JP2010040992A - Method of manufacturing electronic control device, its transfer molding equipment and electronic control device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To prevent the damage to a connector and a connection part, and secure surface pressure between the connector and a molding die to prevent leakage of a resin, by lowering stress given to the connector and the connection part between the connector and an electronic circuit board, when molding, in a method of manufacturing an electronic control device. <P>SOLUTION: The electronic control device includes the connector 3 having the electronic circuit board 2, a metal terminal 5 in which one end protrudes for connecting to an external electronic circuit, and the peripheral flange 7. The method of manufacturing the electronic control device has a step of arranging a whole of the electronic circuit board 2 and a part of the connector 3 within the molding dies 8a, 8b, and a step of integrally forming them with a thermosetting resin composition 4 by a low pressure transfer mold method. When integrally forming, while contacting one surface of the flange 7 to a wall surface around the one end opening of the molded product delivery side of the molding dies 8a, 8b, and applying pressing force to the flange 7 in a direction in parallel with a projection direction 6 of the metal terminal 5, the low pressure transfer mold method is performed. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to an electronic control device in which a connector having a metal terminal for external connection and an electronic circuit board mounted with an electronic component electrically connected thereto are integrally formed of a thermosetting resin composition, and a method for manufacturing the same And a transfer mold apparatus thereof.

  Automobiles tend to widen the passenger compartment from the viewpoint of improving comfort. For this reason, the space in the engine room is reduced, and at the same time, electronic control devices such as an engine control device and a transmission control device that are conventionally installed in the vehicle compartment have also been installed in the engine room. Since the electronic control device installation place in the engine room is limited, and the environment is also high temperature, high humidity, and high vibration, the electronic control device is required to be small in size and robust in a harsh environment.

  As a conventional electronic control device for an automobile engine, a structure of a control unit as shown in FIG. 12 is known. In this control unit, an electronic component 101 such as a capacitor and a resistor and a semiconductor bare chip 102 are mounted on the ceramic circuit board 100 by soldering or conductive adhesive, and the ceramic conductor of the circuit board 100 is electrically connected to the circuit board 100 by wire bonding 103 or the like. Are joined together. The ceramic circuit board 100 is mounted and bonded in a resin casing 105 having a metal heat dissipating plate 109 and a connector terminal 104, and then the ceramic circuit board 100 and the connector terminal 104 are bonded by wire bonding 110 or soldering. Make an electrical connection with. Thereafter, the above-described various electronic components 101 are protected from the outside atmosphere by applying and heating the silicone gel 106. Finally, the ceramic circuit board 100 is fixed to the housing 105 with the lid 107 using an adhesive or an O-ring 108.

  In addition, an electronic control device that fixes a substrate on which electronic components are mounted to a plate material, covers the whole with a cover material, and performs bonding between the base material and the cover material with a sealing material or the like to provide waterproofness and moisture resistance. It is disclosed in Patent Document 1.

  Patent Document 2 similarly discloses a box-type control unit having a connector as an electronic control device using a base material and a cover material.

  In such a conventional box-type electronic control device, it is difficult to reduce the size, and at the same time, vibration resistance and heat resistance are not sufficient, and there is a possibility that poor connection of electronic components may occur.

  On the other hand, Patent Document 3 discloses a technology of a resin-sealed electronic control device that covers a whole or part of a circuit board on which electronic components are mounted in order to improve waterproofness, moistureproofness, and vibration resistance. Has been.

  In such a resin-sealed electronic control device, a structure having a connector is shown in Patent Document 4, and an electronic circuit board on which electronic components are mounted is fixed in a positioned mold, and is made of a flexible resin. A method for sealing is disclosed.

  In these prior arts, the connector and the electronic control unit have an integral structure, and miniaturization, vibration resistance, heat resistance improvement and sealing performance are ensured. However, since it is manufactured by casting a liquid thermosetting composition at room temperature and removing it from the mold after heat curing, there is a problem that it takes a long time to mold and the productivity cannot be so high.

  In addition to the connector, Patent Document 5 discloses a technique for increasing the productivity by causing a pressure sensor portion to protrude from a mold and injection molding with a thermoplastic resin. In this technique, an O-ring is provided in the pressure sensor portion to prevent resin leakage. At the same time, the connector portion is provided with a groove and is sandwiched between molds to prevent resin leakage. In this method, the upper groove of the connector is easily subjected to stress from the upper mold, and the lower groove of the connector is susceptible to stress from the lower mold. Moreover, since it is difficult for the right and left side surfaces of the connector to sufficiently apply the clamping force from the mold, there is a problem that the resin is likely to leak. Moreover, since the groove | channel is formed in the insertion part of a connector, it is unpreferable on reliability.

  In addition, a technique using a low-pressure transfer mold method is disclosed in order to increase productivity. In the low-pressure transfer molding method, resin leakage tends to occur due to the use of a thermosetting resin having a low viscosity, as compared with the injection molding technique using a thermoplastic resin as shown in Patent Document 5 above. Technology is disclosed.

  In Patent Document 6, the tip of the connector clamping portion of the molding die is formed at an acute angle so as to cope with the dimensional variation of the connector, and when the die is tightened, the tip of the die is brought into contact with and pressed against the connector. Alternatively, a mold structure that bites in and prevents resin leakage is disclosed.

