JP2012004213A - Flexible circuit board with waterproof member - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a flexible circuit board with high waterproofness.SOLUTION: The flexible circuit board with a waterproof member comprises: a flexible circuit board inserted through a body of an electronic apparatus; and a waterproof member provided in a waterproof part of the flexible circuit board. The waterproof member is a cured product made of ultraviolet hardening silicon resin, and is a waterproof elastic body.

Description

  The present invention relates to a flexible circuit board with a waterproof member, and more particularly to a flexible circuit board used for a mobile phone.

  Recent mobile phones are required to have high waterproof performance.

  Usually, in a mobile phone, the first housing and the second housing are connected by a hinge portion. FIG. 1 is a cross-sectional view of the vicinity of a hinge portion of a mobile phone. In the mobile phone 1, the hinge portion 3 includes a first housing 2 a in which electronic components and a circuit board 4 a are installed, and a second housing 2 b in which electronic components and a circuit board 4 b are installed. It is connected. The electronic components or the circuit board 4 in each case are electrically connected by the flexible circuit board 5. Specifically, connectors 6a and 6b at both ends of the flexible circuit board are connected to the circuit boards 4a and 4b. Alternatively, the connectors 6a and 6b at both ends of the flexible circuit board are directly connected to the electronic components in the housing.

  At this time, the flexible circuit board 5 once goes out of the first housing 2a, passes through the inside of the hinge portion 3, and is connected to the second housing 2b. For this reason, if the waterproofing between the housing 2 and the flexible circuit board 5 is insufficient, the mobile phone 1 may be splashed with water or the mobile phone 1 may be dropped into the water. As a result, an electronic component or the like breaks down.

  In view of this, Japanese Patent Application Laid-Open No. 2003-142836 (Patent Document 1) discloses a waterproof structure in which a packing is disposed between a housing and a flexible circuit board to waterproof.

  Japanese Patent Laid-Open No. 2004-214927 (Patent Document 2) discloses a waterproof structure in which a waterproof cap is fixed to a flexible circuit board by insert molding, and an O-ring is disposed on the outer periphery of the waterproof cap. .

JP 2003-142836 A (Claims) JP 2004-214927 A (paragraph number 0021)

JP 2009-26966 A (Claims, FIG. 2)

  However, the conventional waterproof structure has a problem that waterproofness is not sufficient.

  Accordingly, an object of the present invention is to solve the above-described problem and to provide a flexible circuit board having high waterproof performance.

  Note that the above-described problem is a common problem in electronic devices having a structure in which a plurality of housings in which electronic components and circuit boards are installed are connected by hinges, not limited to mobile phones.

Such an object is achieved by the following present inventions (1) to (4).
(1) having a flexible circuit board inserted into the casing of the electronic device, and a waterproof member attached to a waterproof part of the flexible circuit board,
The waterproof member is a cured product of an ultraviolet curable silicone resin, and is a waterproof elastic body.
A flexible circuit board with a waterproof member.
(2) an arrangement step of arranging the flexible circuit and the ultraviolet curable silicone resin so that the attachment portion of the waterproof member of the flexible circuit board is in contact with the ultraviolet curable silicone resin filled in the mold; ,
A curing step of curing the ultraviolet curable silicone resin;
The manufacturing method of the flexible circuit board with a waterproof member which has this.
(3) The molding die is a molding die in which a notch for fitting the flexible circuit board is formed on a side wall of the molding die, and the flexible circuit is formed in the notch in the arranging step. The method for producing a flexible circuit board with a waterproof member according to (2), wherein the flexible circuit board is disposed by fitting the board.
(4) The mold is a mold having a plurality of components and having a resin-filled space filled with the ultraviolet curable silicone resin therein, and the waterproof member of the flexible circuit board in the arranging step The mold is placed on the flexible circuit board so that the attachment part is sandwiched from above and below, and then the ultraviolet curable silicone resin is filled in the resin filling space, thereby The method for producing a flexible circuit board with a waterproof member according to (2), wherein an ultraviolet curable silicone resin is disposed.

  According to the present invention, a flexible circuit board having high waterproof performance can be provided.

