CN112165788A - Manufacturing method of waterproof PCB - Google Patents
Manufacturing method of waterproof PCB Download PDFInfo
- Publication number
- CN112165788A CN112165788A CN202011040729.3A CN202011040729A CN112165788A CN 112165788 A CN112165788 A CN 112165788A CN 202011040729 A CN202011040729 A CN 202011040729A CN 112165788 A CN112165788 A CN 112165788A
- Authority
- CN
- China
- Prior art keywords
- layer
- waterproof
- conducting layer
- circuit board
- pressing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 20
- 238000003825 pressing Methods 0.000 claims abstract description 16
- 238000000034 method Methods 0.000 claims abstract description 13
- 238000005553 drilling Methods 0.000 claims abstract description 8
- 238000007747 plating Methods 0.000 claims abstract description 8
- 239000011248 coating agent Substances 0.000 claims abstract description 7
- 238000000576 coating method Methods 0.000 claims abstract description 7
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims abstract description 5
- 229910052737 gold Inorganic materials 0.000 claims abstract description 5
- 239000010931 gold Substances 0.000 claims abstract description 5
- 238000000465 moulding Methods 0.000 claims abstract description 5
- 238000011179 visual inspection Methods 0.000 claims abstract description 5
- 238000005259 measurement Methods 0.000 claims abstract description 4
- 230000001680 brushing effect Effects 0.000 claims description 10
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 9
- 238000010030 laminating Methods 0.000 claims description 8
- 239000011889 copper foil Substances 0.000 claims description 6
- 238000005530 etching Methods 0.000 claims description 5
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- 239000003292 glue Substances 0.000 claims description 3
- 239000011347 resin Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- 239000004744 fabric Substances 0.000 claims description 2
- 239000003365 glass fiber Substances 0.000 claims description 2
- 230000000630 rising effect Effects 0.000 claims description 2
- 229910000679 solder Inorganic materials 0.000 abstract description 4
- 239000000047 product Substances 0.000 description 5
- 230000001681 protective effect Effects 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000003475 lamination Methods 0.000 description 2
- 239000011265 semifinished product Substances 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 238000006087 Brown hydroboration reaction Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 238000009827 uniform distribution Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0047—Drilling of holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
Abstract
The invention provides a manufacturing method of a waterproof PCB, which comprises the following steps: pressing to obtain a semi-finished circuit board, pressing to obtain an insulating waterproof layer, drilling a positioning hole for the second time, coating solder mask ink on the first conductive layer of the circuit board, plating gold on the surface, molding, and performing electrical measurement and visual inspection to complete the manufacture of the waterproof circuit board. The method of the invention has simple manufacturing process and small integral space occupancy of the product, and meets the requirement of miniaturization of electronic products.
Description
Technical Field
The invention relates to the field of printed circuit boards, in particular to a manufacturing method of a waterproof PCB.
Background
The circuit board is widely applied to the fields of automobiles, electronics, communication and the like, and when water enters the circuit board, short circuit can be caused, so that the circuit board is damaged, and inconvenience is brought to life. Therefore, it is necessary to develop a waterproof type PCB capable of preventing moisture from entering into the board during use. The conventional waterproof circuit board is characterized in that a protective shell is arranged on the outer layer of the circuit board, and the circuit board is completely covered inside the protective shell. The conventional waterproof circuit board is provided with the protective shell on the outer layer of the circuit board, so that the space occupancy rate is high, and the application of miniaturization of electronic products is not facilitated.
Disclosure of Invention
In order to solve the problems, the invention provides a manufacturing method of a waterproof PCB, wherein a non-flowing resin and a circuit board are laminated on a welding surface to serve as a waterproof insulating layer, and the waterproof PCB has the characteristics of small space occupation rate and excellent waterproof performance.
The main content of the invention comprises:
a manufacturing method of a waterproof PCB comprises the following steps:
s1, blanking, pressing, drilling, copper plating and etching to manufacture an outer layer pattern to obtain a semi-finished circuit board; the semi-finished circuit board comprises a first conducting layer, a plurality of middle conducting layers and a second conducting layer which are sequentially laminated from top to bottom;
s2, arranging an insulating waterproof layer outside the surface of the second conducting layer far away from the middle conducting layer, and laminating the insulating waterproof layer and the semi-finished circuit board in an electrical laminating mode;
s3, drilling a positioning hole for the second time, and coating a welding-proof ink layer on the surface of the first conducting layer, which is far away from the middle conducting layer;
and S4, performing surface gold plating treatment, molding, electrical measurement and visual inspection to obtain a finished product.
