JP2011196281A - 内燃機関用点火装置 - Google Patents
内燃機関用点火装置 Download PDFInfo
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- JP2011196281A JP2011196281A JP2010065265A JP2010065265A JP2011196281A JP 2011196281 A JP2011196281 A JP 2011196281A JP 2010065265 A JP2010065265 A JP 2010065265A JP 2010065265 A JP2010065265 A JP 2010065265A JP 2011196281 A JP2011196281 A JP 2011196281A
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- 238000002485 combustion reaction Methods 0.000 title claims abstract description 49
- 239000003990 capacitor Substances 0.000 claims abstract description 21
- 230000002401 inhibitory effect Effects 0.000 abstract 1
- 238000010586 diagram Methods 0.000 description 8
- 230000007423 decrease Effects 0.000 description 3
- 230000004044 response Effects 0.000 description 3
- 230000000630 rising effect Effects 0.000 description 2
- 230000003321 amplification Effects 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000003199 nucleic acid amplification method Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 238000001721 transfer moulding Methods 0.000 description 1
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Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F02—COMBUSTION ENGINES; HOT-GAS OR COMBUSTION-PRODUCT ENGINE PLANTS
- F02P—IGNITION, OTHER THAN COMPRESSION IGNITION, FOR INTERNAL-COMBUSTION ENGINES; TESTING OF IGNITION TIMING IN COMPRESSION-IGNITION ENGINES
- F02P3/00—Other installations
- F02P3/02—Other installations having inductive energy storage, e.g. arrangements of induction coils
- F02P3/04—Layout of circuits
- F02P3/0407—Opening or closing the primary coil circuit with electronic switching means
- F02P3/0435—Opening or closing the primary coil circuit with electronic switching means with semiconductor devices
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F02—COMBUSTION ENGINES; HOT-GAS OR COMBUSTION-PRODUCT ENGINE PLANTS
- F02P—IGNITION, OTHER THAN COMPRESSION IGNITION, FOR INTERNAL-COMBUSTION ENGINES; TESTING OF IGNITION TIMING IN COMPRESSION-IGNITION ENGINES
- F02P15/00—Electric spark ignition having characteristics not provided for in, or of interest apart from, groups F02P1/00 - F02P13/00 and combined with layout of ignition circuits
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32135—Disposition the layer connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/32145—Disposition the layer connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being stacked
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48145—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being stacked
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
- H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/13—Discrete devices, e.g. 3 terminal devices
- H01L2924/1304—Transistor
- H01L2924/1305—Bipolar Junction Transistor [BJT]
- H01L2924/13055—Insulated gate bipolar transistor [IGBT]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
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- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Combustion & Propulsion (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Ignition Installations For Internal Combustion Engines (AREA)
Abstract
【解決手段】 点火コイルの1次コイルの電流を通電及び遮断自在なトランジスタ4と、ゲート電流源Vccからトランジスタのゲート端子に流れるゲート電流の通電及び遮断を制御することによって、トランジスタをオン及びオフ自在なプリドライブ回路5と、ゲート電流源とトランジスタのゲート端子との間に接続され、ゲート電流源とトランジスタのゲート端子との間における電気接続の接続及び切断を制御することによって、プリドライブ回路に対して前記トランジスタのオン及びオフの駆動を許可及び禁止自在なインヒビット回路6と、インヒビット回路とトランジスタのゲート端子との間に接続されて、抵抗素子及びキャパシタを有するCR回路7と、を備える。
【選択図】図1
Description
、ゲート端子に印加される電圧の変化を相対的になだらかなものとし、点火コイルに不要な点火が発生することをより確実に抑制することができる。
詳しくは、プリドライブ回路5は、典型的にはNPNバイポーラトランジスタであるトランジスタ5aを備え、かかるトランジスタ5aのコレクタ端子、エミッタ端子、及びベース端子はそれぞれ、トランジスタ4のゲート電流の電流経路、接地電位、及びECU8に接続されている。プリドライブ回路5は、ECU8からトランジスタ5aのベース端子に供給されるIGN信号に応じてトランジスタ5aをオン/オフすることによって、ゲート電流源Vccからトランジスタ4のゲート端子へのゲート電流の通電/遮断を制御する。
トランジスタ4を相対的になだらかに切り替わらせて、点火コイルIGの1次コイル2を通電状態から非通電状態に相対的になだらかに切り替わらせ、2次コイル3にも相対的になだらかな誘導起電力を立ち上がらせて、点火プラグPに飛び火現象による不要な点火を発生させることなく所定のタイミングで確実に点火動作をさせることを満足する条件である。