  This prior art is a method of preventing resin leakage by biting the mold into the connector part. However, the positioning accuracy, the connector dimensional accuracy, and the dimensional accuracy of the connection between the board and the connector terminal when placed in the mold are improved. If it is not increased, an excessive force (stress) is applied to the connector portion, resulting in damage to the connector portion or disconnection of the connection portion. Procurement of high-accuracy parts and high accuracy of connection and positioning still have the problem of reduced productivity and high cost.

  Patent Documents 7 and 8 disclose a structure in which a connector is fixed to a metal base and the connector portion is not directly covered with a sealing resin. In this method, the connector portion is fixed to the metal base in advance, and the connector is not directly clamped with a mold, so that the force and damage to the connector portion are reduced, but the fixing process to the metal base takes an extra step. The process becomes complicated and the cost increases.

Japanese Patent Laid-Open No. 11-243283 JP 2003-258451 A JP-A-2-291195 Japanese Patent Laid-Open No. 7-22722 JP 2005-93475 A Japanese Patent Laid-Open No. 10-76528 JP 2004-111435 A JP 2007-273796 A

  A problem to be solved by the present invention is to provide an electronic control device manufacturing method in which an electronic circuit board having a connector is placed in a molding die, and the entire electronic circuit board and a part of the connector are transfer molded. It is to reduce the stress received by the connector and the connection portion between the connector and the electronic circuit board at the time of clamping, thereby preventing the connector and the connection portion from being damaged. Furthermore, it is to secure a surface pressure between the connector part and the molding die and prevent resin leakage from the connector part. Also, in order to increase productivity, the positional accuracy when connecting the connector part and the electronic circuit board, and the positioning accuracy when clamping the molding die after placing the board with the connector part in the molding die are not so high However, it is to provide a manufacturing method that does not damage the connector and the connection part.

  Moreover, it is also providing the transfer mold apparatus used for said manufacturing method, and the electronic control apparatus manufactured with said manufacturing method.

  In order to solve the above problems, the electronic control device manufacturing method according to the present invention basically has the following configuration.

  An electronic circuit board on which electronic components are mounted, a metal terminal protruding at one end for connection to an external electronic circuit, and a flange around it, and connected to the electronic circuit board through the other end of the metal terminal In the manufacturing process of the electronic control device including the connector, the whole of the electronic circuit board and the electronic component and a part of the connector are placed in a molding die, and a low-pressure transfer mold is formed with a thermosetting resin composition. In the manufacturing method of the electronic control device integrally molded by the method, at the time of the integral molding, one surface of the flange is closed to the opening of the molding die so that the flange closes one end opening on the molded product drawing side of the molding die. The low-pressure transfer mold is performed while contacting a surrounding wall surface and applying a pressing force to the flange in a direction at least parallel to the protruding direction of the metal terminal. To.

  The pressing force is also applied to a pressure jig that conveys the electronic circuit board and the connector to the molding die.

  Further, the electronic control device includes a metal plate that fixes the electronic circuit board, and a pressure member that has an elastic force installed between the electronic circuit board and the metal plate, and the flange includes the flange In the method of manufacturing an electronic control device, the pressing member and at least the fixed surface of the electronic circuit board of the metal plate, which are arranged in a molding die, are integrally molded with the thermosetting resin composition. It is also the feature that the pressure member applies the pressure.

  In order to solve the above problems, a transfer mold apparatus for an electronic control apparatus according to the present invention basically has the following configuration.

  An electronic circuit board on which electronic components are mounted, a metal terminal protruding at one end to connect to an external electronic circuit, and a flange around it, and connected to the electronic circuit board through the other end of the metal terminal A transfer mold apparatus of an electronic control device comprising a connector, wherein the electronic circuit board and the entire electronic component and a part of the connector are disposed in a molding die, and a thermosetting resin composition is used. In a transfer molding device of an electronic control device integrally molded by a low pressure transfer molding method, a contact surface of the flange is formed around one end opening on the molded product drawing side of the molding die, and the flange is formed during the low pressure transfer molding. At least in a direction parallel to the protruding direction of the metal terminal so that the flange contacts the contact surface with a pressing force. Characterized in that it comprises a pressure mechanism for applying pressure.

  The pressurizing mechanism is also characterized in that it is a pressurizing jig that conveys the electronic circuit board and the connector to the molding die.

  In order to solve the above problems, the electronic control device according to the present invention basically has the following configuration.

  An electronic circuit board on which electronic components are mounted, a metal terminal protruding at one end for connection to an external electronic circuit, and a flange around it, and connected to the electronic circuit board through the other end of the metal terminal An electronic control device in which the whole of the electronic circuit board and the electronic component and a part of the connector are integrally formed by a low-pressure transfer mold, and a metal plate for fixing the electronic circuit board, And a flexible electronic circuit board which is fixed to a metal plate and electrically connected to the electronic circuit board.

  In addition, a pressure member having an elastic force is provided between the electronic circuit board and the metal plate.

  Further, the electronic circuit board on which the electronic component is mounted, a metal terminal protruding at one end for connecting to an external electronic circuit, and a flange around the metal terminal, the electronic circuit board via the other end of the metal terminal. A connector to be connected, wherein the electronic circuit board and the whole of the electronic component and a part of the connector are integrally formed by a low-pressure transfer mold. A hole is provided. These holes are characterized in that the hole area A and the distance B between them satisfy a relationship of 0.05 <A / B <15, and a part of the thermosetting resin composition of the transfer mold is included. And

  ADVANTAGE OF THE INVENTION According to this invention, while being able to prevent the resin leak from the whole circumference | surroundings of a connector part, it can prevent giving a stress and damage to the solder joint part and metal terminal of the metal terminal of an connector and an electronic circuit board.