It is sectional drawing of the hinge part vicinity of a mobile telephone. It is a typical top view of the example of the form of the flexible circuit board with a waterproof member of the present invention. FIG. 3 is an end view of the waterproof member in FIG. 2 cut along a section xx. It is a typical end view which shows a mode that the flexible circuit board with a waterproof member of this invention is arrange | positioned in the insertion part of the flexible circuit board of a housing | casing. It is a typical end view which shows the example of a form of a waterproof member. It is a typical perspective view of the shaping | molding die used for the manufacturing method (1) of the flexible circuit board with a waterproof member of this invention. It is a typical top view which shows a mode that the flexible circuit board is installed in the shaping | molding die. FIG. 8 is an end view taken along the line zz in FIG. 7. It is a typical end view which shows a mode that a flexible circuit and an ultraviolet curable silicone resin are arrange | positioned at the arrangement | positioning process (1). It is a typical end view which shows the mode after hardening by the hardening process (1). It is a typical perspective view of the shaping | molding die used for the manufacturing method (1) of the flexible circuit board with a waterproof member of this invention. It is a figure which shows the component of the shaping | molding die in FIG.

The flexible circuit board with a waterproof member of the present invention has a flexible circuit board inserted into a housing of an electronic device, and a waterproof member attached to a waterproof part of the flexible circuit board,
The waterproof member is a cured product of an ultraviolet curable silicone resin, and is a waterproof elastic body.
It is the flexible circuit board with a waterproof member characterized by these.

  The flexible circuit board with a waterproof member of the present invention will be described with reference to FIGS. FIG. 2 is a schematic plan view of an embodiment of a flexible circuit board with a waterproof member of the present invention. FIG. 3 is an end view of the waterproof member in FIG. (4-1) in FIG. 4 is a schematic end view showing a state in which the flexible circuit board with a waterproof member of the present invention is arranged at the insertion portion of the flexible circuit board of the housing, (4-2) These are figures which show only the housing | casing of (4-1).

  In FIG. 2, the flexible circuit board 10 with a waterproof member has the flexible circuit board 5 and the waterproof member 11a. Connectors 6 (6a, 6b) are attached to both ends of the flexible circuit board 5. Further, a reinforcing plate may be provided on the flexible circuit board opposite to the side on which the connector 6 is provided. And the flexible circuit board 10 with a waterproof member is used for the electronic device in which two housings in which the electronic component or the circuit board is installed are attached by a hinge part, for example, the mobile phone shown in FIG. .

  The waterproof member 11a is made of a cured product of an ultraviolet curable silicone resin.

  As shown in FIG. 3, the waterproof member 11 a is bonded to the flexible circuit board 5 so as to cover one mounting surface 14 of the waterproof part 13 of the flexible circuit board and both side surfaces 15 a and 15 b of the flexible circuit board 5. Attached. Further, the other mounting surface 12 of the flexible circuit board 5 is not covered with the waterproof member 11.

  In the electronic device using the flexible circuit board 10 with the waterproof member, the connector 6a attached to one end of the flexible circuit board is connected to the electronic component or the circuit board in the first casing, and the other flexible circuit board. The connector 6b attached to the end is connected to an electronic component or circuit board in the second housing, and the hinge internal part 21 of the flexible circuit board 5 is accommodated in the hinge part. At this time, the flexible circuit board 5 is installed so as to go out from the inside of the first housing, pass through the inside of the hinge portion, and enter the inside of the second housing.

  As shown in FIG. 4, the flexible circuit board 10 with a waterproof member is inserted into the insertion part 16 of the flexible circuit board provided in the housing 2 of the electronic device. And the waterproof member 11a and the flexible circuit board 5 are installed in the insertion part 16 of a flexible circuit board. At this time, the waterproof member 11a is disposed so as to fill a gap between the casing 2 of the electronic device and the flexible circuit board 5, thereby sealing and waterproofing the gap.

  Specifically, the cross-sectional areas of the waterproof member 11a and the flexible circuit board 5 are made larger than the opening area of the insertion portion 16 of the flexible circuit board, and the waterproof member 11a and the flexible circuit board 5 are sandwiched and compressed by the housing 2. . At this time, a portion of the insertion portion 16 of the flexible circuit board of the housing 2 that is in contact with the flexible circuit board 5 is directly contacted by the housing 2 and the flexible circuit board 5, so that the housing 2 is flexible. The space between the circuit board 5 is blocked. In addition, the waterproof member 11 a is sandwiched between the housing 2 and the flexible circuit board 5 at locations other than the location where the flexible circuit board 5 is in contact with the flexible circuit board 5 in the insertion portion 16 of the flexible circuit board. As a result, the space between the housing 2 and the flexible circuit board 5 is closed.

