JP2010258295A - High-frequency module, method of manufacturing the same, and electronic apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a high-frequency module facilitating handling to a metal housing and having a high shielding characteristic, to provide a method of manufacturing the same, and to provide an electronic apparatus with the high-frequency module mounted thereon. <P>SOLUTION: This high-frequency module 1 includes: a printed wiring board 10; first-mounting-form circuit components 11 mounted on the printed wiring board 10 in a first mounting form; a second-mounting-form circuit component 12 mounted on the printed wiring board 10 in a second mounting form different from the first mounting form; and a metal housing 20 covering the first-mounting-form circuit components 11 and the second-mounting-form circuit component 12. The metal housing 20 includes connection terminal parts 23 delimited by cutout parts 21 formed by cutting out side faces 20s of the metal housing 20 and connected to the printed wiring board 10, and partial parts of the first-mounting-form circuit components 11 are arranged corresponding to the cutout parts 21. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a high-frequency module including a printed wiring board on which circuit components of different types of mounting modes are mounted and a metal casing that covers the circuit component, a manufacturing method thereof, and an electronic device in which the high-frequency module is mounted.

  A general high-frequency module includes a metal casing on a printed wiring board for shielding noise and facilitating handling of the high-frequency module in a production line. In addition, since circuit components mounted on a printed wiring board are affected by ambient environments (outside air / climate) such as temperature and humidity, a resin covering the circuit components must be supplied to suppress the influence.

  In conventional high-frequency modules, if resin is supplied before the metal casing is connected to the printed wiring board, the resin may flow between the metal casing and the connection portion of the printed wiring board. Since it is difficult to connect the two with high accuracy, there is a fear that a sufficient shielding effect cannot be obtained. Therefore, the resin is supplied after the metal casing is connected to the printed wiring board. That is, a metal casing provided with a hole for resin supply is connected to the printed wiring board.

  Patent Document 1 is known as a technique that discloses a technique related to shielding of a high-frequency module. Patent Document 2 discloses a technique in which a metal casing is provided in a high-frequency module.

JP 2002-33419 A JP 2004-95973 A

  In the conventional metal casing form, noise can be shielded, but since a hole for resin supply is provided in the metal casing, suction is difficult when handling high-frequency modules in the production line. The problem of becoming. In addition, when resin supply is required after the metal casing is connected to the printed wiring board, there is a problem that the resin cannot be supplied unless the metal casing is removed from the printed wiring board.

  This invention is made | formed in view of such a condition, The 1st mounting aspect circuit component mounted in the 1st mounting aspect, the 2nd mounting aspect circuit component mounted in the 2nd mounting aspect, and a side surface A metal housing in which a connection terminal portion defined by the cutout portion is connected to the printed wiring board, and the first mounting mode circuit component is arranged corresponding to the cutout portion to The high-frequency module is easy to handle and has high shielding characteristics, and the filling resin portion is easily formed by injecting the filling resin through the notch portion between the circuit component of the first mounting mode and the printed wiring board. An object of the present invention is to provide a high-frequency module that can be used.

  The present invention is also a method for manufacturing a high-frequency module, comprising: a circuit component mounting step for mounting a first mounting mode circuit component on a printed wiring board; and a notch formed by notching a side surface of the metal housing. A metal housing connection step of connecting the defined connection terminal portion to the printed wiring board, and filling the filling resin portion between the first mounting mode circuit component and the printed wiring board via the notch portion. By providing a filling resin portion forming step to be formed, the metal casing can be easily and highly accurately connected to the printed wiring board, and the filling resin portion between the first mounting mode circuit component and the printed wiring board can be easily provided. Another object is to provide a method of manufacturing a high-frequency module that can be formed with high accuracy.

  Another object of the present invention is to provide an electronic device having excellent productivity, high shielding characteristics and high reliability by using an electronic device equipped with the high-frequency module according to the present invention.

