JP7042392B2 - Mounting board manufacturing system and mounting board manufacturing method - Google Patents

Description

The present invention relates to a mounting board manufacturing system and a mounting board manufacturing method for manufacturing a mounting board in which components are mounted on the board.

The mounting board manufacturing system includes a component mounting line in which a plurality of component mounting devices for mounting electronic components on a board are connected. In each component mounting device, the component mounting operation of mounting the components taken out from the component supply unit on the board by the component mounting mechanism is repeatedly executed. The mounting position accuracy in such a component mounting operation is not constant, and varies with time due to various factors such as changes over time with the passage of operating time, for example, thermal deformation of the beam that moves the mounting head in the component mounting mechanism over time. In order to prevent deterioration of mounting position accuracy due to such fluctuation factors, correction data that reflects the tendency of component misalignment obtained from the inspection results of the inspection device installed on the component mounting line is applied to each component mounting device. A component mounting device having a function of feeding back and correcting a component mounting position is known (see, for example, Patent Document 1).

Japanese Unexamined Patent Publication No. 2016-58603

However, in the prior art including the above-mentioned prior art example, there is a disadvantage that the mounting position accuracy is lowered when the operation is restarted after a certain period of time has passed after the continuous production is stopped. That is, the correction value in the above-mentioned feedback includes a time-varying component caused by the temperature rise of each part of the mechanism with the passage of the operating time. However, after the production is stopped, the temperature of each part of the mechanism drops and returns to the cooling state. Therefore, if the correction value at the time of the production stop is applied as it is, the component mounting position is not corrected correctly and the mounting position accuracy is lowered. As described above, in the prior art, there is a problem that the mounting position accuracy is deteriorated when the operation is restarted after the continuous production is stopped in the configuration in which the correction data reflecting the misalignment tendency of the parts is fed back.

Therefore, an object of the present invention is to provide a mounting board manufacturing system and a mounting board manufacturing method capable of suppressing a decrease in mounting position accuracy when restarting operation after stopping continuous production.

In the mounting board manufacturing system of the present invention, a mounting head having a holder for holding a component and mounting the component on the board, and the mounting head at a target position for mounting the component held by the holder at the component mounting position on the board. A component mounting section having a mounting head moving section for moving the component, a state detecting section that detects the state of the component mounting section and outputs numerical data indicating the state, and a substrate on which the component is mounted by the component mounting section. A new inspection is performed by calculating a correction value for correcting the target position using the inspection unit that inspects the mounting position of the component mounted on the substrate by imaging the image and the inspection result obtained by the inspection unit. A correction value calculation unit that updates the correction value using the new inspection result when a result is obtained, a target position calculation unit that calculates the target position using the correction value, and a component mounting unit. When the operation is restarted after the operation is stopped and the parts are mounted by the component mounting unit, the latest correction value usage determination unit for determining whether or not the latest correction value used immediately before the operation is stopped is used. When the latest correction value use determination unit determines that the latest correction value cannot be used, the correction value change unit for changing the latest correction value to a correction value having a different value is provided , and the correction value is changed. The unit compares the current numerical data obtained by the state detection unit with the past numerical data stored in advance at the time of restarting the operation, and the time when the same or similar numerical data as the current numerical data is obtained. At least one past correction value used in is selected, and the latest correction value is changed to a correction value obtained based on the selected one past correction value or a plurality of past correction values .

In the mounting board manufacturing system of the present invention, a mounting head having a holder for holding a component and mounting the component on the board, and the mounting head at a target position for mounting the component held by the holder at the component mounting position on the board. A component mounting section having a mounting head moving section for moving the component, a state detecting section that detects the state of the component mounting section and outputs numerical data indicating the state, and a substrate on which the component is mounted by the component mounting section. A new inspection is performed by calculating a correction value for correcting the target position using the inspection unit that inspects the mounting position of the component mounted on the substrate by imaging the image and the inspection result obtained by the inspection unit. A correction value calculation unit that updates the correction value using the new inspection result when a result is obtained, a target position calculation unit that calculates the target position using the correction value, and a component mounting unit. When the operation is restarted after the operation is stopped and the parts are mounted by the component mounting unit, the latest correction value usage determination unit for determining whether or not the latest correction value used immediately before the operation is stopped is used. If the latest correction value use determination unit determines that the latest correction value cannot be used, the correction value change request unit that requests the operator of the component mounting unit to change the correction value is provided . If, as a result of the request by the value change request unit, there is an input to approve the change of the correction value, the current numerical data obtained by the state detection unit and the past numerical data stored in advance at the time of restarting the operation are received. Select at least one past correction value that was used at the time when the same or similar numerical data as the current numerical data was obtained, and select the latest correction value. Change to the correction value obtained based on the correction value or multiple past correction values .
In the mounting board manufacturing system of the present invention, a mounting head having a holder for holding a component and mounting the component on the board, and the mounting head at a target position for mounting the component held by the holder at the component mounting position on the board. A component mounting section having a mounting head moving section for moving the component, a state detecting section that detects the state of the component mounting section and outputs numerical data indicating the state, and a substrate on which the component is mounted by the component mounting section. A new inspection is performed by calculating a correction value for correcting the target position using the inspection unit that inspects the mounting position of the component mounted on the substrate by imaging the image and the inspection result obtained by the inspection unit. A correction value calculation unit that updates the correction value using the new inspection result when a result is obtained, a target position calculation unit that calculates the target position using the correction value, and a component mounting unit. When the operation is restarted after the operation is stopped and the parts are mounted by the component mounting unit, the current numerical data obtained by the state detection unit at the time of restarting the operation and the past numerical data stored in advance are used. By comparison, select at least one past correction value that was used when the same or similar numerical data as the current numerical data was obtained, and select the correction value that was used before stopping the operation. It is provided with a correction value changing unit for changing to a correction value obtained based on one past correction value or a plurality of past correction values.

In the mounting board manufacturing method of the present invention, a mounting head having a holder for holding a component and mounting the component on the board, and the mounting head at a target position for mounting the component held by the holder at a component mounting position on the board. By the component mounting section having the mounting head moving section, the component mounting process of mounting the component on the board and the mounting of the component mounted on the board by imaging the board on which the component is mounted in the component mounting process. The inspection process for inspecting the position and the correction value for correcting the target position are calculated using the inspection result obtained in the inspection process, and when a new inspection result is obtained, the new inspection result is used. A correction value calculation process for updating the correction value by using the correction value, a target position calculation process for calculating the target position using the correction value, and a restart of the operation after stopping the operation in the component mounting process are performed again. When executing the component mounting process, the latest correction value usage determination process for determining whether or not the latest correction value used immediately before stopping the operation is executed is executed, and if it is determined that the latest correction value cannot be used, the above-mentioned Numerical data indicating the state by executing a state detection step of detecting the state of the component mounting portion in the component mounting process, including a correction value changing step of changing the latest correction value to a correction value having a different value. Is output, the output past numerical data is stored, and in the correction value changing step, the current numerical data obtained in the state detection step at the time of restarting the operation and the past numerical data stored in advance are stored. By comparison, at least one past correction value that was used at the time when the numerical data equal to or similar to the current numerical data was obtained was selected, and the latest correction value was selected. Alternatively, the correction value is changed to a correction value obtained based on a plurality of past correction values .
In the mounting board manufacturing method of the present invention, a mounting head having a holder for holding a component and mounting the component on the board, and the mounting head at a target position for mounting the component held by the holder at a component mounting position on the board. A component mounting process for mounting the component on a board by a component mounting section having a mounting head moving section for moving the component, and a state detection step for detecting the state of the component mounting section and outputting numerical data indicating the state. , The inspection process of inspecting the mounting position of the component mounted on the board by imaging the board on which the component is mounted by the component mounting process, and the inspection result obtained in the inspection process are used to correct the target position. When a new inspection result is obtained, the correction value calculation process for updating the correction value using the new inspection result and the target position using the correction value are obtained. In the case of the target position calculation process to be calculated and the case where the operation is restarted after the component mounting unit has stopped the operation and the component mounting is performed by the component mounting unit, the current numerical value obtained in the state detection process at the time of restarting the operation is performed. The data is compared with the past numerical data stored in advance, and at least one past correction value used at the time when the numerical data equal to or similar to the current numerical data is obtained is selected and the operation is performed. It includes a correction value changing step of changing a correction value used before stopping to a selected correction value in the past or a correction value obtained based on a plurality of past correction values.