  The waterproof member 11a is a cured product of an ultraviolet curable silicone resin, and is an elastic body having a waterproof property. Since the waterproof member 11a is an elastic body, an internal stress is generated when the waterproof member 11a is sandwiched and pressed by the housing 2, and the internal stress causes the other surface 12 of the flexible circuit board 12 and the waterproof member 11a to move. And pressed against the housing 2. Thereby, the housing | casing 2, the other surface 12 of the flexible circuit board, and the waterproof member 11a closely_contact | adhere, and the waterproof part of the flexible circuit board 10 with a waterproof member is waterproofed.

  Moreover, since the waterproof member 11a is a cured product of an ultraviolet curable silicone resin, the waterproof performance is high.

  The flexible circuit board according to the present invention is usually a flexible circuit board that is used to connect the electronic component or circuit board in the first housing and the electronic component or circuit board in the second housing through the hinge portion. Any circuit board may be used and is not particularly limited. Examples of the flexible circuit board according to the present invention include a flexible circuit board in which a circuit is formed on one side and a flexible circuit board in which a circuit is formed on both sides. Alternatively, it may be a multilayer flexible circuit board in which two or more flexible circuit boards are stacked.

  The surface of the flexible circuit board according to the present invention is covered with a resin material. The resin material covering the flexible circuit board is not particularly limited as long as it is a material used for a normal flexible circuit board. However, in the embodiment in which the housing and the flexible circuit board are in direct contact with each other, a silicon resin is used. Elastic resins such as fluororesins, urethane resins, and elastomer resins are preferable in that the flexible circuit board has appropriate flexibility and the waterproof performance at a location where the housing and the flexible circuit board are in direct contact is improved.

  In the flexible circuit board with a waterproof member of the present invention, the waterproof member is attached to the flexible circuit board. The place where the waterproof member is attached is a waterproof part of the flexible circuit board, for example, the waterproof part 13 of the flexible circuit board indicated by reference numeral 13 in FIG. And a waterproof part is a part located in the site | part (insertion part of a housing | casing) where the flexible circuit board currently formed in the housing | casing is inserted among flexible circuit boards, For example, in FIG. The portions shown are waterproof portions 18a and 18b.

  The waterproof member according to the flexible circuit board with the waterproof member of the present invention is formed by curing an ultraviolet curable silicone resin that is cured by ultraviolet irradiation, that is, a cured product of the ultraviolet curable silicone resin. And since a waterproof member consists of hardened | cured material of an ultraviolet curable silicone resin, it has waterproof performance.

  The ultraviolet curable silicone resin according to the flexible circuit board with a waterproof member of the present invention is a resin before being cured, and is an ultraviolet curable silicone resin that is cured by irradiating ultraviolet rays. Examples of such an ultraviolet curable silicone resin include organopolysiloxane having an ultraviolet curable functional group such as an acryl group or a methacryl group.

  2 to 4 show an example in which the waterproof member 11 covers and adheres to one of the three mounting surfaces and both sides of the flexible circuit board of the waterproof portion. However, the present invention is not limited to this. As a form example of the flexible circuit board with the waterproof member of the invention, the waterproof member covers all four surfaces (both mounting surfaces and both side surfaces) of the flexible circuit board in the waterproof portion, and the waterproof member is waterproof. An embodiment in which only one mounting surface of the flexible circuit board of the part is covered and bonded, or a waterproof member is covered and bonded on the two mounting surfaces of the flexible circuit board in the waterproof part Is mentioned. The mounting surface of the flexible circuit board is a surface to which a connector, a reinforcing plate attached at a position corresponding to the back side of the connector, a double-sided tape, and the like are fixed, and is a surface spreading in the planar direction. The side surface of the flexible circuit board is a side surface when the two mounting surfaces of the flexible circuit board are the upper and lower surfaces.