  The high-frequency module according to the present invention includes a printed wiring board, a first mounting mode circuit component mounted on the printed wiring board in a first mounting mode, and a second mounting different from the first mounting mode on the printed wiring board. A high frequency module comprising: a second mounting mode circuit component mounted in a mode; and a metal casing that covers the first mounting mode circuit component and the second mounting mode circuit component, wherein the metal casing is the metal A connection terminal portion defined by a cutout portion formed by cutting out a side surface of the housing and connected to the printed wiring board; a part of the circuit component of the first mounting mode corresponds to the cutout portion; It is characterized by being arranged.

  With this configuration, the notch portion is arranged corresponding to the side surface of the metal casing, and the top surface of the metal casing is secured widely, so that reliable suction to the top surface is possible. Therefore, it is possible to provide a high-frequency module that can be easily handled with respect to the metal casing in the manufacturing process (production line) after the metal casing is connected to the printed wiring board. Moreover, since it becomes possible to connect a metal housing | casing with a printed wiring board with high precision, it can be set as the high frequency module which has a high shield characteristic. In addition, since the filling resin portion can be easily formed by injecting the filling resin between the first mounting mode circuit component and the printed wiring board through the notch, the first mounting mode circuit component. Reliability can be improved. That is, the filled resin portion can be formed without removing the metal casing.

  In the high-frequency module according to the present invention, the first mounting aspect circuit component is disposed so as to be exposed from the notch portion in a plan view of the printed wiring board as viewed from the top surface of the metal casing. It is characterized by being.

  With this configuration, it is possible to easily and accurately inject the filling resin for forming the filling resin portion between the first mounting mode circuit component and the printed wiring board.

  In the high-frequency module according to the present invention, the first mounting mode circuit component is a flip-chip mounting mode, and the bumps of the first mounting mode circuit component are connected to the printed wiring board. It is characterized by being.

  With this configuration, since the bumps are arranged within the surface area of the first mounting mode circuit component, it is not necessary to arrange the connection region around the bumps. High frequency characteristics can be improved.

  In the high-frequency module according to the present invention, the first mounting aspect circuit component is connected to the printed wiring board with the semiconductor substrate exposed.

  With this configuration, it is possible to make the first mounting circuit component with high productivity and low cost and high density mounting, and it is possible to obtain a high-frequency module with high productivity and low cost.

  In the high-frequency module according to the present invention, the first mounting mode circuit component is connected to the printed wiring board in a chip size package.

  With this configuration, it is possible to make the first mounting circuit component with high productivity and low cost and high density mounting, and it is possible to obtain a high-frequency module with high productivity and low cost.

  The high-frequency module according to the present invention further includes a filled resin portion filled with a filling resin between the first mounting mode circuit component and the printed wiring board, and the thermal expansion coefficient of the bump is the printed wiring board. The coefficient of thermal expansion is different.

  With this configuration, it is possible to suppress the effect of shrinkage pressure / tensile pressure based on the difference between the thermal expansion coefficient of the bump and the thermal expansion coefficient of the printed wiring board at the filled resin part, and to make a highly reliable high-frequency module Can do.

  In the high-frequency module according to the present invention, the bumps are lead-free solder.

  With this configuration, the first mounting mode circuit component can be easily and highly accurately connected to the printed wiring board, and a high-frequency module suitable for the environment can be obtained.

  In the high-frequency module according to the present invention, the connection terminal portion is disposed at a position on the opposite side of the printed wiring board.

  With this configuration, the metal housing can be securely and firmly connected to the printed wiring board, and highly reliable shielding characteristics and mechanical strength can be ensured.

  In the high-frequency module according to the present invention, the printed wiring board is formed of an organic insulator.

  With this configuration, a high-frequency module using a printed wiring board made of an organic insulator can be obtained.

  In the high-frequency module according to the present invention, the printed wiring board is formed of an inorganic insulator.

  With this configuration, a high-frequency module using a printed wiring board made of an inorganic insulator can be obtained.