Preferably, S2 includes the steps of:
s21, sequentially superposing an insulating waterproof layer, a centrifugal film, a buffer pad and a lower copper foil layer on the surface of the second conducting layer far away from the middle conducting layer;
s22, sequentially superposing a centrifugal film, a buffer pad and an upper copper foil layer on the surface of the first conducting layer far away from the middle conducting layer;
and S23, pressing by adopting an Adara pressing machine.
Preferably, the middle conductive layer comprises a third conductive layer and a fourth conductive layer, the temperature rise rate of the stitching in S23 is 2.5-3.5 ℃/min, and the stitching pressure is 21-28kg/cm2And the thickness is controlled to be 50-90 um.
Preferably, the insulating and waterproof layer is a non-flowing prepreg comprising resin and glass fiber cloth.
Preferably, step S2 is preceded by a browning step.
Preferably, step S2 is followed by a microetching step to remove the brown layer of the first conductive layer.
Preferably, step S3 is preceded by a brushing step.
Preferably, the brushing treatment step comprises the steps of placing the first conductive layer downwards, closing the upper brush, and removing the overflowing glue on the surface of the first conductive layer at a brushing speed of 3m/min and a current of 1.0A.
The invention has the beneficial effects that: the invention provides a manufacturing method of a waterproof PCB, which is characterized in that the waterproof and heat-resistant characteristics of a non-flowing prepreg are utilized, the welding surface of a circuit board and the non-flowing prepreg are pressed to obtain the waterproof PCB, the manufacturing process is simple, the integral space occupancy of a product is small, and the requirement of miniaturization of electronic products is met.
Detailed Description
The technical solution protected by the present invention will be specifically explained below.
The invention provides a manufacturing method of a waterproof PCB, which comprises the steps of pressing to obtain a semi-finished product circuit board, performing browning treatment and voltage combination on the semi-finished product circuit board, coating solder mask ink on a first conducting layer of the circuit board after micro-etching and brushing treatment and secondary positioning hole drilling, finally performing surface gold plating and molding, and completing the manufacturing of the waterproof circuit board after electrical testing and visual inspection.
The technical scheme of the invention will be described in detail by taking the manufacture of a four-layer waterproof circuit board as an example:
s1, according to a conventional manufacturing method of the circuit board, manufacturing an outer layer pattern by sequentially blanking, pressing, drilling, copper plating and etching to obtain a four-layer circuit board, wherein the four-layer circuit board sequentially comprises a first conducting layer, a third conducting layer, a fourth conducting layer and a second conducting layer from top to bottom, and the first conducting layer and the second conducting layer are positioned at the uppermost layer and the bottommost layer; all the conducting layers are bonded through a dielectric layer, such as a prepreg, PP and other dielectrics; this step will get the semi-finished circuit board; for circuit boards with other specifications, the semi-finished circuit board comprises a first conductive layer, a plurality of intermediate conductive layers and a second conductive layer which are sequentially laminated from top to bottom.
Before the voltage combination of the insulating waterproof layer, the semi-finished circuit board is subjected to brown oxidation treatment.
S2, arranging an insulating waterproof layer outside the surface of the second conducting layer far away from the middle conducting layer, and laminating the insulating waterproof layer and the semi-finished circuit board in an electrical laminating mode; the insulating waterproof layer is a non-flowing prepreg, the preferred type is 1080 with a satin finish, the gel content is 65%, and the insulating waterproof layer has excellent water resistance and heat resistance.
