JP2011155234A - Flexible circuit board with waterproof member, and method of manufacturing the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a flexible circuit board which has high waterproofing performance and is easy to manufacture. <P>SOLUTION: The flexible circuit board with a waterproof member includes a flexible circuit board 5 inserted into the casing of an electric apparatus, and the waterproof member 7 which hermetically seals a gap between the casing and the flexible circuit board to achieve waterproofing, and the waterproofing member is made of two kinds of flexible circuit board-side resins 9a and 9b and casing-side resins 8a and 8b. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a flexible circuit board with a waterproof member, and more particularly to a flexible circuit board used in a mobile phone and a method for manufacturing the same.

  Recent mobile phones are required to have high waterproof performance.

  Usually, in a mobile phone, the first housing and the second housing are connected by a hinge portion. FIG. 1 is a cross-sectional view of the vicinity of a hinge portion of a mobile phone. In the mobile phone 1, the hinge portion 3 includes a first housing 2 a in which electronic components and a circuit board 4 a are installed, and a second housing 2 b in which electronic components and a circuit board 4 b are installed. It is connected. The electronic components or the circuit board 4 in each case are electrically connected by the flexible circuit board 5. Specifically, connectors 6a and 6b at both ends of the flexible circuit board are connected to the circuit boards 4a and 4b. Alternatively, the connectors 6a and 6b at both ends of the flexible circuit board are directly connected to the electronic components in the housing.

  At this time, the flexible circuit board 5 once goes out of the first housing 2a, passes through the inside of the hinge portion 3, and is connected to the second housing 2b. For this reason, if the waterproofing between the housing 2 and the flexible circuit board 5 is insufficient, the mobile phone 1 may be splashed with water or the mobile phone 1 may be dropped into the water. As a result, an electronic component or the like breaks down.

  In view of this, Japanese Patent Application Laid-Open No. 2003-142836 (Patent Document 1) discloses a waterproof structure in which a packing is disposed between a housing and a flexible circuit board to waterproof.

  Japanese Patent Laid-Open No. 2004-214927 (Patent Document 2) discloses a waterproof structure in which a waterproof cap is fixed to a flexible circuit board by insert molding, and an O-ring is disposed on the outer periphery of the waterproof cap. .

JP 2003-142836 A (Claims) JP 2004-214927 A (paragraph number 0021)

  However, the waterproof structure of Patent Document 1 has a problem that the waterproof performance is reduced due to deterioration of the packing. Further, the waterproof structure of Patent Document 2 has a problem that the flexible circuit board is easily damaged.

  Moreover, in the waterproof structure of patent document 2, in order to attach a waterproof cap, the process of attaching a metal mold | die to a flexible circuit board and insert-molding was needed, and there existed a problem that a manufacturing process became complicated.

  Accordingly, an object of the present invention is to provide a flexible circuit board having high waterproof performance. Another object of the present invention is to provide a flexible circuit board that is easy to manufacture.

  Note that the above-described problem is a common problem in electronic devices having a structure in which a plurality of housings in which electronic components and circuit boards are installed are connected by hinges, not limited to mobile phones.

Such an object is achieved by the following present inventions (1) to (3).
(1) a flexible circuit board that is inserted into the casing of the electronic device, and a waterproof member that seals and waterproofs the gap between the casing and the flexible circuit board,
The waterproof member is made of two types of resin, a flexible circuit board side resin and a housing side resin,
A flexible circuit board with a waterproof member.
(2) The flexible circuit board with a waterproof member according to (1), wherein an elastic resin having a waterproof property is disposed on the outer periphery of the housing side resin.
(3) sandwiching the flexible circuit board from above and below with two waterproof member pieces comprising a molded body of the housing side resin and the flexible circuit board side resin (A) disposed on the flexible circuit board side of the molded body The first step of surrounding the flexible circuit board with the two waterproof member pieces,
The two waterproof member pieces are bonded so that the housing side resin and the flexible circuit board side resin (A) adhere to each other and the flexible circuit board side resin (A) and the flexible circuit board adhere to each other. A second step (A);
The manufacturing method of the flexible circuit board with a waterproof member characterized by having.
(4) Two waterproof member pieces each comprising a molded body of a housing side resin and a flexible circuit board side resin (B) disposed on the flexible circuit board side of the molded body, the flexible circuit board from above and below A first step of surrounding the flexible circuit board with two pieces of the waterproofing member so as to be sandwiched,
A second step (B) of bonding the housing side resin and the flexible circuit board with the flexible circuit board side resin (B) and bonding the two waterproof member pieces;
The manufacturing method of the flexible circuit board with a waterproof member characterized by having.