According to the present invention, it is possible to suppress a decrease in mounting position accuracy when restarting operation after stopping continuous production.

A block diagram showing a configuration of a mounting board manufacturing system according to an embodiment of the present invention. Top view of the component mounting apparatus in the mounting board manufacturing system according to the embodiment of the present invention. Explanatory drawing of state detection of change with time by component mounting apparatus in mounting board manufacturing system of one Embodiment of this invention Explanatory drawing of mounting position inspection by inspection apparatus in mounting board manufacturing system of one Embodiment of this invention A block diagram showing a configuration of a control system of a component mounting device in a mounting board manufacturing system according to an embodiment of the present invention. A block diagram showing a configuration of an information processing apparatus in a mounting board manufacturing system according to an embodiment of the present invention. Explanatory drawing of the setting screen regarding the correction value at the time of restarting operation in the mounting board manufacturing system of one Embodiment of this invention. The flow diagram which shows the component mounting operation in the mounting board manufacturing system of one Embodiment of this invention. A flow chart showing a process at the time of restarting the operation in the mounting board manufacturing system according to the embodiment of the present invention according to the embodiment of the present invention.

Next, an embodiment of the present invention will be described with reference to the drawings. First, with reference to FIG. 1, a configuration of a mounting board manufacturing system 1 having a function of mounting electronic components on a board to manufacture a mounting board will be described. In FIG. 1, the mounting board manufacturing system 1 is configured by connecting a board supply device M1, a solder printing device M2, a component mounting device M3, M4, M5, an inspection device M6, a reflow device M7, and a mounting board recovery device M8 in series. Has been done. Each device is connected by a board transfer conveyor, and the boards supplied by the board supply device M1 on the upstream side (left side in the figure) are sequentially delivered to the downstream device. Then, the mounting board for which the component mounting work shown below is completed is recovered by the mounting board recovery device M8.

The solder printing device M2 prints solder for joining components on the board supplied from the board supply device M1. The component mounting devices M3, M4, and M5 are component mounting portions in the mounting board manufacturing system 1, and components are mounted on a board on which solder is printed. The inspection device M6 is an inspection unit in the mounting board manufacturing system 1 and inspects the mounting position of the component on the board on which the component is mounted. The reflow device M7 melts and solidifies the solder by heating the board after inspection, and solder-bonds the mounted components to the board.

The above-mentioned devices are connected to each other via the communication network 2, and further connected to the information processing device 3 via the communication network 2. As a result, in the mounting board manufacturing system 1, signals, information, and data are exchanged between each device of the board supply device M1 and the mounting board recovery device M8, and the inspection result by the inspection device M6 is fed back to the upstream device. Is possible. At the same time, various data uploaded from each device to the information processing device 3 are processed by the information processing device 3, and the processed information can be downloaded by each device.

Next, with reference to FIG. 2, the configurations and functions of the component mounting devices M3, M4, and M5 as the component mounting portions in the mounting board manufacturing system 1 will be described. In FIG. 2, a substrate transport portion 5 is arranged in the X direction (board transport direction) in the center of the upper surface of the gantry 4. The board transport unit 5 transports the board 6 delivered from the upstream device, and positions and holds the board 6 at the mounting work position by the component mounting mechanism described below.

Parts supply units 7A and 7B are arranged on both sides of the board transport unit 5, and a plurality of tape feeders 8 are arranged side by side in the component supply units 7A and 7B. The tape feeder 8 feeds the carrier tape holding the component to be mounted at a pitch to supply the component to the component suction position by the component mounting mechanism. A Y-axis beam 9 is arranged in the Y direction orthogonal to the X direction at one end of the upper surface of the gantry 4 in the X direction. The Y-axis beam 9 is provided with a linear motor in which two X-axis beams 10A and 10B are movably coupled in the Y direction, and the X-axis beams 10A and 10B can be moved separately in the Y direction. There is.

The mounting heads 11A and 11B are mounted on the two X-axis beams 10A and 10B so as to be movable in the X direction, respectively, and are provided with a linear motor for moving the mounting heads 11A and 11B in the X direction. The mounting heads 11A and 11B are multiple heads having a plurality of holding heads, and the suction nozzle 11a (see FIG. 4A) as a holding tool for holding a component at the lower end of each holding head and mounting the component on the substrate 6. )have.

The X-axis beam 10A and the Y-axis beam 9 constitute an XY table 12A (see FIG. 5), and by driving the XY table 12A, the mounting head 11A moves in the X direction and the Y direction. Further, the X-axis beam 10B and the Y-axis beam 9 form an XY table 12B (see FIG. 5), and by driving the XY table 12B, the mounting head 11B moves in the X direction and the Y direction. That is, the XY tables 12A and 12B are mounting head moving portions for moving the mounting heads 11A and 11B.

As a result, the two mounting heads 11A and 11B suck and hold the component from the component suction position of the tape feeder 8 of the corresponding component supply units 7A and 7B by the suction nozzle 11a, and take out the component at the component mounting position of the substrate 6. Is installed. In the above configuration, the XY tables 12A and 12B and the mounting heads 11A and 11B form a component mounting mechanism for mounting the components on the substrate 6 by moving the mounting heads 11A and 11B holding the components.

In the component mounting operation by this component mounting mechanism, the XY tables 12A and 12B, which are the mounting head moving portions, are located at the target positions for mounting the components held by the suction nozzle 11a at the component mounting position of the substrate 6, and the mounting head 11A, Move 11B. Here, the target position means the movement target coordinates of the mounting head 11A (11B) in the coordinate system of the XY table 12A (12B).

That is, the component mounting devices M3, M4, and M5 as the component mounting portions shown in the present embodiment are located at the mounting heads 11A and 11B having the holders for holding the components and mounting the components, and the component mounting positions of the board 6. It is configured to have a mounting head moving portion for moving the mounting heads 11A and 11B to a target position for mounting the parts held by the holder.

The component recognition cameras 14A and 14B are arranged between the component supply units 7A and 7B and the board transfer unit 5, respectively. When the mounting heads 11A and 11B from which the components are taken out from the component supply units 7A and 7B move above the component recognition cameras 14A and 14B, respectively, the component recognition cameras 14A and 14B are held by the mounting heads 11A and 11B. Image the parts of. By recognizing the image pickup result, the misalignment of the component held by the mounting heads 11A and 11B is detected.

The mounting heads 11A and 11B are mounted with substrate recognition cameras 13A and 13B located on the lower surface side of the X-axis beams 10A and 10B and moving integrally with the mounting heads 11A and 11B, respectively. As the mounting heads 11A and 11B move, the substrate recognition cameras 13A and 13B move above the substrate 6 positioned on the substrate transport unit 5 and take an image of the substrate 6. By recognizing the image pickup result, the component mounting position on the substrate 6 is recognized. In the component mounting operation by the mounting heads 11A and 11B on the board 6, the mounting position is corrected by taking into consideration the result of the component recognition by the component recognition cameras 14A and 14B and the result of the board recognition by the board recognition cameras 13A and 13B. Will be.

