JP2011192696A - 電子回路装置 - Google Patents
電子回路装置 Download PDFInfo
- Publication number
- JP2011192696A JP2011192696A JP2010055410A JP2010055410A JP2011192696A JP 2011192696 A JP2011192696 A JP 2011192696A JP 2010055410 A JP2010055410 A JP 2010055410A JP 2010055410 A JP2010055410 A JP 2010055410A JP 2011192696 A JP2011192696 A JP 2011192696A
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- Prior art keywords
- gate
- junction fet
- diode
- electrode
- capacitor
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Abstract
【解決手段】本願発明は、ノーマリオフ型の炭化珪素接合FETのゲートに、接合FETのゲート容量と同等か少し小さな容量を持つ素子を接続したものである。
【選択図】図1
Description
先ず、本願において開示される発明の代表的な実施の形態について概要を説明する。
(a)ゲート電極、ソース電極およびドレイン電極を有する炭化珪素系のノーマリオン型接合FET;
(b)前記ノーマリオン型接合FETの前記ゲート電極とゲート駆動回路の間に挿入された素子または素子群、
ここで、前記素子または、相互に並列接続された素子群は、コンデンサまたは、前記ゲート電極に向かって逆方向となるダイオードを含み、これら以外の並列接続素子を含まない。
(c)前記接合FETと、前記コンデンサまたは前記ダイオードを収容し、第1、第2および第3のピンを有するパッケージ;
(d)前記第1のピンと、前記接合FETのドレイン電極間の電流通路を構成する第1の半田層;
(e)前記第2のピンと、前記ダイオードのカソード電極または前記コンデンサの一方の電極間の電流通路を構成する第2の半田層;
(f)前記接合FETの前記ゲート電極と、前記ダイオードのアノード電極または前記コンデンサの他方の電極間の電流通路を構成する第1のボンディングワイヤ;
(g)前記第3のピンと、前記接合FETの前記ソース電極間の電流通路を構成する第2のボンディングワイヤ。
(c)前記接合FETと、前記コンデンサおよび前記ダイオードを収容し、第1、第2および第3のピンを有するパッケージ;
(d)前記第1のピンと、前記接合FETのドレイン電極間の電流通路を構成する第1の半田層;
(e)前記第2のピンと、前記ダイオードのカソード電極および前記コンデンサの一方の電極間の電流通路を構成する第2の半田層;
(f)前記接合FETの前記ゲート電極と、前記ダイオードのアノード電極および前記コンデンサの他方の電極間の電流通路を構成する第1のボンディングワイヤ;
(g)前記第3のピンと、前記接合FETの前記ソース電極間の電流通路を構成する第2のボンディングワイヤ。
(x1)前記接合FETのゲート電極;
(x2)前記接合FETのゲートパッド;
(x3)前記ゲート配線と前記ゲートパッド間において、これらとともに前記コンデンサを構成する絶縁膜。
(x1)前記接合FETのゲート電極;
(x2)前記接合FETのゲートパッド;
(x4)前記ゲート配線と前記ゲートパッド間において、これらとともに前記ダイオードとしてのPINダイオードを構成するように順に連続して設けられたP型半導体領域、第1のN型半導体領域、および、これよりも濃度の高い第2のN型半導体領域。
(x1)前記接合FETのゲート電極;
(x2)前記接合FETのゲートパッド;
(x3)前記ゲート配線と前記ゲートパッド間において、これらとともに前記コンデンサを構成する絶縁膜;
(x4)前記ゲート配線と前記ゲートパッド間において、これらとともに前記ダイオードとしてのPINダイオードを構成するように順に連続して設けられたP型半導体領域、第1のN型半導体領域、および、これよりも濃度の高い第2のN型半導体領域。