  The high frequency module manufacturing method according to the present invention includes a printed wiring board, a first mounting mode circuit component mounted on the printed wiring board in a first mounting mode, and the first mounting mode on the printed wiring board. Is a method of manufacturing a high-frequency module comprising: a second mounting mode circuit component mounted in a different second mounting mode; and a metal casing that covers the first mounting mode circuit component and the second mounting mode circuit component, A circuit component mounting step of mounting the first mounting mode circuit component on the printed wiring board, and a connection terminal portion defined by a notch formed by cutting out a side surface of the metal casing on the printed wiring board. A metal housing connection step to be connected, and a filling resin portion is formed by filling a filling resin between the circuit component of the first mounting mode and the printed wiring board via the notch portion. Characterized in that it comprises a Hama resin portion forming step.

  With this configuration, it is possible to connect the metal housing to the printed wiring board easily and with high precision, and the filling resin portion between the first mounting mode circuit component and the printed wiring board can be formed easily and with high precision. It can be set as the manufacturing method of the high frequency module which can do.

  In the high frequency module manufacturing method according to the present invention, in the filling resin portion forming step, the filling resin is filled between the first mounting mode circuit component and the printed wiring board by a capillary phenomenon. Features.

  With this configuration, since the filling resin is filled using the capillary phenomenon, the filling resin portion can be formed in a state where the influence on the bumps connecting the first mounting mode circuit component and the printed wiring board is suppressed.

  An electronic device according to the present invention is an electronic device equipped with a high-frequency module, and the high-frequency module is the high-frequency module according to the present invention.

  With this configuration, since the high-frequency module having excellent handling in the manufacturing process and having high shielding characteristics and reliability is mounted, it is possible to obtain an electronic device having excellent productivity and high shielding characteristics and reliability.

  A high-frequency module according to the present invention is mounted on a printed wiring board, a first mounting mode circuit component mounted on the printed wiring board in a first mounting mode, and a second mounting mode different from the first mounting mode on the printed wiring board. A high-frequency module comprising a second mounting mode circuit component and a metal casing that covers the first mounting mode circuit component and the second mounting mode circuit component, wherein the metal casing is cut out at a side surface of the metal casing. A connection terminal portion defined by the notch portion formed in this way and connected to the printed wiring board is provided, and a part of the circuit component in the first mounting manner is arranged corresponding to the notch portion.

  Therefore, the notch portion is arranged in correspondence with the side surface of the metal casing, and the top surface of the metal casing is secured widely, so that there is an effect that reliable suction to the top surface is possible. That is, the high-frequency module can be easily handled with respect to the metal casing in the manufacturing process (production line) after the metal casing is connected to the printed wiring board. Moreover, since it becomes possible to connect a metal housing | casing with a printed wiring board with high precision, it can be set as the high frequency module which has a high shield characteristic. In addition, since the filling resin portion can be easily formed by injecting the filling resin between the first mounting mode circuit component and the printed wiring board through the notch, the first mounting mode circuit component. Reliability can be improved. That is, the filled resin portion can be formed without removing the metal casing.

  The method for manufacturing a high-frequency module according to the present invention includes a printed wiring board, a first mounting mode circuit component mounted on the printed wiring board in a first mounting mode, and a first mounting mode different from the first mounting mode on the printed wiring board. A method for manufacturing a high-frequency module, comprising: a second mounting mode circuit component mounted in two mounting modes; and a first mounting mode circuit component and a metal housing that covers the second mounting mode circuit component. A circuit component mounting step for mounting the component on the printed wiring board, a metal housing connecting step for connecting the connection terminal portion defined by the notch formed by cutting out the side surface of the metal housing to the printed wiring board, and A filling resin portion forming step of filling the filling resin between the first mounting mode circuit component and the printed wiring board via the notch to form the filling resin portion;

  Therefore, it becomes possible to connect the metal casing to the printed wiring board easily and with high precision, and to form the filling resin portion between the circuit component of the first mounting mode and the printed wiring board with high precision. There is an effect that it can be a method of manufacturing a high-frequency module that can be used.