  According to the present invention, a flexible circuit board having high waterproof performance can be provided. Moreover, according to this invention, the flexible circuit board with easy manufacture can be provided.

It is sectional drawing of the hinge part vicinity of a mobile telephone. It is a typical top view of the example of the form of the flexible circuit board with a waterproof member of the present invention. It is sectional drawing when the waterproof member in FIG. 2 is cut in xx cross section. It is typical sectional drawing which shows the manufacturing method of the flexible circuit board with a waterproof member of this invention. It is typical sectional drawing which shows the manufacturing method of the flexible circuit board with a waterproof member of this invention.

A flexible circuit board with a waterproof member of the present invention has a flexible circuit board inserted into a casing of an electronic device, and a waterproof member that seals and waterproofs a gap between the casing and the flexible circuit board,
The waterproof member is made of two types of resin, a flexible circuit board side resin and a housing side resin,
It is the flexible circuit board with a waterproof member characterized by these.

  The flexible circuit board with a waterproof member of the present invention will be described with reference to FIGS. FIG. 2 is a schematic plan view of an embodiment of the flexible circuit board with waterproof member of the present invention, and FIG. 3 is a cross-sectional view of the waterproof member in FIG.

  In FIG. 2, the flexible circuit board 10 with a waterproof member has the flexible circuit board 5 and the waterproof member 7 (7a, 7b). Connectors 6 (6a, 6b) are attached to both ends of the flexible circuit board 5. Further, a reinforcing plate may be provided on the flexible circuit board opposite to the side on which the connector 6 is provided. And the flexible circuit board 10 with a waterproof member is used for the electronic device in which two housings in which the electronic component or the circuit board is installed are attached by a hinge part, for example, the mobile phone shown in FIG. .

  As shown in FIG. 3, the waterproof member 7 is attached to the flexible circuit board 5 so as to surround the flexible circuit board 5. The waterproof member 7 is made of two types of resins, a housing side resin 8 (8a, 8b) and a flexible circuit board side resin 9 (9a, 9b). That is, in the waterproof member 7, the flexible circuit board side resin 9 is disposed so as to surround the flexible circuit board 5, and the housing side resin 8 is disposed so as to surround the flexible circuit board side resin. The housing side resins 8 are bonded to each other at the bonding surface 22 with an adhesive. Also, the flexible circuit board side resins 9 are bonded or adhered to each other so that water does not enter between the flexible circuit board side resins 9a and 9b, or the flexible circuit board side resins 9a and 9b are adhesives. It is adhered by.

  In the electronic device using the flexible circuit board 10 with the waterproof member, the connector 6a attached to one end of the flexible circuit board is connected to the electronic component or the circuit board in the first casing, and the other flexible circuit board. The connector 6b attached to the end is connected to an electronic component or circuit board in the second housing, and the hinge internal part 21 of the flexible circuit board 5 is accommodated in the hinge part. At this time, the flexible circuit board 5 is installed so as to go out from the inside of the first housing, pass through the inside of the hinge portion, and enter the inside of the second housing.

  The waterproof member 7 is disposed so as to fill a gap between the casing of the electronic device and the flexible circuit board 5, thereby sealing and waterproofing the gap. Specifically, the flexible circuit board side resin 9 of the waterproof member 7 adheres to or adheres to the flexible circuit board 5, thereby preventing water from entering from the gap between the flexible circuit board 5 and the waterproof member 7. . The casing-side resin 8 of the waterproof member 7 is directly bonded to the casing, or a sealant is attached to the outer periphery of the waterproof member 7 and bonded to the casing, whereby the casing and the waterproof member 7 are bonded. Intrusion of water from the gap is prevented.