(x1)前記接合FETのゲート電極;
(x2)前記接合FETのゲートパッド;
(x4)前記ゲート配線と前記ゲートパッド間において、これらとともに前記ダイオードを構成するショットキ接合部。
(x1)前記接合FETのゲート電極;
(x2)前記接合FETのゲートパッド;
(x3)前記ゲート配線と前記ゲートパッド間において、これらとともに前記コンデンサを構成する絶縁膜;
(x4)前記ゲート配線と前記ゲートパッド間において、これらとともに前記ダイオードを構成するショットキ接合部。
(a)ゲート電極、ソース電極およびドレイン電極を有する炭化珪素系のノーマリオン型接合FET;
(b)前記ノーマリオン型接合FETの前記ゲート電極とゲート駆動回路の間に挿入され、容量成分を有する素子または、相互に並列接続され、全体として容量成分を有する素子群、
ここで、前記容量成分は、前記接合FETのゲート容量と同程度、または、同程度であって且つ、それよりも小さく、更に電圧依存性を実質的に持たないか、または、負の電圧依存性を持つ。
(c)前記接合FETと、前記コンデンサまたは前記ダイオードを収容し、第1、第2および第3のピンを有するパッケージ;
(d)前記第1のピンと、前記接合FETのドレイン電極間の電流通路を構成する第1の半田層;
(e)前記第2のピンと、前記ダイオードのカソード電極または前記コンデンサの一方の電極間の電流通路を構成する第2の半田層;
(f)前記接合FETの前記ゲート電極と、前記ダイオードのアノード電極または前記コンデンサの他方の電極間の電流通路を構成する第1のボンディングワイヤ;
(g)前記第3のピンと、前記接合FETの前記ソース電極間の電流通路を構成する第2のボンディングワイヤ。
(c)前記接合FETと、前記コンデンサおよび前記ダイオードを収容し、第1、第2および第3のピンを有するパッケージ;
(d)前記第1のピンと、前記接合FETのドレイン電極間の電流通路を構成する第1の半田層;
(e)前記第2のピンと、前記ダイオードのカソード電極および前記コンデンサの一方の電極間の電流通路を構成する第2の半田層;
(f)前記接合FETの前記ゲート電極と、前記ダイオードのアノード電極および前記コンデンサの他方の電極間の電流通路を構成する第1のボンディングワイヤ;
(g)前記第3のピンと、前記接合FETの前記ソース電極間の電流通路を構成する第2のボンディングワイヤ。
(x1)前記接合FETのゲート電極;
(x2)前記接合FETのゲートパッド;
(x3)前記ゲート配線と前記ゲートパッド間において、これらとともに前記コンデンサを構成する絶縁膜。
(x1)前記接合FETのゲート電極;
(x2)前記接合FETのゲートパッド;
(x4)前記ゲート配線と前記ゲートパッド間において、これらとともに前記ダイオードとしてのPINダイオードを構成するように順に連続して設けられたP型半導体領域、第1のN型半導体領域、および、これよりも濃度の高い第2のN型半導体領域。
(x1)前記接合FETのゲート電極;
(x2)前記接合FETのゲートパッド;
(x3)前記ゲート配線と前記ゲートパッド間において、これらとともに前記コンデンサを構成する絶縁膜;
(x4)前記ゲート配線と前記ゲートパッド間において、これらとともに前記ダイオードとしてのPINダイオードを構成するように順に連続して設けられたP型半導体領域、第1のN型半導体領域、および、これよりも濃度の高い第2のN型半導体領域。
(x1)前記接合FETのゲート電極;
(x2)前記接合FETのゲートパッド;
(x4)前記ゲート配線と前記ゲートパッド間において、これらとともに前記ダイオードを構成するショットキ接合部。
(x1)前記接合FETのゲート電極;
(x2)前記接合FETのゲートパッド;
(x3)前記ゲート配線と前記ゲートパッド間において、これらとともに前記コンデンサを構成する絶縁膜;
(x4)前記ゲート配線と前記ゲートパッド間において、これらとともに前記ダイオードを構成するショットキ接合部。
1.本願において、実施の態様の記載は、必要に応じて、便宜上複数のセクションに分けて記載する場合もあるが、特にそうでない旨明示した場合を除き、これらは相互に独立別個のものではなく、単一の例の各部分、一方が他方の一部詳細または一部または全部の変形例等である。また、原則として、同様の部分は繰り返しを省略する。また、実施の態様における各構成要素は、特にそうでない旨明示した場合、理論的にその数に限定される場合および文脈から明らかにそうでない場合を除き、必須のものではない。