  In addition, high-precision positioning is not required at the joint between the connector and the electronic circuit board, and similarly high-precision positioning is not required when placing the parts to be sealed in the mold. The equipment can be rationalized.

  FIG. 1 shows an electronic control device manufacturing method according to the present invention, in which an entire electronic circuit board 2 on which an electronic component 1 is mounted and a part of a connector 3 connected thereto are formed by a molding die (upper) 8a, a molding die. FIG. 5 is a partial cross-sectional view showing an example of a method of integrally forming with a thermosetting resin composition (hereinafter also simply referred to as “resin”) 4 by a low pressure transfer molding method, which is disposed in a mold (lower) 8b.

  The connector 3 used in the present invention has a metal terminal 5 that is connected to the electronic circuit board 2 at a connection portion 12, and a flange 7 is formed around the metal terminal 5. The direction of the flange 7 is a direction that can be regarded as perpendicular or perpendicular to the protruding direction 6 of the metal terminal 5.

  At the time of molding of the electronic control device, the entire electronic circuit board 2 and a part of the connector 3 are clamped by molding dies 8a and 8b on the entire circumference thereof, and are integrally molded by the thermosetting resin composition 4. . At this time, the flange 7 of the connector 3 and the molding dies 8a and 8b protrude with respect to the connector 3 so that the resin 4 is pressed with a sufficient surface pressure so that the resin 4 does not leak from the connector 3 due to the resin pressure during molding. The most important feature is to integrally form the plate 6 in a direction that can be regarded as parallel or parallel to the direction 6 (hereinafter, both are simply referred to as “parallel”) while applying a pressing force. At the time of press contact, the flange 7 is in contact with the wall surface around the opening of the molding dies 8a and 8b so as to close the one end opening of the molding dies 8a and 8b on the molded product drawing side.

  In this embodiment, pressing the flange 7 and the molds 8a and 8b in contact with each other is referred to as “pressure contact”, and the pressing force at the time of pressing is referred to as “pressure contact force”.

  More specifically,

  As shown in FIG. 1, when the connector 3 is arranged and molded so that the flange 7 is located outside the molding dies 8a and 8b, the pressure jig 9 is used to form the molding dies 8a and 8b. A pressure contact force is applied to the connector 3 in a direction 10 parallel to the protruding direction 6 from the outside to the inside.

  When the connector 3 is arranged and molded so that the flange 7 is located inside the molding dies 8a and 8b (an example is shown in FIG. 3), the pressure jig 9 is used to A pressure contact force is applied to the connector 3 outward (in the direction opposite to the arrow in the direction 10) in parallel with the protruding direction 6.

  Thus, by making the direction in which the force is applied to the connector 3 parallel to the protruding direction 6, the electronic circuit board 2 and the connector 3 are molded together with the molding pressure when the thermosetting resin composition 4 flows. The force which presses against type | molds 8a and 8b generate | occur | produces, and resin leakage can be prevented by maintaining the surface pressure of the contact part of molding die 8a, 8b and the flange 7. FIG. In this case, since the direction of the force to be applied may change depending on the flow direction of the resin 4, the direction in which the flow of the resin 4 presses the electronic circuit board 2 and the connector 3 against the molding dies 8a and 8b (parallel to the protruding direction 6). It is desirable to adjust to.

  In the present invention, a force is not applied to the periphery of the connector 3 from the outside of the connector 3 toward the center direction (direction toward the metal terminal 5), but a force parallel to the protruding direction 6 of the metal terminal 5 with respect to the flange 7. Therefore, no force is applied to the metal terminal 5, and the metal terminal 5 and the connection part 12 between the metal terminal 5 and the electronic circuit board 2 are not stressed or damaged during molding.

  In the present invention, a pressing jig or a pulling jig installed outside the molding die can be used as the pressurizing jig 9 for applying a pressing force to the connector 3. The pressure jig 9 applies force to the connector 3 in parallel with the protruding direction 6 of the metal terminal 5 of the connector 3 so that the flange 7 formed around the connector 3 is in close contact with the molding dies 8a and 8b. Add. The pressurizing jig 9 can also transport the electronic circuit board 2 to which the connector 3 is bonded, and such a form is desirable for automation and improvement of productivity.

  Further, when the flange 7 is disposed inside the molding dies 8a and 8b, as shown in FIG. 8, a pressure member 28 having an elastic force is mounted on the electronic circuit board 2, and the molding dies are mounted. When a resin-sealed sealing member such as the electronic circuit board 2 and the connector 3 is disposed in 8a and 8b, a pressing force is applied between the flange 7 and the molding dies 8a and 8b by the pressing force of the pressure member 28, It is also possible to prevent resin leakage. As the pressure member 28 having the elastic force, a metal or resin having a spring structure, or a material having elasticity such as rubber or elastomer can be used. When the electronic component 1 is mounted on the electronic circuit board 2 by a solder reflow method, it is preferable to use a metal having a spring structure because it can be assembled together with the electronic component 1. This embodiment will be described later as Example 4.