  Moreover, the electronic device which concerns on this invention is an electronic device carrying a high frequency module, Comprising: A high frequency module is a high frequency module which concerns on this invention.

  Therefore, since the high-frequency module having excellent handling in the manufacturing process and having high shielding characteristics and reliability is mounted, the electronic device having excellent productivity and high shielding characteristics and reliability can be obtained.

It is a perspective view which shows notionally the whole structure of the high frequency module which concerns on Embodiment 1 of this invention. It is a top view which shows the state which looked at the connection terminal part of the high frequency module shown to FIG. 1A from the top | upper surface direction of the metal housing. It is a perspective view which shows notably the one part process of the manufacturing method of the high frequency module which concerns on Embodiment 2 of this invention. It is a perspective view which shows notionally the state after manufacture of the high frequency module shown to FIG. 2A. It is a top view which shows the arrangement | positioning state of the bump of the 1st mounting aspect circuit component mounted in the high frequency module which concerns on Embodiment 3 of this invention. It is sectional drawing which shows notionally the cross-sectional state in the arrow BB of FIG. 3A of the 1st mounting aspect circuit component shown to FIG. 3A. It is a side view which shows notionally the state filled with filling resin with the manufacturing method of the high frequency module which concerns on Embodiment 3 of this invention.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

<Embodiment 1>
Based on FIG. 1A and FIG. 1B, the high frequency module which concerns on this Embodiment is demonstrated.

  FIG. 1A is a perspective view conceptually showing the overall structure of the high-frequency module according to Embodiment 1 of the present invention.

  1B is a plan view showing a state in which the connection terminal portion of the high-frequency module shown in FIG. 1A is viewed from the top surface direction of the metal housing.

  The high-frequency module 1 according to the present embodiment includes a printed wiring board 10, a first mounting mode circuit component 11 mounted on the printed wiring board 10 in a first mounting mode, and a first mounting mode on the printed wiring board 10. A second mounting mode circuit component 12 mounted in a different second mounting mode, and a metal housing 20 that covers the first mounting mode circuit component 11 and the second mounting mode circuit component 12 are provided.

  Further, in the high-frequency module 1 according to the present embodiment, the metal housing 20 is defined by the notch portion 21 formed by notching the side surface 20 s of the metal housing 20 and connected to the printed wiring board 10. A part 23 of the first mounting mode circuit component 11 is provided corresponding to the notch 21.

  Therefore, the notch 21 is disposed in correspondence with the side surface 20s of the metal housing 20 and the top surface 20t of the metal housing 20 is secured widely, so that reliable suction to the top surface 20t is possible. Therefore, the high-frequency module 1 can be easily handled with respect to the metal casing 20 in the manufacturing process (production line) after the metal casing 20 is connected to the printed wiring board 10. Moreover, since it becomes possible to connect the metal housing | casing 20 to the printed wiring board 10 with high precision, it can be set as the high frequency module 1 which has a high shield characteristic.

  In addition, the filling resin portion 14 (see Embodiment 3 and FIG. 4) is injected between the first mounting mode circuit component 11 and the printed wiring board 10 through the notch portion 21 to inject the filling resin portion 14 (implementation). 2 and FIG. 2b (see Embodiment 3 and FIG. 4) can be easily formed, so that the reliability of the circuit component 11 in the first mounting mode 11 can be improved. That is, the filled resin portion 14 can be formed without removing the metal housing 20.

  The first mounting mode circuit component 11 is disposed so as to be exposed from the notch 21 in a plan view of the printed wiring board 10 viewed from the top surface 20t of the metal housing 20 (FIG. 1B). Therefore, it is possible to easily and accurately inject the filling resin 14r for forming the filling resin portion 14 between the first mounting mode circuit component 11 and the printed wiring board 10.