実施の形態について更に詳述する。各図中において、同一または同様の部分は同一または類似の記号または参照番号で示し、説明は原則として繰り返さない。
このセクションでは、原理的説明を中心とするため、ノーマリオフ型の炭化珪素系接合FET(1)の要部のみを図示して示す。周辺構造及び製法は、セクション7及び8において、説明する。
図10は本発明の第2の実施の形態の回路図を示している。第1の実施の形態との違いは、コンデンサ2の代わりの容量成分をダイオード3が兼ねていることにある。従って、ダイオード3の容量は第1の実施の形態に比べ桁で大きくなっている。炭化珪素の接合FET1は第1の実施の形態と同じものである。
本実施の形態では第1の実施の形態と同様に、接合FET1はノーマリオフであればトレンチ型である必要はなく、プレーナ型でもその他の構造でも同様の効果がある。また、ダイオード3は、シリコンのpnダイオードである必要はなく、逆耐圧が15V程度あれば、シリコンのショットキーバリアダイオードでも炭化珪素のショットキーバリアダイオードでも窒化ガリウムのショットキーバリアダイオードでもその他のダイオードでもよい。
本実施の形態の第1および2の実施の形態との違いは、コンデンサ2およびダイオード3をデバイスのチップ内に内蔵している点にある。本実施の形態の説明をする前に、図14および図15(図14のゲートパッド周辺領域AGのA−A’断面)を用いて従来のチップ構成とゲートパッドの構造を説明する。従来の接合FET1はチップ表面にゲートパッド13とソースパッド19が配置されており、ソースパッド19の直下にデバイスのアクティブ領域28がある。ゲートの配線12は基板上絶縁膜11上に配置されておりゲートパッド13に接続されている。また、ゲートパッド13を覆うようにパッシベーション膜14が形成されている。
図22に本発明の第4の実施の形態の断面構造図を示す。本実施の形態の第3の実施の形態との違いは、ゲートパッドの領域AGに形成するのがキャパシタ2だけであるという点である。製造方法としては、第3の実施の形態の製造方法からダイオード2となるポリシリコンを成膜するプロセス、ポリシリコンをパターニングするプロセス、ポリシリコン上に開口するプロセスを除いたものであり、第3の実施の形態に比べプロセスが簡素であるという特徴を持つ。
図23に本発明の第5の実施の形態の断面構造図を示す。本実施の形態は第2の実施の形態のダイオード3をデバイスのチップ1に内蔵したものである。製造方法としては、第3の実施の形態の製造方法からキャパシタ部分の開口を行うプロセスとキャパシタ2の絶縁膜25を成膜するプロセスを除いたものである。ダイオード3の容量特性に関しては第2の実施の形態と同様で、ダイオード3に電圧が12.5Vかかったときの容量が500pFになるように設計してある。動作としても第2の実施の形態と同様である。
図24に本発明の第6の実施の形態の断面構造図を示す。本実施の形態では、第5の実施の形態のダイオード3が炭化珪素基板1を用いたショットキーバリアダイオード17になっている。実施の形態の1から5の図では省略したが、ゲートパッドの下にはターミネーションのp領域15となっており、その上にはゲートのコンタクトをとるp+領域16(ここでは、ゲート電極12として作用する)がある。本実施の形態では、p+領域16の上にショットキーメタル17mとしてTiを形成している。ショットキーメタル17mとしては、NiやMoなど他のメタルでも問題ないが、このショットキーバリアダイオード17の容量特性としては、第2の実施の形態で説明した特性を満足する必要がある。本実施の形態の動作としては第2の実施の形態と同様である。
図29に図14と同様な、本願の第1の実施の形態の炭化珪素系接合FET(1)のチップ上面図を示す。図29に示すように、チップ1上には、そのほとんどを占めるソースパッド19、およびゲートパッド13が設けられている。ソースパッド19とほぼ同じ領域には、アクティブ領域28が設けられており、これらの周辺近傍には、P型ターミネーション領域15(図24以外では、簡潔性を確保するために表示していない)が設けられている。この図のX−X’断面を図30に示す。図30のアクティブセル領域切り出し部ACは、図2および図25から図28が対応し、ゲートパッド周辺領域AGは、図15から図24が対応する。