The type of the thermosetting resin composition 4 used in the present invention is not particularly limited, but is preferably a solid at room temperature and melted and cured by heating in terms of pot life, productivity, and reliability. As such a resin, for example, a phenol resin, a polyimide resin, an unsaturated polyester resin, a polyamideimide resin, an epoxy resin, a silicone resin, an acrylic resin, a methacrylic resin, or a mixture of these resins can be used. Further, it is desirable that the physical properties after curing can be adjusted by filling the resin with organic substances such as rubber particles or inorganic substances. The inorganic filler can be selected from alumina, crystalline silica, amorphous silica, glass powder, talc, silicon nitride, aluminum nitride, titanium oxide crushed powder, and spherical powder. From the viewpoint of moldability and physical property values after molding, a silica powder filled with an epoxy resin is preferred. Furthermore, the linear expansion coefficient should be in the range of 7 × 10 ⁻⁶ / ° C. to 20 × 10 ⁻⁶ / ° C. in consideration of the adhesion and thermal stress with the electronic circuit board and the electronic circuit components mounted on the substrate. Is desirable.

  In the present invention, the molding method of the electronic control device is based on a low-pressure transfer molding method. Although the molding temperature is not particularly limited, it is usually performed by heating the mold to a temperature of about 175 ° C. After the resin sealing member is placed in the molding die cavity and the thermosetting resin composition tablet is inserted into the pot, the molding die is clamped with a pressure of about 10 to 100 t and the plunger is fixed at a constant speed or several times. The melted thermosetting resin composition is moved in stages and transferred from the pot into a molding die and filled. The filling pressure is desirably molded at a molding pressure of 0.5 MPa to 10 MPa that can achieve both the deformation and damage of the thermosetting resin connector and the denseness of the resin. That is, below 0.5 MPa, voids remain in the resin, and there is a problem in reliability. On the other hand, above 10 MPa, the connector is easily deformed and the mounted electronic component may be damaged at the same time in the connector fixing method according to the present invention. During molding, the inside of the molding die cavity is evacuated as necessary, so that molding with less defects such as voids and peeling can be performed. The electronic control device after molding is desirably heat-treated at a temperature of about 100 ° C. to 200 ° C. for a predetermined time in order to cure the thermosetting resin composition.

The connector used in the present invention is not particularly limited as long as it is a member that can be used as a connector. Polyesters such as polyamide, polybutylene terephthalate, polyethylene terephthalate, polynaphthalene terephthalate, and liquid crystal polymer, which are representative engineering polymers, or A thermoplastic resin such as polyphenylene sulfide is suitable for the material. Furthermore, a thermoplastic resin composition obtained by filling these thermoplastic resins with glass fiber or an inorganic filler is desirable in terms of strength, durability, and the like, and a linear expansion coefficient of 30 × 10 ⁻⁶ / ° C. to 100 It exists in the range of * 10 < ^-6 > / ^degreeC in joining with a thermosetting resin composition.

  Since the thermoplastic resin composition cannot increase the filling amount of the inorganic filler so much, it is general that the linear expansion coefficient is slightly larger than that of the thermosetting resin composition. Therefore, if the thermoplastic resin composition is used for the connector part and the entire structure is covered with the thermosetting resin composition, the temperature is gradually lowered from the high temperature state during the molding and curing of the thermosetting resin composition. Since the thermal contraction of the connector portion is larger than that of the resin-sealed portion, peeling occurs at the interface, and the fixing force of the connector is reduced, which may reduce the vibration resistance. In the present invention, even if a thermoplastic resin composition is used for the connector part, adhesion with the thermosetting resin composition can be enhanced by performing surface cleaning or surface treatment of the connector, and vibration resistance is improved. Can do.

  In addition, in the present invention, as shown in the partial cross-sectional view of the electronic control device shown in FIG. 2, the hole 14 is formed in the peripheral wall surface portion 13 of the connector 3 that is sealed with the thermosetting resin composition 4. By providing a plurality, the fixing strength between the connector 3 and the resin sealing portion can be maintained. This is because the thermosetting resin composition 4 is loaded in the hole 14 and the connector 3 is fixed during molding. Thereby, it is possible to improve the vibration resistance and reliability of the electronic control unit.

  This fixing strength is related to the strength of the thermosetting resin composition 4 as the sealing material, the strength of the thermoplastic resin composition as the material of the connector 3, and the area A of the holes 14 and the interval B15 thereof. Yes.

  As a result of examination from the viewpoint of material properties that can be generally selected at present, if the relationship between the area A of the holes 14 and the interval B is 0.05 <A / B <15, sufficient fixing strength may be obtained. I understood. That is, when A / B is 0.05 or less, the thermosetting resin composition filled in the hole 14 portion and formed in a columnar shape is easily broken, whereas when A / B is 15 or more, the connector Breakage of the thermoplastic resin composition that constitutes is likely to occur. For this reason, if the relationship between the area A of the hole 14 and the interval B is 0.05 <A / B <15 in which the strength balance between the thermoplastic resin portion and the thermosetting resin portion is balanced, the fixing strength of the connector 3 Found that it is possible to keep enough.

  The size and number of the holes 14 provided in the peripheral wall surface portion 13 of the connector 3 may be any size and number as long as the holes 14 are provided so as to satisfy the relationship of 0.05 <A / B <15. Good. In addition, it is desirable that the sizes and intervals of the holes 14 be as uniform as possible and from the viewpoint of the balance of the fixing strength, but as long as the relationship between each hole 14 and the interval B is 0.05 <A / B <15. In particular, they may not be the same size and interval. The shape of the hole can be selected from any shape such as a circle or a square.