In the following description, in order to eliminate redundancy and simplify the description, when the component mounting parts having the above configuration are shown, the elements existing in a pair are supplied as parts unless it is necessary to distinguish them. Parts 7A, 7B, X-axis beams 10A, 10B, mounting heads 11A, 11B, XY tables 12A, 12B, board recognition cameras 13A, 13B, parts recognition cameras 14A, 14B, simply parts supply part 7, X-axis beam 10, The mounting head 11, the XY table 12, the board recognition camera 13, and the component recognition camera 14 are collectively abbreviated.

In the component mounting device M3, the upper surface of the gantry 4 is arranged so as to surround the substrate 6 positioned on the substrate transport portion 5 from the surroundings, and four position reference points are used as reference points for detecting the state of the component mounting device M3. Posts 15 (1) to 15 (4) are erected. When detecting the state of the component mounting device M3, the positions of the position reference posts 15 (1) to 15 (4) are imaged by the board recognition camera 13 moved by the XY table 12. By recognizing this imaging result by the image recognition unit 24 (see FIG. 5), the mounting head 11 is displaced from the normal state due to thermal deformation of the XY table 12, that is, the state of the component mounting device M3. Can be detected and numerical data indicating this state can be output.

The detection of this state will be described with reference to FIG. First, FIG. 3A shows a state in which the mounting head 11 is moved by the XY table 12 to position the substrate recognition camera 13 above the position reference post 15 to be recognized. Position as a reference point The position of the reference post 15 is fixed to the gantry 4 to which the component mounting device M3 is attached. When moving the mounting head 11, the position indicated by the normal position data of the position reference post 15 is moved as a target. Then, by imaging the position reference post 15 with the substrate recognition camera 13, the recognition image shown in FIG. 3B can be obtained.

That is, on the recognition screen 13a of the substrate recognition camera 13, an image showing the upper surface of the position reference post 15 is a position shift vector P (X) according to a state due to thermal deformation of the Y-axis beam 9, the X-axis beam 10, and the mounting head 11. Only the directional component px and the Y directional component py) appear in a state of being displaced from the optical coordinate origin of the recognition screen 13a. That is, when there is no thermal deformation, that is, when the Y-axis beam 9, the X-axis beam 10, and the mounting head 11 are cooled, the image of the position reference post 15 on the recognition screen 13a appears in accordance with the origin of the optical coordinate system, and the temperature appears. As the thermal deformation increases, the misalignment vector P indicating the misalignment state of the position reference post 15 becomes larger.

As shown in FIG. 3C, the misalignment detection for the position reference post 15 is executed for the four position reference posts 15 (1) to 15 (4) arranged so as to surround the substrate 6. As a result, the position shift vector P corresponding to each of the four position reference posts 15 (1) to 15 (4) is obtained. The combination of these misalignment vectors P is numerical data indicating the state of the component mounting device by a vector component. The numerical data output in this way is referred to when the correction value is changed by the correction value changing unit 28, which will be described later.

Further, temperature sensors T1, T2, and T3 as temperature measuring units are mounted on the upper surfaces of the Y-axis beam 9 and the X-axis beams 10A and 10B at substantially the center of each in the longitudinal direction. The temperature sensors T1, T2, and T3 measure the temperatures of the Y-axis beams 9, X-axis beams 10A, and 10B, and output them as numerical data indicating a temperature rise state due to continuous operation of the component mounting device M3. It is not necessary to measure all of the temperature sensors T1, T2, and T3, and at least one of them may be measured as the temperature of the representative point. That is, in the example shown here, the temperature of at least one representative point is used as the numerical data indicating the state of the component mounting device M3. The component mounting devices M4 and M5 also have a function of calculating numerical data using a position reference post and a temperature sensor, that is, numerical data indicating the state of the component mounting devices M4 and M5, as in the component mounting device M3. ..

The substrate 6 on which components are mounted by the component mounting devices M3, M4, and M5 is inspected by the inspection device M6, which is an inspection unit. Here, the substrate 6 on which the components are mounted is imaged and the mounting position of the components mounted on the substrate 6 is inspected. That is, as shown in FIG. 4A, the substrate 6 on which the component 16 is mounted is carried into the substrate transport unit 17 provided in the inspection device M6. An inspection camera 18 is arranged above the substrate transport portion 17 so as to be movable in the horizontal direction by the camera moving mechanism 19. By moving the inspection camera 18 above the component 16 to be inspected and recognizing the captured image by the inspection processing unit (not shown), the mounting position deviation amounts Δxn and Δyn shown in FIG. 4B are acquired. Will be done.

The mounting position deviation amounts Δxn and Δyn indicate the positional deviation state between the component mounting position 6a where the center point 16c of the component 16 should match in the design data and the center point 16c of the component 16 actually mounted on the board 6. Is. Although only one component 16 to be inspected is shown here for convenience of explanation, in the actual component mounting work, the component mounting devices M3, M4, and M5 are sequentially mounted on a single board 6. There are a plurality of the above-mentioned parts 16, and the mounting position deviation amounts Δxn and Δyn are obtained for each part 16.

The mounting position deviation amounts Δxn and Δyn obtained in this way are inspection results obtained by the inspection device M6 which is an inspection unit. In the mounting board manufacturing system 1, the inspection result obtained in this way is used to calculate a correction value for correcting the above-mentioned target position, and when a new inspection result is obtained, a new inspection result is obtained. The process of updating the correction value for correcting the target position by using is performed by the function of the correction value calculation unit 25 (FIG. 5). That is, the inspection results obtained by sequentially targeting a plurality of boards by the inspection device M6 are sequentially fed back to the component mounting devices M3, M4, and M5 via the communication network 2.

In the component mounting devices M3, M4, and M5, the process of calculating the target position using the correction value calculated using these inspection results acquired sequentially is the function of the target position calculation unit 26 (FIG. 5). It is done by. As a method for calculating the correction value, various calculation methods such as a method in which a value obtained by multiplying the mounting position deviation amounts Δxn and Δyn, which are inspection results, by a predetermined ratio, and the like can be appropriately selected.

In the mounting board manufacturing system 1 shown in the present embodiment, when calculating the correction value for correcting the target position by using these inspection results, as described below, the component mounting devices M3, M4, The numerical data showing the state of the change with time due to the thermal deformation of the XY table 12 in M5 is referred to.

Here, the change with time of the state in the component mounting device M3 will be described. In the component mounting work, the mounting turn for repeatedly moving the mounting head 11 between the component supply unit 7 and the substrate 6 is executed at high frequency, so that the Y-axis beam 9 and the X-axis beam 10 are from a linear motor. The temperature rises due to the heat generation, causing thermal deformation in which the heated portion expands thermally.

Due to this thermal deformation, the XY table 12, which has maintained its original linear shape in the cooling state before the start of operation, is deformed into a complicated curved shape according to the heat generation condition. This deformation changes with the passage of time from the start of operation, and after a certain time, the thermal deformation becomes saturated and converges to a constant shape. After that, the thermal deformation gradually disappears as the temperature drops due to the stop of operation, and the initial shape is restored after complete cooling.

If the component mounting work is executed in a state where such thermal deformation occurs, the component 16 is mounted on the substrate 6 without the horizontal position of the mounting head 11 being stable due to the deformation of the XY table 12. That is, the component is mounted on the board 6 in a state of being displaced from the original component mounting position on the board 6. The amount of this misalignment is not constant in time series and differs depending on the state of thermal deformation of the XY table 12.