タ4のゲート端子には電圧が印加されることはなく、トランジスタ4はスイッチング動作をすることなくオフ状態に維持される。
を逸脱しない範囲で適宜変更可能であることはもちろんである。
2…1次コイル
3…2次コイル
4…トランジスタ
5…プリドライブ回路
5a…NPNバイポーラトランジスタ
6…インヒビット回路
6a…PNPバイポーラトランジスタ
7…CR回路
8…ECU
B…バッテリ
C…キャパシタ
IG…点火コイル
P…点火プラグ
R1、R2、R3、R4…抵抗素子
Vcc…ゲート電流源
PK…パッケージ
SB…支持体
Claims (5)
- 点火コイルの1次コイルに流れる電流を通電及び遮断自在なトランジスタと、
ゲート電流源から前記トランジスタのゲート端子に流れるゲート電流の通電及び遮断を制御することによって、前記トランジスタをオン及びオフ自在なプリドライブ回路と、
前記ゲート電流源と前記トランジスタの前記ゲート端子との間に接続され、前記ゲート電流源と前記トランジスタの前記ゲート端子との間における電気接続の接続及び切断を制御することによって、前記プリドライブ回路に対して前記トランジスタのオン及びオフの駆動を許可及び禁止自在なインヒビット回路と、
前記インヒビット回路と前記トランジスタの前記ゲート端子との間に接続されて、抵抗素子及びキャパシタを有するCR回路と、
を備えることを特徴とする内燃機関用点火装置。 - 前記トランジスタは、IGBTから成ることを特徴とする請求項1に記載の内燃機関用点火装置。
- 前記CR回路は、前記キャパシタに蓄えられた電荷に起因する電流を前記IGBTのゲート端子に流すことを特徴とする請求項2に記載の内燃機関用点火装置。
- 前記CR回路の時定数は、前記IGBTのゲート端子に印加される電圧の変化を相対的になだらかにするように設定されていることを特徴とする請求項2又は3に記載の内燃機関用点火装置。
- 前記トランジスタ、前記プリドライブ回路、前記インヒビット回路、及び前記CR回路は、同一の集積回路内に配置され、前記集積回路と前記プリドライブ回路及び前記インヒビット回路の動作を制御するマイクロコンピュータとが同一のパッケージ内に配置されていることを特徴とする請求項1から4のいずれかに記載の内燃機関用点火装置。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010065265A JP5517686B2 (ja) | 2010-03-19 | 2010-03-19 | 内燃機関用点火装置 |
TW100108530A TWI468584B (zh) | 2010-03-19 | 2011-03-14 | 用於內燃機之點火裝置 |
CN201180012321.8A CN103109079B (zh) | 2010-03-19 | 2011-03-15 | 内燃机用点火装置 |
PCT/JP2011/056020 WO2011115097A1 (ja) | 2010-03-19 | 2011-03-15 | 内燃機関用点火装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010065265A JP5517686B2 (ja) | 2010-03-19 | 2010-03-19 | 内燃機関用点火装置 |
Publications (2)
Publication Number | Publication Date |
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JP2011196281A true JP2011196281A (ja) | 2011-10-06 |
JP5517686B2 JP5517686B2 (ja) | 2014-06-11 |
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JP2010065265A Active JP5517686B2 (ja) | 2010-03-19 | 2010-03-19 | 内燃機関用点火装置 |
Country Status (4)
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JP (1) | JP5517686B2 (ja) |
CN (1) | CN103109079B (ja) |
TW (1) | TWI468584B (ja) |
WO (1) | WO2011115097A1 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2017150345A (ja) * | 2016-02-23 | 2017-08-31 | 日立オートモティブシステムズ阪神株式会社 | 内燃機関用点火装置 |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106170621B (zh) * | 2014-06-06 | 2017-06-23 | 新电元工业株式会社 | 点火装置 |
JP6631304B2 (ja) * | 2016-02-17 | 2020-01-15 | 株式会社デンソー | 点火装置 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0431664A (ja) * | 1990-05-25 | 1992-02-03 | Hanshin Electric Co Ltd | 内燃機関の点火装置 |
JPH08277769A (ja) * | 1995-04-04 | 1996-10-22 | Mitsubishi Electric Corp | 内燃機関用点火装置 |
JP2003049756A (ja) * | 2001-08-07 | 2003-02-21 | Denso Corp | 内燃機関用点火装置 |
JP2008144657A (ja) * | 2006-12-08 | 2008-06-26 | Mitsubishi Electric Corp | 内燃機関用点火制御システムの点火装置 |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1284362B1 (en) * | 2000-05-26 | 2005-07-27 | Hitachi, Ltd. | Ignition device for internal combustion engine |
-
2010
- 2010-03-19 JP JP2010065265A patent/JP5517686B2/ja active Active
-
2011
- 2011-03-14 TW TW100108530A patent/TWI468584B/zh active
- 2011-03-15 WO PCT/JP2011/056020 patent/WO2011115097A1/ja active Application Filing
- 2011-03-15 CN CN201180012321.8A patent/CN103109079B/zh active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0431664A (ja) * | 1990-05-25 | 1992-02-03 | Hanshin Electric Co Ltd | 内燃機関の点火装置 |
JPH08277769A (ja) * | 1995-04-04 | 1996-10-22 | Mitsubishi Electric Corp | 内燃機関用点火装置 |
JP2003049756A (ja) * | 2001-08-07 | 2003-02-21 | Denso Corp | 内燃機関用点火装置 |
JP2008144657A (ja) * | 2006-12-08 | 2008-06-26 | Mitsubishi Electric Corp | 内燃機関用点火制御システムの点火装置 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2017150345A (ja) * | 2016-02-23 | 2017-08-31 | 日立オートモティブシステムズ阪神株式会社 | 内燃機関用点火装置 |
Also Published As
Publication number | Publication date |
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CN103109079A (zh) | 2013-05-15 |
TW201200721A (en) | 2012-01-01 |
TWI468584B (zh) | 2015-01-11 |
WO2011115097A1 (ja) | 2011-09-22 |
JP5517686B2 (ja) | 2014-06-11 |
CN103109079B (zh) | 2015-08-12 |
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