  In the embodiment of the flexible circuit board with waterproof member of the present invention, the waterproof member covers the three mounting surfaces of the flexible circuit board and covers the three surfaces of the flexible circuit board. The shape of the member is not particularly limited as long as the shape covers one of the mounting surface and both sides of the flexible circuit board. For example, as shown in FIG. A shape in which a flexible circuit board is embedded in a waterproof member, or a flexible top surface of a rectangular waterproof member when viewed in cross section as shown in (5-1) and (5-2) in FIG. The shape which the side surface adhesion part 17 (17a, 17b) of the circuit board protruded is mentioned. Moreover, as the shape of the waterproof member of the embodiment in which the waterproof member covers and adheres to all four surfaces (both mounting surfaces and both side surfaces) of the waterproof circuit portion of the flexible circuit board with the waterproof member of the present invention. The shape of the waterproof member 11d shown in FIG. Moreover, as the shape of the waterproof member of the embodiment in which the waterproof member covers and covers only one mounting surface of the flexible circuit board of the waterproof portion among the flexible circuit boards with the waterproof member of the present invention, The shape of the waterproofing member 11e shown in (5-4) of 5 is mentioned. As the shape of the waterproof member of the embodiment in which the waterproof member covers the two mounting surfaces of the flexible circuit board at the waterproof portion among the flexible circuit boards with the waterproof member of the present invention as shown in FIG. The shape of the waterproof member 11f shown to (5-5) is mentioned. Further, the overall shape of the waterproof member is appropriately selected according to the shape of the insertion portion of the housing.

  The waterproof member is made of an adhesive resin that can be bonded to the flexible circuit board, and may be directly bonded to the flexible circuit board by its own adhesive force, or there is no adhesion to the flexible circuit board. It may be made of resin and may be bonded to the flexible circuit board via a waterproof adhesive.

  The waterproof circuit-equipped flexible circuit board of the present invention is provided with connectors for connecting to the electronic components in the housing or the circuit board at both ends thereof. Moreover, the flexible circuit board with a waterproof member of the present invention is provided with an electronic member that can be surface-mounted, for example, a resistor, a transistor, a capacitor, or the like, if necessary.

  The electronic device using the flexible circuit board with a waterproof member of the present invention is not particularly limited as long as it is an electronic device in which two housings in which electronic components or circuit boards are installed are connected by a hinge portion. Examples include mobile phones, digital cameras, and digital movies.

The manufacturing method of the flexible circuit board with a waterproof member of this invention is shown below. The manufacturing method of a flexible circuit board with a waterproof member according to the first aspect of the present invention (hereinafter also referred to as manufacturing method (1)) is such that the portion where the waterproof member of the flexible circuit board is attached is filled in a mold. An arrangement step (1) of arranging the flexible circuit and the ultraviolet curable silicone resin so as to come into contact with the existing ultraviolet curable silicone resin;
A curing step (1) for curing the ultraviolet curable silicone resin;
A method for producing a flexible circuit board with a waterproof member, comprising:

  Regarding the manufacturing method (1), the waterproof member is a flexible circuit board with a waterproof member, which covers and adheres to one of the mounting surface and both side surfaces of the flexible circuit board, and the waterproof member is cured of an ultraviolet curable silicone resin. With reference to FIGS. 6 to 10, an example of manufacturing a form made of an object will be described. 6 is a schematic perspective view of a mold used in the manufacturing method (1), and FIG. 7 is a schematic plan view showing a state in which a flexible circuit board is installed in the mold. 8 is an end view taken along the line z-z in FIG. 7, and FIG. 9 is a schematic diagram showing a state in which the flexible circuit and the ultraviolet curable silicone resin are arranged in the arrangement step (1). FIG. 10 is a schematic end view showing a state after being cured in the curing step (1).

  As shown in FIG. 6, the mold 20a is a rectangular parallelepiped container having no upper surface, and is made of a material that transmits ultraviolet rays, for example, quartz, an ultraviolet transparent acrylic resin, or the like. The notch 19 in which the flexible circuit board 5 is installed is formed in the two side walls 201 of the mold 20 a by fitting the flexible circuit board 5.

  Next, as shown in FIGS. 7 and 8, the flexible circuit board 5 is installed in the notch 19 of the mold 20a. At this time, the flexible circuit board 5 is installed so that one mounting surface 14 and both side surfaces 15a and 15b of the waterproof portion of the flexible circuit board 5 are located in the molding die 20a. Note that the position of the other mounting surface 12 of the flexible circuit board 5 (the position of the dotted line indicated by reference numeral 22) is the same as the height of the other two side walls 202 of the mold 20a, or the other two side walls of the mold 20a. The position is lower than the height of 202.

  Next, as shown in FIG. 9, the ultraviolet curable silicone resin 23 is filled in the mold 20 a up to the position 22 of the other mounting surface 12 of the flexible circuit board 5. Thus, one mounting surface 14 and both side surfaces 15a and 15b of the flexible circuit board 5 are covered with the ultraviolet curable silicone resin filled in the mold 20a.

  In this way, the arrangement step (1) is performed.

