JP2011176546A - 弾性表面波デバイス、発振器、モジュール装置 - Google Patents
弾性表面波デバイス、発振器、モジュール装置 Download PDFInfo
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- JP2011176546A JP2011176546A JP2010038404A JP2010038404A JP2011176546A JP 2011176546 A JP2011176546 A JP 2011176546A JP 2010038404 A JP2010038404 A JP 2010038404A JP 2010038404 A JP2010038404 A JP 2010038404A JP 2011176546 A JP2011176546 A JP 2011176546A
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- surface acoustic
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- 238000010897 surface acoustic wave method Methods 0.000 title claims abstract description 70
- 229910004298 SiO 2 Inorganic materials 0.000 claims abstract description 172
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 98
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 claims abstract description 57
- 235000012239 silicon dioxide Nutrition 0.000 claims abstract description 49
- 239000000377 silicon dioxide Substances 0.000 claims abstract description 49
- 239000000758 substrate Substances 0.000 claims abstract description 48
- 229910052594 sapphire Inorganic materials 0.000 claims abstract description 40
- 239000010980 sapphire Substances 0.000 claims abstract description 40
- 230000008878 coupling Effects 0.000 description 16
- 238000010168 coupling process Methods 0.000 description 16
- 238000005859 coupling reaction Methods 0.000 description 16
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 10
- 230000001902 propagating effect Effects 0.000 description 8
- 244000126211 Hericium coralloides Species 0.000 description 7
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 6
- 229910052782 aluminium Inorganic materials 0.000 description 6
- 229910000838 Al alloy Inorganic materials 0.000 description 4
- 239000013078 crystal Substances 0.000 description 4
- 230000005284 excitation Effects 0.000 description 4
- PIGFYZPCRLYGLF-UHFFFAOYSA-N Aluminum nitride Chemical compound [Al]#N PIGFYZPCRLYGLF-UHFFFAOYSA-N 0.000 description 3
- 238000005530 etching Methods 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 238000005259 measurement Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 230000001681 protective effect Effects 0.000 description 3
- 239000011787 zinc oxide Substances 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 239000000428 dust Substances 0.000 description 2
- 238000000206 photolithography Methods 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- 238000007740 vapor deposition Methods 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000001312 dry etching Methods 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 230000014509 gene expression Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000013508 migration Methods 0.000 description 1
- 230000005012 migration Effects 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
Images
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- Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010038404A JP2011176546A (ja) | 2010-02-24 | 2010-02-24 | 弾性表面波デバイス、発振器、モジュール装置 |
| US12/977,525 US8624690B2 (en) | 2009-12-28 | 2010-12-23 | Surface acoustic wave device, oscillator, module apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010038404A JP2011176546A (ja) | 2010-02-24 | 2010-02-24 | 弾性表面波デバイス、発振器、モジュール装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2011176546A true JP2011176546A (ja) | 2011-09-08 |
| JP2011176546A5 JP2011176546A5 (https=) | 2013-02-28 |
Family
ID=44689008
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2010038404A Withdrawn JP2011176546A (ja) | 2009-12-28 | 2010-02-24 | 弾性表面波デバイス、発振器、モジュール装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2011176546A (https=) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2021516015A (ja) * | 2018-03-07 | 2021-06-24 | アールエフ360・ヨーロップ・ゲーエムベーハー | マルチプルレイヤシステム、製造方法およびマルチプルレイヤシステム上に形成されるsawデバイス |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04109709A (ja) * | 1990-08-29 | 1992-04-10 | Sanyo Electric Co Ltd | 弾性表面波素子 |
| JPH08316779A (ja) * | 1995-05-15 | 1996-11-29 | Sanyo Electric Co Ltd | 弾性表面波素子 |
| JP2002152000A (ja) * | 2000-11-14 | 2002-05-24 | Seiko Epson Corp | 弾性表面波素子 |
| JP2002237737A (ja) * | 2000-12-05 | 2002-08-23 | Ngk Insulators Ltd | 弾性表面波デバイス用基板、その製造方法およびそれを用いた弾性表面波デバイス |
| JP2008244523A (ja) * | 2007-03-23 | 2008-10-09 | Seiko Epson Corp | 弾性表面波素子および電子機器 |
-
2010
- 2010-02-24 JP JP2010038404A patent/JP2011176546A/ja not_active Withdrawn
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04109709A (ja) * | 1990-08-29 | 1992-04-10 | Sanyo Electric Co Ltd | 弾性表面波素子 |
| JPH08316779A (ja) * | 1995-05-15 | 1996-11-29 | Sanyo Electric Co Ltd | 弾性表面波素子 |
| JP2002152000A (ja) * | 2000-11-14 | 2002-05-24 | Seiko Epson Corp | 弾性表面波素子 |
| JP2002237737A (ja) * | 2000-12-05 | 2002-08-23 | Ngk Insulators Ltd | 弾性表面波デバイス用基板、その製造方法およびそれを用いた弾性表面波デバイス |
| JP2008244523A (ja) * | 2007-03-23 | 2008-10-09 | Seiko Epson Corp | 弾性表面波素子および電子機器 |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2021516015A (ja) * | 2018-03-07 | 2021-06-24 | アールエフ360・ヨーロップ・ゲーエムベーハー | マルチプルレイヤシステム、製造方法およびマルチプルレイヤシステム上に形成されるsawデバイス |
| JP7432518B2 (ja) | 2018-03-07 | 2024-02-16 | アールエフ360・シンガポール・ピーティーイー・リミテッド | マルチプルレイヤシステム、製造方法およびマルチプルレイヤシステム上に形成されるsawデバイス |
| US11949400B2 (en) | 2018-03-07 | 2024-04-02 | Rf360 Singapore Pte. Ltd. | Multiple layer system, method of manufacture and saw device formed on the multiple layer system |
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| A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20130111 |
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