  That is, the first mounting aspect circuit component 11 may be disposed at a position where the filling resin 14r for forming the filling resin portion 14 can be easily injected (position near the notch portion 21).

  The metal housing 20 is made of, for example, white. Western white is made of, for example, 60% copper, 15% zinc, 15% nickel, and other metals. Since it is excellent in flexibility, bending workability, and corrosion resistance, an optimal shape can be easily and accurately formed as a shield plate. It is also possible to apply a metal other than Western white.

  The connection terminal portion 23 is preferably arranged at a position on the opposite side of the printed wiring board 10. With this configuration, the metal housing 20 can be securely and firmly connected to the printed wiring board 10, and highly reliable shielding characteristics and mechanical strength can be ensured. Note that the arrangement of the connection terminal portions 23 is not limited to two, but can be three or more. In the present embodiment, the connection terminal portion 23 formed so as to correspond to the central region of the side 20f formed by the top surface 20t of the metal housing 20, and the two corners at the opposite positions facing the side 20f. And two connection terminal portions 23 formed corresponding to the portion 20c. That is, the metal housing 20 is firmly connected to the printed wiring board 10 because it is connected to the printed wiring board 10 by the three connection terminal portions 23.

  After applying the solder paste to the connection terminal installation location of the printed wiring board 10, the connection terminal portion 23 is positioned and placed at the connection terminal installation location, and then subjected to a reflow process. It is connected to the printed wiring board 10 easily and with high accuracy.

  The printed wiring board 10 may be formed of an organic insulator. With this configuration, the high-frequency module 1 using the printed wiring board 10 made of an organic insulator can be obtained. As the organic insulator, for example, a polyimide resin, an epoxy resin, or the like can be applied.

  Moreover, the printed wiring board 10 may be formed of an inorganic insulator. With this configuration, the high-frequency module 1 using the printed wiring board 10 made of an inorganic insulator can be obtained. As the inorganic insulator, for example, ceramics such as alumina can be applied.

  In the high-frequency module 1 according to the present embodiment, the first mounting mode circuit component 11 is a flip-chip mounting mode, and the bumps 11b of the first mounting mode circuit component 11 are connected to the printed wiring board 10. Has been.

  With this configuration, the bumps 11b are arranged within the range of the surface of the first mounting mode circuit component 11, so that it is not necessary to arrange a connection region around the bumps 11b. Density and high frequency characteristics can be improved.

  In addition, the 1st mounting aspect circuit component 11 made into the mounting aspect of the flip-flop system can be made into various forms as shown below.

  The first mounting aspect circuit component 11 may be connected to the printed wiring board 10 with the semiconductor substrate exposed. With this configuration, it is possible to make the first mounting circuit component with high productivity and low cost and high density mounting, and the high-frequency module 1 with high productivity and low cost can be obtained.

  Further, the first mounting mode circuit component 11 may be connected to the printed wiring board 10 in a chip size package. With this configuration, it is possible to make the first mounting circuit component with high productivity and low cost and high density mounting, and the high-frequency module 1 with high productivity and low cost can be obtained.

  The bump 11b is preferably lead-free solder. With this configuration, the first mounting mode circuit component 11 can be connected to the printed wiring board 10 easily and with high accuracy, and the high-frequency module 1 suitable for the environment can be obtained.

  Further, the second mounting mode circuit component 12 is mounted in a mounting mode different from the first mounting mode circuit component 11, for example, a surface mounting mode having lead terminals 12 w, and the printed wiring board 10 via lead-free solder. It is connected to the.

<Embodiment 2>
Based on FIG. 2A and FIG. 2B, the high-frequency module and the method for manufacturing the high-frequency module according to the present embodiment will be described. Since the basic configuration is the same as that of the first embodiment, reference numerals are used and description thereof is omitted as appropriate.

  FIG. 2A is a perspective view conceptually showing a part of the manufacturing process of the high frequency module according to Embodiment 2 of the present invention.