In order to suppress the mounting position shift due to the change of the thermal deformation state of the XY table 12 with time, in the mounting board manufacturing system 1 shown in the present embodiment, the inspection obtained by the inspection device M6 as described above is performed. By sequentially feeding back the results, the mounting position shift caused by the above-mentioned change with time is corrected. However, in the method of sequentially feeding back the inspection results in this way, the correction value for correcting the mounting position deviation is always a value according to the state at that time, so that the operation is stopped in the component mounting device M3. If the operation is restarted after this, the following inconveniences occur.

That is, after the operation of the component mounting device M3 is stopped, the degree of thermal deformation of the XY table 12 decreases depending on the elapsed time after the operation is stopped, and the state of the component mounting device M3 changes. Therefore, if the correction value used until just before the operation is stopped is applied as it is when restarting the operation, the mounting position deviation cannot be properly corrected in the component mounting operation after the restart of the operation, and the mounting position accuracy is lowered. I will invite you.

In order to eliminate such inconvenience, in the mounting board manufacturing system 1 shown in the present embodiment, the following processes are selectively executed so that the correction value at the time of restarting the operation can be handled appropriately and rationally. do. That is, when the component mounting device M3 stops the operation and then restarts the operation to mount the component, the latest correction value used immediately before the stop of the operation is not unconditionally used as it is, but is registered in advance. The correction value is calculated and changed according to the "Settings related to the correction value when restarting operation".

This setting prescribes a mode for changing the correction value when the operation is restarted after the operation is stopped, and is input by the setting screen shown in FIG. 7 and is input to the setting information storage unit 23 (see FIG. 5). It will be remembered. As shown in FIG. 7, on the display screen 31a of the touch panel 31 included in the component mounting device M3, the setting screen of "setting related to the correction value at the time of restarting operation" 23a is displayed. The "setting related to the correction value at the time of restarting the operation" 23a includes two items of "processing setting at the time of restarting the operation" 46 and "calculation of the correction value" 47. Then, by operating the registration operation button 48, the input contents are registered and stored in the setting information storage unit 23.

In the "processing setting at the time of restarting operation" 46, "always calculate the optimum correction value" (setting (1)) or "optimum correction value as necessary" by checking and inputting the two-choice check boxes 46a and 46b. You can select either "Calculate" (setting (2)) in advance. When "Always calculate the optimum correction value" is selected in setting (1), the process of changing the latest correction value used immediately before stopping the operation to a correction value with a different value changes the correction value. It is executed by the processing function of the part 28 (see FIG. 5).

In addition, when "Calculate the optimum correction value as needed" is selected in setting (2), the process of determining whether or not the latest correction value used immediately before stopping the operation can be used is the latest. It is executed by the processing function of the correction value use determination unit 27 (see FIG. 5). Here, when the latest correction value use determination unit 27 determines that the latest correction value used immediately before cannot be used, the process of changing the latest correction value to a correction value having a different value is the correction value change unit. It is executed by the processing function of 28 (see FIG. 5). That is, in the setting (2), the process of calculating the optimum correction value is executed only when it is determined that the latest correction value cannot be used and the correction value needs to be changed.

Further, in the "process setting at the time of restarting operation" 46, it is possible to select whether or not to execute the notification process "notify the operator when the correction value needs to be changed" by checking the check box 46c. ing. By selecting to execute this notification process, if it is determined that the latest correction value cannot be used and it is necessary to change the correction value, the operator (operator) of the component mounting device M3 can change the correction value. The requested notification is made. This processing is performed by the processing function of the correction value change request unit 29 (see FIG. 5).

In the "calculation of correction value" 47, "calculation based on the past correction value" is performed when the correction value is calculated by the correction value changing unit 28 by checking the two-choice check boxes 47a and 47b. Alternatively, it is possible to select in advance which of "calculate using a data table" is applied. When "Calculate based on past correction values" is selected, the past correction values stored in the past correction value storage unit 43 (see FIG. 6) provided in the control unit 40 of the information processing apparatus 3 when the correction values are changed are selected. Is referenced. That is, the correction value changing unit 28 changes the latest correction value to a past correction value stored in the past correction value storage unit 43 or a correction value obtained based on at least one past correction value.

In the calculation based on this past correction value, the current numerical data obtained by the state detection unit 21 at the time of restarting the operation is compared with the past numerical data stored in the equipment state storage unit 22, and the current numerical data is compared. Select at least one past correction value that was used at the time when the same or similar numerical data was obtained. Then, the latest correction value is changed to a correction value obtained based on one selected past correction value or a plurality of past correction values.

That is, in the present embodiment, if the numerical data indicating the device state is the same or similar, it is determined that the positional deviation of the mounting position in the component mounting device M3 also shows the same tendency. Therefore, a correction value that matches the condition that the numerical data is the same or similar is searched from the past correction values stored in the past correction value storage unit 43, and the corresponding correction value is selected and used as the changed correction value. .. If it is difficult to specify only one corresponding correction value in the past correction values, the changed correction value is obtained by expanding the similar conditions and using a plurality of selected correction values. .. In this case, an arithmetic process for obtaining an average value is performed for a plurality of selected correction values.

Alternatively, when "Calculate using data table" is selected, the data table that defines the correlation between the stop time of the component mounting device M3 and the correction value is referred to when changing the correction value. Here, if the stop time of the component mounting device M3 is the same, it is determined that the positional deviation of the mounting position in the component mounting device M3 also shows the same tendency. Therefore, by referring to the stop time acquired by the measurement with the above-mentioned data table, it is possible to estimate an appropriate correction value at the time when the stop time is measured. That is, in the present embodiment, the control unit 20 includes the above-mentioned data table together with the stop time measuring unit that measures the stop time of the component mounting device M3. Then, the correction value changing unit 28 changes the latest correction value to a correction value obtained based on the stop time measured by the stop time measuring unit and the correlation defined in the data table.

In order to enable the handling of the correction value at the time of restarting the operation as described above, in the present embodiment, the control systems of the component mounting device M3 and the information processing device 3 constituting the mounting board manufacturing system 1 are shown in FIG. 5, respectively. , The configuration is as shown in FIG. First, the configuration of the control system of the component mounting device M3 will be described with reference to FIG. Here, among the control functions of the component mounting device M3, the functions related to the calculation and updating of the correction value are mainly described.

The control unit 20 (see FIG. 4A) built in the component mounting device M3 includes a mounting head 11, an XY table 12, a board recognition camera 13, a component recognition camera 14, a component supply section 7, and a board transfer section 5. The touch panel 31 is connected. By controlling the board transfer unit 5 by the control unit 20, the transfer operation of the board 6 in the component mounting device M3 is executed. By controlling the component supply unit 7 by the control unit 20, the component is supplied to the mounting head 11 by the tape feeder 8. Then, the control unit 20 controls the mounting head 11 and the XY table 12, so that the components are mounted on the board 6 positioned and held by the board transporting unit 5. The touch panel 31 is an operation input and display means, and displays an input screen for operation input to the control unit 20 and various setting screens.

The control unit 20 includes a state detection unit 21, an equipment state storage unit 22, a setting information storage unit 23, an image recognition unit 24, a correction value calculation unit 25, a target position calculation unit 26, and a latest correction value use determination unit as internal functional elements. 27, a correction value change unit 28, and a correction value change request unit 29 are provided. Further, the control unit 20 is connected to the communication network 2 via the communication interface 30. As a result, signals and data can be exchanged with other devices constituting the mounting board manufacturing system 1, data can be uploaded to the information processing device 3, and data can be downloaded from the information processing device 3. There is.