このセクションでは、セクション7で説明した半導体装置(電子回路装置)1のアクティブセル領域切り出し部AC(図2に対応)について、その製造方法(ウエハプロセス)の概要を説明する。
以上本発明者によってなされた発明を実施形態に基づいて具体的に説明したが、本発明はそれに限定されるものではなく、その要旨を逸脱しない範囲において種々変更可能であることは言うまでもない。
1a 半導体チップの表面(ソース側主面)
1b 半導体チップの裏面(ドレイン側主面)
2 コンデンサ
3 ダイオード
3a ダイオードのN+領域
3b ダイオードのN−領域
3c ダイオードのP+領域
4 N+型ドレイン領域
5 N−型ドリフト領域
6 N+型ソース領域
7 P+型ゲート領域
8 トレンチ
9 ドレイン電極
10 ソース電極
11 基板上絶縁膜
12 ゲート配線(ゲート電極)
13 ゲートパッド
14 ファイナルパッシベーション膜
15 P型ターミネーション領域
16 P+型ゲートコンタクト領域
17 ショットキダイオード
17m ショットキメタル層
17j ショットキ接合部
18 挿入素子または素子群
19 ソースパッド
20 パッケージ
21 第1の半田層
22 第2の半田層
23 第1のボンディングワイヤ
24 第2のボンディングワイヤ
25 キャパシタ絶縁膜
26 シリサイド層
27 層間絶縁膜
28 アクティブ領域
29 ハードマスク膜(酸化シリコン膜)
30 ソースコンタクトホール
AG ゲートパッド周辺領域
AC アクティブセル領域切り出し部
C1 挿入素子または素子群の容量成分
C2 ゲート容量
D 外部ドレイン端子(第1のピン)
G 外部ゲート端子(第2のピン)
R3 ゲートのリーク経路の等価抵抗
S 外部ソース端子(第3のピン)
VG 外部ゲート端子の電圧
Vg ゲート電極の電圧
Claims (20)
- 以下を含む電子回路装置:
(a)ゲート電極、ソース電極およびドレイン電極を有する炭化珪素系のノーマリオン型接合FET;
(b)前記ノーマリオン型接合FETの前記ゲート電極とゲート駆動回路の間に挿入された素子または素子群、
ここで、前記素子または、相互に並列接続された素子群は、コンデンサまたは、前記ゲート電極に向かって逆方向となるダイオードを含み、これら以外の並列接続素子を含まない。 - 前記1項の電子回路装置において、前記素子または素子群は、コンデンサおよび、前記ダイオードを含む。
- 前記2項の電子回路装置において、前記素子または素子群の印加電圧が12.5Vのとき、前記素子または素子群の容量が、前記接合FETのゲート電圧が2.5Vのときのゲート容量の1/3から1/7である。
- 前記1項の電子回路装置において、更に、以下を含む:
(c)前記接合FETと、前記コンデンサまたは前記ダイオードを収容し、第1、第2および第3のピンを有するパッケージ;
(d)前記第1のピンと、前記接合FETのドレイン電極間の電流通路を構成する第1の半田層;
(e)前記第2のピンと、前記ダイオードのカソード電極または前記コンデンサの一方の電極間の電流通路を構成する第2の半田層;
(f)前記接合FETの前記ゲート電極と、前記ダイオードのアノード電極または前記コンデンサの他方の電極間の電流通路を構成する第1のボンディングワイヤ;
(g)前記第3のピンと、前記接合FETの前記ソース電極間の電流通路を構成する第2のボンディングワイヤ。 - 前記2項の電子回路装置において、更に、以下を含む:
(c)前記接合FETと、前記コンデンサおよび前記ダイオードを収容し、第1、第2および第3のピンを有するパッケージ;
(d)前記第1のピンと、前記接合FETのドレイン電極間の電流通路を構成する第1の半田層;
(e)前記第2のピンと、前記ダイオードのカソード電極および前記コンデンサの一方の電極間の電流通路を構成する第2の半田層;
(f)前記接合FETの前記ゲート電極と、前記ダイオードのアノード電極および前記コンデンサの他方の電極間の電流通路を構成する第1のボンディングワイヤ;
(g)前記第3のピンと、前記接合FETの前記ソース電極間の電流通路を構成する第2のボンディングワイヤ。 - 前記1項の電子回路装置において、前記接合FETは、半導体チップ内に形成されており、この半導体チップは、以下を含む:
(x1)前記接合FETのゲート電極;
(x2)前記接合FETのゲートパッド;
(x3)前記ゲート配線と前記ゲートパッド間において、これらとともに前記コンデンサを構成する絶縁膜。 - 前記1項の電子回路装置において、前記接合FETは、半導体チップ内に形成されており、この半導体チップは、以下を含む:
(x1)前記接合FETのゲート電極;
(x2)前記接合FETのゲートパッド;
(x4)前記ゲート配線と前記ゲートパッド間において、これらとともに前記ダイオードとしてのPINダイオードを構成するように順に連続して設けられたP型半導体領域、第1のN型半導体領域、および、これよりも濃度の高い第2のN型半導体領域。 - 前記2項の電子回路装置において、前記接合FETは、半導体チップ内に形成されており、この半導体チップは、以下を含む:
(x1)前記接合FETのゲート電極;
(x2)前記接合FETのゲートパッド;
(x3)前記ゲート配線と前記ゲートパッド間において、これらとともに前記コンデンサを構成する絶縁膜;
(x4)前記ゲート配線と前記ゲートパッド間において、これらとともに前記ダイオードとしてのPINダイオードを構成するように順に連続して設けられたP型半導体領域、第1のN型半導体領域、および、これよりも濃度の高い第2のN型半導体領域。 - 前記1項の電子回路装置において、前記接合FETは、半導体チップ内に形成されており、この半導体チップは、以下を含む:
(x1)前記接合FETのゲート電極;
(x2)前記接合FETのゲートパッド;
(x4)前記ゲート配線と前記ゲートパッド間において、これらとともに前記ダイオードを構成するショットキ接合部。 - 前記2項の電子回路装置において、前記接合FETは、半導体チップ内に形成されており、この半導体チップは、以下を含む:
(x1)前記接合FETのゲート電極;
(x2)前記接合FETのゲートパッド;
(x3)前記ゲート配線と前記ゲートパッド間において、これらとともに前記コンデンサを構成する絶縁膜;
(x4)前記ゲート配線と前記ゲートパッド間において、これらとともに前記ダイオードを構成するショットキ接合部。 - 以下を含む電子回路装置:
(a)ゲート電極、ソース電極およびドレイン電極を有する炭化珪素系のノーマリオン型接合FET;
(b)前記ノーマリオン型接合FETの前記ゲート電極とゲート駆動回路の間に挿入され、容量成分を有する素子または、相互に並列接続され、全体として容量成分を有する素子群、
ここで、前記容量成分は、前記接合FETのゲート容量と同程度、または、同程度であって且つ、それよりも小さく、更に電圧依存性を実質的に持たないか、または、負の電圧依存性を持つ。 - 前記11項の電子回路装置において、前記容量成分を有する素子または素子群の印加電圧が12.5Vのときの容量が、前記接合FETのゲート電圧が2.5Vのときのゲート容量の1/3から1/7である。
- 前記11項の電子回路装置において、前記素子は、コンデンサまたは前記ゲート電極に向かって逆方向となるダイオードである。
- 前記11項の電子回路装置において、前記素子群は、コンデンサおよび前記ゲート電極に向かって逆方向となるダイオードである。
- 前記14項の電子回路装置において、前記素子又は素子群は、前記コンデンサおよび前記ダイオード以外の素子を有さない。
- 前記13項の電子回路装置において、更に、以下を含む:
(c)前記接合FETと、前記コンデンサまたは前記ダイオードを収容し、第1、第2および第3のピンを有するパッケージ;
(d)前記第1のピンと、前記接合FETのドレイン電極間の電流通路を構成する第1の半田層;
(e)前記第2のピンと、前記ダイオードのカソード電極または前記コンデンサの一方の電極間の電流通路を構成する第2の半田層;
(f)前記接合FETの前記ゲート電極と、前記ダイオードのアノード電極または前記コンデンサの他方の電極間の電流通路を構成する第1のボンディングワイヤ;
(g)前記第3のピンと、前記接合FETの前記ソース電極間の電流通路を構成する第2のボンディングワイヤ。 - 前記14項の電子回路装置において、更に、以下を含む:
(c)前記接合FETと、前記コンデンサおよび前記ダイオードを収容し、第1、第2および第3のピンを有するパッケージ;