  FIG. 2B is a perspective view conceptually showing a state after the high-frequency module shown in FIG. 2A is manufactured.

  The method for manufacturing a high-frequency module according to the present embodiment includes a printed wiring board 10, a first mounting mode circuit component 11 mounted on the printed wiring board 10 in a first mounting mode, and a first mounting mode on the printed wiring board 10. Manufacturing method of high-frequency module 1 comprising second mounting mode circuit component 12 mounted in a second mounting mode different from the above, and metal housing 20 covering first mounting mode circuit component 11 and second mounting mode circuit component 12 It is.

  The manufacturing method of the high-frequency module 1 according to the present embodiment includes a circuit component mounting process for mounting the first mounting mode circuit component 11 on the printed wiring board 10 and a cut formed by cutting out the side surface 20s of the metal housing 20. Metal housing connection step for connecting the connection terminal portion 23 defined by the notch 21 to the printed wiring board 10 and filling between the first mounting mode circuit component 11 and the printed wiring board 10 through the notch 21. A filling resin portion forming step of filling the resin 14r to form the filling resin portion 14 (FIG. 2B).

  With this configuration, the metal housing 20 can be easily and accurately connected to the printed wiring board 10, and the filling resin portion 14 between the first mounting mode circuit component 11 and the printed wiring board 10 can be easily formed. And it can be set as the manufacturing method of the high frequency module 1 which can be formed with high precision.

  2A shows a state in which the first mounting mode circuit component 11 and the second mounting mode circuit component 12 are mounted (the processing in the circuit component mounting process is completed), and the metal casing 20 is connected (metal casing). In the state in which the processing in the body connection process is completed), the filling resin dispenser 50 for filling the filling resin 14r between the first mounting mode circuit component 11 and the printed wiring board 10 is disposed (filling resin portion forming process) Process) state. FIG. 2B shows a state in which the filling resin portion 14 is formed between the first mounting manner circuit component 11 and the second mounting manner circuit component 12 (the processing in the filling resin portion forming step is completed).

  The first mounting mode circuit component 11 and the second mounting mode circuit component 12 can be mounted in such a manner that they can be mounted simultaneously. For example, the first mounting mode circuit component 11 is a flip-chip mounting mode, and the bumps 11 b formed of lead-free solder are connected to the printed wiring board 10. Further, the second mounting mode circuit component 12 is a surface mounting mode having lead terminals 12w, and the lead terminals 12w are connected to the printed wiring board 10 through lead-free solder.

  In addition, the 2nd mounting aspect circuit component 12 can also be set as mounting forms other than a surface mounting aspect. For example, a configuration in which the printed wiring board 10 is connected by wire bonding is also possible. However, since the same solder flow processing step can be used, it is desirable that both the first mounting mode circuit component 11 and the second mounting mode circuit component 12 are connected by solder reflow.

  In addition, generally used resin, such as an epoxy resin and a silicone resin, can be applied to the filling resin 14r.

  The filling resin portion 14 can be formed by disposing the nozzle of the filling resin dispenser 50 in the notch 21 and supplying the filling resin 14r close to the end of the first mounting mode circuit component 11. The method for forming the filled resin portion 14 will be described in more detail in the third embodiment.

<Embodiment 3>
Based on FIG. 3A thru | or FIG. 4, the manufacturing method of the high frequency module and high frequency module which concern on this Embodiment is demonstrated.

  FIG. 3A is a plan view showing an arrangement state of bumps of the first mounting mode circuit component mounted on the high-frequency module according to Embodiment 3 of the present invention.

  3B is a cross-sectional view conceptually showing a cross-sectional state of the first mounting mode circuit component shown in FIG. 3A at arrows BB in FIG. 3A. Note that hatching is omitted.

  FIG. 4 is a side view conceptually showing a state in which a filling resin is filled in the method for manufacturing a high-frequency module according to Embodiment 3 of the present invention.

  The first mounting mode circuit component 11 shown in FIGS. 3A and 3B is a so-called flip-chip mounting mode.