  The flexible circuit board according to the present invention is usually a flexible circuit board that is used to connect the electronic component or circuit board in the first housing and the electronic component or circuit board in the second housing through the hinge portion. Any circuit board may be used and is not particularly limited. Examples of the flexible circuit board according to the present invention include a flexible circuit board in which a circuit is formed on one side and a flexible circuit board in which a circuit is formed on both sides. Alternatively, it may be a multilayer flexible circuit board in which two or more flexible circuit boards are stacked.

  The flexible circuit board-side resin according to the present invention is a resin that directly contacts the flexible circuit board, and is disposed so as to surround the flexible circuit board. The resin on the flexible circuit board side is a resin that exhibits waterproof performance by adhering to the flexible circuit board, such as silicon resin, and prevents water from entering between the flexible circuit board and the waterproof member (hereinafter referred to as flexible resin). It is also described as a circuit board side resin (A).), Or by adhering to a flexible circuit board, such as a thermosetting resin or a thermoplastic resin, the waterproof performance is exhibited, and between the flexible circuit board and the waterproof member. Is a resin that prevents water from entering (hereinafter also referred to as a flexible circuit board side resin (B)).

  Examples of the flexible circuit board side resin (A) include silicon resin; fluorine-based resin such as polytetrafluoroethylene (PTFE); and elastomer resin having elasticity such as urethane resin and acrylic resin.

  Examples of the flexible circuit board side resin (B) include thermosetting resins and thermoplastic resins. As a thermosetting resin which concerns on the flexible circuit board side resin (B), a phenol resin, an epoxy resin, a polyurethane resin etc. are mentioned, for example. As a thermoplastic resin which concerns on a flexible circuit board side resin (B), polyamide resins, such as nylon, polyethylene, a polystyrene, etc. are mentioned, for example.

  The housing side resin according to the present invention is disposed so as to surround the flexible circuit board side resin.

  Examples of the housing-side resin include a thermosetting resin and a thermoplastic resin. Examples of the thermosetting resin related to the housing side resin include a phenol resin, an epoxy resin, and a polyurethane resin. Examples of the thermoplastic resin related to the housing side resin include polyamide resins such as nylon, polyethylene, polystyrene, and the like.

  The flexible circuit board side resin is adhered or adhered to the casing side resin so that water does not enter between the flexible circuit board side resin and the casing side resin.

  The flexible circuit board side resin (A), the flexible circuit board side resin (B), and the housing side resin can contain a curing accelerator, a filler, an antioxidant, and the like, if necessary.

  The waterproof circuit-equipped flexible circuit board of the present invention is provided with connectors for connecting to the electronic components in the housing or the circuit board at both ends thereof. Moreover, the flexible circuit board with a waterproof member of the present invention is provided with an electronic member that can be surface-mounted, for example, a resistor, a transistor, a capacitor, or the like, if necessary.

  The electronic device using the flexible circuit board with a waterproof member of the present invention is not particularly limited as long as it is an electronic device in which two housings in which electronic components or circuit boards are installed are connected by a hinge portion. Examples include mobile phones, digital cameras, and digital movies.

  A waterproof member obtained by conventional insert molding is made of a single layer of resin, and a hard resin is directly bonded to the flexible circuit board. Therefore, when the entire flexible circuit board is moved, the stress is concentrated on the flexible circuit board in the vicinity of the waterproof member, and the flexible circuit board is easily damaged. In order to enhance the waterproof performance, the stronger the adhesion between the waterproof member and the flexible circuit board, the easier it is to break.

  On the other hand, in the flexible circuit board with a waterproof member of the present invention, the waterproof member is composed of two types of resins. Therefore, even when a hard resin is used as the housing side resin, if a soft resin is used as the flexible circuit board side resin, when the entire flexible circuit board moves, the stress applied to the flexible circuit board in the vicinity of the waterproof member is reduced. Can be relaxed.

  Moreover, since the waterproof member obtained by conventional insert molding is made of a single layer of resin, it can be insert-molded as a material for forming the waterproof member, and can exhibit waterproof performance with the surface material of the flexible circuit board. A material that can be firmly and closely bonded must be used. Therefore, the material that can be used as the waterproof member is limited, and as a result, when the housing and the waterproof member are brought into direct contact with each other, the housing side resin material exhibits high waterproof performance with the housing. Since a suitable resin cannot be selected, there is a possibility that the waterproof performance may be insufficient.