  Next, for each of the molding dies 20a shown in FIG. 9, the ultraviolet curable silicone resin 23 filled in the molding dies 20a is irradiated with ultraviolet rays to cure the ultraviolet curable silicone resin, and the ultraviolet curing shown in FIG. The cured silicon resin cured product 24 is formed (curing step (1)).

  After performing the curing step (1), the molding die 20a is removed from the cured product 24 of the ultraviolet curable silicone resin to obtain the flexible circuit board with a waterproof member of the present invention.

  In the arrangement step (1), when using a molding die in which a notch for fitting a flexible circuit board is formed in the upper part of the side wall of the molding die as shown in FIG. In (1), a flexible circuit board is arrange | positioned by inserting a flexible circuit board in the notch part of the side wall of a shaping | molding die. At this time, the flexible circuit board is disposed so that the attachment portion of the waterproof member of the flexible circuit board is positioned inside the mold. In this case, in the arranging step (1), after the flexible circuit board is fitted into the notch of the mold, the ultraviolet curable silicon resin is filled in the mold and the ultraviolet curable silicon resin is arranged. Before inserting the flexible circuit board into the notch of the mold, put a certain amount of UV curable silicone resin in the mold, and then fit the flexible circuit board into the notch of the mold Then, the mold may be filled with an ultraviolet curable silicone resin.

  The shaping | molding die concerning an arrangement | positioning process (1) is a shaping | molding die for shape | molding the shape of a waterproof member. The molding die related to the arranging step (1) may be a molding die constituted by a single continuous component, or a molding die constituted by combining a plurality of components.

  In addition to the mold 20a shown in FIG. 6, as the mold, for example, the mold 30 shown in FIGS. In FIG. 11, a molding die 30 is composed of two molding die components 31a and 31b, and is a molding die that is installed at a waterproof portion so as to sandwich a flexible circuit board from above and below. The mold 30 is made of a material that transmits ultraviolet rays. In addition, the component 31a of the shaping | molding die in FIG. 11 is a shape symmetrical up and down with respect to the component 31b of a shaping | molding die and a flexible circuit board.

  As shown in FIG. 12, the mold component 31b includes a flexible circuit board insertion space 32 into which the flexible circuit board is fitted when the mold components 31a and 31b are combined, and UV curing. A resin filling space 34 that is a space filled with the curable silicon resin and a resin injection space 33 for injecting the ultraviolet curable silicon resin into the resin filling space 34 from the outside of the mold 30 are formed. In the mold 30, the flexible circuit board fitting space 32 and the resin filling space 34 are formed in the resin filling space 34 so that the portion where the waterproof member of the flexible circuit board is attached is located.

  Then, the mold part 30 is installed in the waterproof part of the flexible circuit board by combining the components 31 a and 31 b of the mold so that the waterproof part of the flexible circuit board is sandwiched from above and below, and then the ultraviolet rays are injected from the resin injection space 33. The placement step (1) is performed by injecting a curable silicone resin into the resin filling space 34 in the mold 30 and filling the resin filling space 34 with the ultraviolet curable silicone resin.

  In the arrangement step (1), as a mold, a mold having a plurality of components and having a resin-filled space filled with an ultraviolet curable silicone resin is used as shown in FIGS. In the arranging step (1), a mold is placed on the flexible circuit board so that the waterproof part of the flexible circuit board is sandwiched from above and below, and then the resin filling space is filled with an ultraviolet curable silicone resin. Thus, the flexible circuit and the ultraviolet curable silicone resin are arranged.

  A mold release agent may be applied to the inside of the mold according to the arranging step (1) in order to improve the mold release property of the cured product of the ultraviolet curable silicone resin after curing.

  In the placing step (1), before the flexible circuit board is placed on the mold, the ultraviolet curable silicone resin is previously provided on the surface of the flexible circuit board that contacts the ultraviolet curable silicone resin, particularly on both sides of the flexible circuit board. After the surface treatment such as coating is performed to improve the wettability of the surface covered with the ultraviolet curable silicone resin, the ground circuit-treated flexible circuit board can be placed in the mold.

  The manufacturing method (1) is a form in which the manufacture (molding) of the waterproof member and the attachment (adhesion) to the flexible circuit board are performed simultaneously. First, the waterproof member is manufactured, and then the manufactured waterproof The member may be attached (bonded) to the flexible circuit board to manufacture the flexible circuit board with a waterproof member of the present invention.