  Bumps 11b are arranged in a matrix (for example, 5 × 6 = 30 bumps 11b) on the surface 11s on the side connected to the printed wiring board 10. Since the distance between the bumps 11b arranged at a high density in a matrix shape is small, or the space between the surface 11s (first mounting mode circuit component 11) and the printed wiring board 10 is narrow, filling is performed. The resin 14r can fill the space between the first mounting mode circuit component 11 and the printed wiring board 10 by capillary action.

  A part of the first mounting mode circuit component 11 is arranged corresponding to the notch 21, and the filling resin dispenser 50 is arranged corresponding to the notch 21. Therefore, the filling resin 14r supplied from the filling resin dispenser 50 to the surface of the printed wiring board 10 via the nozzle flows on the surface of the first mounting mode circuit component 11 and a part of the first mounting mode circuit component 11 ( To the end). The filling resin 14r that has reached the first mounting mode circuit component 11 by the flow can fill the space between the first mounting mode circuit component 11 and the printed wiring board 10 by capillary action (FIG. 4). .

  That is, in the method for manufacturing the high-frequency module 1 according to the present embodiment, in the filling resin portion forming step, the filling resin 14r is filled between the first mounting mode circuit component 11 and the printed wiring board 10 by capillary action. . Therefore, since the filling resin 14r is filled using the capillary phenomenon, the filling resin portion 14 is formed in a state in which the influence on the bumps 11b connecting the first mounting mode circuit component 11 and the printed wiring board 10 is suppressed. Can do.

  The printed wiring board 10 is preferably heated with a hot plate in order to improve the viscosity (fluidity) of the filling resin 14r and to cause curing with high sealing performance.

  That is, the high-frequency module 1 according to the present embodiment includes the filled resin portion 14 filled with the filled resin 14r between the first mounting mode circuit component 11 and the printed wiring board 10. Further, the thermal expansion coefficient of the bump 11 b is different from the thermal expansion coefficient of the printed wiring board 10.

  Therefore, it becomes possible to suppress the influence by the contraction pressure / tensile pressure based on the difference between the thermal expansion coefficient of the bump 11b and the thermal expansion coefficient of the printed wiring board 10 by the filling resin portion 14, and the high-frequency module 1 with high reliability. can do.

  As the filling resin 14r, for example, an epoxy resin, a silicone resin, or the like can be applied. The viscosity of the filling resin 14r is adjusted in advance so as to be filled between the bumps 11b between the first mounting mode circuit component 11 and the printed wiring board 10 by capillary action.

The thermal expansion coefficient of the bump 11b formed of lead-free solder is, for example, 23.4 × 10 ⁻⁶ / ° C. for Sn3.0Ag0.5Cu and 26.0 × 10 ⁻⁶ / ° C for Sn-10Sb. ° C. The thermal expansion coefficient of the printed wiring board 10 is, for example, 60 × 10 ⁻⁶ / ° C. in FR4 (heat-resistant glass cloth base epoxy resin copper-clad laminate).

  Therefore, the thermal expansion coefficient of the bump 11b and the thermal expansion coefficient of the printed wiring board 10 generally have a difference of several times. That is, in the temperature cycle test (for example,..., -40.degree. C., + 85.degree. C., -40.degree. C.,...) After the high frequency module 1 is completed, the first mounting mode circuit component 11 (bump 11b) and the printed circuit are printed. Shrinkage pressure / tensile pressure is generated between the wiring board 10 and the wiring board 10.

  As described above, in this embodiment, since the filling resin portion 14 is formed between the first mounting mode circuit component 11 and the printed wiring board 10, the thermal expansion coefficient of the bump 11b and the printed wiring board 10 It becomes possible to suppress the influence of the contraction pressure / tensile pressure caused by the difference from the thermal expansion coefficient. Therefore, the reliability of the connection of the bumps 11b to the printed wiring board 10 can be improved.