  Furthermore, according to the method for manufacturing the electronic control device according to the present invention, the electronic circuit board is fixed to the metal plate, and at least the electronic circuit board mounting surface of the metal plate is integrally formed with the thermosetting resin composition. An electronic control device can be provided.

  In addition, the electronic control device includes at least two types of electronic circuit boards, a board mainly composed of resin and glass cloth, and a resin board having flexibility that is electrically connected thereto, and has flexibility. It is possible to provide an electronic control device characterized in that a resin substrate is fixed on a metal plate. This embodiment will be described later as Example 3.

  As the metal plate in the present invention, for example, an aluminum die cast, a steel plate, an aluminum plate, a copper plate or the like, or a plate obtained by plating these metal plates can be used. In order to improve adhesion with the thermosetting resin composition, it is desirable to select and use roughening, chemical surface treatment, or the like.

  The electronic circuit board in the present invention is not particularly limited as long as an electronic circuit is formed. For example, in addition to organic multilayer substrates that are impregnated with epoxy resin in glass cloth and integrally molded with copper foil, these are laminated while patterning them, multilayer ceramic substrates such as alumina and glass ceramics, and multilayers using thermoplastic resins A substrate can be used. In view of cost and reliability, it is preferable to use a multilayer glass cloth-epoxy composite material substrate. A thin resin substrate having flexibility on which a circuit is formed on the surface of polyimide or polyester can also be used. In this case, the heat dissipation of the heat generating component can be enhanced by attaching the resin substrate to the metal plate. This flexible resin substrate can be used in combination with another multilayer laminate.

  In the present invention, a device for applying a pressure contact force to the connector (for example, a pressure jig) also serves as a transport device that grips and transports the connector and the electronic circuit board joined thereto. This transport device is a device for accurately transporting and fixing a connector and an electronic circuit board connected thereto to a designated position on a molding die before molding, and taking out from the molding die after molding and using it in the next process. Transport to.

  In the conventional manufacturing process, an electronic circuit board and a connector connected thereto are placed on the lower mold, and then the upper mold is clamped. In this case, a supporting portion for placing the electronic circuit board and the connector is provided. Necessary. In particular, since the support portion on which the electronic circuit board is placed becomes a portion that is not sealed with resin, there is a problem in reliability because it is likely to become a starting point of moisture intrusion, destruction, or peeling. Further, when the connector is clamped, if the positional accuracy between the support portion and the connector is not high, the connection portion between the electronic circuit board and the connector is easily broken, the connector portion is deformed, the substrate is misaligned, and the like.

  When a device for applying a pressure contact force to the connector according to the present invention (for example, a pressure jig) is used, there is no need to position the electronic circuit board with high accuracy when placing it on the mold, It is possible to adjust the position of the electronic circuit board so as to be sealed at an accurate position in the resin. Therefore, it is possible to rationalize productivity and production equipment.

  As described above, since it is not necessary to apply force from the periphery of the connector to the center and to perform positioning with high accuracy, the clearance between the molding die and the connector can be widened. For this reason, the above-mentioned decrease in connector fixing force and vibration resistance due to the difference in coefficient of linear expansion between the connector material (for example, the thermoplastic resin composition) and the sealing resin (thermosetting resin composition) is prevented. You can also

  Furthermore, since the support portion for supporting the electronic circuit board is unnecessary and the structure is supported by the metal terminal from the connector, the entire electronic circuit board can be resin-sealed, and the reliability is improved. At the same time, it is possible to rationalize the manufacturing apparatus and the process by providing a device that applies a pressure contact force to the connector with a conveyance function.

  Hereinafter, an example of an electronic control device manufacturing method and an electronic control device according to the present invention will be described in more detail.

  FIG. 1 shows a state in which the electronic circuit board 2 and the connector 3 connected thereto are molded with the thermosetting resin composition 4 as described above. In this embodiment, the connector 3 is arranged so that the flange 7 is positioned outside the molding dies 8a and 8b. In this case, at the time of molding, the flange 7 provided around the connector 3 is moved from the outside to the inside of the molding dies 8a and 8b by the pressure jig 9 with a force parallel to the protruding direction 6 of the metal terminal 5. (In the direction of direction 10). As a result, the joint portion between the connector 3 and the molding dies 8a and 8b can be sealed without a gap by the flange 7, and the thermosetting resin composition 4 leaks out of the molding dies 8a and 8b. Can be prevented.

  At this time, since only the flange 7 is pressurized, the metal terminal 5 of the connector 3 and the connecting portion 12 between the electronic circuit board 2 and the metal terminal 5 are not damaged such as deformation or disconnection. At the same time, the clearance between the molding dies 8a and 8b and the connector 3 can be widened, and the accuracy such as the joining dimension of the metal terminal 5 and the electronic circuit board 2 and the assembly dimension of the connector 3 and the metal terminal 5 can be improved. The manufacturing process does not need to be so high and can be a low-cost manufacturing process.

  A second embodiment of the present invention will be described with reference to FIGS. 3, 4, and 5.

  FIG. 3 is a schematic cross-sectional view showing a method for manufacturing an electronic control device according to the present invention. Hereinafter, the manufacturing method will be described according to the procedure.