  On the other hand, in the flexible circuit board with a waterproof member of the present invention, if a resin capable of exhibiting waterproof performance with the flexible circuit board is used as the flexible circuit board side resin, the material of the housing side resin is the flexible circuit board. There is no need to consider compatibility with. Therefore, it is possible to select a resin that enhances waterproofness with the housing as the housing-side resin.

  The method for producing the flexible circuit board with waterproof member of the present invention is not particularly limited. For example, the flexible circuit board side resin is bonded to the waterproof part of the flexible circuit board, and then the bonded flexible circuit board side resin is bonded. A method of adhering a molded body of the housing side resin to the outside of the flexible circuit board or insert molding the flexible circuit board side resin into the waterproof part of the flexible circuit board, and then insert molding the housing side resin outside the formed flexible circuit board side resin Even if the waterproof member is attached to the flexible circuit board in a two-stage process such as a method of performing the process, as shown below, the waterproof member may be attached to the flexible circuit board in a one-step process.

The manufacturing method of the flexible circuit board with waterproof member according to the first aspect of the present invention (hereinafter also referred to as the manufacturing method (1) of the present invention) includes a molded body of a housing side resin, and a flexible circuit board of the molded body. Two pieces of waterproof member made of the flexible circuit board side resin (A) disposed on the side are aligned so that the flexible circuit board is sandwiched from above and below, and the flexible circuit board is joined with the two pieces of waterproof member. A first enclosing step;
The two waterproof member pieces are bonded so that the housing side resin and the flexible circuit board side resin (A) adhere to each other and the flexible circuit board side resin (A) and the flexible circuit board adhere to each other. A second step (A);
A method for producing a flexible circuit board with a waterproof member, comprising:

Moreover, the manufacturing method of the flexible circuit board with a waterproof member of the 2nd form of this invention is the molded body of housing side resin, and the flexible circuit board side resin (B) arrange | positioned at the flexible circuit board side of this molded body A first step of fitting two waterproof member pieces comprising the flexible circuit board so that the flexible circuit board is sandwiched from above and below, and surrounding the flexible circuit board with the two waterproof member pieces;
A second step (B) of bonding the housing side resin and the flexible circuit board with the flexible circuit board side resin (B) and bonding the two waterproof member pieces;
A method for producing a flexible circuit board with a waterproof member, comprising:

  The manufacturing method of the present invention will be described with reference to FIGS. FIG.4 and FIG.5 is typical sectional drawing which shows the manufacturing method of the flexible circuit board with a waterproof member of this invention.

  As shown in FIG. 4, first, a waterproof member piece 23 comprising a molded body 18 (18a, 18b) of a housing side resin and a flexible circuit board side resin 19 (19a, 19b) disposed inside thereof. Two (23a, 23b) are prepared. Next, as shown in FIGS. 4 and 5, the two waterproof member pieces 23 a and 23 b are combined with each other such that the waterproof portion of the flexible circuit board 5 is sandwiched from above and below by these two waterproof member pieces 23. At this time, the surface where the waterproof member pieces 23a and 23b are joined is the adhesive surface 22 for bonding the two members, so that the two waterproof member pieces are applied after the adhesive 11 is applied to the adhesive surface 22. 23.

  Next, in a state where the two waterproof member pieces 23 are combined, the adhesive 11 is thermally cured by heating to bond the waterproof member pieces 23a and 23b.

  And in the manufacturing method (1) of this invention, when match | combining the waterproof member pieces 23a and 23b, the flexible circuit board side resin 19a, 19b is the molded body 18a, 18b of housing | casing side resin. In this state, the waterproof member pieces 23a and 23b are bonded to each other so that the flexible circuit board side resins 19a and 19b are applied to both the flexible circuit board 5 and the casing side resin moldings 18a and 18b. Adhere to. Thereby, the space between the flexible circuit board 5 and the flexible circuit board side resin 19 is waterproof, and the space between the flexible circuit board side resin 19 and the housing side resin 18 is waterproof.