Specifically, S2 includes the steps of:
s21, sequentially superposing an insulating waterproof layer, a centrifugal film, a buffer pad and a lower copper foil layer on the surface of the second conducting layer far away from the middle conducting layer;
s22, sequentially superposing a centrifugal film, a buffer pad and an upper copper foil layer on the surface of the first conducting layer far away from the middle conducting layer;
s23, adopting an Adara laminating machine to carry out lamination, wherein the temperature rising rate of the lamination is 2.5-3.5 ℃/min, and the laminating pressure is 21-28kg/cm2The thickness is controlled to be 50-90 um; preferably, the heating rate is 2.6 ℃/min; the pressing pressure is 21kg/cm2。
The centrifugal membrane is used for protecting a circuit on the surface of the plate and preventing the circuit from being scratched in the pressing process, and the cushion pad is used for ensuring the uniform distribution of the pressing pressure in the pressing process.
S3, before the solder mask ink coating is started, the first conducting layer can be subjected to micro-etching treatment to remove a brown layer on the surface of the first conducting layer, and brushing treatment is carried out to be more beneficial to the solder mask ink coating, specifically, the brushing treatment step comprises the steps of placing the first conducting layer downwards, closing an upper brush, and carrying out brushing at a speed of 3m/min and a current of 1.0A to remove glue overflow on the surface of the first conducting layer; and then, drilling a positioning hole for the second time on the circuit board, and coating a welding-proof ink layer on the surface of the first conducting layer, which is far away from the middle conducting layer.
And S4, performing surface gold plating treatment, molding, electrical measurement and visual inspection to obtain a finished product.
The above description is only an embodiment of the present invention, and not intended to limit the scope of the present invention, and all modifications of equivalent structures and equivalent processes, which are made by the present specification, or directly or indirectly applied to other related technical fields, are included in the scope of the present invention.
Claims (8)
1. A manufacturing method of a waterproof PCB is characterized by comprising the following steps:
s1, blanking, pressing, drilling, copper plating and etching to manufacture an outer layer pattern to obtain a semi-finished circuit board; the semi-finished circuit board comprises a first conducting layer, a plurality of middle conducting layers and a second conducting layer which are sequentially laminated from top to bottom;
s2, arranging an insulating waterproof layer outside the surface of the second conducting layer far away from the middle conducting layer, and laminating the insulating waterproof layer and the semi-finished circuit board in an electrical laminating mode;
s3, drilling a positioning hole for the second time, and coating a welding-proof ink layer on the surface of the first conducting layer, which is far away from the middle conducting layer;
and S4, performing surface gold plating treatment, molding, electrical measurement and visual inspection to obtain a finished product.
2. The method of claim 1, wherein the step S2 comprises the steps of:
s21, sequentially superposing an insulating waterproof layer, a centrifugal film, a buffer pad and a lower copper foil layer on the surface of the second conducting layer far away from the middle conducting layer;
s22, sequentially superposing a centrifugal film, a buffer pad and an upper copper foil layer on the surface of the first conducting layer far away from the middle conducting layer;
and S23, pressing by adopting an Adara pressing machine.
3. The method of claim 2, wherein the intermediate conductive layer comprises a third conductive layer and a fourth conductive layer, the temperature rising rate of the pressing process in the S23 is 2.5-3.5 ℃/min, and the pressing pressure is 21-28kg/cm2And the thickness is controlled to be 50-90 um.
4. The method of any one of claims 1 to 3, wherein the insulating and waterproof layer is a non-flowing prepreg comprising resin and glass fiber cloth.
5. The method for manufacturing a waterproof PCB according to any one of claims 1 to 3, wherein the step S2 is preceded by a browning step.
6. The method of claim 5, further comprising a microetching step after step S2 to remove the brown layer of the first conductive layer.
