) for carrying and positioning the substrate 4 delivered from the upstream apparatus by the substrate carrying mechanism 6, the presence or absence of the substrate 4 at a predetermined position of the substrate carrying mechanism 6 is detected by the substrate detecting unit 6b. Detected. Thereafter, a component mounting operation is performed on the board 4 in which the presence of the board is detected (ST12). Next, it is determined whether or not the component mounting operation is completed (ST13), and after completion, the board 4 after mounting is carried out (ST14). Thereafter, it is determined whether the next target board can be carried in (ST15). If it can be carried in, the process returns to ST11, and the subsequent work process is repeated in the same manner.

  In (ST15), if it is determined that the next substrate cannot be loaded due to some cause such as a device trouble, the operation shifts to the substrate waiting stop (ST16) and the own device stops operating, and the measurement of the stop time is started ( (ST17) Further, upstream device information is acquired (ST18). Next, as in the example shown in FIG. 5, it is determined whether or not the acquired upstream device information matches a processing start condition described later (ST19). Here, if the processing start condition is not met, the process returns to (ST18) to continue monitoring the upstream device information. If it is determined in (ST19) that the processing start condition is met, it is determined whether or not a predetermined time has elapsed since the substrate waiting stop (ST20). This predetermined time has the same meaning as the predetermined time in the example shown in FIG.

  Here, when the predetermined time has elapsed, it is determined that the temporal change of the mounting position accuracy exceeds the allowable level, and the temporal change correction process similar to (ST4) in FIG. 5 is executed. (ST21). If the predetermined time has not elapsed in (ST20), it is determined that the change in mounting position accuracy due to the stop of the apparatus is within an allowable range, and the standby operation is performed without executing the change with time change processing. After completion (ST22), the process returns to (ST11). Thereafter, the component mounting operation is repeatedly executed by the component mounting mechanism of the device itself for the board 4 that is sequentially loaded.

  That is, in the component mounting method described above, the substrate transport positioning step for transporting and positioning the substrate 4 delivered from the upstream device by the substrate transport mechanism 6 and the substrate detection for detecting the presence or absence of the substrate 4 at a predetermined position of the substrate transport mechanism 6. The mounting head 15 that has taken out components from the component supply unit 7 is controlled by controlling the component mounting mechanism in consideration of the process, the temporal change correction processing steps shown in the above (ST4) and (ST21), and the correction calculation result. And a mounting control step of executing a mounting operation for moving and mounting the component onto the substrate 4 positioned and held by the substrate holding portion 6a.

  Then, in the temporal change correction processing step, the process start conditions described below were met at the start of production or prior to resuming the mounting work operation after the own device stopped the mounting work operation for a predetermined time or more. Then, the temporal change correction process is started. Here, processing start conditions referred to in (ST2) in FIG. 5 and (ST19) in FIG. 6 will be described. In the present embodiment, the processing start condition is that the state of the substrate 4 in the upstream device indicated in the device information transmitted from the upstream device of the own device is changed to the next substrate 4 in the own device by the time-dependent correction process. It is set in advance as a condition that does not delay the start of the mounting work operation and minimizes the time lag from the end of the time-dependent change correction process to the start of the mounting operation of the next substrate 4 as much as possible.

  By complying with the process start conditions set in this way, even when the aging change correction process is executed, the mounting work operation of the board 4 carried into the own apparatus after completion of the component mounting work in the upstream apparatus is completed. No time loss due to delayed start. In addition, by minimizing the above-mentioned time lag as much as possible, it is possible to minimize the degree of aging that occurs after the aging correction until the actual component mounting operation, and more precise aging correction accuracy Can be secured.

  In the present embodiment, the processing start condition is selected and set from the two conditions described below. FIG. 7 shows processing start conditions for the temporal change correction process when a specific component mounting apparatus is the self apparatus M in a plurality of component mounting apparatuses constituting the component mounting system 1. In FIG. 7, the own device M has been stopped for a predetermined time or more, and is in a state that requires a aging correction process prior to restarting the mounting operation.

  First, in the upstream apparatus M *, the loading of the substrate 4 from the further upstream apparatus is started at timing t1, and the substrate detection unit 6b detects the substrate 4 at timing t2 in the middle of loading. Then, the component mounting work for the board 4 is started at the timing t3, and the component mounting work by the upstream device M * is completed at the timing t4. In the figure, a vertical line L indicated by a broken line indicates a current time point t in the passage of time traveling in the direction of the broken line arrow, and a time Tr (t) from the current time point t to timing t4 is executed at the current time point t. The remaining work time required for completing the mounting operation is shown.