  In addition, in the manufacturing method (2) of the present invention, when the waterproof member pieces 23a and 23b are combined, the flexible circuit board side resins 19a and 19b are formed on the flexible circuit board 5 by the molded bodies 18a and 18b of the housing side resin. In this state, the waterproof member pieces 23a and 23b are heated to adhere the waterproof member pieces 23a and 23b, and the flexible circuit board side resins 19a and 19b The molded body 18 and the flexible circuit board 5 are bonded together. Thereby, the space between the flexible circuit board 5 and the flexible circuit board side resin 19 is waterproof, and the space between the flexible circuit board side resin 19 and the housing side resin 18 is waterproof.

  In the first step according to the manufacturing method (1) of the present invention, two waterproof member pieces according to the manufacturing method (1) of the present invention are aligned so as to sandwich the flexible circuit board from above and below, and two flexible circuit boards are provided. It is the process of enclosing with a waterproof member piece. Moreover, the 1st process which concerns on the manufacturing method (2) of this invention match | combines the two waterproof member pieces which concern on the manufacturing method (2) of this invention so that a flexible circuit board may be inserted | pinched from the upper and lower sides, and a flexible circuit board may be used. It is a process of enclosing with two waterproof member pieces.

  The waterproof member piece according to the manufacturing method (1) of the present invention includes a housing-side resin molded body and a flexible circuit board disposed on the flexible circuit board side of the molded body, that is, inside the housing-side resin molded body. Side resin (A). Further, the waterproof member piece according to the manufacturing method (2) of the present invention includes a molded body of the housing side resin and a flexible circuit board side of the molded body, that is, a flexible resin disposed on the inner side of the molded body of the housing side resin. Circuit board side resin (B).

  The housing side resin and the flexible circuit board resin (A) according to the manufacturing method (1) of the present invention are the same as the housing side resin and the flexible circuit board side resin (A) according to the flexible circuit board with a waterproof member of the present invention. . Moreover, the housing side resin and the flexible circuit board side resin (B) according to the manufacturing method (2) of the present invention are the same as the housing side resin and the flexible circuit board side resin (B) according to the flexible circuit board with a waterproof member of the present invention. It is the same.

  In the manufacturing method (1) of the present invention and the manufacturing method (2) of the present invention, the type of the housing side resin is the curing temperature and the curing time (adhesive) when bonding the two waterproof member pieces in the second step. Is a thermosetting resin), manufacturing conditions such as heating temperature and cooling temperature (when the adhesive is a thermoplastic resin), and when combined with the flexible circuit board side resin, the housing side resin and the flexible circuit board side resin In combination with other resins, such as when it is waterproofed by being in direct contact with the housing, so that waterproof performance can be exhibited by interaction with the housing. It is appropriately selected in consideration of compatibility in waterproof performance, adhesion, durability, and the like.

  In the manufacturing method (1) of the present invention and the manufacturing method (2) of the present invention, the type of the flexible circuit board side resin is selected from the curing temperature and the curing time when bonding the two waterproof member pieces in the second step ( When the adhesive is a thermosetting resin), manufacturing conditions such as heating temperature and cooling temperature (when the adhesive is a thermoplastic resin), and when combined with the flexible circuit board side resin, the housing side resin and the flexible circuit board It is appropriately selected in consideration of compatibility with other resins, adhesion, durability, etc., such as a combination that is waterproof with the side resin.

  In the manufacturing method (1) and the manufacturing method (2) of the present invention, the waterproof member of the flexible circuit board with the waterproof member is formed by the housing-side resin and the flexible circuit board-side resin after the second step. Therefore, the shape of the molded body of the housing side resin and the shape of the flexible circuit board side resin disposed inside thereof are appropriately selected depending on the shape of the waterproof member after the second step. That is, in the manufacturing method (1) and the manufacturing method (2) of the present invention, the flexible circuit board is so formed that the waterproof portion of the flexible circuit board is surrounded by the flexible circuit board-side resin after the second step. The shape of the molded body of the housing side resin and the shape of the flexible circuit board side resin are selected so that the side resin is surrounded by the housing side resin.