A manufacturing method in which a waterproof member is manufactured first, and then the manufactured waterproof member is attached (adhered) to the flexible circuit board will be described below. The method for producing a flexible circuit board with a waterproof member according to the second aspect of the present invention (hereinafter also referred to as production method (2)) is obtained by curing an ultraviolet curable silicone resin to obtain a cured product of the ultraviolet curable silicone resin. A curing step (2) to obtain a mass;
Cutting out the cured product lump of the ultraviolet curable silicone resin into the shape of the waterproof member to obtain the waterproof member (2);
An adhesion step (2) for adhering the waterproof member to a waterproof portion of the flexible circuit board;
A method for producing a flexible circuit board with a waterproof member, comprising:

  That is, the manufacturing method (2) is a manufacturing method for manufacturing a waterproof member first by manufacturing a large lump of a cured product of an ultraviolet curable silicone resin, and cutting the lump into a shape of the waterproof member. It is.

  As an example of the production of the flexible circuit board by the production method (2), first, an ultraviolet curable silicone resin is put into a large curing container and cured by irradiating with ultraviolet rays, and a cured product of the ultraviolet curable silicone resin is obtained. Then, the cured product lump of the obtained ultraviolet curable silicone resin is formed into the shape of the waterproof member 11e in (5-4) in FIG. 5 or the shape of the waterproof member 11f in (5-5), for example. An example of cutting and obtaining the waterproof member 11e or the waterproof member 11f and then attaching (adhering) the obtained waterproof member to the flexible circuit board is given.

  The ultraviolet curable silicone resin and the cured product of the ultraviolet curable silicone resin obtained by curing the ultraviolet curable silicone resin according to the production methods (1) and (2) are ultraviolet rays related to the flexible circuit board with a waterproof member of the present invention. This is the same as the cured product of the curable silicone resin and the ultraviolet curable silicone resin.

  ADVANTAGE OF THE INVENTION According to this invention, the flexible circuit board excellent in waterproofness can be manufactured by a simple method.

DESCRIPTION OF SYMBOLS 1 Mobile phone 2a 1st housing | casing 2b 2nd housing | casing 3 Hinge part 4a, 4b Circuit board 5 Flexible circuit board 6, 6a, 6b Connector 7, 7a, 7b Waterproof member 10 Flexible circuit board 11 with waterproof member 11 and 11a 11b, 11c, 11d, 11e, 11f Waterproof member 12 The other mounting surface 13 of the flexible circuit board Waterproof portion 14 of the flexible circuit board One mounting surface 15, 15a, 15b of the flexible circuit board Side surface 16 of the flexible circuit board Flexible circuit Substrate insertion part 17 Side adhesive part 18 Waterproof part 19 Notch part 20, 30 Mold 21 Inside hinge part 22 Position on the other mounting surface of the flexible circuit board 23 UV curable silicone resin 24 UV curable silicone resin Cured product 31a, 31b Mold component 32 Flexible circuit base Plate fitting space 33 Resin injection space 34 Resin filling space 201 Two side walls 202 of the molding die The other two side walls of the molding die

Claims (4)

A flexible circuit board inserted into the housing of the electronic device, and a waterproof member attached to a waterproof part of the flexible circuit board,
The waterproof member is a cured product of an ultraviolet curable silicone resin, and is a waterproof elastic body.
A flexible circuit board with a waterproof member. An arrangement step of arranging the flexible circuit and the ultraviolet curable silicone resin so that the attachment portion of the waterproof member of the flexible circuit board is in contact with the ultraviolet curable silicone resin filled in the mold,
A curing step of curing the ultraviolet curable silicone resin;
The manufacturing method of the flexible circuit board with a waterproof member which has this.   The mold is a mold in which a notch for fitting the flexible circuit board is formed on a side wall of the mold, and the flexible circuit board is fitted into the notch in the arranging step. The method for manufacturing a flexible circuit board with a waterproof member according to claim 2, wherein the flexible circuit board is disposed by inserting the flexible circuit board.   The molding die is a molding die that includes a plurality of components and has a resin-filled space filled with the ultraviolet curable silicone resin therein, and in the placement step, a waterproof member attachment portion of the flexible circuit board is provided. Are placed on the flexible circuit board so as to be sandwiched from above and below, and then the ultraviolet curable silicone resin is filled into the resin-filled space, whereby the flexible circuit board and the ultraviolet curable resin are filled. 3. The method for producing a flexible circuit board with a waterproof member according to claim 2, wherein a silicon resin is disposed.