The state detection unit 21 detects the state of the component mounting device M3, which is the component mounting unit, and outputs numerical data indicating this state. The plurality of output numerical data are stored in the equipment state storage unit 22. The correction value changing unit 28 is the same as or the same as the current numerical data as compared with the current numerical data obtained by the state detecting unit 21 at the time of restarting the operation and the past numerical data stored in the equipment state storage unit 22. Select at least one past correction value that was used when similar numerical data was obtained. Then, the latest correction value is changed to a correction value obtained based on one selected past correction value or a plurality of past correction values.

Although an example of storing past numerical data in the equipment state storage unit 22 provided in the component mounting device M3 is shown here, the equipment state storage unit 44 provided in the control unit 40 of the information processing device 3 shows an example. The past numerical data may be stored.

Here, the configuration of the state detection unit 21 includes a first configuration in which the position reference post 15 is imaged and recognized, and a second configuration in which the temperature of a representative point provided in the component mounting device M3 is measured. You can select it. In the first configuration of the state detection unit 21, the substrate recognition camera 13 moved by the XY table 12, the position reference post 15 as at least one reference point fixed to the gantry 4, and the position imaged by the substrate recognition camera 13 From the image of the reference post 15, the configuration includes an image recognition unit 24 that outputs the position of the position reference post 15 in the component mounting device M3 as numerical data indicating the state of the component mounting device M3.

Further, in the second configuration of the state detection unit 21, the temperature measurement unit (temperature sensor) that measures the temperature of at least one representative point of the component mounting device M3 and outputs the temperature as numerical data indicating the state of the component mounting device M3. It has a configuration including T1, T2, and T3 (see FIG. 1).

Instead of detecting the state of the component mounting device M3 by the state detecting unit 21, the stop time measuring unit that measures the stop time of the component mounting device M3 by the timekeeping function of the control unit 20 and the correlation between the stop time and the correction value. A configuration with a data table that defines relationships may be used. The data table is stored in the control unit 20 or the control unit 40.

In this case, the correction value changing unit 28 determines the latest correction value with the time required from the operation stop to the restart of the component mounting device M3 measured by the stop time measuring unit, and the correlation defined in the data table. Change to the correction value obtained based on. When changing the correction value, the selection of whether to calculate based on the past correction value as described above or to calculate using the data table is selected in advance as "setting related to the correction value at the time of restarting operation". "(See FIG. 7).

The setting information storage unit 23 stores the above-mentioned “setting regarding the correction value at the time of restarting operation” 23a shown in FIG. 7. The image recognition unit 24 recognizes the image pickup result of the board recognition camera 13 and the component recognition camera 14. As a result, board recognition for recognizing the position of the board 6 and component recognition for recognizing the position of the component held by the mounting head 11 are performed. Further, by recognizing the image pickup result of the position reference post 15 by the substrate recognition camera 13, numerical data indicating the state due to thermal deformation is output.

The correction value calculation unit 25 calculates a correction value for correcting the target position using the inspection result obtained by the inspection device M6, and when a new inspection result is obtained, the new inspection result is used. Performs the process of updating the correction value. The target position calculation unit 26 calculates the target position by using the correction value calculated by the correction value calculation unit 25 and the updated correction value. The latest correction value use determination unit 27 determines whether or not the latest correction value used immediately before the operation is stopped can be used when the component mounting device M3 stops the operation and then restarts the operation to mount the parts. do.

This determination of availability is made based on the operation stop time of the equipment or the numerical data indicating the device state output by the state detection unit 21. That is, based on the operation stop time of the equipment, the latest correction value use determination unit 27 is the latest if the time required for the component mounting device M3 to stop and restart the operation is longer than the preset time. It is judged that the correction value of is unusable. Further, when based on the numerical data indicating the device state, the latest correction value use determination unit 27 has the numerical data output by the state detection unit 21 before the component mounting device M3 stops the operation and the state detection unit 21 when the operation is restarted. Compares with the numerical data output by, and as a result of the comparison, if the difference is larger than the preset threshold value, it is judged that the data cannot be used.

When the component mounting device M3 stops the operation and then restarts the operation to mount the component, the correction value changing unit 28 changes the latest correction value used immediately before the operation is stopped to a correction value having a different value. The process to be changed is executed according to the pre-registered "setting related to the correction value at the time of restarting operation" 23a (see FIG. 7). That is, when it is set to always calculate the optimum correction value, the correction value changing unit 28 unconditionally changes the latest correction value to the optimum correction value having a different value. If the correction value is set to be calculated as necessary, the correction value change unit 28 is the latest only when the latest correction value use determination unit 27 determines that the latest correction value cannot be used. Change the correction value to the optimum correction value with a different value.

When the latest correction value use determination unit 27 determines that the latest correction value cannot be used, the correction value change request unit 29 performs a process of requesting the operator of the component mounting device M3 to change the correction value. This process is performed by displaying, for example, a notification on the touch panel 31 to the operator who is the operator that the correction value needs to be changed. For this notification, the notification processing is selected in the "processing setting at the time of restarting the operation" 46 of the "setting regarding the correction value at the time of restarting the operation" 23a (see FIG. 7) stored in the setting information storage unit 23. Only done if there is.

By giving this notification, it is possible to inform the operator in charge of the device that the device is in a situation where it is determined that the correction value needs to be changed and the correction value is automatically changed. As a result, if the operator determines that the change of the correction value is inappropriate and inputs a reply to that effect, the correction value change process is suspended and the inappropriate correction value is automatically set. It is possible to avoid.

Next, the configuration of the information processing apparatus 3 will be described with reference to FIG. In FIG. 6, a monitor 32 and an input device 33 are connected to the control unit 40 of the information processing device 3. The control unit 40 includes a communication processing unit 41, an inspection result storage unit 42, a past correction value storage unit 43, and an equipment state storage unit 44 as internal processing functions. Further, the control unit 40 is connected to the communication network 2 via the communication interface 45.

The monitor 32 is a display device, and displays an operation screen at the time of input operation by the input device 33, a data screen showing data stored in each unit of the control unit 40, and the like. The communication processing unit 41 performs data communication processing via the communication network 2 with each device constituting the mounting board manufacturing system 1. As a result, data is uploaded from each device constituting the mounting board manufacturing system 1 and data stored in the information processing device 3 is downloaded to each device.

The inspection result storage unit 42 stores the inspection result by the inspection device M6. The past correction value storage unit 43 stores a plurality of correction values used in the past by the component mounting device M3. Similar to the equipment state storage unit 22 shown in FIG. 5, the equipment state storage unit 44 stores the past numerical data output from the state detection unit 21 by the component mounting device M3.

The mounting board manufacturing system 1 is configured as described above, and the mounting board manufacturing method executed by the mounting board manufacturing system 1 will be described below. First, the component mounting operation executed by the component mounting device M3 constituting the mounting board manufacturing system 1 will be described with reference to the flow of FIG. Here, the component mounting operation in the normal operation state in which the board mounting is continuously executed in the component mounting device M3 is shown. This component mounting operation corresponds to a component mounting process in which components are mounted on a board by the component mounting device M3, which is a component mounting unit having the above-described configuration in the mounting board manufacturing method.

In this mounting board manufacturing method, an inspection process of imaging a board on which a component is mounted and inspecting the mounting position of the component mounted on the board is executed for each board by the inspection device M6 in the component mounting process, and the result is obtained. The inspection result is stored in the inspection result storage unit 42 of the sequential information processing apparatus 3.