<Embodiment 4>
The electronic device according to the present embodiment is an electronic device in which a high-frequency module is mounted, and the high-frequency module is a high-frequency module according to the first to third embodiments.

  Therefore, since the high-frequency module having excellent handling in the manufacturing process and having high shielding characteristics and reliability is mounted, an electronic device having excellent productivity and high shielding characteristics and reliability can be obtained.

  Note that a high-frequency receiver mounted with a high-frequency module corresponds to the electronic device.

DESCRIPTION OF SYMBOLS 1 High frequency module 10 Printed wiring board 11 1st mounting aspect circuit component 11b Bump 12 2nd mounting aspect circuit part 14 Filling resin part 14r Filling resin 20 Metal housing 20c Corner | angular part 20f Side 20s Side 20t Top surface 21 Notch part 23 Connection Terminal 50 Filling resin dispenser

Claims (13)

A printed wiring board, a first mounting mode circuit component mounted on the printed wiring board in a first mounting mode, and a second mounting mounted on the printed wiring board in a second mounting mode different from the first mounting mode A high-frequency module comprising an aspect circuit component and a metal housing that covers the first mounting aspect circuit component and the second mounting aspect circuit component,
The metal casing includes a connection terminal portion defined by a notch formed by cutting out a side surface of the metal casing and connected to the printed wiring board.
A part of said 1st mounting aspect circuit component is arrange | positioned corresponding to the said notch part, The high frequency module characterized by the above-mentioned. The high-frequency module according to claim 1,
The high frequency module according to claim 1, wherein the first mounting circuit component is disposed so as to be exposed from the notch in a plan view of the printed wiring board as viewed from the top surface of the metal casing. The high-frequency module according to claim 1 or 2,
The first mounting mode circuit component is a flip-chip mounting mode, and the bumps of the first mounting mode circuit component are connected to the printed wiring board. The high-frequency module according to claim 3,
The first mounting aspect circuit component is connected to the printed wiring board in a state where a semiconductor substrate is exposed. The high-frequency module according to claim 3,
The first mounting mode circuit component is connected to the printed wiring board in a chip size package. A high-frequency module according to any one of claims 3 to 5,
The first mounting aspect includes a filling resin portion filled with a filling resin between the circuit component and the printed wiring board, and the thermal expansion coefficient of the bump is different from the thermal expansion coefficient of the printed wiring board. High frequency module to do. The high-frequency module according to claim 6,
The bump is made of lead-free solder. A high-frequency module according to any one of claims 1 to 7,
The high-frequency module according to claim 1, wherein the connection terminal portion is arranged at a position opposite to the printed wiring board. A high-frequency module according to any one of claims 1 to 8,
The high-frequency module, wherein the printed wiring board is formed of an organic insulator. A high-frequency module according to any one of claims 1 to 8,
The high-frequency module, wherein the printed wiring board is formed of an inorganic insulator. A printed wiring board, a first mounting mode circuit component mounted on the printed wiring board in a first mounting mode, and a second mounting mounted on the printed wiring board in a second mounting mode different from the first mounting mode A method of manufacturing a high-frequency module comprising: an aspect circuit component; and a metal casing that covers the first mounting aspect circuit component and the second mounting aspect circuit component,
A circuit component mounting step of mounting the first mounting mode circuit component on the printed wiring board;
A metal housing connection step of connecting a connection terminal portion defined by a notch formed by cutting out a side surface of the metal housing to the printed wiring board;
A high-frequency module comprising: a filling resin portion forming step of filling a filling resin between the first mounting mode circuit component and the printed wiring board through the notch portion to form a filling resin portion. Manufacturing method. It is a manufacturing method of the high frequency module according to claim 11,
In the filling resin portion forming step, the filling resin is filled between the first mounting mode circuit component and the printed wiring board by a capillary phenomenon. An electronic device equipped with a high-frequency module,
The electronic device according to claim 1, wherein the high-frequency module is the high-frequency module according to claim 1.

Images