  (1) A solder paste is printed on the electronic circuit board 2.

  (2) After mounting the electronic component 1 on the electronic circuit board 2, the whole is heated to 240 ° C. or higher, and the electronic circuit board 2 and the electronic component 1 are connected by solder reflow.

  (3) The resin-sealed member 16 is obtained by inserting the metal terminal 5 of the connector 3 into the electronic circuit board 2 and connecting the electronic circuit board 2 and the metal terminal 5 by partial flow soldering.

  (4) The resin sealing member 16 is lifted and conveyed by the pressure jig 9 having a conveyance function.

  (5) The resin sealing member 16 is placed in the molding dies 8a and 8b heated to 175 ° C. in the low-pressure transfer mold apparatus by the pressure jig 9. In this embodiment, the connector 3 is arranged so that the flange 7 is positioned inside the molding dies 8a and 8b. Thereafter, the thermosetting resin composition tablet 17 is placed on the plunger 18. The clamping pressure of the molding dies 8a and 8b is 70t.

  The low-pressure transfer mold apparatus has a structure in which the O-rings are provided on the parting surfaces of the molding dies 8a and 8b and the plunger 18 so that the inside of the molding dies 8a and 8b can be deaerated.

  (6) After adjusting the position of the resin sealing member 16 with the pressure jig 9, the pressure jig 9 has 500 N along the direction 19 parallel to the protruding direction of the metal terminal 5 and going from the inside of the molding die to the outside. The flange 7 and the molding dies 8a and 8b are pressed against each other.

  At the same time, the inside of the molding dies 8a and 8b is evacuated to a pressure of about 2 kPa by a vacuum pump (not shown). Thereafter, the plunger 18 is raised at a constant speed (may be shifted in several steps), the molten thermosetting resin composition 20 is transferred into the molding dies 8a and 8b, and pressurized at a final pressure of 5 MPa, 180 The thermosetting resin composition 20 is cured by being held in the molding dies 8a and 8b for 2 seconds.

  (7) The resin sealing member 16 (electronic control device 22) after resin sealing is taken out by the pressure jig 9 and transferred to a transport tray (not shown). Thereafter, post-curing is performed at 140 ° C. for 10 hours to obtain a finished product of the electronic control unit 22.

  FIG. 4 is a schematic cross-sectional view of the electronic control device 22 manufactured according to the above-described manufacturing method, and FIG. As shown in FIGS. 4 and 5, the electronic control device 22 manufactured by the method of the present invention has a structure in which the insertion portion of the connector 3 is flat up to the flange 7, and the flange 7, the thermosetting resin composition 4, and the like. Since the boundary is flat, the female connector has good fit and long-term reliability. In addition, since the entire electronic circuit board 2 is sealed with the thermosetting resin composition 4, the structure is very airtight. Furthermore, since the distortion of the solder at the connecting portion between the electronic component 1 and the electronic circuit board 2 is suppressed by the thermosetting resin composition 4, the connection reliability is greatly improved, and the heat resistance and vibration resistance are also improved. To do.

  FIG. 6 shows a schematic cross-sectional view of an electronic control device according to Embodiment 3 of the present invention. FIG. 7 shows an external view of the electronic control device shown in FIG. 6 as viewed from below.

  In the electronic control device of Example 3, two types of electronic circuit boards, that is, an electronic circuit board 2 and a flexible resin board (wiring board 25), and a metal plate 24 are integrally molded by the thermosetting resin composition 4. ing. The flexible wiring board 25 is fixed on the metal plate 24 and is electrically connected to the electronic circuit board 2. The electronic circuit board 2 is fixed to the metal plate 24 through a wiring board 25 having flexibility. The electronic control device according to the third embodiment is basically manufactured by the same process (see FIG. 3) as shown in the second embodiment, but the following points are different.

  In the third embodiment, an aluminum plate is used as the metal plate 24 and a flexible printed wiring board (hereinafter referred to as “FPC”) in which copper wiring is provided on polyimide is used as the wiring board 25 having flexibility. First, the FPC wiring board 25 is fixed to the metal plate 24 with an adhesive 26, and then the connection of the heat generating component 27 on the wiring board 25 and the connection of the electronic component 1 on the electronic circuit board 2 are performed. The solder connection between the wiring board 25 and the electronic circuit board 2 is simultaneously performed using a solder reflow furnace.

  Thereafter, in the step (5) of the low-pressure transfer mold shown in FIG. 3, a resin-sealed member in which the metal plate 24, the electronic circuit board 2, and the connector 3 are integrated is placed on the molding die 8b by a pressure jig. 9 is arranged. At this time, the metal plate 24 is first placed on the molding die 8b, and the electronic circuit board 2 is adjusted to a predetermined position by the pressure jig 9. Thereafter, the electronic control device of the third embodiment is manufactured by the same method as that shown in the second embodiment. In Embodiment 3 of the present invention, by using the flexible wiring board 25 and the metal plate 24, an electronic control device that has high heat dissipation and high mounting strength and can realize high-density mounting can be manufactured.