First, at the start of the component mounting operation, it is confirmed that the board has been carried in (ST1). Here, it waits until the board delivery can be confirmed, and when the delivery completion is confirmed, it is determined whether or not the device status detection is necessary (ST2). Here, it is determined whether or not the timing at which the board is carried in corresponds to the timing at which the device state detection should be executed. That is, it is determined whether the timing corresponds to the preset device state detection interval, or whether the board corresponds to the predetermined number of boards for which the device state detection should be executed.

If applicable here, the process proceeds to the next step to detect the device status (ST3). Here, the state detection unit 21 outputs numerical data indicating the device state, and the output numerical data is stored in the equipment state storage unit 22. Following the detection of the device status, if the detection of the device status is skipped, the inspection result is acquired (ST4). Here, among the inspection results stored in the inspection result storage unit 42 of the information processing apparatus 3, the latest unacquired inspection results are acquired via the communication network 2. If there is no latest unacquired test result here, the acquisition of the inspection result is skipped.

Next, the correction value for correcting the target position is calculated using the acquired inspection result (ST5). If the inspection result cannot be obtained in (ST4), the previously calculated correction value is used as it is. That is, here, the correction value for correcting the target position is calculated using the inspection result obtained in the previously executed inspection process, and when a new inspection result is obtained, the new inspection result is used. Update the correction value (correction value calculation process). Although the flow is described here assuming that a series of processes up to (ST5) is performed after the board is carried in, the processes up to (ST5) may be performed before the board is carried in.

Next, substrate recognition is performed (ST6). That is, the substrate 6 is imaged by the substrate recognition camera 13, and the image recognition result is recognized by the image recognition unit 24 to recognize the position of the substrate 6. Next, the component is held (ST7), and the component is taken out from the component supply unit 7 by the mounting head 11. Next, component recognition is performed (ST8). That is, the mounting head 11 from which the component is taken out is moved above the component recognition camera 14, the component is imaged, and the image recognition result is recognized by the image recognition unit 24 to recognize the position of the component.

Next, the calculation of the target coordinates is performed (ST9). Here, the position coordinates of the XY table coordinate system, which is the movement target that the mounting head 11 holding the component moves to mount the component, is calculated. In this calculation, the target coordinates are obtained by adding the mounting position coordinates given by the design data of the board, the component recognition result and the board recognition result, and the correction value obtained in (ST5). At this time, when the components are held by the plurality of suction nozzles 11a in the multiple mounting head 11, the target coordinates are obtained for each of the plurality of components. That is, here, the correction value obtained by the calculation in (ST5) is used to calculate the target position where the mounting head 11 moves to mount the component (target position calculation step).

Next, parts are mounted (ST10). That is, the component held by the mounting head 11 that has moved to the above-mentioned target position is mounted at the component mounting position of the substrate 6. Next, it is confirmed whether or not all the work target parts are mounted (ST11), and if there are unmounted parts, the process returns to (ST7) and each step after component holding is repeatedly executed. Then, when it is confirmed that all the parts are mounted in (ST11), the board is carried out (ST12). Then, the correction value is uploaded (ST13).

Here, the correction value used in the target coordinate calculation of (ST9) is uploaded to the information processing apparatus 3 together with the recording of the date and time. When the device state detection is executed in (ST3), the numerical data output by the state detection unit 21 is also uploaded to the information processing device 3. The uploaded correction values and numerical data are stored in the past correction value storage unit 43 and the equipment state storage unit 44 of the information processing apparatus 3, respectively.

Next, in the mounting board manufacturing method executed by the mounting board manufacturing system 1, the process at the time of restarting the operation when the operation is restarted after the operation of the component mounting device M3 is stopped and the component mounting process is executed again is shown in FIG. The explanation will be given according to the flow of 9. First, when the operation is restarted, the completion of the board delivery is confirmed (ST21). Here, it waits until the board delivery can be confirmed, and when the delivery completion is confirmed, the correction value setting at the time of restarting the operation is confirmed (ST22). That is, the setting contents of the calculation guideline of the correction value used for calculating the target position are confirmed.

Here, referring to the "setting related to the correction value at the time of restarting the operation" 23a (see FIG. 7) stored in the setting information storage unit 23 of the control unit 20, the setting at the time of the operation is "always the optimum correction value". Check whether it is "Calculate" (setting (1)) or "Calculate the optimum correction value if necessary" (setting (2)). If the setting content is "always calculate the optimum correction value" (setting (1)), the process proceeds to the correction value change process (ST27) for changing to the optimum correction value. Here, when the component mounting device M3 stops the operation in the component mounting process and then restarts the operation to execute the component mounting process again, the latest correction value used immediately before the operation is stopped is used as the value. The correction value changing process for changing to a different correction value is executed by the processing function of the correction value changing unit 28 (correction value changing step).

In the present embodiment, the past correction value storage unit 43 of the information processing apparatus 3 is configured to store a plurality of past correction values. Then, in the above-mentioned correction value changing step, the latest correction value used immediately before the operation is stopped is changed to the past correction value stored in the past correction value storage unit 43 or at least one past correction value. Change to the correction value obtained based on. In the correction value change based on the past correction value, the numerical data indicating the device state is referred to.

That is, in the present embodiment, in the component mounting process described with reference to FIG. 8, the state detecting step of detecting the state of the component mounting device M3, which is the component mounting unit, is executed by the state detecting unit 21, and numerical data indicating the state is shown. Is output, and a plurality of output past numerical data are stored in the equipment state storage unit 22 (or the equipment state storage unit 44 of the information processing device 3). Although the flow is described here assuming that a series of processes up to (ST27) is performed after the substrate is carried in, the processes up to (ST27) may be performed before the board is carried in.

In the correction value change process of (ST27), the current numerical data obtained in the state detection step at the time of restarting the operation is compared with the stored past numerical data, and is the same as or similar to the current numerical data. Select at least one past correction value that was used at the time the numerical data was obtained. Then, the latest correction value to be changed is changed to a correction value obtained based on one selected past correction value or a plurality of past correction values.

The execution mode of the state detection step by the state detection unit 21 is a first configuration in which the position reference post 15 is imaged and recognized, and a second configuration in which the temperature of a representative point provided in the component mounting device M3 is measured. The configuration is selected and executed. In the first configuration of the state detection process, the substrate recognition camera 13 moved by the XY table 12 images the position reference post 15 as at least one reference point fixed to the gantry 4 on which the component mounting device M3 is mounted. From the image of the position reference post 15 captured by the board recognition camera 13, the image recognition step of outputting the position of the position reference post 15 in the component mounting device M3 as numerical data indicating the state of the component mounting device M3 is executed. There is. Further, in the second configuration of the state detection step, the temperature of at least one representative point of the component mounting device M3 is measured (see the temperature sensors T1, T2, and T3 shown in FIG. 1), and the temperature is used as the state of the component mounting device M3. It is output as numerical data indicating.

Instead of executing the state detection process of detecting the state of the component mounting device M3 by the state detecting unit 21, the stop time measuring process of measuring the stop time of the component mounting device M3 by the timekeeping function of the control unit 20 is executed. You may. In this case, in the correction value changing process of (ST27), the time required from the operation stop to the restart of the component mounting device M3 measured in the stop time measurement process for the latest correction value to be changed, and the stop. Change to the correction value obtained based on the correlation defined in the data table that defines the correlation between time and correction value. The data table used here is stored in the control unit 20 or the control unit 40.