7. The method for manufacturing a waterproof PCB of claim 5, wherein step S3 is preceded by a brushing step.
8. The method of claim 7, wherein the brushing process comprises placing the first conductive layer downward, closing the upper brush, and brushing at a speed of 3m/min and a current of 1.0A to remove the excessive glue on the surface of the first conductive layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011040729.3A CN112165788B (en) | 2020-09-28 | 2020-09-28 | Manufacturing method of waterproof PCB |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011040729.3A CN112165788B (en) | 2020-09-28 | 2020-09-28 | Manufacturing method of waterproof PCB |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN112165788A true CN112165788A (en) | 2021-01-01 |
| CN112165788B CN112165788B (en) | 2024-02-06 |
Family
ID=73861402
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202011040729.3A Active CN112165788B (en) | 2020-09-28 | 2020-09-28 | Manufacturing method of waterproof PCB |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN112165788B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113473750A (en) * | 2021-06-30 | 2021-10-01 | 天津普林电路股份有限公司 | Lamination processing method of windowing laminated plate for aviation |
Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000071386A (en) * | 1998-08-26 | 2000-03-07 | Matsushita Electric Works Ltd | Production of laminated sheet |
| JP2000286546A (en) * | 1999-03-31 | 2000-10-13 | Matsushita Electric Works Ltd | Production of printed wiring board |
| JP2006196718A (en) * | 2005-01-14 | 2006-07-27 | Kureha Corp | Moisture-resistant coverlay film, and flexible printed wiring board using same coverlay film |
| JP2007308681A (en) * | 2006-04-18 | 2007-11-29 | Hitachi Chem Co Ltd | Photo-curable resin composition, photo- curable moisture-preventing insulation coating for mounting circuit board, electronic part and method for producing the same |
| JP2010287862A (en) * | 2009-06-15 | 2010-12-24 | C Uyemura & Co Ltd | Method of manufacturing printed circuit board |
| JP2011155234A (en) * | 2009-12-28 | 2011-08-11 | Sumitomo Bakelite Co Ltd | Flexible circuit board with waterproof member, and method of manufacturing the same |
| JP2013030548A (en) * | 2011-07-27 | 2013-02-07 | Fujikura Ltd | Flexible printed wiring board and manufacturing method of the same |
| CN103392385A (en) * | 2012-02-13 | 2013-11-13 | Cedal装置有限责任公司 | Improvements in the manufacturing of stacks of multiplayer plastic laminates for printed circuits |
| CN103582325A (en) * | 2012-07-31 | 2014-02-12 | 富葵精密组件(深圳)有限公司 | Circuit board and manufacturing method thereof |
| CN110461099A (en) * | 2019-09-02 | 2019-11-15 | 昆山纬亚智能科技有限公司 | A kind of processing method of flexible circuit board |
-
2020
- 2020-09-28 CN CN202011040729.3A patent/CN112165788B/en active Active
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000071386A (en) * | 1998-08-26 | 2000-03-07 | Matsushita Electric Works Ltd | Production of laminated sheet |
| JP2000286546A (en) * | 1999-03-31 | 2000-10-13 | Matsushita Electric Works Ltd | Production of printed wiring board |
| JP2006196718A (en) * | 2005-01-14 | 2006-07-27 | Kureha Corp | Moisture-resistant coverlay film, and flexible printed wiring board using same coverlay film |
| JP2007308681A (en) * | 2006-04-18 | 2007-11-29 | Hitachi Chem Co Ltd | Photo-curable resin composition, photo- curable moisture-preventing insulation coating for mounting circuit board, electronic part and method for producing the same |
| JP2010287862A (en) * | 2009-06-15 | 2010-12-24 | C Uyemura & Co Ltd | Method of manufacturing printed circuit board |
| JP2011155234A (en) * | 2009-12-28 | 2011-08-11 | Sumitomo Bakelite Co Ltd | Flexible circuit board with waterproof member, and method of manufacturing the same |
| JP2013030548A (en) * | 2011-07-27 | 2013-02-07 | Fujikura Ltd | Flexible printed wiring board and manufacturing method of the same |
| CN103392385A (en) * | 2012-02-13 | 2013-11-13 | Cedal装置有限责任公司 | Improvements in the manufacturing of stacks of multiplayer plastic laminates for printed circuits |
| CN103582325A (en) * | 2012-07-31 | 2014-02-12 | 富葵精密组件(深圳)有限公司 | Circuit board and manufacturing method thereof |
| CN110461099A (en) * | 2019-09-02 | 2019-11-15 | 昆山纬亚智能科技有限公司 | A kind of processing method of flexible circuit board |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113473750A (en) * | 2021-06-30 | 2021-10-01 | 天津普林电路股份有限公司 | Lamination processing method of windowing laminated plate for aviation |
| CN113473750B (en) * | 2021-06-30 | 2022-11-15 | 天津普林电路股份有限公司 | Lamination processing method of windowing laminated plate for aviation |
Also Published As
| Publication number | Publication date |
|---|---|
| CN112165788B (en) | 2024-02-06 |
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