  The board 4 for which the component mounting operation has been completed at the timing t4 is carried out by the upstream apparatus M *, delivered to the own apparatus M at the timing t5, and then loaded into the board holding part 6a for holding the board. Is called. At timing t6, the mounting operation for the substrate 4 by the apparatus M is started. At this time, the own apparatus M needs the aging correction process before resuming the mounting operation. However, in order not to delay the mounting work in the own apparatus M, the aging change correction process is completed before the timing t6. It is desirable. Furthermore, in order to ensure the correction accuracy of the time-dependent correction, it is desirable to start the mounting operation without leaving an excessive time lag after completion of the time-dependent correction processing.

  In order to satisfy such a condition, in this embodiment, the time-dependent correction processing unit 20b calculates in real time the remaining work time Tr (t) required to complete the mounting work operation executed at the current time point t. In addition, a time calculation function for predicting and calculating the correction processing time T2 required for executing the aging correction process according to the quality grade of the component mounting work for the product type is provided. In the prediction calculation of the correction processing required time T2, the moving time of the mounting head 15 for imaging is calculated according to the number of reference marks m to be imaged.

  Then, the substrate transport time T1 for the substrate 4 that is known in advance, that is, the time for unloading the substrate 4 for which the mounting operation has been completed in the upstream device M *, and the transferred substrate 4 in the own device M A time difference ΔT between a time T1 (a time from timing t4 to timing t6) that is added to the time for carrying in the substrate and a correction processing required time T2 is obtained, and the remaining time Tr (t ) And the processing start condition is set so that the execution of the time-dependent change correction processing is started at the timing when the remaining work time Tr (t) becomes longer than the time difference ΔT.

  Specifically, an allowance time Ta that is allowed as a time lag from the completion of the aging correction process to the start of the next component mounting operation is set in advance, and the remaining work time Tr (t) is set to the time difference ΔT. Execution of the temporal change correction process is started at a timing coincident with the time when Ta is added. The allowance time Ta is determined as appropriate by evaluating the prediction accuracy of the time calculation function by the temporal change correction processing unit 20b and considering the evaluation result. Substrate transport time T1, correction processing time T2, and margin time Ta are prepared in advance for each substrate type and stored in the storage unit 23.

  As a result, even if a correction processing time T2 longer than the substrate transport time T1 is required due to the use of a position calibration method using more reference marks m than in the past, the upstream side The time-dependent correction process can be terminated at a timing retroactive by a margin time Ta from the timing t6 at which the substrate transfer operation for loading the substrate 4 that has been mounted by the device M * into the own device M is completed. It is possible to eliminate a loss time caused by the execution of the change correction process and prevent a decrease in productivity.

  In the above-described embodiment, an example is shown in which the temporal change correction processing unit 20b is provided with a time calculation function that performs real-time calculation of the remaining work time Tr (t) and prediction calculation of the correction processing required time T2. However, when such a time calculation function is not provided, as described below, the temporal change correction process is executed at timing t2 when the substrate detection unit 6b detects the substrate 4 in the upstream apparatus M *. Processing start conditions may be set to start. That is, in this case, the temporal change correction processing unit 20b indicates the presence / absence of the substrate 4 in the upstream device M * in the device information detected by the substrate detection unit 6b of the upstream device M * and transmitted to the own device M. Monitoring is performed according to the detection result.

  Then, the processing start condition is set so that the execution of the temporal change correction processing is started at the timing t2 when the upstream apparatus M * detects the presence of the substrate. In this case, the aging correction process starts at a timing somewhat earlier than the timing of the aging correction process determined based on the real-time time calculation result as described above. Loss time caused by the execution of the change correction process can be eliminated.

  The component mounting system and the component mounting method of the present invention have the effect of eliminating the loss time caused by the execution of the time-dependent correction process of the component mounting mechanism and preventing a reduction in productivity. This is useful in the field of component mounting in which components are mounted to manufacture a mounting board.

DESCRIPTION OF SYMBOLS 1 Component mounting system 4 Board | substrate 6 Board | substrate conveyance mechanism 6a Board | substrate holding | maintenance part 6b Board | substrate detection part 7 Component supply part 9 Y axis movement table 10A Front side X axis movement table 10B Rear side X axis movement table 15 Mounting head 17 Board camera m Reference mark M4 , M5 Component mounting device M Own device M * Upstream device T1 Board transfer time T2 Time required for correction processing Tr (t) Remaining work time ΔT Time difference

Claims (6)