On the other hand, when the setting content is "calculate the optimum correction value as necessary" (setting (2)), a series of determinations for determining the necessity of changing the correction value prior to the correction value change processing. The process is executed. Here, when the operation is stopped in the component mounting process and then the operation is restarted and the component mounting process is executed again, it is determined whether or not the latest correction value used immediately before the operation is stopped can be used (latest correction). Value usage judgment process).

For this determination, device state detection is performed here (ST23). That is, the device state detection process for detecting the state of the component mounting device M3 is executed by the state detection unit 21, and numerical data indicating the state of the device is output. Then, in the above-mentioned latest correction value use determination step, the numerical data output in the device state detection step (see (ST2) shown in FIG. 8) executed before the component mounting device M3 stops the operation, and the operation. Compare with the numerical data output in the device state detection step (ST23) executed at the time of restart.

And as a result of comparison, if the difference is larger than the preset threshold value, the state of the device is fluctuating and it is inappropriate to apply the same correction value, and the latest correction value cannot be used. to decide. Regarding the execution mode of the state detection step by the state detection unit 21 described above, the first configuration in which the position reference post 15 is imaged and recognized and the temperature of the representative point provided in the component mounting device M3 are determined in the same manner as in the above example. Select and execute the second configuration to be measured.

Instead of executing the state detection process of detecting the state of the component mounting device M3 by the state detecting unit 21, the stop time measuring process of measuring the stop time of the component mounting device M3 by the timekeeping function of the control unit 20 is executed. You may. That is, in the process of determining the use of the latest correction value, if the time required for the component mounting device M3 to stop and restart the operation is longer than the preset time, it is presumed that the fluctuation of the device state is large, and the same reason. Therefore, it is judged that the latest correction value cannot be used.

In this way, if it is determined whether or not the latest correction value can be used based on the result of device status detection in (ST23) or the result of stop time measurement, it is necessary to change the correction value based on these results. Judged (ST24). That is, if it is determined that the latest correction value used immediately before stopping the operation can be used as it is, it is not necessary to change the correction value, and in this case, the process proceeds to (ST28).

On the other hand, when it is determined that the latest correction value cannot be used, it is determined that the correction value needs to be changed. In this case, the necessity of the operator notification is determined. Here, by referring to the "setting related to the correction value at the time of restarting the operation" 23a (see FIG. 7) stored in the setting information storage unit 23, the "change of the correction value" in the "processing setting at the time of restarting the operation" 46. If necessary, notify the operator. ”Check whether the notification process is selected. If the execution of this notification process is not selected here, it is determined that the notification to the operator is unnecessary, and the process proceeds to (ST27).

When the execution of this notification process is selected, it is determined that the notification to the operator is necessary, and the operator notification and the input standby state are set (ST26), that is, the latest correction value use determination unit 27. When it is determined that the latest correction value cannot be used, the function of the correction value change request unit 29 (see FIG. 5) requests the operator (operator) of the component mounting device M3 to change the correction value. Then, if there is an answer input from the operator to the effect that the change of the correction value is accepted, the process proceeds to (ST27) and the correction value change process is executed.

The correction value change process executed here is the same as the process executed in the case of the setting (1). That is, in the above-mentioned processing step, the processing executed in the case of the setting (2) is used immediately before the operation is stopped when the operation is restarted after the operation is stopped in the component mounting process and the component mounting process is executed again. The latest correction value usage judgment process for determining whether or not the latest correction value has been used is executed, and if it is determined that the latest correction value cannot be used here, the latest correction value is changed to a correction value with a different value. It is a form including.

If the correction value change process is performed in (ST27) in this way, board recognition (ST28), component holding (ST29), component recognition (ST30), target coordinate calculation (ST31), component mounting (ST32) , Confirmation that all the work target parts have been mounted (ST33), board removal (ST34), and correction value upload (ST35) are sequentially executed. Each of the above-mentioned processing steps (ST28) to (ST35) is the same as each processing step shown in FIGS. 8 (ST6) to (ST13).

As described above, in the mounting board manufacturing system and the mounting board manufacturing method shown in the present embodiment, the board on which the component is mounted is imaged by the component mounting portion, the mounting position of the component is inspected, and the inspection result is used. The correction value for correcting the mounted target position is calculated, and when a new inspection result is obtained, the correction value is updated using the new inspection result, and the target position is calculated using the correction value. When the component mounting section is restarted after the component mounting section is stopped and the component mounting section is used to mount the component, the latest correction value used immediately before the operation is stopped is detected as the device status. The correction value is changed to a different value calculated based on. As a result, it is possible to avoid a situation in which a correction value that does not match the device state fluctuated due to the stoppage of operation is used as it is, and to suppress a decrease in mounting position accuracy when restarting operation after stopping continuous production.

Also, in the same configuration, when the operation is restarted after the component mounting section has stopped the operation and the component mounting section is used to mount the component, it is determined whether or not the latest correction value used immediately before the operation is stopped can be used. If it is determined that the latest correction value cannot be used, the latest correction value is changed to a different correction value calculated based on the result of detecting the device status. As a result, in addition to the above-mentioned effects, the process of changing the correction value can be limited to only when the change is required, and the data management for appropriately managing the correction value can be streamlined.

The mounting board manufacturing system and the mounting board manufacturing method of the present invention have the effect of suppressing a decrease in mounting position accuracy when restarting operation after stopping continuous production, and a mounting board in which components are mounted on the board. It is useful in the field of manufacturing.

1 Mounting board manufacturing system 2 Communication network 3 Information processing equipment 4 Stand 6 Board 7A, 7B Parts supply unit 11A, 11B Mounting head 13A, 13B Board recognition camera 15 Position reference post 16 Parts M3, M4, M5 Parts mounting device M6 Inspection device T1, T2, T3 temperature sensor

Claims (17)

