JP2011199290A - 発光素子、発光素子パッケージ、及び照明システム - Google Patents
発光素子、発光素子パッケージ、及び照明システム Download PDFInfo
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- JP2011199290A JP2011199290A JP2011060508A JP2011060508A JP2011199290A JP 2011199290 A JP2011199290 A JP 2011199290A JP 2011060508 A JP2011060508 A JP 2011060508A JP 2011060508 A JP2011060508 A JP 2011060508A JP 2011199290 A JP2011199290 A JP 2011199290A
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- light emitting
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/44—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the coatings, e.g. passivation layer or anti-reflective coating
- H01L33/46—Reflective coating, e.g. dielectric Bragg reflector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
Abstract
【解決手段】本発明に従う発光素子は、第1導電型半導体層、活性層、及び第2導電型半導体層を含む発光構造物と、上記発光構造物の上に基板と、上記基板の上に第1屈折率を有する第1誘電体層と、上記第1誘電体層の上に上記第1屈折率と異なる第2屈折率を有する第2誘電体層を含んで形成された複数の誘電体層を含む第1反射層と、上記第1反射層の上に上記第1反射層を構成する複数の誘電体層の各屈折率より屈折率の小さい第2反射層と、を含む。
【選択図】図1
Description
例えば、発光素子で発生した光を電磁波(Electromagnetic Wave)と取扱う場合、このような電磁波は電場(Electric Field、E-Field)と磁場(Magnetic Field、M-Field)とが互いに垂直に交差しながら進行する。
実施形態に従うバックライトユニット1200は、導光板1210と、上記導光板1210に光を提供する発光モジュール部1240と、上記導光板1210の下に反射部材1220と、上記導光板1210、発光モジュール部1240、及び反射部材1220を収納するボトムカバー1230と、を含むことができるが、これに限定されるのではない。
Claims (11)
- 第1導電型半導体層、活性層、及び第2導電型半導体層を含む発光構造物と、
前記発光構造物の上の基板と、
前記基板の上に第1屈折率を有する第1誘電体層と、前記第1誘電体層の上に前記第1屈折率と異なる第2屈折率を有する第2誘電体層を含んで形成された複数の誘電体層を含む第1反射層と、
前記第1反射層の上に前記第1反射層を構成する複数の誘電体層の各屈折率より屈折率の小さい第2反射層と、
を含むことを特徴とする発光素子。 - 前記第1反射層の一部分に支持層が形成され、前記第2反射層は空気層を含むことを特徴とする請求項1に記載の発光素子。
- 前記第2反射層は、
前記第1反射層と空気との間の屈折率を有することを特徴とする請求項1に記載の発光素子。 - 前記第2反射層は、
SOG(Spin-on-glass)、MgF2のうち、いずれか1つ以上を含むことを特徴とする請求項3に記載の発光素子。 - 前記第1誘電体層と前記第2誘電体層の厚さは、λ/(4n×cosθ)(但し、λは光の波長、nは誘電体層の屈折率、θは光の基板に対する入射角で、0゜〜25゜の値)であることを特徴とする請求項1に記載の発光素子。
- 前記第1誘電体層の屈折率が前記第2誘電体層の屈折率より小さいことを特徴とする請求項1に記載の発光素子。
- 前記第1誘電体層の屈折率が前記基板の屈折率より小さいことを特徴とする請求項6に記載の発光素子。
- 前記第1誘電体層と前記第2誘電体層が複数の周期で積層されることを特徴とする請求項1に記載の発光素子。
- 前記支持層は、金属材質であることを特徴とする請求項2に記載の発光素子。
- パッケージ胴体と、
前記パッケージ胴体に設けられた電極層と、
前記電極層に電気的に連結された請求項1〜9の何れか1項記載の発光素子と、
を含むことを特徴とする発光素子パッケージ。 - 基板と、前記基板の上に設けられた請求項10に記載の発光素子パッケージを備える発光モジュールと、を含むことを特徴とする照明システム。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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KR1020100025075A KR101081196B1 (ko) | 2010-03-22 | 2010-03-22 | 발광소자 및 그 제조방법과 발광소자 패키지 |
KR10-2010-0025075 | 2010-03-22 |
Publications (1)
Publication Number | Publication Date |
---|---|
JP2011199290A true JP2011199290A (ja) | 2011-10-06 |
Family
ID=44202233
Family Applications (1)
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JP2011060508A Pending JP2011199290A (ja) | 2010-03-22 | 2011-03-18 | 発光素子、発光素子パッケージ、及び照明システム |
Country Status (6)
Country | Link |
---|---|
US (1) | US8742447B2 (ja) |
EP (1) | EP2369650B1 (ja) |
JP (1) | JP2011199290A (ja) |
KR (1) | KR101081196B1 (ja) |
CN (1) | CN102201519B (ja) |
TW (1) | TWI562399B (ja) |
Cited By (1)
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---|---|---|---|---|
JP2016146407A (ja) * | 2015-02-06 | 2016-08-12 | 豊田合成株式会社 | 光学多層膜および発光素子 |