  A fourth embodiment of the present invention will be described with reference to FIGS. FIG. 8 is a schematic cross-sectional view of the electronic control device of Example 4, FIG. 9 is an external view of the electronic control device shown in FIG. 8 viewed from below, and FIG. 10 is an external view of the electronic control device shown in FIG. Moreover, the cross-sectional schematic diagram which shows the manufacturing method of this electronic control apparatus is shown in FIG. The electronic control device according to the fourth embodiment includes a metal plate 24 and a flexible wiring board 25 as in the third embodiment, but has a structure in which the connector 3 is attached to the lower portion as shown in FIGS. . Even with such a structure, by using the pressure member 28 using elasticity, the flange 7 can be pressed against the molding dies 8a and 8b, and resin leakage can be prevented.

  In this embodiment, as the pressure member 28 using elasticity, one or a plurality of nickel-plated copper plates pressed into a U shape are used (three in the example of FIG. 8). The pressure member 28 is soldered together with the electronic component 1 onto the electronic circuit board 2 by a reflow furnace, and is placed between the electronic circuit board 2 and the metal plate 24. Thereafter, the connector 3 is inserted into the electronic circuit board 2 and the metal terminals 5 are connected by robot soldering. At this time, the connector 3 and the electronic circuit board 2 are arranged so that the connector 3 and the electronic circuit board 2 are in contact with each other at a portion other than the metal terminal 5 so that no stress is applied to the joint between the metal terminal 5 and the electronic circuit board 2. Are closely connected (see FIGS. 8 and 11).

  As shown in FIG. 11, the molding die 8b of the low-pressure transfer mold apparatus is provided with a cavity 29 for accommodating the non-resin-sealed portion of the connector 3. At the time of molding, the connector 3 is placed on the molding die 8 b so that the non-resin-sealed portion of the connector 3 enters the cavity 29 and the flange 7 is positioned at the edge of the cavity 29 to close the cavity 29. Then, the pressing member 28 is fixed, and the molding die 8a is clamped and clamped.

  At this time, due to the elastic force of the pressure member 28, the flange 7 is moved to the molding die 8b in a direction 30 parallel to the protruding direction of the metal terminal 5 from the resin-sealed portion of the connector 3 toward the non-resin-sealed portion. A pressing force acts, and resin leakage from the joint portion between the connector 3 and the molding die 8b can be prevented.

  In the fourth embodiment, the connector 3 is different in the protruding direction from the first to third embodiments and has a structure that enters the inside of the molding dies 8a and 8b. Even in such a case, as described above, the resin leakage is prevented, and the connection portion between the metal terminal 5 and the electronic circuit board 2 of the connector 3 and the metal terminal 5 are prevented from being stressed or damaged. can do. Therefore, even when the mounting layout of the connector 3 is limited, the present invention is effective as shown in the fourth embodiment, so that the degree of freedom in design can be increased.

  As described in the above embodiments, according to the present invention, resin leakage from the connector portion can be prevented, and stress and damage can be prevented from being applied to the joint portion between the metal terminal of the connector and the electronic circuit board and the metal terminal. it can. In addition, high-precision positioning is not required at the joint between the connector and the electronic circuit board, and high-precision positioning is not required when placing the parts to be sealed in the mold. The equipment can be rationalized.

  Furthermore, the resin sealing structure of the present invention can provide a small electronic control device that does not require a base material or a cover material and is integrated with the connector, and the connection portion between the electronic circuit board and the electronic component has connection reliability. Can be improved. When an electronic circuit board having an organic through-hole is used, the temperature cycle life is improved by filling the through-hole with resin. Therefore, even when used in electronic control devices for engine control in harsh environments such as automobiles, construction machinery, agricultural machinery, ships, etc., it is possible to reduce the size of electronic control devices that are excellent in reliability, vibration resistance, and heat resistance. Can be offered at.

  The present invention can be applied to products that are molded by the low-pressure transfer molding method, such as electronic control devices, that have a portion that protrudes to the outside of the molding die at the time of molding, and manufacturing methods and manufacturing apparatuses thereof.

It is a fragmentary sectional view which shows the manufacturing method of the electronic control apparatus by this invention. It is a fragmentary sectional view showing a connector provided with a plurality of holes by the present invention. It is a cross-sectional schematic diagram which shows the manufacturing process of the electronic control apparatus by this invention (Example 2). (Example 2) which is a cross-sectional schematic diagram of the electronic control apparatus by this invention. (Example 2) which is an external view of the electronic control apparatus by this invention. (Example 3) which is a cross-sectional schematic diagram of the electronic control apparatus by this invention. (Example 3) which is an external view of the electronic control apparatus by this invention. (Example 4) which is a cross-sectional schematic diagram of the electronic control apparatus by this invention. (Example 4) which is an external view of the electronic control apparatus by this invention. It is another external view of the electronic control apparatus by this invention. Example 4 (Example 4) which is a cross-sectional schematic diagram which shows the manufacturing method of the electronic control apparatus by this invention. It is sectional drawing which shows the conventional electronic control apparatus.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 1 ... Electronic component, 2 ... Electronic circuit board, 3 ... Connector, 4 ... Thermosetting resin composition, 5 ... Metal terminal, 6 ... Projection direction of metal terminal, 7 ... Flange, 8a ... Mold (upper), 8b ... molding die (bottom), 9 ... pressure jig, 10 ... direction parallel to the protruding direction of the metal terminal from the outside to the inside of the molding die, 12 ... connecting portion between the electronic circuit board and the metal terminal, 13 ... Peripheral wall surface portion of the sealed portion of the connector, 14... Holes in the peripheral wall surface portion of the connector, 15..., Hole spacing, 16. A direction parallel to the protruding direction of the metal terminal and going from the inside of the molding die to the outside, 20 ... a molten thermosetting resin composition, 22 ... an electronic control device, 24 ... a metal plate, 25 ... a wiring board having flexibility, 26 ... Adhesive, 27 ... Heat generating component, 28 ... Pressure member, 29 ... Yabiti, 30 ... direction toward the non-resin-sealed portion from the resin sealing portion in the projecting direction and parallel connector metal terminal.