A mounting head having a holder for holding a component and mounting it on a board, and a mounting head moving unit for moving the mounting head to a target position for mounting the component held by the holder at a component mounting position on the board. The component mounting part to have and
A state detection unit that detects the state of the component mounting unit and outputs numerical data indicating the state, and a state detection unit.
An inspection unit that images the board on which the components are mounted by the component mounting unit and inspects the mounting position of the components mounted on the board.
A correction value for correcting the target position is calculated using the inspection result obtained by the inspection unit, and when a new inspection result is obtained, the correction value is updated using the new inspection result. Correction value calculation unit and
A target position calculation unit that calculates the target position using the correction value,
When the component mounting unit stops operation and then restarts the operation to mount the component by the component mounting section, the latest correction value for determining whether or not the latest correction value used immediately before the operation is stopped can be used. Usage judgment department and
When the latest correction value use determination unit determines that the latest correction value cannot be used, it is provided with a correction value change unit that changes the latest correction value to a correction value having a different value .
The correction value changing unit compares the current numerical data obtained by the state detection unit at the time of restarting the operation with the past numerical data stored in advance, and the numerical data equal to or similar to the current numerical data is obtained. Select at least one past correction value used at the time of acquisition, and change the latest correction value to the selected one past correction value or the correction value obtained based on a plurality of past correction values. A mounting board manufacturing system. The mounting board according to claim 1, wherein the latest correction value use determination unit determines that the component mounting unit cannot be used if the time required for the component mounting unit to stop and restart the operation is longer than a preset time. Manufacturing system. The latest correction value use determination unit compares the numerical data output by the state detection unit before the component mounting unit stops the operation with the numerical data output when the operation is restarted, and as a result of the comparison, the difference is large. The mounting board manufacturing system according to claim 1, wherein it is determined that the system cannot be used. The state detection unit is a reference point in the component mounting unit based on an image of a camera moved by the mounting head moving unit, at least one reference point fixed to the component mounting unit, and a reference point captured by the camera. The mounting board manufacturing system according to claim 3, further comprising an image recognition unit that outputs the position of the component as numerical data indicating the state of the component mounting unit. The implementation according to claim 3, wherein the state detecting unit includes a temperature measuring unit that measures the temperature of at least one representative point of the component mounting unit and outputs the temperature as numerical data indicating the state of the component mounting unit. Board manufacturing system. A mounting head having a holder for holding a component and mounting it on a board, and a mounting head moving unit for moving the mounting head to a target position for mounting the component held by the holder at a component mounting position on the board. The component mounting part to have and
A state detection unit that detects the state of the component mounting unit and outputs numerical data indicating the state, and a state detection unit.
An inspection unit that images the board on which the components are mounted by the component mounting unit and inspects the mounting position of the components mounted on the board.
A correction value for correcting the target position is calculated using the inspection result obtained by the inspection unit, and when a new inspection result is obtained, the correction value is updated using the new inspection result. Correction value calculation unit and
A target position calculation unit that calculates the target position using the correction value,
When the component mounting unit stops operation and then restarts the operation to mount the component by the component mounting section, the latest correction value for determining whether or not the latest correction value used immediately before the operation is stopped can be used. Usage judgment department and
When the latest correction value use determination unit determines that the latest correction value cannot be used, it is provided with a correction value change request unit that requests the operator of the component mounting unit to change the correction value .
If, as a result of the request by the correction value change request unit, there is an input to approve the change of the correction value, the current numerical data obtained by the state detection unit at the time of restarting the operation and the past stored in advance are stored. One that compares with the numerical data, selects at least one past correction value that was used at the time when the same or similar numerical data as the current numerical data was obtained, and selected the latest correction value. A mounting board manufacturing system that changes to a correction value obtained based on a past correction value or a plurality of past correction values . The mounting board according to claim 6, wherein the latest correction value use determination unit determines that the component mounting unit cannot be used if the time required for the component mounting unit to stop and restart the operation is longer than a preset time. Manufacturing system. The latest correction value use determination unit compares the numerical data output by the state detection unit before the component mounting unit stops the operation with the numerical data output by the state detection unit when the operation is restarted, and makes a comparison. The mounting board manufacturing system according to claim 6, wherein if the difference is large as a result, it is determined that the system cannot be used. The state detection unit is a reference point in the component mounting unit based on an image of a camera moved by the mounting head moving unit, at least one reference point fixed to the component mounting unit, and a reference point captured by the camera. The mounting board manufacturing system according to claim 8, further comprising an image recognition unit that outputs the position of the component as numerical data indicating the state of the component mounting unit. The eighth aspect of the present invention, wherein the state detecting unit includes a temperature measuring unit that measures the temperature of at least one representative point of the component mounting unit and outputs the temperature as numerical data indicating the state of the component mounting unit. Mounting board manufacturing system. A mounting head having a holder for holding parts and mounting them on a board, and a mounting head moving unit for moving the mounting head to a target position for mounting the parts held by the holder at a component mounting position on the board. Depending on the component mounting part, the component mounting process for mounting the component on the board and the component mounting process
In the component mounting process, an inspection process of imaging the board on which the component is mounted and inspecting the mounting position of the component mounted on the board, and an inspection process.
A correction value for correcting the target position is calculated using the inspection result obtained in the inspection step, and when a new inspection result is obtained, the correction value is updated using the new inspection result. Correction value calculation process and
A target position calculation process for calculating the target position using the correction value, and
When the operation is stopped and then the operation is restarted in the component mounting process and the component mounting process is executed again, the latest correction value usage judgment for determining whether or not the latest correction value used immediately before the operation is stopped can be used. When the process is executed and it is determined that the process cannot be used, the process includes a correction value changing step of changing the latest correction value to a correction value having a different value.
In the component mounting process, a state detection step for detecting the state of the component mounting portion is executed, numerical data indicating the state is output, and the output past numerical data is stored.
In the correction value changing step, the current numerical data obtained in the state detection step at the time of restarting the operation is compared with the past numerical data stored in advance, and the numerical data equal to or similar to the current numerical data is obtained. Select at least one past correction value used at the time of acquisition, and change the latest correction value to the selected one past correction value or the correction value obtained based on a plurality of past correction values. How to manufacture a mounting board. In the latest correction value use determination process, the numerical data output in the device state detection process executed before the component mounting unit stops the operation and the device state detection process executed when the operation is restarted are output. The mounting board manufacturing method according to claim 11, wherein the data is compared with the numerical data, and if the difference is large as a result of the comparison, it is determined that the data cannot be used. Further, according to claim 11, if the time required for the component mounting unit to stop and restart the operation in the latest correction value use determination step is longer than a preset time, it is determined that the component mounting unit cannot be used. Mounting board manufacturing method. In the device state detection step, a camera moved by the mounting head moving portion captures at least one reference point fixed to a gantry to which the component mounting portion is mounted, and an image of the reference point captured by the camera. The mounting board manufacturing method according to claim 13, wherein the position of the reference point in the component mounting portion is output as numerical data indicating a state of the component mounting portion. The mounting board manufacturing method according to claim 13, wherein in the apparatus state detection step, the temperature of at least one representative point of the component mounting portion is measured and the temperature is output as numerical data indicating the state of the component mounting portion. .. A mounting head having a holder for holding a component and mounting it on a board, and a mounting head moving unit for moving the mounting head to a target position for mounting the component held by the holder at a component mounting position on the board. The component mounting part to have and
A state detection unit that detects the state of the component mounting unit and outputs numerical data indicating the state, and a state detection unit.
An inspection unit that images the board on which the components are mounted by the component mounting unit and inspects the mounting position of the components mounted on the board.
A correction value for correcting the target position is calculated using the inspection result obtained by the inspection unit, and when a new inspection result is obtained, the correction value is updated using the new inspection result. Correction value calculation unit and
A target position calculation unit that calculates the target position using the correction value,
When the operation is restarted after the component mounting unit has stopped the operation and the component mounting is performed by the component mounting unit, the current numerical data obtained by the state detection unit at the time of restarting the operation and the past stored in advance are stored. Compared with the numerical data, select at least one past correction value that was used at the time when the numerical data equal to or similar to the current numerical data was obtained, and used it before stopping the operation. A mounting board manufacturing system comprising a correction value changing unit for changing a correction value to a selected past correction value or a correction value obtained based on a plurality of past correction values. A mounting head having a holder for holding parts and mounting them on a board, and a mounting head moving unit for moving the mounting head to a target position for mounting the parts held by the holder at a component mounting position on the board. Depending on the component mounting part, the component mounting process for mounting the component on the board and the component mounting process
A state detection process that detects the state of the component mounting portion and outputs numerical data indicating the state,
An inspection process in which a board on which a component is mounted is imaged by the component mounting process to inspect the mounting position of the component mounted on the board, and an inspection process.
A correction value for correcting the target position is calculated using the inspection result obtained in the inspection step, and when a new inspection result is obtained, the correction value is updated using the new inspection result. Correction value calculation process and
A target position calculation process for calculating the target position using the correction value, and
When the operation is restarted after the component mounting unit has stopped the operation and the component mounting is performed by the component mounting unit, the current numerical data obtained in the state detection step at the time of restarting the operation and the past stored in advance are stored. Compared with the numerical data, select at least one past correction value that was used at the time when the numerical data equal to or similar to the current numerical data was obtained, and used it before stopping the operation. A mounting board manufacturing method including a correction value changing step of changing a correction value to a correction value obtained based on one past correction value or a plurality of past correction values selected.

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