(d)前記第1のピンと、前記接合FETのドレイン電極間の電流通路を構成する第1の半田層;
(e)前記第2のピンと、前記ダイオードのカソード電極および前記コンデンサの一方の電極間の電流通路を構成する第2の半田層;
(f)前記接合FETの前記ゲート電極と、前記ダイオードのアノード電極および前記コンデンサの他方の電極間の電流通路を構成する第1のボンディングワイヤ;
(g)前記第3のピンと、前記接合FETの前記ソース電極間の電流通路を構成する第2のボンディングワイヤ。 - 前記13項の電子回路装置において、前記接合FETは、半導体チップ内に形成されており、この半導体チップは、以下を含む:
(x1)前記接合FETのゲート電極;
(x2)前記接合FETのゲートパッド;
(x3)前記ゲート配線と前記ゲートパッド間において、これらとともに前記コンデンサを構成する絶縁膜。 - 前記13項の電子回路装置において、前記接合FETは、半導体チップ内に形成されており、この半導体チップは、以下を含む:
(x1)前記接合FETのゲート電極;
(x2)前記接合FETのゲートパッド;
(x4)前記ゲート配線と前記ゲートパッド間において、これらとともに前記ダイオードとしてのPINダイオードを構成するように順に連続して設けられたP型半導体領域、第1のN型半導体領域、および、これよりも濃度の高い第2のN型半導体領域。 - 前記14項の電子回路装置において、前記接合FETは、半導体チップ内に形成されており、この半導体チップは、以下を含む:
(x1)前記接合FETのゲート電極;
(x2)前記接合FETのゲートパッド;
(x3)前記ゲート配線と前記ゲートパッド間において、これらとともに前記コンデンサを構成する絶縁膜;
(x4)前記ゲート配線と前記ゲートパッド間において、これらとともに前記ダイオードとしてのPINダイオードを構成するように順に連続して設けられたP型半導体領域、第1のN型半導体領域、および、これよりも濃度の高い第2のN型半導体領域。
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JPS5942492B2 (ja) * | 1976-11-18 | 1984-10-15 | ソニー株式会社 | プツシユプルパルス増巾回路 |
JP2004134547A (ja) | 2002-10-10 | 2004-04-30 | Hitachi Ltd | 半導体装置 |
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2010
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2011
- 2011-03-08 US US13/042,528 patent/US8390001B2/en not_active Expired - Fee Related
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Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH09154813A (ja) * | 1995-12-04 | 1997-06-17 | Olympus Optical Co Ltd | 電子内視鏡装置 |
JP2009021461A (ja) * | 2007-07-13 | 2009-01-29 | Renesas Technology Corp | 半導体装置 |
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US20150041829A1 (en) | 2015-02-12 |
JP5484138B2 (ja) | 2014-05-07 |
US9293453B2 (en) | 2016-03-22 |
US20110220916A1 (en) | 2011-09-15 |
US8390001B2 (en) | 2013-03-05 |
US8872191B2 (en) | 2014-10-28 |
US20130056754A1 (en) | 2013-03-07 |
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