  In the production method (1) of the present invention and the production method (2) of the present invention, the molding method of the housing side resin is not particularly limited, and the housing side resin is molded by injection molding, compression molding, transfer molding or the like. A molded body of the housing side resin can be obtained. In the production method (1) and the production method (2) of the present invention, the method of disposing the flexible circuit board side resin inside the molded body of the housing side resin is not particularly limited, and is previously limited. A method of fitting the molded body of the flexible circuit board side resin into the inside of the housing side resin molding, or a heat treatment so that the shape of the flexible circuit board side resin is formed inside the housing side resin molding. A method of applying a curable resin, a method of semi-curing a thermosetting resin after applying a thermosetting resin so as to be in the shape of a flexible circuit board side resin inside a molded body of a housing side resin, Examples include a method of disposing a thermoplastic resin melt or softened material and cooling it so as to be in the shape of the flexible circuit board side resin inside the housing side resin molding.

  In addition, in the production method (1) and the production method (2) of the present invention, before the two waterproof member pieces are combined in the first step, an adhesive is applied to the adhesive surface of the waterproof member pieces. Apply. In addition, in the production method (1) and the production method (2) of the present invention, if necessary, before joining the two waterproof member pieces in the first step, the adhesive surface of the waterproof member pieces is bonded. In addition, an adhesive is also applied to the surface where the flexible circuit board side resins are in contact with each other. The adhesive for adhering the two waterproof member pieces is not particularly limited as long as it can adhere the two waterproof member pieces by being heated in the second step. Examples thereof include thermosetting adhesives such as adhesives and acrylic adhesives. Moreover, the adhesive for bonding the two waterproof member pieces needs to have waterproof performance.

  In the production method (1) of the present invention, after the first step, the second step (A) according to the production method of the present invention is performed. The second step (A) includes two waterproof member pieces so that the housing side resin and the flexible circuit board side resin (A) adhere to each other, and the flexible circuit board side resin (A) and the flexible circuit board adhere to each other. Is a step of bonding.

  In the second step (A), the two waterproof member pieces are heated in a state in which the two waterproof member pieces are pressed against each other with the adhesive surfaces of the two waterproof member pieces being combined. And glue.

  Moreover, in the manufacturing method (2) of this invention, the 2nd process (B) which concerns on the manufacturing method of this invention is performed following a 1st process. The second step (B) is a step (B) in which the housing side resin and the flexible circuit board are bonded by the flexible circuit board side resin (B) and two waterproof member pieces are bonded.

  In the second step (B), the two waterproof member pieces are heated in a state in which the two waterproof member pieces are pressed against each other, with the adhesive surfaces of the two waterproof member pieces being combined. Thus, the housing side resin and the flexible circuit board are bonded by the flexible circuit board side resin (B), and the two waterproof member pieces are bonded.

  The heating temperature in the second step (B) is appropriately selected depending on the type of the flexible circuit board side resin (B). For example, when the flexible circuit board side resin (B) is a thermosetting resin, the heating temperature is selected depending on the curing temperature, and when the flexible circuit board side resin (B) is a thermoplastic resin, the heating temperature is selected based on the melting point. .

  Thus, in the manufacturing method (1) of the present invention, the second step (A) is performed, and in the manufacturing method (2) of the present invention, the second step (B) is performed. The flexible circuit board with a waterproof member of the invention is obtained.

  In the manufacturing method (1) of the present invention and the manufacturing method (2) of the present invention, the waterproof member can be fixed to the flexible circuit board by sandwiching the flexible circuit board between the waterproof member pieces and then heating them, so that the flexible circuit board is flexible. Other members attached to the circuit board, for example, the connector 6 in FIG. 2, a reinforcing plate attached at a position corresponding to the back side of the connector 6 of the flexible circuit board, a double-sided tape, etc. are mounted on the flexible circuit board and then heated. In addition to the fixing step, the production method (1) of the present invention or the production method (2) of the present invention can be performed. Therefore, a flexible circuit board having high waterproof performance can be manufactured by a simple method.

  On the other hand, in the insert molding, since the waterproof member must be formed on the flexible circuit board by fixing the mold to the flexible circuit board, the step of fixing the member such as the connector 6 to the flexible circuit board; Separately, an insert molding process is required. Therefore, the manufacturing method (1) of the present invention and the manufacturing method (2) of the present invention can reduce the number of manufacturing steps as compared with the case where the waterproof member is formed by insert molding.