A component mounting system configured by connecting a plurality of component mounting apparatuses for mounting components on a board, sequentially carrying the board into the component mounting apparatus and executing a predetermined component mounting operation,
The component mounting apparatus detects a presence / absence of the board at a predetermined position of the board transport mechanism provided in a board transport mechanism that transports a board delivered from an upstream apparatus and positions and holds the board. A plurality of reference marks formed at fixed positions around the substrate detection unit and the substrate holding unit;
A component mounting mechanism that moves a mounting head that holds the component by a head moving mechanism to take out the component from the component supply unit that supplies the component by the mounting head and transfer and mount it on the substrate that is positioned and held by the substrate holding unit When,
A substrate that moves integrally with the mounting head and is positioned and held by the substrate holding unit and a camera that captures the plurality of reference marks, and the substrate and the plurality of references that are obtained by recognizing an image acquired by the camera. A recognition processing unit for detecting the position of the mark;
An operation for performing a correction operation for correcting a drive error caused by a change with time of the head moving mechanism by comparing the detected positions of the plurality of reference marks with the original positions of the reference marks stored in the storage unit. A time-dependent change process for executing a temporal change correction process for correcting a drive error caused by a time-dependent change of the head moving mechanism by controlling the processing unit and the head moving mechanism, the camera, the recognition processing unit, and the arithmetic processing unit. A component processing system including a correction processing unit, a mounting control unit that executes a component mounting operation by controlling the component mounting mechanism in consideration of the result of the correction calculation, and device information indicating the state of the board in the device itself A device information transmission unit for transmitting to other devices constituting
The aging correction processing unit is transmitted from the upstream device of the own device prior to restarting the mounting work operation at the start of production or after the own device stops the mounting work operation for a predetermined time or more set in advance. The state of the board in the upstream apparatus indicated in the apparatus information does not delay the start of the next board mounting operation in the own apparatus by the time-dependent correction process, and the next time from the end of the time-dependent correction process. Component mounting characterized in that execution of the aging correction process is started when a processing start condition set in advance as a condition for minimizing a time lag until the start of a substrate mounting operation is possible. system. The temporal change correction processing unit includes a time calculation function for predicting and calculating a remaining work time required until completion of the mounting work operation being performed at that time and a correction processing time required for execution of the temporal change correction process,
The processing start condition is that the remaining work in the upstream apparatus is indicated by the apparatus information transmitted from the upstream apparatus rather than the time difference between the correction processing required time and the substrate transport time of the substrate by the substrate transport mechanism. The component mounting system according to claim 1, wherein the component mounting system is set to start execution of the aging correction process at a timing when the time becomes longer. The temporal change correction processing unit monitors the presence / absence of a substrate in the upstream device by a detection result indicated by device information detected by the substrate detection unit of the upstream device and transmitted to the device itself,
2. The component mounting system according to claim 1, wherein the process start condition is set to start execution of the time-dependent correction process at a timing when the presence of the board is detected in an upstream apparatus. A component mounting method in a component mounting system configured by connecting a plurality of component mounting devices for mounting components on a substrate, sequentially carrying the substrate into the component mounting device and executing a predetermined component mounting operation,
A substrate transport positioning step of transporting and positioning a substrate delivered from the upstream device by a substrate transport mechanism; a substrate detection step of detecting the presence or absence of the substrate at a predetermined position of the substrate transport mechanism;
An imaging operation for imaging a plurality of reference marks formed at fixed positions around the substrate holding unit by a camera that moves integrally with the mounting head, and the plurality of images obtained by recognizing images acquired by the camera A recognition process for detecting the position of the reference mark and a comparison of the positions of the plurality of detected reference marks with the original positions of the reference marks stored in the storage unit result in a change with time of the head moving mechanism. A temporal change correction processing step for executing a temporal change correction process including a calculation process for performing a correction calculation for correcting a drive error;
By controlling the component mounting mechanism in consideration of the correction calculation result, the mounting head that has picked up the component from the component supply unit that supplies the component is moved by the head moving mechanism, and the component is positioned and held on the substrate holding unit. A mounting control step for executing a mounting work operation to be transferred and mounted on the printed circuit board,
In the aging correction processing step, prior to resuming the mounting work operation at the start of production or after the own apparatus stops the mounting work operation for a predetermined time or more, the state of the substrate in the upstream device is The time change correction process does not delay the start of the next substrate mounting operation in the apparatus and minimizes the time lag from the end of the time change correction process to the start of the next substrate mounting operation. A component mounting method, comprising: starting the aging correction process when a process start condition set in advance as a condition is met. In the time-dependent correction processing step, the remaining work time required to complete the mounting work operation being performed at that time and the time required for correction processing required to execute the time-dependent correction processing are predicted and calculated.
The processing start is set such that the remaining work time in the upstream device transmitted from the upstream device is longer than the time difference between the correction processing time and the substrate transport time of the substrate by the substrate transport mechanism. 5. The component mounting method according to claim 4, wherein execution of the aging correction process is started at a timing that matches a condition. In the temporal change correction processing step, the presence or absence of the substrate in the upstream device is monitored by the detection result indicated by the device information detected by the substrate detection unit of the upstream device and transmitted to the device,
5. The component according to claim 4, wherein execution of the temporal change correction processing is started at a timing that matches the processing start condition set on the condition that the presence of the substrate is detected in an upstream device. Implementation method.

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