Claims (13)

An electronic circuit board on which electronic components are mounted, a metal terminal protruding at one end for connection to an external electronic circuit, and a flange around it, and connected to the electronic circuit board through the other end of the metal terminal In the process of manufacturing an electronic control device equipped with a connector,
In the method of manufacturing an electronic control device, the electronic circuit board and the whole of the electronic component and a part of the connector are disposed in a molding die and integrally molded with a thermosetting resin composition by a low pressure transfer molding method.
At the time of the integral molding, one surface of the flange is brought into contact with a wall surface around the opening of the molding die so that the flange closes one end opening of the molding die on the molded product drawing side. A method of manufacturing an electronic control device, comprising performing the low-pressure transfer molding while applying a pressing force at least in a direction parallel to a protruding direction of a metal terminal. In the manufacturing method of the electronic control unit according to claim 1,
The method of manufacturing the electronic control device is a pressure jig that applies the pressing force to the electronic circuit board and the connector to the mold. In the manufacturing method of the electronic control unit according to claim 1,
In the case where the flange is disposed in the molding die, the pressing force is a manufacturing method of an electronic control device that uses the molding pressure of the thermosetting resin composition. In the manufacturing method of the electronic control unit according to claim 1,
The electronic control device includes a metal plate for fixing the electronic circuit board, and a pressing member having an elastic force installed between the electronic circuit board and the metal plate,
The flange is disposed in the mold;
Of the pressure member and the metal plate, at least the fixed surface of the electronic circuit board is integrally formed with the thermosetting resin composition,
The pressing force is applied to the electronic control device manufacturing method that is the pressing member. In the manufacturing method of the electronic control device according to any one of claims 1 to 4,
The connector is formed of a thermoplastic resin composition, and the thermosetting resin composition includes at least an epoxy resin and quartz powder. In the manufacturing method of the electronic control unit according to claim 5,
The linear expansion coefficient of the thermoplastic resin composition is in the range of 30 × 10 ⁻⁶ / ° C. to 100 × 10 ⁻⁶ / ° C., and the linear expansion coefficient of the thermosetting resin composition is 7 × 10 ^−6. The manufacturing method of the electronic control apparatus which exists in the range of 20 ^degreeC / 20 to 10 ^degreeC . In the manufacturing method of the electronic control device according to any one of claims 1 to 6,
The manufacturing method of the electronic control apparatus whose molding pressure at the time of the said integral molding is 0.5 MPa to 10 MPa. An electronic circuit board on which electronic components are mounted, a metal terminal protruding at one end to connect to an external electronic circuit, and a flange around it, and connected to the electronic circuit board through the other end of the metal terminal A transfer molding device of an electronic control device comprising:
In the transfer mold apparatus of an electronic control device, the electronic circuit board and the electronic component as a whole and a part of the connector are disposed in a molding die and integrally molded with a thermosetting resin composition by a low pressure transfer molding method. ,
A contact surface of the flange is formed around one end opening on the molded product drawing side of the molding die,
A pressure mechanism that applies a pressing force to the flange in at least a direction parallel to the protruding direction of the metal terminal so that the flange contacts the contact surface with a pressing force during the low-pressure transfer molding. An electronic control device transfer molding device. In the transfer molding device of the electronic control device according to claim 8,
A transfer mold device of an electronic control device in which a flange provided radially inward is formed around the opening of the molding die, and an inner wall surface or an outer wall surface of the inward flange serves as the contact surface. In the transfer molding device of the electronic control device according to claim 8,
The said pressurization mechanism is a transfer mold apparatus of the electronic control apparatus which is a pressurization jig which conveys the said electronic circuit board and the said connector to the said metal mold | die. An electronic circuit board having electronic components mounted thereon;
A metal terminal protruding at one end to connect to an external electronic circuit, a flange around the metal terminal, and a connector connected to the electronic circuit board through the other end of the metal terminal,
In the electronic control device in which the whole of the electronic circuit board and the electronic component and a part of the connector are integrally formed by a low-pressure transfer mold,
A metal plate for fixing the electronic circuit board;
An electronic control device comprising: a flexible electronic circuit board fixed to the metal plate and electrically connected to the electronic circuit board. The electronic control device according to claim 11.
An electronic control device comprising a pressing member having an elastic force between the electronic circuit board and the metal plate. An electronic circuit board having electronic components mounted thereon;
A metal terminal protruding at one end to connect to an external electronic circuit, a flange around the metal terminal, and a connector connected to the electronic circuit board through the other end of the metal terminal,
In the electronic control device in which the whole of the electronic circuit board and the electronic component and a part of the connector are integrally formed by a low-pressure transfer mold,
The connector is provided with a plurality of holes in the peripheral wall surface, and these holes satisfy the relationship of 0.05 <A / B <15 between the hole area A and the distance B between them. An electronic control device comprising a part of a curable resin composition.

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