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US9461201B2 (en) | 2007-11-14 | 2016-10-04 | Cree, Inc. | Light emitting diode dielectric mirror |
US9362459B2 (en) | 2009-09-02 | 2016-06-07 | United States Department Of Energy | High reflectivity mirrors and method for making same |
US9435493B2 (en) | 2009-10-27 | 2016-09-06 | Cree, Inc. | Hybrid reflector system for lighting device |
US9105824B2 (en) | 2010-04-09 | 2015-08-11 | Cree, Inc. | High reflective board or substrate for LEDs |
US9012938B2 (en) | 2010-04-09 | 2015-04-21 | Cree, Inc. | High reflective substrate of light emitting devices with improved light output |
US8764224B2 (en) | 2010-08-12 | 2014-07-01 | Cree, Inc. | Luminaire with distributed LED sources |
US8680556B2 (en) | 2011-03-24 | 2014-03-25 | Cree, Inc. | Composite high reflectivity layer |
KR101330786B1 (ko) * | 2011-04-06 | 2013-11-18 | 희성전자 주식회사 | 방열 구조를 갖는 발광다이오드 소자 및 그 제조 방법 |
US8686429B2 (en) | 2011-06-24 | 2014-04-01 | Cree, Inc. | LED structure with enhanced mirror reflectivity |
US9728676B2 (en) | 2011-06-24 | 2017-08-08 | Cree, Inc. | High voltage monolithic LED chip |
US10243121B2 (en) | 2011-06-24 | 2019-03-26 | Cree, Inc. | High voltage monolithic LED chip with improved reliability |
KR102075655B1 (ko) * | 2013-06-24 | 2020-02-10 | 엘지이노텍 주식회사 | 발광 소자 및 발광 소자 패키지 |
KR102135352B1 (ko) * | 2013-08-20 | 2020-07-17 | 엘지전자 주식회사 | 표시장치 |
US10658546B2 (en) | 2015-01-21 | 2020-05-19 | Cree, Inc. | High efficiency LEDs and methods of manufacturing |
KR101683683B1 (ko) * | 2015-06-18 | 2016-12-09 | 주식회사 세미콘라이트 | 반도체 발광소자 |
WO2016159744A1 (ko) | 2015-04-03 | 2016-10-06 | 주식회사 세미콘라이트 | 반도체 발광소자 |
EP3419050A1 (en) | 2017-06-23 | 2018-12-26 | ams International AG | Radiation-hardened package for an electronic device and method of producing a radiation-hardened package |
TWI708907B (zh) * | 2017-09-30 | 2020-11-01 | 軒帆光電科技股份有限公司 | 用於照明裝置之光源模組 |
CN114520281A (zh) | 2020-11-20 | 2022-05-20 | 隆达电子股份有限公司 | 发光装置、背光板及显示面板 |
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2010
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- 2010-12-01 EP EP10193391.9A patent/EP2369650B1/en not_active Not-in-force
- 2010-12-22 TW TW099145189A patent/TWI562399B/zh active
- 2010-12-29 CN CN201010621735.8A patent/CN102201519B/zh not_active Expired - Fee Related
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2011
- 2011-02-03 US US13/020,055 patent/US8742447B2/en active Active
- 2011-03-18 JP JP2011060508A patent/JP2011199290A/ja active Pending
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Also Published As
Publication number | Publication date |
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CN102201519B (zh) | 2015-09-09 |
EP2369650A2 (en) | 2011-09-28 |
KR20110105936A (ko) | 2011-09-28 |
US8742447B2 (en) | 2014-06-03 |
EP2369650B1 (en) | 2016-06-22 |
TWI562399B (en) | 2016-12-11 |
US20110227110A1 (en) | 2011-09-22 |
KR101081196B1 (ko) | 2011-11-07 |
EP2369650A3 (en) | 2014-06-25 |
TW201133928A (en) | 2011-10-01 |
CN102201519A (zh) | 2011-09-28 |
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