  In the flexible circuit board with a waterproof member of the present invention, a waterproof elastic resin may be further provided on the outer periphery of the housing side resin. And the flexible circuit board with a waterproof member of this invention further improves the waterproof performance between housing | casing side resin and a housing | casing by having the elastic resin which has waterproofness in the outer periphery of housing | casing side resin. it can. In addition, the outer periphery of housing side resin refers to the site | part facing a housing | casing among housing side resin.

  The elastic resin having a waterproof property disposed on the outer periphery of the housing side resin is not particularly limited as long as it is a waterproof and elastic resin. For example, silicon resin; polytetrafluoroethylene (PTFE) Fluorine-based resins such as urethane resins and acrylic resins having elasticity such as acrylic resins.

  The position where the waterproof elastic resin is disposed is the outer periphery of the housing side resin, and is disposed so as to surround the outside of the housing resin. In other words, the waterproof elastic resin is disposed on the outer periphery of the housing side resin at a position where the gap between the housing side resin and the housing can be filled.

  There is no particular limitation on the method of disposing waterproof elastic resin on the outer periphery of the housing side resin. For example, a method of covering the outer side of the housing side resin with a ring-shaped resin or surrounding the outer side of the housing side resin. And a method of applying a thermosetting or ultraviolet curable resin to the resin and then curing the applied resin.

  Further, the waterproof elastic resin covers the entire resin in the depth direction of the housing side resin (in FIG. 2, the y direction is a direction perpendicular to the circumferential direction of the housing side resin). The depth direction of the housing side resin may be arranged so as to surround only the portion facing the housing so as to surround the outside of the housing side resin. May be. As a method of disposing a waterproof elastic resin so that only the portion facing the housing is covered and enclosing the outside of the housing-side resin, for example, the housing-side resin facing the housing A method of forming a groove so as to surround the outside of the housing side resin and disposing a waterproof elastic resin along the groove may be mentioned.

  ADVANTAGE OF THE INVENTION According to this invention, the flexible circuit board excellent in waterproofness can be manufactured by a simple method.

DESCRIPTION OF SYMBOLS 1 Mobile phone 2a 1st housing | casing 2b 2nd housing | casing 3 Hinge part 4a, 4b Circuit board 5 Flexible circuit board 6, 6a, 6b Connector 7, 7a, 7b Waterproof member 8, 8a, 8b Housing side resin 9, 9a, 9b Flexible circuit board side resin 10 Flexible circuit board with waterproof member 11 Adhesives 18, 18a, 18b Molded bodies 19, 19a, 19b of housing side resin 21 Flexible circuit board side resin 21 Inside hinge part 22 Adhesive surface 23, 23a, 23b Waterproof member piece

Claims (4)

A flexible circuit board that is inserted into the casing of the electronic device, and a waterproof member that seals and waterproofs the gap between the casing and the flexible circuit board,
The waterproof member is made of two types of resin, a flexible circuit board side resin and a housing side resin,
A flexible circuit board with a waterproof member.   2. The flexible circuit board with waterproof member according to claim 1, wherein a waterproof elastic resin is disposed on an outer periphery of the housing side resin. Two waterproof member pieces each comprising a molded body of the housing side resin and the flexible circuit board side resin (A) disposed on the flexible circuit board side of the molded body are aligned so as to sandwich the flexible circuit board from above and below. A first step of surrounding the flexible circuit board with the two waterproof member pieces;
The two waterproof member pieces are bonded so that the housing side resin and the flexible circuit board side resin (A) adhere to each other and the flexible circuit board side resin (A) and the flexible circuit board adhere to each other. A second step (A);
The manufacturing method of the flexible circuit board with a waterproof member characterized by having. Align two pieces of waterproofing members made of the molded body of the housing side resin and the flexible circuit board side resin (B) disposed on the flexible circuit board side of the molded body so as to sandwich the flexible circuit board from above and below. A first step of surrounding the flexible circuit board with the two waterproof member pieces;
A second step (B) of bonding the housing side resin and the flexible circuit board with the flexible circuit board side resin (B) and bonding the two waterproof member pieces;
The manufacturing method of the flexible circuit board with a waterproof member characterized by having.